JPH05338769A - Ranged supply device for electronic part chip - Google Patents

Abstract

PURPOSE:To smooth the movement of electronic part chips in a ranged supply device for electronic part chips. CONSTITUTION:A chamber 17 for receiving a plurality of electronic part chips is provided on the inlet 16 side of a ranging passage 15, and the chamber 17 has a gate 20 having an opening 19 allowing the pass of the electronic part chips, so that the chamber 17 is partially partitioned by the gate 20 to form a small chamber 18 near the inlet 16 of the ranging passage 15. A part of the wall surface for regulating the opening 19 of the gate 20 and a part of the wall surface of the small chamber 18 continued thereto are formed by a displaceable movable block 24.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a plurality of electronic component chips (including passive components, active components, and other electrical components,
In addition to chip parts as finished products, it also includes parts as semi-finished products. ) Of the electronic component chip aligning and supplying apparatus while supplying them in an aligned state in a predetermined direction, and in particular, a plurality of electronic component chips in such an electronic component chip aligning and supplying apparatus are provided. The present invention relates to improvement for smooth movement.

[0002]

2. Description of the Related Art The applicant of the present invention has disclosed in Japanese Patent Laid-Open No. 63-27268
As described in Japanese Patent Publication No. 6, an electronic component chip storage cassette used to supply a plurality of electronic component chips to an electronic component chip alignment supply device has been proposed.

The above-mentioned electronic component chip storage cassette basically has a plurality of electronic component chips and a storage space for storing these electronic component chips therein, and an outlet for discharging the electronic component chips. The case includes a case formed in communication with the storage space and an openable lid that closes the discharge port. Such an electronic component chip storage cassette, as it is, is not only applied as a packaging form when an electronic component chip manufacturer ships an electronic component chip, but on the consumer side of the electronic component chip,
It can be mounted as it is on the electronic component chip aligning and supplying device provided in the chip mounting machine, and can be applied to supply a plurality of electronic component chips to the chip mounting process.

FIG. 11 shows a conventional electronic component chip alignment supply device 1. The alignment supply device 1 communicates with the alignment passage 2 and an alignment passage 2 that guides a plurality of electronic component chips (not shown in FIG. 11) to move in an aligned state in a predetermined direction. In addition, a space 4 having a larger cross section than the alignment passage 2 is defined on the inlet 3 side of the alignment passage 2, and a room 4 for accommodating a plurality of electronic component chips is provided. Further, a gate 7 having an opening 6 that allows passage of electronic component chips is provided so that a small room 5 is formed in the vicinity of the entrance 3 of the alignment passage 2 by partitioning a part of the room 4. ..

The electronic component chip storage cassette described above is
It is mounted on the aligning and supplying apparatus 1 with its outlet facing the opening 8 of the chamber 4 of the aligning and supplying apparatus 1. In this state, if the lid of the cassette is opened, the plurality of electronic component chips stored in the storage space of the cassette will be ejected from the outlet to the room 4.
Supplied within.

As described above, the plurality of electronic component chips stored in the room 4 pass through the opening 6 of the gate 7 and the small room 5.
It enters inside and finally reaches the alignment passage 2. In FIG. 11, the angle 9 is selected to be, for example, about 45 degrees, so that the movement of the electronic component chip as described above is caused substantially by the gravity acting on the electronic component chip. A path extending in the horizontal direction is provided on the outlet 10 side of the alignment passage 2, but electronic component chips are taken out one by one from the outlet 10 of the alignment passage 2 based on vacuum suction. In addition,
The alignment passage 2 may have the slope provided at its inlet 3 to the outlet 10.

FIG. 12 shows a sectional view of a portion of the gate 7. When there are a large number of electronic component chips in the room 4, the gate 7 is located in a relatively lower electronic component chip, for example, in the small chamber 5, due to the gravity given from each of the electronic component chips. It is possible to prevent the electronic component chips from being clogged with each other and hinder their movement, and to reduce the gravity applied to the electronic component chips in the small chamber 5 regardless of the number of the electronic component chips existing in the room 4. This is to keep it constant.

[0008]

In order to stably supply the electronic component chips from the small chamber 5 to the alignment passage 2 in the above-described aligning and supplying apparatus 1, the small chamber 5 needs to have a certain size. is there. However, if the small chamber 5 is too large, it takes time to drop the electronic component chips, and the supply speed cannot be increased. On the other hand, if the small chamber 5 is too small, a plurality of electronic component chips are clogged, which may hinder the smooth movement of the electronic component chips.

As described above, by providing the gate 7, the above-mentioned clogging can be prevented to some extent.
On the other hand, by providing the gate 7, as shown in FIG.
In the opening 6 of the gate 7, a plurality of electronic component chips 11 stick to each other, so-called "bridge phenomenon"
May occur. Thus, once the "bridge phenomenon" occurs, it becomes impossible to supply the electronic component chips into the small chamber 5. The inner peripheral surface of the opening 6 of the gate 7 shown in FIG. 12 is rounded, which makes it more difficult for the "bridge phenomenon" to occur. Phenomenon has occurred.

Therefore, an object of the present invention is to provide an electronic component chip aligning and supplying apparatus capable of eliminating the above-mentioned "bridge phenomenon" at all or almost and increasing the speed of supplying electronic component chips. Is to

[0011]

According to the present invention, a plurality of electronic component chips are respectively moved in an aligned state in a predetermined direction, as in the electronic component chip aligning and supplying apparatus 1 shown in FIG. And a room for communicating with the alignment passage and defining a space having a larger cross section than the alignment passage on the inlet side of the alignment passage and accommodating a plurality of electronic component chips. An electronic component chip provided with a gate having an opening that allows passage of the electronic component chip so as to partition a part of the chamber to form a small chamber near the entrance of the alignment passage. It is directed to an aligning and feeding device. In the present invention, in order to solve the above-mentioned technical problem, at least a part of a wall surface defining the opening of the gate and at least a part of a wall surface of the small room connected to the wall surface are provided by a movable block that is displaceable It is characterized by being done.

[0012]

According to the present invention, the movable block is displaced to widen or narrow the gap between at least a part of the wall surface defining the opening of the gate and at least a part of the wall surface of the small room and the wall surface facing them. be able to.

[0013]

Therefore, according to the present invention, since the distance between the wall surfaces varies as described above, even if the "bridge phenomenon" occurs in the electronic component chip, such "bridge phenomenon" is immediately caused. It can be easily broken.

Therefore, the plurality of electronic component chips can be smoothly moved in the electronic component chip aligning and supplying device,
It is possible to smoothly proceed the supply of electronic component chips through the alignment passage. Further, since the movable block forms not only the wall surface of the gate but also the wall surface of the small room, the small room can be made small without any problem while preventing the electronic component chips from being clogged, that is, the "bridge phenomenon".

Therefore, when the electronic component chip aligning and supplying apparatus according to the present invention is applied to, for example, a chip mounting machine, the chip mounting process can be advanced with a high operation rate, high reliability and a high supply speed.

Further, in the present invention, since the movable block extends from the gate to at least a part of the small chamber,
The size of the movable block does not become too small, and therefore, the movable block can be displaceably incorporated into the electronic component chip alignment supply device without any trouble.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an electronic component chip aligning and supplying apparatus 12 according to an embodiment of the present invention. Alignment supply device 1
The 2 comprises a block assembly 13 consisting of several blocks, each of which has a unique shape or structure to facilitate giving a preferred structure in its particular part. This block assembly 13 is shown in perspective view in FIG. Further, FIG. 3 is an enlarged view showing a specific portion of the block assembly 13 shown in FIG. 4 and 5 show line IV- of FIG. 3, respectively.
FIG. 5 is a sectional view taken along line IV and line VV. As can be seen from FIGS. 4 and 5, FIG. 1 is shown with the side plate 14 on the front side thereof removed.

The aligning and supplying device 12 includes an aligning passage 15 for guiding a plurality of electronic component chips (not shown in FIGS. 1 to 5) so as to move in an aligned state in a predetermined direction. A space 17 communicating with the alignment passage 15 and defining a space having a larger cross section than the alignment passage 15 on the inlet 16 side of the alignment passage 15 and storing a plurality of electronic component chips is provided. Also, room 1
A gate 20 having an opening 19 that allows passage of electronic component chips is provided in the chamber 17 so that a small chamber 18 is formed in the vicinity of the entrance 16 of the alignment passage 15 by partitioning a part of the device 7.

The electronic component chip storage cassette described above is mounted in the opening 21 of the chamber 17, and a plurality of electronic component chips are supplied from the cassette into the chamber 17. The plurality of electronic component chips enter the small chamber 18 through the opening 19 of the gate 20 and finally reach the alignment passage 15. Since the angle 22 is set to about 45 degrees, such movement of the electronic component chip is brought about by the gravity exerted on the electronic component chip. Although a path extending in the horizontal direction is provided on the outlet 23 side of the alignment passage 15, the electronic component chips are taken out one by one from the outlet 23 based on, for example, vacuum suction.

The structure and operation described above are substantially the same as those of the above-mentioned conventional aligning and feeding apparatus 1 shown in FIG. The characteristic configuration of this embodiment will be described below.

The wall surface defining the opening 19 of the gate 20 is provided by the movable block 24 forming a part of the block assembly 13. Movable block 24
Further extends to the small room 18 and also gives a part of the wall surface of the small room 18.

The fixed block 25, which constitutes the main part of the block assembly 13, holds the movable block 24 in a displaceable manner as indicated by an arrow 26 in FIG. for that reason,
A gap 27 is formed between the fixed block 25 and the movable block 24.

Further, in this embodiment, in addition to the movable block 24 described above, the second movable block 28 can be displaced while being held by the first movable block 24, the fixed block 25 and the spacer block 29. It is provided. Therefore, a gap 30 is formed between the fixed block 25 and the second movable block 28.

Further, in this embodiment, measures for smoothing the movement of the electronic component chip are taken at some places. First, in the movable block 24,
Slopes 31 and 32 are formed. Further, the second movable block 28 is provided with an inclined surface 33.
Further, the fixed block 25 is provided with inclined surfaces 34 and 35. Of these, the inclined surface 34 forms a uniform surface with the inclined surface 36 that defines a part of the bottom wall of the chamber 17 in the main body of the aligning and supplying device 12.
A groove 37 is provided on the bottom surface of the chamber 17, and the bottom surface of the groove 37 extends uniformly toward the bottom surface of the alignment passage 15.

Although not shown, the inlet 1 of the alignment passage 15 is provided in order to agitate the electronic component chips that try to enter the alignment passage 15 and smooth the movement of the electronic component chips.
Compressed air may be intermittently blown into the vicinity of 6.

As described above, according to this embodiment, especially by the action of the movable block 24, the "bridge phenomenon" of the electronic component chip, which tends to occur in the opening 21 of the gate 20 and the small chamber 18, is effectively prevented. be able to.

When the electronic component chip aligning and supplying apparatus of this type has been used, the opening of the room is usually directed downward to collect the electronic component chips remaining therein. In the conventional aligning and feeding apparatus 1 described above with reference to FIG. 11, since the wall surface of the small chamber 5 defined by the gate 7 is curved, when the opening 8 is directed downward, some electronic component chips are Although it remains on the gate 7 and the electronic component chip recovery operation cannot be performed smoothly, in the above-described embodiment, since the gate 20 does not have such a curve, the opening 21 is directed downward. Electronic component chips can be collected smoothly.

Another embodiment of the present invention will be described below with reference to FIGS. 6 to 10. In order to avoid duplication of the description, the above-mentioned FIG.
5 through 5. Elements corresponding to those shown in FIG. 5 are labeled with similar reference numerals.

6 and 7 respectively show the gate 20.
It is a figure equivalent to FIG. 4 which shows the modification with respect to the shape of FIG.

In FIG. 6, the gate 20 provided by the movable block 24 has a wall surface defining the opening 19,
Two mutually orthogonal surfaces 38 and 39 are formed.
In FIG. 7, a rounded surface 40 is formed on the gate 20 as a wall surface defining the opening 19.

8 to 10 are front views of the block assembly 13 showing a modified example of the movable block 24. As shown in FIG.

FIG. 8 shows the movable block 24 obtained by bending the plate material into a U-shape. Further, FIG. 9 shows the movable block 24 integrally including elements corresponding to the above-mentioned second movable block 28. In FIG. 10, the shapes of the movable block 24 and the fixed block 25 are changed. Therefore, in order to prevent the movable block 24 from falling off, the movable block 24 has a fixed pin 41 provided in the fixed block 25. A hole 42 for receiving the state is provided. The movable block 24 is
The hole 42 can be displaced within a range in which the hole 42 can be displaced with respect to the fixed pin 41.

In some of the embodiments described above, not only the movable block 24 but also the second movable block 28 is arranged in the small chamber 18.
8 is not an essential element for this invention.

[Brief description of drawings]

FIG. 1 is a front view of an electronic component chip alignment and supply device 12 according to an embodiment of the present invention, and is shown in a state where a side plate on the front side is removed.

FIG. 2 is a perspective view showing the block assembly 13 shown in FIG. 1 alone.

FIG. 3 is an enlarged front view showing a main part of the block assembly 13 shown in FIG.

4 is a sectional view taken along line IV-IV in FIG.

5 is a cross-sectional view taken along the line VV of FIG.

FIG. 6 is a view corresponding to FIG. 4 showing another embodiment of the present invention.

FIG. 7 is a view corresponding to FIG. 4 showing still another embodiment of the present invention.

FIG. 8 is a front view of a block assembly 13 showing still another embodiment of the present invention.

FIG. 9 is a front view of a block assembly 13 showing still another embodiment of the present invention.

FIG. 10 is a front view of a block assembly 13 showing still another embodiment of the present invention.

FIG. 11 is a front view showing a conventional electronic component chip alignment supply device 1.

12 is a cross-sectional view taken along the line XII-XII in FIG.

[Explanation of symbols]

 12 electronic component chip alignment supply device 15 alignment passage 16 entrance 17 room 18 small room 19 opening 20 gate 24 movable block 27 gap

Claims (1)

[Claims] 1. A plurality of electronic component chips,
An alignment passage that guides the alignment passage to move in a predetermined direction, a space that communicates with the alignment passage, and has a cross section that is larger than the alignment passage on the inlet side of the alignment passage, and that defines a plurality of electrons. A room for accommodating the component chips, and allowing passage of the electronic component chips in the room so as to partition a part of the room to form a small room near the entrance of the alignment passage. In an electronic component chip aligning and supplying apparatus provided with a gate having an opening, at least a part of a wall surface defining the opening of the gate and at least a part of a wall surface of the small chamber continuous with the wall surface are movable. An electronic component chip alignment and supply device characterized by being provided by a block.