JPH05339554A - Epoxy adhesive containing aggregate - Google Patents

Abstract

PURPOSE:To obtain a low-cost adhesive having a necessary adhesive power and used for bonding a concrete flooring to a vibration-damping steel sheet. CONSTITUTION:An adhesive compsn. comprising a bisphenol A or F epoxy resin having an epoxy equivalent of 100-300g/eq as the main component and a curing agent having active hydrogen atoms reactive with epoxy groups and consisting of at least one compd. selected from the group consisting of a polyamine, polyamideamine, and their modifications is compounded with 10-70vol.% aggregate having a max. particle size of 1mm or lower or with 10-70vol.% mixture of an aggregate having a max. particle size of 1mm or lower with a filler having a max. particle size of 300mum or lower.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive for damping steel sheets used for producing a sound-insulating composite floor composed of concrete floor material and damping steel sheet.

[0002]

2. Description of the Related Art In the production of sound-insulating composite floors, a concrete floor material such as a concrete slab or a lightweight cellular concrete slab and a damping steel plate are closely adhered to each other. Agent is used. This is because epoxy adhesives can bond almost anything, including metals.

[0003]

However, a concrete floor material usually has small irregularities and undulations on its surface. If there is a gap between the concrete floor material and the vibration-damping steel plate, the bending deformation of concrete cannot be sufficiently transmitted to the vibration-damping steel plate, so that sufficient vibration damping performance as a sound-insulating composite floor cannot be obtained. Therefore, it is necessary to bond the damping steel plate to a place where the unevenness and undulations of the surface of the concrete floor material are leveled. Sufficient adhesive strength can be obtained by using a conventional epoxy adhesive as the level adjusting material, but a large amount is used, resulting in an increase in cost. It is also possible to use self-leveling mortar, but in that case,
The strength of the self-leveling mortar and the adhesive strength with the concrete floor material must be fully considered.

The present invention has been made to solve this problem and is inexpensive and necessary by mixing a specific epoxy adhesive with an aggregate or a filler having a diameter not more than a predetermined value in a predetermined ratio. It is an object of the present invention to provide an adhesive having a bonding force between a concrete floor material and a vibration damping steel plate.

[0005]

The adhesive of the present invention comprises a bisphenol A type or F type epoxy resin having an epoxy equivalent of 100 to 300 g / eq as a main component, and a polyamide or polyamide amine having active hydrogen which reacts with an epoxy group. Alternatively, one or more of these modified materials is used as a curing agent, and the aggregate having a maximum particle diameter of 1 mm or less or the filler and the filler having a maximum particle diameter of 300 μm or less are included as 10 to 70 volume% components of the whole. is there.

[0006]

In the present invention, a specific amount of aggregate or a mixture of aggregate and filler is mixed with a specific epoxy adhesive so that the epoxy adhesive with the required adhesive strength between the concrete floor material and the steel plate can be obtained. It is possible to increase the volume. Therefore, by using the adhesive of the present invention as a leveling material on the surface of a concrete floor and also as an adhesive for a damping steel plate to the concrete floor, it is possible to reduce the cost of the sound-insulating composite floor.

[0007]

EXAMPLE An epoxy adhesive containing aggregates of the present invention is a main component of a bisphenol A type or F type epoxy resin having an epoxy equivalent of 100 to 300 g / eq, and contains polyamine, polyamidoamine or polyamine having active hydrogen which reacts with an epoxy group. At least one or more aggregates such as silica sand, slag, silicon carbide, alumina, sintered bauxite, emery, surrogate stone or glass beads having a maximum particle diameter of 1 mm or less are used as a hardening agent by using one or more of these modified materials as a hardening agent. It is 10 to 70% by volume, preferably 30 to 60% by volume, based on the total volume of the adhesive.

The epoxy resin type bisphenol A is most preferable in terms of versatility and economy. The bisphenol F type has a lower viscosity than the bisphenol A type, and has an advantage that crystallization does not easily occur even when the temperature is low. Bisphenol A
When the epoxy equivalent of the F type or the F type is less than 100 g / eq, the viscosity is low, but the reactivity is low, and therefore the strength is lowered in the same formulation. On the other hand, the epoxy equivalent is 300 g /
If it exceeds eq, the viscosity becomes too high, and the strength and workability deteriorate with the same composition. A suitable viscosity of the resin component, which is a combination of the main agent and the curing agent, is 200 poise (20 ° C.) or less. Reactive diluents may be incorporated to achieve this. 200
If it exceeds the poise, the amount of the aggregate that can be compounded becomes small and the initial purpose cannot be achieved. Further, if the maximum particle diameter of the aggregate exceeds 1 mm, the workability is deteriorated and it becomes difficult to spread the adhesive thinly, and the initial purpose cannot be achieved.

The compounding ratio of aggregate to epoxy adhesive is 10
% Or less, the desired cost improvement cannot be achieved so much, while
If it is 70% or more, the strength and workability are significantly deteriorated. Also,
The particle size distribution of the aggregate greatly affects strength and workability, and it is desirable that the maximum particle size of the aggregate is 1 mm or less and the average particle size is 0.5 mm or less.

In addition to the aggregate, if at least one filler such as alumina, talc, fly ash, titanium oxide, graphite, calcium carbonate, slag having a maximum particle size of 300 μm or less is included, it is compared with the one containing only the aggregate. An adhesive having even higher adhesive strength can be obtained. In this case, since the fluidity of the adhesive will be poor, careful attention must be paid when blending. A spherical powder such as spherical silica or fly ash can improve the fluidity and further reduce the amount of resin within the range allowed by the strength. The preferable mixing ratio of the aggregate and the filler is approximately 3: 1 by weight. When the maximum particle diameter of the aggregate is 1 mm or less and the average particle diameter is 0.5 mm, the filler has an average particle diameter of 7
Particles of about 0 μm and particles having an average particle diameter of about 20 μm, for example, granulated slag powder (4500 branes of slag fine powder are used as a starting material, and 8000 branes of slag fine powder are produced in a classifying process 1600. ~ 1
Slag powder of about 800 branes) is added.

[0011]

[Table 1]

Table 1 shows a compounding example of the epoxy adhesive containing aggregate of the present invention. The main agent is epoxy equivalent 21
Bisphenol A type epoxy resin having a viscosity of 9 to 14 poise (25 ° C.) at 7.5 g / eq and a curing agent having an amine value of 235.
A fatty acid-modified polyamidoamine having a viscosity of 50 to 100 poise (25 ° C.) in g / eq was used, a reactive diluent was further used, and Soma silica sand having different particle sizes was used as an aggregate.

[0013]

[Table 2]

Table 2 shows that 100 g / m ² of a wash primer is applied to ^two steel plates having a side of 5 cm by spraying,
These are the results of applying each adhesive of Table 1 to one of the steel plates to a thickness of 3 mm with a bar coater, bonding two steel plates, and performing a tensile test after curing. This gives A,
It was found that each of the adhesives B and C had sufficient strength to withstand use.

[0015]

[Table 3]

Table 3 shows the results obtained by bonding the steel sheet and the concrete using the conventionally used adhesive (a) and the adhesives (b)-(b) containing aggregates of the present invention having different compositions and determining the bonding strength. is there. The filler used in the adhesive E in Table 3 is
It is a fine powder slag having a Blaine specific surface area of 4500 cm ² / g obtained by finely pulverizing the granulated slag with a roller mill. For the measurement, remove oil from the steel plate with acetone, apply 100 g / m ^{2 of} the wash primer by spraying, apply each adhesive to the steel plate with a bar coater to a thickness of 3 mm, and then clean and adjust the surface. A method was used in which it was adhered to a concrete treated with a sealer by airless spray, cured for 3 days, and then measured. The adhesive strength when used in the production of a sound-insulating composite floor composed of a concrete floor material and a vibration-damping steel plate should be approximately 10 kgf / cm ² or more, and any of the adhesives 1 to ^{2 of} the present invention can be used. Proved to be.

FIG. 1 is an enlarged view of a joint between a concrete floor material and a damping steel plate using an epoxy adhesive containing aggregate, and FIG.
Shows a perspective view of a sound-insulating composite floor using damping steel plates. In the figure, 1 is a concrete floor material, 2 is a damping steel plate, 3 is a spacer that prevents the adhesive from adhering to the side surface of the damping steel plate 2, and 4 is an epoxy adhesive containing aggregate. However, the spacer 3 has flexibility so as not to restrain the shear displacement of the damping steel plate 2. In addition, the concrete as the concrete flooring material, ordinary concrete,
Includes lightweight concrete and lightweight cellular concrete.

[0018]

According to the epoxy adhesive containing aggregate of the present invention, the adhesive having the adhesive strength required for the adhesion between the concrete floor material and the vibration-damping steel plate is used, and only the amount of the aggregate material or the aggregate material and the filling material is increased. Adhesives having a higher volume than epoxy adhesives have been obtained. Therefore, in bonding the concrete floor material and the vibration damping steel plate, by using the epoxy adhesive containing aggregate as the level adjusting material and the adhesive, the conventional epoxy adhesive is also used as the level adjusting material. Compared with the case of using it, a significant cost reduction can be achieved, and it is not necessary to pay attention to the strength and the adhesive strength with the concrete floor material as in the case of using self-leveling mortar.

[Brief description of drawings]

FIG. 1 is an enlarged view of a joint between a concrete floor material and a damping steel plate.

FIG. 2 is a perspective view of a sound insulation composite floor.

[Explanation of symbols]

 1 Concrete floor material 2 Damping steel plate 3 Spacer 4 Epoxy adhesive with aggregate

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Jun Ninomiya 1-2, Marunouchi, Chiyoda-ku, Tokyo Nihon Kokan Co., Ltd. (72) Hisaya Kamura 1-2-1, Marunouchi, Chiyoda-ku, Tokyo Nihon Steel Pipe Co., Ltd. (72) Inventor Noboru Kaneko 1-2-1, Marunouchi, Chiyoda-ku, Tokyo Nihon Steel Pipe Co., Ltd.

Claims (1)

[Claims] 1. A curing agent comprising, as a main component, a bisphenol A type or F type epoxy resin having an epoxy equivalent of 100 to 300 g / eq and having active hydrogen capable of reacting with an epoxy group, a polyamide, a polyamidoamine or a modified product thereof. An epoxy adhesive containing an aggregate, comprising: an aggregate having a maximum particle diameter of 1 mm or less or a filler having a maximum particle diameter of 300 μm or less in an amount of 10 to 70% by volume.