JP2003117786A - Semiconductor chip grinding apparatus and installing method of semiconductor chip to grinding table - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor chip grinding apparatus and an installing method of a semiconductor chip to a grinding table capable of automatically easily drawing a drawing part of a protective tape, and facilitating installation of the protective tape to the grinding table. SOLUTION: This semiconductor chip grinding attachment has a process of sticking a semiconductor chip T to a chip sticking surface 3a of the protective tape 3 stuck to a frame ring 14 by putting a grinding object surface on the upside, a process of drawing the drawing part 3b between the chip sticking surface 3a and the frame ring 14 by pressing the protective tape 3 from the reverse side by a drawing means 17 by relatively moving the protective tape 3 and the drawing means 17 arranged on the reverse side of the chip sticking surface 3a in the mutually approaching direction, and a process of vacuum- sucking the reverse of the chip sticking surface 3a of the drawn protective tape 3 to a chip support surface 9 of the grinding table 11 by the drawing part 3b, and vacuum-sucking the frame ring 14 to a frame ring fixing surface positioned below the chip support surface 9 on the outer peripheral side of the chip support surface 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor in which a semiconductor chip is attached to a protective tape, the protective tape is attached to a grinding table, and the back surface of the semiconductor chip is ground by a grinding disc equipped with a grinding wheel. The present invention relates to a chip grinding device and a method for mounting a semiconductor chip on a grinding table.

[0002]

2. Description of the Related Art In recent years, electronic devices have become more sophisticated, more functional,
As miniaturization progresses and the semiconductor elements mounted thereon also have higher functionality, higher density packaging is required.
For this reason, the demand for three-dimensionally mounting semiconductor elements has become prominent in thin and large-capacity devices represented by IC memory cards. As means for thinning the semiconductor element, there are a method of performing backside grinding in a wafer state and a method of performing backside grinding in a chip state cut out from a wafer.In particular, the latter is done after attaching individual chips to a protective tape. The protective tape is fixed to the grinding table together with a vacuum chuck and a special jig.

FIG. 8 shows a plan view of a conventional grinding table in a semiconductor chip grinding apparatus. 9 is a cross-sectional view taken along the line [9]-[9] in FIG. 8 and 9
Shows the state in which the protective tape is attached to the grinding table.

A concave portion 10 is formed in the central portion of the grinding table 1 which is raised further, and a porous porous member 2 having air permeability is fitted into the concave portion 10. The surface of the porous member 2 is flush with the central surface of the grinding table 1, and these surfaces form a chip supporting surface 9 for supporting the semiconductor chip T via the protective tape 3 during grinding. The recess 10 is connected to a vacuum system such as a vacuum pump (not shown) via the suction passage 7.

On the outer peripheral side of the chip support surface 9, a ring-shaped frame ring fixing surface 6 formed one step lower than the chip support surface 9 has a holding ring 5 which can be moved up and down by manual operation.
Is attached. The presser ring 5 is formed with presser portions 5a that extend radially inward at four locations at 90 ° intervals.

The protective tape 3 has a substantially circular shape and is stretched on a metal frame ring 4. Specifically, the outer peripheral side end of the protective tape 3 is bonded to the lower surface of the frame ring 4. The state shown in FIGS. 8 and 9 is a state in which the protective tape 3 is attached to the grinding table 1 by extending the extending portion 3b between the chip attachment surface 3a and the frame ring 4, and before the attachment. In the state, the frame ring 4 and the protective tape 3 are flat and thin disk-shaped. The frame ring 4 is formed with four pressed portions 4a that extend radially outward at four locations every 90 °.

At the center of the chip attaching surface 3a of the protective tape 3, a gauge measuring wafer W is attached. A plurality of semiconductor chips T, which are divided from the wafer state and which are determined as non-defective, are attached around the gauge measurement wafer W along the circumferential direction. The semiconductor chip T is attached to the chip attaching surface 3a with the circuit forming surface facing down and the back surface serving as the ground surface facing up.

The protective tape 3 is, for example, an acrylic adhesive tape, and has a property that its adhesive strength is lowered by irradiation with ultraviolet rays. The thickness is, for example, 180 μm, but the semiconductor chip with solder bumps has, for example, 320 μm in order to absorb the solder bumps and prevent the semiconductor chip from tilting.
m protective tape is used.

Next, a method of attaching the protective tape 3 to which the semiconductor chip T is attached to the grinding table 1 will be described.

Before the attachment, the frame ring 4 and the protective tape 3 have a flat thin disk shape. First, the extending portion 3b between the frame ring 4 and the chip attaching surface 3a
Is pushed by a person with a finger from the side opposite to the surface on which the chip T is pasted to extend. Then, the back surface of the chip attaching surface 3a is adsorbed to the surface (chip supporting surface 9) of the porous member 2 that is vacuum-sucked, and each pressed portion 4a of the frame ring 4 is pressed by each pressing portion 5 of the pressing ring 5. A person manually turns the frame ring 4 to position it so that it is positioned below. After that, the pressing ring 5 is also pushed down by manual operation to tighten the pressed portion 4a of the frame ring 4 between the pressing portion 5 of the pressing ring 5 and the frame ring fixing surface 6.

As a result, the frame ring 4 is fixed to the frame ring fixing surface 6 at a position below the chip attaching surface 3a, and the back surface of the chip attaching surface 3a supports the chip due to the tension acting on the extending portion 3b. It is pressed against the surface 9, and stable grinding with enhanced adhesion can be performed.

As described above, the semiconductor chip T is installed on the grinding table 1 with the back surface (surface to be ground) facing upward through the protective tape 3. When this installation is completed, the grinding table 1 is moved to the position below the grinding means. This movement is performed by, for example, rotating an index table on which the grinding table 1 is placed. As shown by the alternate long and short dash line in FIG. 9, the grinding means is composed of a grinding disk 8 and a grinding wheel 8a intermittently arranged in a ring shape on the outer circumference of the lower surface of the grinding disk 8. While rotating the grinding disk 8 and the grinding table 1 together, the grinding disk 8 is lowered to press the grinding wheel 8a against the surface to be ground of the semiconductor chip T for grinding.

At the time of this grinding, the circuit forming surface of the semiconductor chip T is adhered to the protective tape 3 for protection,
It is possible to relieve the pressure from the grinding wheel 8a and prevent the grinding dust from adhering to the circuit forming surface. Further, a gauge measuring wafer W having the same thickness as the semiconductor chip T is also
The gauge measuring wafer W is ground together with the semiconductor chip T, and the thickness of the gauge measuring wafer W is measured by a gauge (not shown) during grinding. Therefore, the thickness of the semiconductor chip T can be obtained from the measured thickness of the gauge-measuring wafer W, and the thickness can be automatically ground to a predetermined size.

[0014]

Conventionally, as described above, as a method of stretching the extending portion 3b when the protective tape 3 is attached to the grinding table 1, a person pushes the extending portion 3b with a finger. This is troublesome, time consuming, and poor in workability. In particular, with a protective tape having a relatively large thickness for attaching a semiconductor chip with solder bumps, it is difficult to manually draw the protective tape. Further, since the surface side of the stretched portion 3b is locally bulged because it is stretched by pushing with a finger, and if the amount of bulging is large, that portion will be caught by the grinding wheel 8a and ground, and a suction error will occur. It may occur. Further, the extent of stretching is determined by the stretching portion 3b so that the back surface of the chip attaching surface 3a is pressed against the chip supporting surface 9 of the grinding table 1 in the state where the chip attaching surface 3a is attached to the grinding table 1 (FIG. 9). Must be adjusted to exert tension. In this way, the skill of the operator is required to control the pushing force of the finger.

The present invention has been made in view of the above-mentioned problems, and a semiconductor chip grinding apparatus and a grinding table in which the extending portion of the protective tape can be automatically and easily drawn and the protective tape can be easily attached to the grinding table. An object of the present invention is to provide a method of installing a semiconductor chip on a substrate.

[0016]

A semiconductor chip grinding apparatus according to claim 1 of the present invention comprises a grinding means for grinding a semiconductor chip affixed to a chip affixing surface of a protective tape stretched on a frame ring, and a chip affixing device. The frame ring is provided with a grinding table having a chip support surface for vacuum suction from the opposite side and a frame ring fixing surface for vacuum suction of the frame ring, which is located on the outer peripheral side of the chip support surface and below the chip support surface. It is arranged on the back side of the chip adhering surface of the holding means for holding and the protection tape in which the frame ring is held by the holding means, and is moved relatively to the direction of approaching the protection tape to press the protection tape from the back side. And a stretching means for stretching the stretched portion between the chip attaching surface and the frame ring, and the protective tape is attached to the chip with the stretched portion stretched. With the rear surface is vacuum adsorbed to the chip supporting surface of the frame ring is vacuum adsorbed to the frame ring fixing surface.

That is, the work of stretching the protective tape is changed from a manual work by an operator to an automated process. Installation to the grinding table can also be done by simply placing the frame ring on the vacuum suction surface.

According to a fourth aspect of the present invention, there is provided a semiconductor chip grinding apparatus in which a grinding means for grinding a semiconductor chip stuck to a chip sticking surface of a protective tape stretched on a frame ring, and a chip sticking surface are vacuumed from the opposite side. A grinding table having a chip supporting surface to be sucked and a frame ring fixing surface which is located below the chip supporting surface on the outer peripheral side of the chip supporting surface and vacuum sucks the frame ring, and the frame ring is directed to the frame ring fixing surface. Clamping means for fixing the frame ring to the frame ring fixing surface by sandwiching the frame ring between the chip attaching surface and the frame ring and extending the extending portion between the chip attaching surface and the frame ring. , Clamper driving means for driving the clamper means.

That is, the work of stretching the protective tape and the work of attaching it to the grinding table are collectively and automatically carried out at once using the power of a motor or a cylinder device.

According to a fifth aspect of the present invention, there is provided a method of mounting a semiconductor chip on a grinding table, which comprises a step of sticking a semiconductor chip to a chip sticking surface of a protective tape stretched on a frame ring with a surface to be ground facing upward. And the protective tape and the stretching means arranged on the back surface side of the chip attaching surface are relatively moved in a direction in which they are close to each other, and the protective tape is pressed from the back surface side by the extending means, and the chip attaching surface and the frame ring. And the step of stretching the stretched portion between the stretched portion and the back surface of the chip attaching surface of the protective tape stretched by the stretched portion is vacuum-sucked to the chip supporting surface of the grinding table, and the frame ring is attached to the outer peripheral side of the chip supporting surface. And a step of vacuum suction to the frame ring fixing surface located below the chip supporting surface,
Have.

That is, the work of stretching the protective tape is changed from a manual work by an operator to an automated process. Installation to the grinding table can also be done by simply placing the frame ring on the vacuum suction surface.

A method of mounting a semiconductor chip on a grinding table according to claim 8 of the present invention is a step of bonding a semiconductor chip with a surface to be ground facing upward to a chip bonding surface of a protective tape stretched on a frame ring. And a step of vacuum-sucking the back surface of the chip attaching surface of the protective tape to the chip supporting surface of the grinding table, and the frame ring by the clamper means driven by the clamper driving means on the outer peripheral side of the chip supporting surface. While pressing toward the frame ring fixing surface located below, the extending portion between the chip attaching surface and the frame ring is extended, and the frame ring is sandwiched between the clamper means and the frame ring fixing surface. Fixing the frame ring to the frame ring fixing surface.

That is, the work of stretching the protective tape and the work of attaching it to the grinding table are collectively and automatically carried out at once using the power of a motor or a cylinder device.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

The semiconductor chip grinding apparatus according to the first embodiment of the present invention comprises a stretching means 17 and a holding means 1 shown in FIG.
6a and 16b and FIGS. 1 and 2 ([2]-in FIG.
[2] A grinding table 11 shown in the sectional view in the direction of the line),
A grinding disk 8 (shown by a chain line in FIG. 2) having a grinding wheel 8a and a suction assisting means 12 are provided.

A recess 10 is formed in the central portion of the grinding table 11 which is elevated, and a porous porous member (for example, ceramic) 2 having air permeability is fitted into the recess 10. . The surface of the porous member 2 is flush with the surface of the central portion of the grinding table 11, and these surfaces form a circular chip supporting surface 9 for supporting the semiconductor chip T via the protective tape 3 during grinding. To do.
The recess 10 is connected to a vacuum system such as a vacuum pump (not shown) via the suction passage 7.

On the outer peripheral side of the chip support surface 9, a ring-shaped portion formed one step lower than the chip support surface 9 is provided with a porous member (for example, ceramic) 13 connected to a vacuum system via suction paths 15 and 7. It is fitted. The porous members 13 are arranged in a continuous ring shape or are arranged intermittently along the circumferential direction, and the surface thereof functions as a frame ring fixing surface. A stopper ring 11a is provided on the outermost peripheral surface of the grinding table 11.

The protective tape 3 has a substantially circular shape and is stretched on a metal frame ring 14. Specifically, the outer peripheral side end of the protective tape 3 is adhered to the lower surface of the frame ring 14. In the state shown in FIGS. 1 and 2, the protective tape 3 is
The extending portion 3b between the chip attaching surface 3a and the frame ring 14 is extended and attached to the grinding table 11, and the state before attachment is as shown in FIG. 3A. The protective tape 3 has a flat thin disk shape.

A gauge measuring wafer W is attached to the center of the chip attaching surface 3a of the protective tape 3. Around the gauge measurement wafer W, for example, a plurality of semiconductor chips T that have been divided from the wafer state and determined to be non-defective are attached along the circumferential direction. The semiconductor chip T is attached to the chip attaching surface 3a with the circuit forming surface facing down and the back surface serving as the ground surface facing up.

The protective tape 3 is, for example, an acrylic adhesive tape, and has a property that its adhesive strength is lowered by irradiation with ultraviolet rays. The thickness is, for example, 180 μm, but the semiconductor chip with solder bumps has, for example, 320 μm in order to absorb the solder bumps and prevent the semiconductor chip from tilting.
m protective tape is used.

Next, a method of installing the semiconductor chip T on the grinding table 11 via the protective tape 3 according to the present embodiment will be described.

First, on the chip attaching surface 3a of the protective tape 3 in a state where the extending portion 3b is not extended and the frame ring 14 and the protective tape 3 are flat and thin disk-shaped,
A plurality of semiconductor chips T and a gauge measurement wafer W are attached with the surface to be ground facing up.

Next, as shown in FIG. 3A, the frame ring 14 is held by holding means 16a and 16b, and the extending means 17 is arranged on the back side of the chip attaching surface 3a. The holding means 16a, 16b are configured to hold the frame ring 14 from above and below, and may have a ring shape along the frame ring 14, or may be intermittently arranged at equal intervals along the circumferential direction. . The stretching means 17 is a disc (made of, for example, metal) whose surface is heated to, for example, about 50 ° C. and which is vertically movable. The disc may be heated indirectly by a heater (not shown) or the disc itself may have a heater built therein.

Then, the stretching means 17 is brought closer to the protective tape 3 and brought into contact with the back surface of the chip attaching surface 3a, and the stretching means 17 is further moved (raised) to obtain the state of FIG.
As shown in FIG. 5, the stretching means 17 presses the back surface of the chip attaching surface 3 a of the protective tape 3 to extend the extending portion 3 b between the chip attaching surface 3 a and the frame ring 14.

Even if the stretching means 17 is disengaged from the protective tape 3, the stretched portion 3b remains in the stretched state, and in this state, the protective tape 3 adsorbs several points on the upper surface of the frame ring 14 by, for example, a robot hand. It is held and moved to above the grinding table 11, and the back surface of the chip attaching surface 3a is placed on the front surface (chip supporting surface 9) of the porous member 2 and is vacuum-sucked. Further, the frame ring 14 is also placed on the surface (frame ring fixing surface) of the porous member 13,
For example, the frame ring 14 is pushed downward by the rod-shaped suction assisting means 12 that is vertically moved by a cylinder, and is vacuum-sucked on the surface of the porous member 13. The role of the suction assisting means 12 is to obtain a reliable close contact between the frame ring 14 and the porous member 13. However, the vacuum suction force is sufficiently large and the frame ring 14 is simply placed on the porous member 1.
It is not always necessary as long as it can adhere to the surface of No. 3 without a gap.

Through the above steps, as shown in FIG. 2, the frame ring 14 is fixed to the surface (frame ring fixing surface) of the porous member 13 at a position lower than the chip attaching surface 3a and the extending portion 3b. The back surface of the chip attaching surface 3a is pressed against the chip supporting surface 9 by the tension acting on the chip attaching surface 3a, and stable grinding with enhanced adhesion can be performed.
Further, the outer peripheral side surface of the frame ring 14 abuts on the inner peripheral wall of the stopper ring, and the frame ring 14 is reliably positioned with respect to the porous member 13 to stabilize the fixation by vacuum suction.

As described above, the semiconductor chip T is mounted on the grinding table 11 with the back surface (surface to be ground) facing upward through the protective tape 3. When this installation is completed, the grinding table 11 is moved to a position below the grinding means. This movement is performed by, for example, the grinding table 11
This is done by rotating the index table on which is mounted.
The grinding means is composed of a grinding disk 8 and a grinding wheel 8a intermittently arranged in a ring shape on the outer circumference of the lower surface of the grinding disk 8. While rotating the grinding disk 8 and the grinding table 1 together, the grinding disk 8 is lowered to press the grinding wheel 8a against the surface to be ground of the semiconductor chip T for grinding.

At the time of this grinding, the circuit forming surface of the semiconductor chip T is adhered to and protected by the protective tape 3.
It is possible to relieve the pressure from the grinding wheel 8a and prevent the grinding dust from adhering to the circuit forming surface. Further, a gauge measuring wafer W having the same thickness as the semiconductor chip T is also
The gauge measuring wafer W is ground together with the semiconductor chip T, and the thickness of the gauge measuring wafer W is measured by a gauge (not shown) during grinding. Therefore, the thickness of the semiconductor chip T can be obtained from the measured thickness of the gauge-measuring wafer W, and the thickness can be automatically ground to a predetermined size.

As described above, in the present embodiment, the table 11 for extending the extending portion 3b and grinding the protective tape 3 is used.
The entire process of attaching to the can be fully automated, the workability can be improved compared to the past, and the burden on the worker is not required. In particular, the advantage of automating the stretching operation is great, and it is possible to easily stretch the protective tape having a large sheet thickness corresponding to the semiconductor chips with bumps developed in recent years to a desired stretching amount in a short time. It should be noted that the conventional work of stretching with a finger took about 5 minutes, but the stretching process shown in FIG. 3 of the present embodiment takes about 5 to 10 seconds, which greatly shortens the time and improves the production efficiency. Make a big contribution.

Further, by adjusting the movement amount and temperature of the stretching means 17 according to the material and thickness of the protective tape 3 and the width of the stretching portion 3b, the desired stretching amount can be easily obtained without skill. Can be controlled.

Next, a second embodiment of the present invention will be described. The same components as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

The semiconductor chip grinding apparatus according to the second embodiment of the present invention is shown in FIGS. 4 and 5 ([5]-in FIG. 4).
[5] Cross-sectional view in the line direction) shown in FIG.
A clamper means 23, a cylinder device 22 which is a clamper drive means, and a grinding disk 8 having a grinding wheel 8a.

A recess 10 is formed in the central portion of the grinding table 21 which is further raised, and a porous porous member (for example, ceramic) 2 having air permeability is fitted into the recess 10. . The recess 10 is connected to a vacuum system such as a vacuum pump (not shown) via the suction passage 7.

Surface of porous member 2 (chip supporting surface 9)
A ring-shaped frame ring fixing surface 21a is formed at a position one step lower than the chip supporting surface 9 on the outer peripheral side of the. Four clampers 23 are attached at 90 ° intervals along the circumferential direction on the outer peripheral side of the frame ring fixing surface 21a. These four clampers 23 constitute the clamper means according to the present invention.

Each clamper 23 has a substantially L-shaped cross section having a hook portion 23a, and is rotatably mounted around a rotary shaft P1 fixed to the grinding table 21. The lower end of the clamper 23 is of the cylinder device 22,
The rod 22a that expands and contracts in the horizontal direction is connected via a pin P2. Specifically, for example, the pin P2 is the rod 2
2a and the lower end of the clamper 23 has a pin P2.
It is rotatably connected around.

The structures of the protective tape 3 and the frame ring 14 are the same as those in the first embodiment. Then, similarly to the first embodiment, the gauge measurement wafer W is attached to the center of the chip attachment surface 3a of the protective tape 3, and the periphery of the gauge measurement wafer W is divided, for example, from the wafer state. A plurality of semiconductor chips T determined to be non-defective are attached along the circumferential direction.

Next, a method of mounting the semiconductor chip T on the grinding table 21 via the protective tape 3 according to the present embodiment will be described.

First, the chip attachment surface 3a of the protective tape 3 in a state where the extending portion 3b is not extended and the frame ring 14 and the protective tape 3 are flat and thin disk-shaped,
A plurality of semiconductor chips T and a gauge measurement wafer W are attached with the surface to be ground facing up.

Next, the protective tape 3 is moved to a position above the grinding table 21 by adsorbing and holding several points on the upper surface of the frame ring 14 by, for example, a robot hand, and the back surface of the chip attaching surface 3a is the front surface of the porous member 2. It is placed on (chip supporting surface 9) and vacuum-adsorbed. At this time, the hook portion 23a of the clamper 23 is attached to the frame ring fixing surface 2
It is off 1a.

Then, the cylinder device 22 is driven to drive the rod 22a thereof to move the clamper 23 to the rotating shaft P1.
Rotate around. By this rotation, the hook portion 23
a comes into contact with the upper surface of the frame ring 14, and further rotation causes the frame ring 14 to move to the frame ring fixing surface 21.
Press toward a. As a result, the chip attachment surface 3
The extending portion 3b between the a and the frame ring 14 is extended, and the hook portion 23a and the frame ring fixing surface 21 are formed.
The frame ring 14 is sandwiched between the frame ring 14a and the frame a, and the frame ring 14 is fixed to the frame ring fixing surface 21a.

Through the above steps, as shown in FIG. 5, the frame ring 14 receives the pressing force from the hook portion 23a of the clamper 23 at a position lower than the chip attaching surface 3a and receives the frame ring fixing surface 21a. Fixed to. At this time, the back surface of the chip attaching surface 3a is pressed against the chip supporting surface 9 by the tension acting on the extending portion 3b, and stable grinding with enhanced adhesion can be performed.

In the present embodiment, a series of steps of stretching the stretching portion 3b and attaching the protective tape 3 to the grinding table 21 can be automatically performed collectively and automatically. It is more efficient than the first embodiment in which the mounting step and the mounting step are separately performed. Besides, the same actions and effects as those of the first embodiment can be obtained.

Although the respective embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these.
Various modifications are possible based on the technical idea of the present invention.

In the stretching step shown in FIG. 3 in the first embodiment, the protective tape 3 and the frame ring 14 together with the holding means 16a and 16b are moved to the stationary stretching means 17 without moving the stretching means 17. You may make it move with respect to it. Alternatively, they may be moved in a direction to bring them closer to each other.

In the second embodiment, the clamper 23
May be fixed to the rotary shaft P1, the rotary shaft of the motor may be connected to the rotary shaft P1, and the clamper 23 may be rotated by the rotation of the rotary shaft of the motor. At this time, in order to apply a large pressing force to the frame ring 14, a gear is interposed between the rotary shaft of the motor and the rotary shaft P1. Further, the number of clampers 23 is not limited to four, and if the number is increased, the stretching can be performed more smoothly and easily. At this time,
In order to uniformly stretch the stretching portion 3b in the circumferential direction, it is preferable that the plurality of clampers 23 be arranged at equal angular intervals along the circumferential direction.

Alternatively, as shown in FIGS. 6 and 7, one ring-shaped clamper 33 may constitute the clamper means. In this case, the clamper 33 of the cylinder device 32 is
It is configured to be connected to a rod 32a that expands and contracts in the vertical direction and move vertically with respect to the frame ring fixing surface 31a of the grinding table 31. At this time, when attaching / removing the protective tape 3 and the frame ring 14 to / from the grinding table 31, the clamper 3 should be moved vertically.
Since the hook portion 33a of No. 3 interferes, it is attached / removed by sliding in the horizontal direction.

[0057]

By automatically stretching the stretched portion of the protective tape using the stretching means, the protective tape can be easily attached to the grinding table in a short time. Also, the degree of stretching can be optimally adjusted without variation. Further, by using the suction assisting means, the frame ring can be securely fixed to the frame ring fixing surface. Further, by using the heated stretching means, even a material having a low stretchability can be easily stretched.

By using the clamper means driven by the clamper driving means, the frame ring is pressed toward the frame ring fixing surface, thereby extending the extending portion and fixing the frame ring to the frame ring fixing surface. This can be done collectively in the same process, and the protective tape can be efficiently attached to the grinding table in a shorter time.

[Brief description of drawings]

FIG. 1 is a plan view of a grinding table according to a first embodiment of the present invention.

2 is a cross-sectional view taken along line [2]-[2] in FIG.

FIG. 3 is a diagram for explaining the stretching action of the protective tape in the first embodiment.

FIG. 4 is a plan view of a grinding table according to a second embodiment of the present invention.

5 is a cross-sectional view taken along line [5]-[5] in FIG.

FIG. 6 is a plan view of a grinding table according to a modified example of the present invention.

7 is a sectional view taken along line [7]-[7] in FIG.

FIG. 8 is a plan view of a conventional grinding table.

9 is a cross-sectional view taken along the line [9]-[9] in FIG.

[Explanation of symbols]

2 ... Porous member, 3 ... Protective tape, 3a ... Chip attachment surface, 3b ... Extending part, 8 ... Grinding disk, 8a.
Grinding wheel, 9 ... Chip support surface, 11 ... Grinding table, 12 ... Adsorption assisting means, 13 ... Porous member, 1
4 ... Frame ring, 16a, 16b ... Holding means,
17 ... Stretching means, 21 ... Grinding table, 21a ...
… Frame ring fixed surface, 23 …… Clamper, 31 ……
Grinding table, 31a ... Frame ring fixed surface, 3
3 ... Clamper, T ... Semiconductor chip, W ... Gauge measuring wafer.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) // B24B 37/04 B24B 37/04 H

Claims (8)

[Claims] 1. A grinding means for grinding a semiconductor chip attached to a chip attachment surface of a protective tape stretched on a frame ring, a chip support surface for vacuum-adsorbing the chip attachment surface from the opposite side, and the chip support surface. A grinding table having an outer peripheral side below the chip support surface and having a frame ring fixing surface for vacuum-sucking the frame ring; holding means for holding the frame ring; and the frame ring by the holding means. Is disposed on the back surface side of the chip attaching surface of the protective tape that is held, is moved relative to the protection tape relative to press the protection tape from the back surface side, the chip attaching surface and A stretching means for stretching a stretched portion between the frame ring and the frame ring, wherein the protective tape is in a state where the stretched portion is stretched, Together with the rear surface of the-up application surface is vacuum adsorbed to the chip supporting surface, the semiconductor chip grinding apparatus, characterized in that the frame ring is vacuum adsorbed to the frame ring fixed surface. 2. The semiconductor chip grinding apparatus according to claim 1, further comprising suction assisting means for pushing the frame ring to assist vacuum suction of the frame ring to the frame ring fixing surface. 3. The semiconductor chip grinding apparatus according to claim 1, wherein the stretching means is heated. 4. A grinding means for grinding a semiconductor chip attached to a chip attachment surface of a protective tape stretched on a frame ring, a chip support surface for vacuum-adsorbing the chip attachment surface from the opposite side, and the chip support surface. Of the grinding table, which is located below the chip supporting surface on the outer peripheral side of the frame ring and has a frame ring fixing surface for vacuum-sucking the frame ring, and the frame ring is pressed toward the frame ring fixing surface, While extending the extending portion between the chip attaching surface and the frame ring, sandwiching the frame ring between the frame ring fixing surface,
A semiconductor chip grinding apparatus comprising: a clamper unit for fixing the frame ring to the frame ring fixing surface; and a clamper driving unit for driving the clamper unit. 5. A step of sticking a semiconductor chip to a chip sticking surface of a protective tape stretched on a frame ring with a surface to be ground up, and the protective tape and the chip sticking surface are arranged on the back surface side. A step of relatively moving the stretching means and a direction of approaching each other, pressing the protective tape from the back side by the stretching means, and stretching the stretched portion between the chip attaching surface and the frame ring. The vacuum ring is attached to the chip supporting surface of the grinding table by the back surface of the chip attaching surface of the protective tape in which the extending portion is stretched, and the frame ring is formed on the outer peripheral side of the chip supporting surface from the chip supporting surface. A method of mounting a semiconductor chip on a grinding table, the method comprising: vacuum suction to a frame ring fixing surface located below. 6. The grinding according to claim 5, wherein during the step of vacuum-sucking the frame ring to the frame ring fixing surface, the suction assist means pushes the frame ring to assist the vacuum suction. Method of mounting semiconductor chips on a table for use. 7. The method of mounting a semiconductor chip on a grinding table according to claim 5, wherein the stretching means is heated and the protective tape is pressed from the back surface side by the heated stretching means. . 8. A step of adhering a semiconductor chip with a surface to be ground up to a chip adhering surface of a protective tape stretched on a frame ring, and a back surface of the chip adhering surface of the protective tape is a chip of a grinding table. A step of vacuum-adsorbing to the supporting surface, and pressing the frame ring toward a frame ring fixing surface located below the chip supporting surface on the outer peripheral side of the chip supporting surface by a clamper means driven by a clamper driving means. Then, the extending portion between the chip attaching surface and the frame ring is extended, and the frame ring is sandwiched between the clamper means and the frame ring fixing surface, and the frame ring is attached to the frame ring. And a step of fixing the semiconductor chip to a fixed surface, the step of fixing the semiconductor chip to the grinding table.