JPH05343894A - Inserting method for electronic component - Google Patents

Abstract

PURPOSE:To ensure reliability on insertion without depending upon the magnitude of the quantity of a spring back after the lead of an electronic is molded. CONSTITUTION:Pitches at the time of the molding of leads 18 are set arbitrarily by an electronic component 15 having the leads 18 composed of various wire diameters and materials at both ends to be inserted in the direction of an axial center, and pitches at the time of insertion can be set at fixed pitches. Accordingly, the leads 18 of the electronic component 15 at fixed pitches can be inserted into the inserting holes 23 of a substrate 20 in the optimum quantity of a spring back at all times without depending upon the magnitude of the quantity of the spring back after the leads 18 of the electronic component 15 are molded, thus ensuring high reliability on insertion.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component inserting method, and more particularly to an electronic component inserting method for inserting an electronic component into a predetermined position.

[0002]

2. Description of the Related Art A conventional electronic component inserting method has steps shown in FIG. 6, and an electronic component inserting apparatus used in an application example thereof has a structure shown in FIG. That is, the insert unit 2 into which the lead wire 4 of the electronic component 1 having the lead wires made of various wire diameters and materials at both ends in the axial direction is inserted after being molded into a predetermined shape, and the arrow with the insert unit 2 held. The variable pitch unit 3 is movable in the insertion pitch direction E shown. The insertion unit 2 has a V groove 20 at the lower end and pushers the lead wire 4 of the molded electronic component 1 into a predetermined insertion hole 6 of the substrate 5 for insertion, a molding lever 8 that can be opened and closed, and an electronic unit. The lead wire 4 of the component 1 is formed and is composed of an insertion guide 10 having a V groove 9 for guiding the insertion. In addition, the pitch variable unit 3 includes the carrier 11 that moves in the insertion pitch direction E while holding the insertion unit 2 and the ball screw 1.
2. The pulse motor 13 was used.

As shown in FIG. 8, the center position of the lead wire 4 with respect to the V groove 9 of the insertion guide 10 differs depending on the wire diameter of the lead wire 4 of the electronic component 1 to be inserted, so that the substrate 5
In order to align the center of the insertion hole 6 with the center of the lead wire 4, the pitch of the insertion unit 2 is corrected and the electronic component 1 is corrected.
The lead wire 4 was molded into a predetermined shape and inserted.

[0004]

In the above structure, after the lead wire 4 of the electronic component 1 is molded, the lead wire 4 is pressed against the V groove 9 of the insertion guide 10 by spring back, and the electronic component 1 is As shown in FIG. 9, it does not fall off and stays in its place, and is pushed by the pusher 7 to move in the insertion direction F indicated by the arrow for the first time. However, the amount of springback varies depending on the wire diameter and the material of the lead wire 4 of the electronic component 1 and may not be sufficient. In such a case, the electronic component 1
After the lead wire 4 is molded, the electronic component 1 is dropped along the V groove 9 of the insertion guide 10 before being pushed in by the pusher 7 without being left there. When the balance between the left and right is unbalanced, as shown in FIG. 10, it is inserted in a floating state, and the insertion reliability is reduced.
On the contrary, if there is too much spring back,
As described above, when there is a gap between the lower end surface of the insertion guide 10 and the substrate 5, the tip end of the lead wire 4 spreads out, and the insertion reliability is lowered because the lead wire 4 does not enter the insertion hole 6.

The present invention is to solve the above-mentioned conventional problems, and the lead wires of an electronic component having a predetermined pitch are inserted into the insertion holes of the substrate without being influenced by the amount of springback of the lead wire of the electronic component after molding. An object of the present invention is to provide an electronic component insertion method with high insertion reliability that enables insertion.

[0006]

In order to achieve the above object, the electronic component inserting method of the present invention uses an electronic component having lead wires made of various wire diameters and materials at both ends in the axial direction to be inserted. The pitch at the time of molding can be set arbitrarily and the pitch at the time of insertion can be set to a predetermined pitch.

[0007]

According to this insertion method, when the amount of spring back after forming the lead wire of the electronic component is large, the lead wire pitch is formed smaller than the pitch of the insertion hole of the board, and then the insertion hole is formed at a predetermined insertion pitch. If the amount of springback is small, on the contrary, if the lead wire pitch is made larger than the pitch of the insertion hole of the board and then inserted into the insertion hole at the specified insertion pitch, Therefore, it is possible to secure a high insertion reliability in which the lead wires of the electronic component having a predetermined pitch can be inserted into the insertion holes of the substrate with a constant springback amount regardless of the above.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component inserting method according to an embodiment of the present invention will be described below with reference to the drawings.

First, referring to FIGS. 2 and 3, the electronic component inserting apparatus used in this embodiment has a predetermined lead wire 18 of an electronic component 15 having lead wires made of various wire diameters and materials at both ends in the axial direction. It is composed of an insertion unit 16 which is inserted into the insertion direction F indicated by an arrow after molding in the shape of, and a pitch variable unit 17 which is movable in the insertion pitch direction E indicated by an arrow while holding the insertion unit 16.

The insertion unit 16 is an electronic component 1 to be inserted.
5 has a V groove 19 for receiving the lead wire 18 for forming the lead wire 18 for regulating the lead wire 18 of No. 5 in a direction perpendicular to the axial direction of the lead wire 18 and forming the lead wire 18 at a constant insertion pitch. A pair of pushers 21 for pushing the wire 18 into the substrate 20 and a pair of pushers 21 are provided corresponding to the pushers 21, and the V of the pusher 21 is formed when the lead wire 18 of the electronic component 15 is molded.
The pair of molding levers 22 that prevent the lead wire 18 from falling out of the groove 19 and that can be molded into a predetermined shape and that can swing with respect to the pusher 21, and the lead wire 1
8 is bent along the molding lever 22 and the tip of the molded lead wire 18 is inserted into the predetermined insertion hole 2 of the substrate 20.
3 is provided with a pair of insertion guides 25 each having a V groove 24 for guiding the pusher 21 and the insertion guides 25. The forming lever 22 is swingably supported by a guide block 26. The insertion guide 25 is inserted into a horizontal shaft 30 supported by a block 27, and the pair of insertion guides 25 and the pusher 21 provided facing each other are provided in the block 2 respectively.
It is moved up and down in conjunction with the lifting of 7, 29. Molding lever 2
2 is a horizontal shaft 32 supported by a block 31
And is rocked in conjunction with the elevation of the block 31.

The pitch changing unit 17 has a pair of carriers 33 that move in the insertion pitch direction E while holding the insertion unit 16, and a screw direction is opposite to the left and right with respect to the machine center line 34 so that the pitch changing unit 17 can rotate. Each carrier 33 is composed of a ball screw 35 capable of changing the pitch evenly in the insertion pitch direction E around the machine center line 34 and a pulse motor 36 for rotating the ball screw 35 by a predetermined amount. The pitch variable unit 17 allows the pitch of the insertion unit 16 to be corrected. Here, as shown in FIG. 4, X is a value of an appropriate amount of springback after molding. In addition, the pitch of the insertion unit 16 (here, one of the insertion guides 2
L is the distance from the bottom of the V groove 24 of No. 5 to the bottom of the V groove 24 of the insertion guide 25 facing this.

Next, a concrete description will be given according to the steps of the electronic component inserting method shown in FIG. As a condition, the lead wire 18
The insertion pitch is P, the wire diameter of the lead wire 18 is D, and the electronic component 15 whose springback amount after molding is X ₁ is to be inserted.

(Pitch correction for wire diameter) Electronic component 1 to be inserted
Depending on the diameter of the lead wire 5 of 5, the V groove 2 of the insertion guide 25
Since the center position of the lead wire 18 is different from that of the lead wire 4, the pitch L of the insertion unit 16 is corrected in order to align the center of the insertion hole 23 of the substrate 20 with the center of the lead wire 18. The pitch L of the insertion unit 16 is corrected,
L = P + D (see FIGS. 5a and 5b).

(Pitch correction for springback amount) Sp
The pitch correction amount for the ringback amount is 2 (XX₁) Tona
When combined with the above wire diameter pitch correction, the insertion unit 1
The pitch L of 6 is L = P + D + 2 (X-X ₁).

When the (molding) block 29 is lowered, the V groove 19 of the pusher 21 is lowered to a position where it abuts the molding lever 22, and at the same time, the lead wire 18 of the electronic component 15 is held. Next, the insertion guide 2 is moved by lowering the block 27.
The lead wire 18 is bent and formed along the forming lever 22 by the V groove 24 at the same time as 5 is lowered to a position where it abuts on the substrate 20.

(Pitch correction cancellation for springback amount)
After molding, pitch correction amount for springback amount 2 (XX
₁ ) is released, and the pitch of the insertion unit 16 is only the wire diameter pitch correction, and L = P + D.

For this reason, the pitch of the insertion unit 16 which is a regular pitch is 2 when compared with that at the time of molding when XX ₁ > 0.
It becomes narrower by (X−X ₁ ), and when X−X ₁ <0, it becomes wider than that at the time of molding by 2 (X−X ₁ ), and the springback amount becomes the optimum value X (FIG. 5c). , D)).

(Insertion) The rising of the block 31 causes the molding lever 22 to swing away from the pusher 21 and to a position where the lowering of the pusher 21 is not hindered. After that, the pusher 21 is lowered by descending the block 29.
Is lowered, and the lead wire 18 is inserted into the predetermined insertion hole 23 of the substrate 20.
, And the insertion operation of the lead wires 18 of the electronic component 15 at a regular pitch is completed. After that, blocks 27 and 29
Rises, the block 31 descends, and the insertion guide 25, the pusher 21, and the molding lever 22 return to the original state.

As described above, according to this insertion method, when the amount of spring back after forming the lead wire of the electronic component is large, the lead wire pitch is formed smaller than the pitch of the insertion hole of the substrate, and then the predetermined insertion is performed. Insert into the insertion hole at a pitch,
Conversely, when the springback amount is small, the leadback pitch is formed larger than the pitch of the insertion hole of the board and then inserted into the insertion hole at a predetermined insertion pitch, depending on the amount of springback. Instead, it is possible to secure high insertion reliability in which the lead wires of the electronic component having a predetermined pitch can be always inserted into the insertion hole of the substrate with a constant springback amount.

[0020]

As is apparent from the above description of the embodiments, according to the electronic component insertion method of the present invention, the pitch at the time of molding is arbitrarily set according to the electronic component to be inserted, and the pitch at the time of insertion is set. Since the pitch can be set to a predetermined pitch, high insertion reliability can be secured without being affected by the amount of springback of the electronic component after the lead wire is formed.

[Brief description of drawings]

FIG. 1 is a block diagram showing steps of an electronic component inserting method according to an embodiment of the present invention.

FIG. 2 is a front sectional view of an electronic component inserting device used in the electronic component inserting method.

3 is an AA arrow view showing the main part of FIG.

FIG. 4 is an explanatory view showing an insertion guide in a state of holding an electronic component after a molding step of an electronic component inserting method according to an embodiment of the present invention.

FIG. 5 is an explanatory view showing an insertion guide in a state of holding an electronic component after a molding step of an electronic component inserting method according to an embodiment of the present invention.

FIG. 6 is a block diagram showing steps of a conventional electronic component insertion method.

FIG. 7A is a front cross-sectional view of an electronic component insertion device used in a conventional electronic component insertion method, and FIG. 7B is a view taken along the line BB in FIG.

FIG. 8 shows a lead wire having a large wire diameter or a lead wire having a small wire diameter showing a positional relationship between a lead wire of an electronic component after a molding step of a conventional electronic component insertion method, an insertion hole of a substrate, and an insertion guide. Bottom view of the insertion guide

FIG. 9 is a front sectional view showing an essential part of the electronic component inserting device in the inserting step.

FIG. 10 is a front cross-sectional view showing a main part of the electronic component insertion device in a state where the electronic component has fallen off the insertion guide.

FIG. 11 is a front cross-sectional view showing the main part of the electronic component insertion device in a state where the tip ends of the lead wires of the electronic component have spread and have not entered the insertion holes of the substrate.

[Explanation of symbols]

15 electronic parts 18 lead wire 20 board 23 insertion hole L pitch of insertion unit P insertion pitch of lead wire D diameter of lead wire X proper amount of springback X ₁ amount of springback

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akio Yamagami 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. A method of inserting a lead wire of an electronic component having lead wires made of various wire diameters and materials at both ends in an axial direction into an insertion hole of a substrate, wherein a pitch correcting step for wire diameter and a spring back are performed. An electronic device that has a quantity pitch correction step, a molding step, a springback quantity pitch correction cancellation step, and an insertion step, and can arbitrarily set the pitch of the molding step and set the pitch during insertion to a predetermined pitch. How to insert parts.