JPH0535476B2 - - Google Patents
Info
- Publication number
- JPH0535476B2 JPH0535476B2 JP60189397A JP18939785A JPH0535476B2 JP H0535476 B2 JPH0535476 B2 JP H0535476B2 JP 60189397 A JP60189397 A JP 60189397A JP 18939785 A JP18939785 A JP 18939785A JP H0535476 B2 JPH0535476 B2 JP H0535476B2
- Authority
- JP
- Japan
- Prior art keywords
- card
- infrared ray
- magnetic
- receiving part
- infrared light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 3
- 238000003708 edge detection Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
Abstract
Description
【発明の詳細な説明】
〔概要〕
ICカードと磁気カードを赤外光の透過により
判別する装置である。[Detailed Description of the Invention] [Summary] This is a device that distinguishes between an IC card and a magnetic card by transmitting infrared light.
本発明はICカードと磁気カードの判別をなす
ための装置に関するもので、さらに詳しく言え
ば、ICカードと磁気カードに使用されているプ
ラスチツクは赤外光をある程度透過するが、IC
カードのチツプは赤外光を透過させないことを利
用し、ICカードと磁気カードを判別する装置に
関するものである。
The present invention relates to a device for distinguishing between an IC card and a magnetic card.More specifically, the plastic used in IC cards and magnetic cards transmits infrared light to some extent, but the
This relates to a device that uses the fact that the card chip does not transmit infrared light to distinguish between an IC card and a magnetic card.
第１０図に示されるICカード１１とICカード
リーダ／ライタ２１は知られたものであり、IC
カード１１は電極１２が表に出たもので、カード
内にICチツプ１３を収納する。
The IC card 11 and IC card reader/writer 21 shown in FIG.
The card 11 has electrodes 12 exposed, and an IC chip 13 is housed inside the card.
第１１図に示される磁気カード３１も知られた
ものであり、このカードには磁気メモリ３２が設
けられている。 A magnetic card 31 shown in FIG. 11 is also known, and this card is provided with a magnetic memory 32.
外形的には磁気カードもICカードも同じ形を
している一方で、ICカードの電極の数、場所な
どは未だ規格化されていない。そのため、ICカ
ードリーダ／ライタ磁気カードが挿入されたり他
の規格のICカードが挿入される可能性がある。
ICカードリーダ／ライタに磁気カードが入ると、
ICカード用端子に電源を印加しなければICカー
ドと磁気カードの識別はできない。いいかえる
と、電源を印加してもなんら反応がない場合、
ICカードリーダ／ライタに挿入されたものが磁
気カードであるということが判明する。
While magnetic cards and IC cards have the same external shape, the number and location of electrodes on IC cards have not yet been standardized. Therefore, there is a possibility that an IC card reader/writer magnetic card or an IC card of another standard may be inserted.
When a magnetic card is inserted into the IC card reader/writer,
Unless power is applied to the IC card terminal, IC cards and magnetic cards cannot be distinguished. In other words, if there is no response even when power is applied,
It turns out that the card inserted into the IC card reader/writer is a magnetic card.
他の規格のICカードが挿入された場合に前記
の如く電源を印加すると、ICカードに記憶され
ている情報が破壊されるおそれがある。 If power is applied as described above when an IC card of another standard is inserted, the information stored in the IC card may be destroyed.
本発明はこのような点に鑑みて創作されたもの
で、電源を印加することなくICカードと磁気カ
ードを区別することのできる装置を提供すること
を目的とする。 The present invention was created in view of these points, and an object of the present invention is to provide a device that can distinguish between an IC card and a magnetic card without applying power.
第１図は本発明の原理を示すための図である。 FIG. 1 is a diagram showing the principle of the present invention.
本発明においては、カード端検知用センサ１６
がICカード１１が挿入されたことを検知すると
赤外光発光部１４に信号を送つて赤外光を放射さ
せ、赤外光受光部１５によつて赤外光が透過した
か否かを検知する。 In the present invention, the card edge detection sensor 16
When it detects that the IC card 11 has been inserted, it sends a signal to the infrared light emitting section 14 to emit infrared light, and the infrared light receiving section 15 detects whether or not the infrared light has passed through. do.
挿入されたカードが第１図に示した如くICカ
ードであるとき、それはICチツプ１３をもつて
いるので、赤外光の通る路にICチツプがくると
赤外光は透過せず、赤外光受光部にはなんの変化
も現れない。ところが、磁気カードが挿入された
ときは赤外光受光部は赤外光を受けそれに対して
反応を示す。このようにして、挿入されたものが
ICカードであるか否かを判定しうるのである。
When the inserted card is an IC card as shown in Figure 1, it has an IC chip 13, so if the IC chip comes in the path of infrared light, the infrared light will not pass through and the infrared light will pass through. No change appears in the light receiving section. However, when a magnetic card is inserted, the infrared light receiving section receives infrared light and reacts to it. In this way, what was inserted is
It is possible to determine whether it is an IC card or not.
以下、図面を参照して本発明実施例を詳細に説
明する。
Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図に示した赤外光発光部１４（以下単に発
光部という）と赤外光受光部１５（以下単に受光
部という）は、第２図に示す如くプラスチツク板
１７上にそれぞれ配置し、発光部１４は商品名
EL−23Fなる発光ダイオード、受光部１５は商
品名PT−23Fなるフオト・トランジスタで構成
する。前記の発光ダイオードは、出力100ｍＷ、
電流60ｍＡで波長940nｍ（近赤外光）を発振す
る。これらの素子は6.5mmの間隔で配置されたプ
ラスチツク板１６上に対向して設ける。そして、
受光部１５は外部の乱光防止用の遮蔽板１８で覆
つて誤動作をすることのないようにする。 The infrared light emitting section 14 (hereinafter simply referred to as the light emitting section) and the infrared light receiving section 15 (hereinafter simply referred to as the light receiving section) shown in FIG. 1 are respectively arranged on a plastic plate 17 as shown in FIG. The light emitting part 14 is the product name
A light emitting diode named EL-23F is used, and the light receiving section 15 is made up of a photo transistor named PT-23F. The above light emitting diode has an output of 100mW,
It oscillates at a wavelength of 940 nm (near infrared light) with a current of 60 mA. These elements are mounted facing each other on plastic plates 16 spaced apart by 6.5 mm. and,
The light receiving section 15 is covered with a shielding plate 18 for preventing external light scattering to prevent malfunction.
第３図は発光部１４と受光部１５のための回路
を示す回路図で、本発明の一実施例においては、
用いた部品の抵抗値などを図に記入の値に設定
し、1KΩのボリユームでVrefを0.7〜0.8Vに調整
した。 FIG. 3 is a circuit diagram showing a circuit for the light emitting section 14 and the light receiving section 15, and in one embodiment of the present invention,
The resistance values of the parts used were set to the values shown in the figure, and Vref was adjusted to 0.7 to 0.8V with a volume of 1KΩ.
第４図は、発光部の発光ダイオード面にカード
表面を向けて走行させた場合の、受光部のフオト
トランジスタの出力波形（第３図の出力Ａ）とコ
ンパレータの出力波形（スライス・レベル0.7V）
（第３図の出力Ｂ）を示す図で、α、βの波形は
カード端面検知の目的でカード両端にアルミ・ホ
イルを貼つて得た波形である。 Figure 4 shows the output waveform of the phototransistor in the light receiving part (output A in Figure 3) and the output waveform of the comparator (slice level 0.7V) when the card is run with its surface facing the light emitting diode surface of the light emitting part. )
(Output B in Figure 3), the waveforms α and β are waveforms obtained by pasting aluminum foil on both ends of the card for the purpose of detecting the card edge.
第５図は、ICチツプ１３、文字パターン１９
をもつたICカード１１を図の矢印方向にスキヤ
ンしたときに得られた受光部のフオト・トランジ
スタの出力波形である。ICチツプ部で出力が著
しく低下していることが示される。なお、同図以
下において、横軸には時間(t)を、縦軸には電圧(V)
をとつてある。 Figure 5 shows IC chip 13 and character pattern 19.
This is the output waveform of the phototransistor of the light receiving section obtained when the IC card 11 with a 1000 MHz was scanned in the direction of the arrow in the figure. This shows that the output of the IC chip has decreased significantly. In the following figures, the horizontal axis represents time (t), and the vertical axis represents voltage (V).
It has been taken.
第６図と第７図は２つの異なつたICカード、
また第８図と第９図は２つの異なつた磁気カード
についての本願発明者が実験したフオト・トラン
ジスタの出力波形で本発明装置が実用可能である
ことを示すものである。 Figures 6 and 7 show two different IC cards,
Furthermore, FIGS. 8 and 9 show the output waveforms of photo transistors tested by the inventors for two different magnetic cards, and show that the apparatus of the present invention can be put to practical use.
以上述べてきたように、本発明によれば、IC
カードのメモリを破壊することなくICカードの
磁気カードの区別が電源を用いることなく実現さ
れる効果がある。
As described above, according to the present invention, the IC
This has the effect of being able to distinguish magnetic cards from IC cards without destroying the memory of the card and without using a power source.
第１図は本発明の原理を示す図、第２図は第１
図の発光部と受光部を示す図、第３図は本発明実
施例の回路図、第４図は受光部とコンパレータの
出力波形を示す図、第５図はICカードを検知す
る場合の受光部の出力波形図、第６図と第７図は
２つの異なつたICカードの出力波形図、第８図
と第９図は２つの異なつた磁気カードの出力波形
図、第１０図はICカードとICカードリーダ／ラ
イタの斜視図、第１１図は磁気カードの平面図で
ある。
第１図ないし第１１図において、１１はICカ
ード、１２は電極、１３はICチツプ、１４は発
光部、１５は受光部、１６はカード端検知用セン
サ、１７はプラスチツク板、１８は遮蔽板、１９
は文字パターンである。
Figure 1 is a diagram showing the principle of the present invention, Figure 2 is a diagram showing the principle of the present invention.
Figure 3 is a circuit diagram of the embodiment of the present invention, Figure 4 is a diagram showing the output waveforms of the light receiver and comparator, and Figure 5 is light reception when detecting an IC card. Figures 6 and 7 are output waveform diagrams of two different IC cards, Figures 8 and 9 are output waveform diagrams of two different magnetic cards, and Figure 10 is an IC card output waveform diagram. FIG. 11 is a perspective view of the IC card reader/writer, and FIG. 11 is a plan view of the magnetic card. In Figures 1 to 11, 11 is an IC card, 12 is an electrode, 13 is an IC chip, 14 is a light emitting part, 15 is a light receiving part, 16 is a card edge detection sensor, 17 is a plastic plate, and 18 is a shielding plate. , 19
is a character pattern.
Claims (1)
して配置し、 これら発光部と受光部の間にカードを挿入し、
当該カードがICカード１１である場合には発光
部１４から発振される赤外光の非透過状態を、ま
た当該カードが磁気カードであるときは前記赤外
光の透過状態を受光部１５の出力波形で検知する
構成としたことを特徴とするICカード／磁気カ
ード判別装置。[Claims] 1. An infrared light emitting section 14 and an infrared light receiving section 15 are arranged facing each other, and a card is inserted between the light emitting section and the light receiving section,
When the card is an IC card 11, the infrared light emitted from the light emitting unit 14 is not transmitted, and when the card is a magnetic card, the infrared light is transmitted as the output from the light receiving unit 15. An IC card/magnetic card discrimination device characterized by having a configuration that detects by waveform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60189397A JPS6250982A (en) | 1985-08-30 | 1985-08-30 | Device for discriminating between ic card and magnetic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60189397A JPS6250982A (en) | 1985-08-30 | 1985-08-30 | Device for discriminating between ic card and magnetic card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6250982A JPS6250982A (en) | 1987-03-05 |
| JPH0535476B2 true JPH0535476B2 (en) | 1993-05-26 |
Family
ID=16240608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60189397A Granted JPS6250982A (en) | 1985-08-30 | 1985-08-30 | Device for discriminating between ic card and magnetic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6250982A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0712384U (en) * | 1993-07-29 | 1995-02-28 | 新明和オートエンジニアリング株式会社 | Crane equipment |
-
1985
- 1985-08-30 JP JP60189397A patent/JPS6250982A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0712384U (en) * | 1993-07-29 | 1995-02-28 | 新明和オートエンジニアリング株式会社 | Crane equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6250982A (en) | 1987-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |