JPH05345290A - Hand mechanism - Google Patents

Abstract

PURPOSE:Not to cause damage to a bear-chip or a base plate at the time of peeling of the bear-chip. CONSTITUTION:This mechanism has a columnar holding part 1 revolving in the specified direction and moving in the vertical direction and a top end part 2 having a claw part 3 sandwiching the side edge of a bear-chip 10 fastened on a base plate 8 with an adhesive 9, an attraction hole 4 to attract a surface 10A and a heater 5 to heat the bear-chip 10, and it is furnished with a spring 7 installed in suspense between the holding part 1 and the top end part 2 by being arranged on the outer periphery of a guide shaft 6 one side of which is fixed on the holding part 1 and the other side of which is freely engaged with the top end part 2 and which transmits revolution of the holding part 1 to the top end part 2. Thereafter, the surface of the bear-chip 10 is attracted as the holding part 1 is lowered and it is heated by the heater 5 up to specified temperature, and after heating, the holding part 1 is raised by the spring 7 and the revolved and fastened bear-chip 10 is peeled off.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hand mechanism for repairing a bare chip fixed to a substrate with an adhesive agent.

In recent years, in electronic devices using semiconductor elements,
As high speed and high density packaging have been promoted, bare chips constituting a semiconductor element have been directly mounted on a printed circuit board.

In mounting such bare chips, generally, bumps are formed on the bare chips, while the substrate of the printed circuit board is made of a ceramic material, and pads corresponding to the bumps are arranged on the surface of the substrate. The bare chip is fixed to the substrate with an adhesive so that the bump and the pad are in close contact with each other.

However, such a bare chip needs to be remounted such that the bare chip once mounted on the substrate is removed from the substrate and replaced with a new bare chip due to failure or modification.

Therefore, when repairing to remove such a bare chip from the substrate as necessary, normally,
It is done by the hand mechanism.

[0006]

2. Description of the Related Art Conventionally, the structure was formed as shown in the conventional explanatory view (No. 1) of FIG. 3 and the conventional explanatory view (No. 2) of FIG. Fig. 3 is a perspective view, Fig. 4 (a) is a side sectional view, (b)
[Fig. 3] is a side sectional view of a peeled state.

As shown in FIG. 3, a block portion 21 having a claw 21C at the tip of a shaft 21A rotated as shown by an arrow A is shown.
The hand mechanism 21 is formed by forming B, and when repairing the bare chip 10 mounted by being fixed to the substrate 8 by the adhesive 9 made of a thermosetting resin material, the hand mechanism 21 is indicated by the arrow Z1. The bare chip 10 was clamped by the claws 21C, and the shaft 21A was rotated in the direction of arrow A to perform repair.

Such a hand mechanism 21 has a structure shown in FIG.
When the bare chip 10 is sandwiched by the claws 21C as shown in Fig. 5, a heater 5 is provided to heat the bare chip 10 to a predetermined temperature T. Further, the bare chip 10 is provided with bumps 10B. It is formed so as to contact the pad 8A connected to the pattern 8B formed on the.

Therefore, when the bare chip 10 is repaired, the adhesive 9 is decomposed by heating at a temperature T higher than the curing temperature of the adhesive 9, and the shaft portion 21A is rotated about the axis C in the direction of the arrow A. The bare chip 10 was peeled from the substrate 8 by moving it as shown in FIG. 4 (b).

Therefore, the hand mechanism 21 for raising and lowering in the direction of the arrow Z is positioned directly above the bare chip 10 to be repaired, the bare chip 10 is sandwiched by the lowering of the hand mechanism 21, and heating at the temperature T is performed, and then the hand mechanism
The bare chip 10 mounted on the substrate 8 was repaired by rotating 21 in the direction of arrow A.

[0011]

However, when the bare chip 10 is sandwiched by the hand mechanism 21 as described above, an arrow mark is formed.
By rotating in the A direction and repairing the bare chip 10, as shown in FIG. 4B, the peeled bare chip 10 is removed.
By overlapping with the surface of the substrate 8, the fracture surface of the adhesive 9 rubs the pad 8A, the pattern 8B, and the bare chip 10.

Therefore, when the substrate 8 or the bare chip 10 is damaged and the mounting of the bare chip 10 is changed, a repair work for repairing the damaged portion is required. Therefore, in the present invention, when peeling the bare chip,
The purpose is to prevent damage to the bare chip or the substrate.

[0013]

FIG. 1 is a diagram for explaining the principle of the present invention. As shown in FIG. 1, it is rotated about a shaft C in a predetermined direction A and moved up and down in a vertical direction Z. Columnar holding portion 1, a claw portion 3 for holding the side edge of a bare chip 10 fixed to a substrate 8 by an adhesive 9 and the bare chip.
A tip portion 2 having a suction hole 4 for adsorbing the surface 10A of 10 and a heater 5 for heating the bare chip 10;
And a guide shaft 6 slidably locked to the tip portion 2 and transmitting the rotation of the holding portion 1 to the tip portion 2, and the guide shaft 6 is provided on the outer periphery of the guide shaft 6. The holding part 1 and the tip part 2 so that the spring 7 is stretched between the holding part 1 and the tip part 2, and the surface 10A of the bare chip 10 is attracted to the tip part 2 when the holding part 1 descends. The heater 5 is heated to a predetermined temperature, and after heating, the holding portion 1 is raised so that the spring force of the spring 7 acts on the tip portion 2, and the spring force is applied to the tip portion 2. Then, the holding portion 1 is rotated, and the bare chip 10 fixed by the adhesive 9 is peeled off.

The above-mentioned problems can be solved by such a configuration.

[0015]

[Operation] That is, the rotating holding part 1 and the tip part 2 having the claw part 3 for sandwiching the bare chip 10, one is fixed to the holding part 1 and the other is slidably locked to the tip part 2. A guide shaft 6 and a spring 7 arranged around the guide shaft 6, and a suction hole 4 for sucking the bare chip 10 at the tip 2 and a heater 5 for heating the bare chip 10. The surface 10A of the bare chip 10 is heated by sandwiching the bare chip 10 with the claw portion 3 and the surface 10A of the bare chip 10 is adsorbed to the holding portion 1
Spring 7 lifts bare chip
The holding portion 1 is rotated while pulling 10 upward, so that the peeled bare chip 10 is held by the tip portion 2.

Therefore, the peeled adhesive as described above.
It is possible to prevent the substrate 8 or the bare chip 10 from being damaged because it is not rubbed by the fractured surface of the substrate 9, repair work is unnecessary, and the mounting of the bare chip 10 can be easily changed.

[0017]

The present invention will be described in detail below with reference to FIG.
2A and 2B are explanatory views of an embodiment according to the present invention. FIG. 2A is a side sectional view, FIG. 2B is a sectional view taken along the line XX in FIG. 2A, and FIGS. Throughout the drawings, the same reference numerals denote the same objects.

As shown in FIG. 2 (a), the holding portion 1 is moved up and down in the direction of arrow Z and is rotated about the axis C in the direction of arrow A, and the holding portion 1 is held by the guide shaft 6.
The hand mechanism 11 is constituted by the tip portion 2 slidably locked to the guide shaft 6 and the spring 7 which is provided on the outer circumference of the guide shaft 6 and presses the holding portion 1 and the tip portion 2 into contact with each other. The tip portion 2 is formed with a claw portion 3 for holding the bare chip 10, a suction hole 4 for sucking the bare chip 10, and a heater 5 for heating the bare chip 10.

Further, one end 6A of the guide shaft 6 is fixed to the holding portion 1, and the other end 6B is along a cross groove formed in the tip 2 as shown in FIG. 2 (b). It is formed so that the rotation of the holding part 1 is transmitted to the tip part 2 via the guide shaft 6, and further, the suction holes 4 are arranged at four positions, and each suction hole 4 is It is formed so as to communicate with a tube 12 connected to the tip portion 2 for sucking air.

Therefore, the bare chip 10 mounted on the substrate 1
When repairing, first, as shown in (c1) of Fig. 2,
By lowering the holding part 1 and the tip part 2, the claw part 3 of the tip part 2
Sandwich the side end surface of bare chip 10 with
The surface 10A is adsorbed by the suction of the suction hole 4, and at the same time, the temperature of T is heated by the heater 5.

Next, the holding portion 1 is raised in the direction of arrow Z2 by a predetermined amount so that a space S is formed between the holding portion 1 and the tip portion 2, whereby the spring 7 is stretched and the arrow F is drawn.
Keeping the spring force shown in Fig. 2 to be applied to the bare chip 10,
The holder 1 is rotated in the direction of arrow A as shown in (c2).

The adhesive 9 that has fixed the bare chip 10 is broken by such a rotation, and the bare chip 10 is removed from the substrate 1.
10 will be peeled off.In this case, the peeled bare chip 10 is adsorbed and held on the tip 2 side, and the peeled bare chip 10 is separated by the spring force of the spring 7.
It is lifted by the rise of the tip portion 2 of S, and the fracture surfaces of the adhesive 9 are separated at the same time as the fracture of the adhesive 9.

Therefore, the bare chip 10 can be repaired so that the peeled fracture surfaces do not rub against each other, and the pads 8A, the patterns 8B and the bare chip 10 formed on the substrate 8 are damaged. Can be avoided.

The bare chip 10 held by the tip 2 can be separated from the tip 2 by moving the holder 1 to a predetermined position and stopping the suction of the tube 12. Away from the tip 2,
Then, the next repair can be performed.

[0025]

As described above, according to the present invention,
A guide shaft and a spring are provided between the holding part and the tip part, and a suction hole for sucking the bare chip is provided at the tip part, and the bare chip is pulled upward when peeling the bare chip by rotating the holding part. The peeled bare chip can be held by the tip portion so that the peeled surfaces of the adhesive fracture surfaces do not rub against each other.

Therefore, the damage to the substrate and the bare chip, which has been conventionally caused during the repair, can be avoided, the mounting of the bare chip can be easily changed, and the practical effect is great.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the present invention.

FIG. 2 is an explanatory diagram of an embodiment according to the present invention.

FIG. 3 is a conventional explanatory view (No. 1)

FIG. 4 is a conventional explanatory view (No. 2)

[Explanation of symbols]

 1 Holding part 2 Tip part 3 Claw part 4 Suction hole 5 Heater 6 Cide shaft 7 Spring 8 Substrate 9 Adhesive 10 Bare chip 10A Surface

Claims (1)

[Claims] 1. A cylindrical holding portion (1) which is rotated in a predetermined direction (A) about a shaft core (C) and is vertically moved (Z), and an adhesive (9). Heating the bare chip (10) with the claw part (3) that holds the side edge of the bare chip (10) fixed to the substrate (8), the suction hole (4) that adsorbs the surface (10A) of the bare chip (10) A tip (2) having a heater (5) for
One is fixed to the holding part (1), the other is slidably locked to the tip part (2), and a guide for transmitting the rotation of the holding part (1) to the tip part (2). By disposing the shaft (6) and the outer periphery of the guide shaft (6), the holding portion (1)
And a spring (7) stretched between the tip portion (2) and the tip portion (2), and the surface of the bare chip (10) is lowered by lowering the holding portion (1).
By adsorbing (10A) to the tip (2), the heater
(5) heated to a predetermined temperature, and after heating, the spring
The holding part (1) is raised so that the spring force by (7) acts on the tip part (2), and the spring force is applied to the tip part (2). ) Rotate the adhesive
A hand mechanism characterized by performing repair for peeling the bare chip (10) fixed by (9).