JPH05338108A - Metal mask and method for forming image holes in metal mask - Google Patents
Metal mask and method for forming image holes in metal maskInfo
- Publication number
- JPH05338108A JPH05338108A JP17013292A JP17013292A JPH05338108A JP H05338108 A JPH05338108 A JP H05338108A JP 17013292 A JP17013292 A JP 17013292A JP 17013292 A JP17013292 A JP 17013292A JP H05338108 A JPH05338108 A JP H05338108A
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- Prior art keywords
- image
- hole
- etching
- metal mask
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、スクリーン印刷用の
メタルマスク及びメタルマスクの画像孔形成方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal mask for screen printing and a method for forming image holes in the metal mask.
【０００２】[0002]
【従来の技術】従来、スクリーン印刷に使用するメッシ
ュを張設した枠に画像に合わせた画像孔を穿設したメタ
ルマスクを取り付けて、画像孔からインクを通して被印
刷物に画像を印刷していた。2. Description of the Related Art Conventionally, a metal mask having image holes corresponding to an image is attached to a frame stretched with a mesh used for screen printing, and an image is printed on an object to be printed through ink through the image hole.
【０００３】このメタルマスクを形成する際には、 ステンレスなどの金属薄板の表裏両面に耐エッチン
グ液を塗布し、 金属薄板の表裏両面に所定画像と同一のフォトマス
クを配置し、 金属薄板の表裏両面にフォトマスクの外側から光を
当て、耐エッチング被膜液を感光させて、耐エッチング
被膜を形成する。 金属薄板を洗浄し、感光されいない耐エッチング被
膜液を金属薄板から除去する。 金属薄板に表裏両面からエッチングを施し、金属薄
板の耐エッチング被膜を形成していない部分を溶かし画
像孔を穿設する。When forming this metal mask, an anti-etching solution is applied to both front and back surfaces of a metal thin plate such as stainless steel, and photomasks identical to a predetermined image are arranged on both front and back surfaces of the metal thin plate. Light is applied to both sides from the outside of the photomask to expose the anti-etching film solution to form the anti-etching film. The metal sheet is washed to remove the unexposed etching resistant coating solution from the metal sheet. The thin metal plate is etched from both the front and back sides, and the portion of the thin metal plate where the etching resistant film is not formed is melted to form an image hole.
【０００４】[0004]
【発明が解決しようとする課題】前記従来の技術では、
エッチングにより孔を穿設するので、孔は耐エッチング
被膜の縁より外側に金属板の材厚の1/4 程度広がった形
状で形成される。したがって、画像孔の側壁は画像孔の
口縁と中央部を結ぶ線より外側に広がった形状となる。
よって、エッチング時間が短い場合には、メタルマスク
３４の画像孔３５は中央部で環状の突起３６を生じ、所
定画像３３より孔口径が狭くなる（図３（ａ））。従っ
て、印刷時に中央部でインクの通りが悪くなるおそれが
あった。また、エッチング時間が長い場合には、メタル
マスク３４ａの画像孔３７の上縁及び下縁で所定口径
で、中央部３８で所定画像３３より広がった形状の孔口
径となる（図３（ｂ））。従って、印刷時に中央部３８
にインクが残るおそれがあった。従って、印刷精度が悪
くなる問題点があった。SUMMARY OF THE INVENTION In the above conventional technique,
Since the holes are formed by etching, the holes are formed outside the edge of the etching resistant film in a shape that is spread about 1/4 of the material thickness of the metal plate. Therefore, the side wall of the image hole has a shape spreading outward from the line connecting the edge of the image hole and the central portion.
Therefore, when the etching time is short, the image hole 35 of the metal mask 34 forms an annular protrusion 36 at the central portion, and the hole diameter becomes smaller than the predetermined image 33 (FIG. 3A). Therefore, there is a possibility that the ink may not pass through the central portion during printing. Further, when the etching time is long, the upper and lower edges of the image hole 37 of the metal mask 34a have a predetermined aperture and the central portion 38 has a wider aperture than the predetermined image 33 (FIG. 3B). ). Therefore, when printing, the central portion 38
There was a risk that ink would remain on. Therefore, there is a problem that the printing accuracy is deteriorated.
【０００５】[0005]
【課題を解決するための手段】然るにこの発明は、略台
形の画像孔を穿設してメタルマスクを構成したので、前
記問題点を解決した。However, according to the present invention, since the metal mask is formed by forming substantially trapezoidal image holes, the above problems are solved.
【０００６】即ちこの発明は、金属薄板に、孔上縁で所
定画像より狭く、孔下縁で所定画像より広い略台形の画
像孔を穿設したことを特徴とするメタルマスクである。That is, the present invention is a metal mask characterized in that a substantially trapezoidal image hole is formed in the thin metal plate at the upper edge of the hole narrower than the predetermined image and at the lower edge of the hole wider than the predetermined image.
【０００７】また、金属薄板の上面に所定画像より小形
の画像を形成した上面耐エッチング被膜を形成し、金属
薄板の下面に所定画像より大形の画像を形成した下面耐
エッチング被膜を形成し、金属薄板の上下両面からエッ
チングを施して画像孔を形成することを特徴としたメタ
ルマスクの画像孔形成方法である。更に、金属薄板の上
下面に夫々所定画像とほぼ同一形状の耐エッチング被膜
を形成し、前記金属板の上面で所定時間より短い時間エ
ッチングを施し、前記金属板の下面で所定時間より長い
時間エッチングを施して画像孔を形成することを特徴と
したメタルマスクの画像孔形成方法である。Further, an upper surface etching-resistant film having a smaller image than a predetermined image is formed on the upper surface of the metal thin plate, and a lower surface etching-resistant film having a larger image than the predetermined image is formed on the lower surface of the metal thin plate, A method for forming an image hole in a metal mask, characterized in that an image hole is formed by performing etching from both upper and lower surfaces of a thin metal plate. Further, an etching resistant film having substantially the same shape as a predetermined image is formed on each of the upper and lower surfaces of the thin metal plate, the upper surface of the metal plate is etched for a time shorter than a predetermined time, and the lower surface of the metal plate is etched for a time longer than a predetermined time. Is a method for forming an image hole in a metal mask, which is characterized in that the image hole is formed by applying.
【０００８】前記における所定画像とは、印刷予定の画
像と同じ大きさの画像を指す。また、テーパー孔は垂直
に対して１度乃至３０度程度とすることが望ましく、と
りわけ５度乃至１０度の角度が適している。また、前記
における耐エッチング被膜はエッチング液から金属薄板
を保護するもので、エッチング液が酸性の場合には耐酸
性、エッチング液がアルカリ性の場合には耐アルカリ性
のものを使用し、金属薄板に応じて適宜選択して使用す
る。The above-mentioned predetermined image refers to an image having the same size as the image to be printed. Further, it is desirable that the tapered hole is approximately 1 to 30 degrees with respect to the vertical, and an angle of 5 to 10 degrees is particularly suitable. Further, the above-mentioned etching-resistant coating protects the metal thin plate from the etching liquid, and when the etching liquid is acidic, it is acid-resistant, and when the etching liquid is alkaline, it is alkali-resistant. Select as appropriate for use.
【０００９】[0009]
【作用】この発明は略台形の画像孔を穿設したので、イ
ンクは滑らかに画像孔を通り、被印刷物に写される。ま
た、金属薄板の上面に所定画像より小形の画像を形成し
た上面耐エッチング被膜を形成し、下面に所定画像より
大形の画像を形成した下面耐エッチング被膜を形成した
ので、略台形の画像孔を形成できる。更に、金属板の上
面で所定時間より短い時間エッチングを施し、下面で所
定時間より長い時間エッチングを施したので、略台形の
画像孔を形成できる。According to the present invention, since the substantially trapezoidal image hole is formed, the ink is smoothly passed through the image hole and is transferred onto the printing material. In addition, since the upper surface of the thin metal plate has an etching-resistant film on which an image smaller than a predetermined image is formed, and the lower surface has an etching-resistant film on which a larger image is formed than a predetermined image, a substantially trapezoidal image hole is formed. Can be formed. Further, since the upper surface of the metal plate is etched for a time shorter than the predetermined time and the lower surface is etched for a time longer than the predetermined time, a substantially trapezoidal image hole can be formed.
【００１０】[0010]
【実施例１】図１に基づきこの発明の実施例を説明す
る。メタルマスク形成用のステンレス板１の上面１ａ、
下面１ｂに夫々耐エッチング被膜液を塗布した、耐エッ
チング液層２、３を夫々形成する（図１（ａ））。次
に、印刷予定の所定画像１７より小形の黒色部分４、透
明部分４ａを形成した上フォトマスク５を形成し、所定
画像１７より大形の黒色部分６、透明部分６ａを形成し
た下フォトマスク７を形成する。前記上フォトマスク５
を、ステンレス板１の上面１ａ側に配置し、前記下フォ
トマスク７を、ステンレス板１の下面１ｂ側に夫々配置
する（図１（ｂ））。次に、上下フォトマスク５、７の
外側から所定の光を当て、耐エッチング液層２、３のフ
ォトマスク透明部分４ａ、６ａに対応する部分を感光さ
せる。Embodiment 1 An embodiment of the present invention will be described with reference to FIG. The upper surface 1a of the stainless plate 1 for forming a metal mask,
Etching-resistant liquid layers 2 and 3 are formed by applying etching-resistant coating liquids to the lower surface 1b, respectively (FIG. 1A). Next, an upper photomask 5 having a black portion 4 and a transparent portion 4a smaller than the predetermined image 17 to be printed is formed, and a lower photomask having a black portion 6 and a transparent portion 6a larger than the predetermined image 17 is formed. Form 7. Above photomask 5
Are arranged on the upper surface 1a side of the stainless plate 1 and the lower photomasks 7 are arranged on the lower surface 1b side of the stainless plate 1 (FIG. 1 (b)). Next, predetermined light is applied from the outside of the upper and lower photomasks 5 and 7 to expose the portions of the etching resistant liquid layers 2 and 3 corresponding to the photomask transparent portions 4a and 6a.
【００１１】次に、ステンレス板１の上下両面を洗浄
し、耐エッチング液層２の感光しなかった部分（上フォ
トマスク５の黒色部分６に応じた部分）を除去し、透孔
９を形成する。したがって、感光した部分（上フォトマ
スク５の透明部分５ａに応じた部分）は耐エッチング被
膜８を形成する。同様に、耐エッチング液層３の感光し
なかった部分（下フォトマスク７の黒色部分８に応じた
部分）を除去し、透孔１１を形成する。したがって、感
光した部分（下フォトマスク７の透明部分６ａに応じた
部分）は耐エッチング被膜１０を形成する（図１
（ｃ））。Next, the upper and lower surfaces of the stainless steel plate 1 are washed to remove the non-exposed portion of the etching resistant liquid layer 2 (the portion corresponding to the black portion 6 of the upper photomask 5) to form the through hole 9. To do. Therefore, the exposed portion (the portion corresponding to the transparent portion 5a of the upper photomask 5) forms the etching resistant coating 8. Similarly, the non-exposed portion of the etching resistant liquid layer 3 (the portion corresponding to the black portion 8 of the lower photomask 7) is removed, and the through hole 11 is formed. Therefore, the exposed portion (the portion corresponding to the transparent portion 6a of the lower photomask 7) forms the etching resistant film 10 (FIG. 1).
(C)).
【００１２】次に、ステンレス板１の上下両面から同一
時間だけ所定のエッチングを施し、上下両面の透孔９、
１１に対応した部分（耐エッチング被膜８、１０を形成
していない部分）のステンレス板１を溶かし、ステンレ
ス板１に画像孔１２を穿設する（図１（ｄ））。この画
像孔１２は中央１４で所定画像１７に応じた大きさであ
り、上端１３で所定画像１７より狭く、下端１５で所定
画像１７より広く、下に広がった略台形に形成される。Next, predetermined etching is performed from the upper and lower surfaces of the stainless steel plate 1 for the same period of time to form the through holes 9 on the upper and lower surfaces.
The portion corresponding to 11 (the portion where the etching resistant coatings 8 and 10 are not formed) is melted to form an image hole 12 in the stainless plate 1 (FIG. 1D). The image hole 12 has a size corresponding to the predetermined image 17 at the center 14, is narrower than the predetermined image 17 at the upper end 13, is wider than the predetermined image 17 at the lower end 15, and is formed in a substantially trapezoidal shape widening downward.
【００１３】前記において、画像孔１２の中央１４の壁
面の点Ａを通り、画像孔１２の上口縁１３ａと下口縁１
５ａとを結ぶ直線を直線Ｂとする。点Ａを通る鉛直線Ｃ
と前記直線Ｂとが成す角θ1 を１０度とするように、前
記画像孔１２は形成されている。従って、このような画
像孔１２となるように、耐エッチング被膜８、１０、透
孔９、１１の形状、大きさが決められ、即ち上下フォト
マスク５、７の画像の大きさ（黒色部分４、６及び透明
部位分４ａ、６ａ）が決められている。In the above description, passing through the point A on the wall surface of the center 14 of the image hole 12, the upper edge 13a and the lower edge 1 of the image hole 12 are passed.
A straight line connecting 5a and 5a is defined as a straight line B. Vertical line C passing through point A
The image hole 12 is formed so that the angle θ 1 formed by the line B and the straight line B is 10 degrees. Therefore, the shapes and sizes of the etching resistant coatings 8 and 10 and the through holes 9 and 11 are determined so as to form such image holes 12, that is, the size of the image of the upper and lower photomasks 5 and 7 (black portion 4). , 6 and transparent portions 4a, 6a) are determined.
【００１４】次に、耐エッチング被膜２、３を除去し、
メタルマスク１６が形成される（図１（ｄ））。Next, the etching resistant coatings 2 and 3 are removed,
The metal mask 16 is formed (FIG. 1D).
【００１５】上記実施例に基づくメタルマスク１６の使
用は、通常のメタルマスクと同様にスクリーン枠に取り
付け、所望の印刷をする（図示していない）。この際
に、インクはメタルマスク１６の画像孔１２の上端１３
から下端１４に向けてとおり、画像孔１２は下に広がっ
た略台形であるので、インクは滑らかに画像孔１２を通
過し、被印刷物に写される。また、画像孔１２内にイン
クが溜まるおそれもない。The use of the metal mask 16 according to the above embodiment is mounted on the screen frame in the same manner as a normal metal mask, and desired printing is performed (not shown). At this time, the ink is the upper end 13 of the image hole 12 of the metal mask 16.
Since the image hole 12 has a substantially trapezoidal shape that spreads downwards from the bottom to the lower end 14, the ink smoothly passes through the image hole 12 and is transferred onto the printing material. Also, there is no possibility that ink will accumulate in the image holes 12.
【００１６】前記実施例において直線Ｂと直線Ｃとがな
す角θを１０度としたが、１度乃至３０度程度であれば
他の角度とすることもできる。１度より小さい場合には
従来のストレートの孔と変化なく、３０度より大きい場
合にはインクが被印刷物上に広がり正確な画像を再現で
きない。In the above embodiment, the angle θ formed by the straight line B and the straight line C is set to 10 degrees, but it may be set to another angle if it is about 1 to 30 degrees. When it is less than 1 degree, it does not change from the conventional straight hole, and when it is more than 30 degree, the ink spreads on the printing material and an accurate image cannot be reproduced.
【００１７】また、前記実施例において、ステンレス板
を使用したが、燐青銅、ニッケル、銅、アルミニウムな
ど他の材質の金属薄板とすることもできる。この場合に
は、夫々の金属薄板に応じてエッチング液が選択され、
エッチング液に応じて耐エッチング被膜（耐エッチング
被膜液）が夫々適宜選択して使用される。Further, although the stainless steel plate is used in the above embodiment, a thin metal plate made of other material such as phosphor bronze, nickel, copper or aluminum may be used. In this case, the etching solution is selected according to each thin metal plate,
The etching resistant coating (etching resistant coating liquid) is appropriately selected and used according to the etching liquid.
【００１８】[0018]
【実施例２】次に、図２に基づきこの発明の他の実施例
を説明する。メタルマスク形成用のステンレス板１の上
面１ａ、下面１ｂに夫々耐エッチング被膜液を塗布し
た、耐エッチング液層２、３を夫々形成する（図２
（ａ））。次に、印刷予定の所定画像１７より小形の黒
色部分１８及び透明部分１８ａを形成した上フォトマス
ク１９を形成し、また前記上フォトマスク１９と同一
で、即ち所定画像１７より小形の黒色部分２０、透明部
分２０ａを形成した下フォトマスク２１を形成する。前
記上フォトマスク１９を、ステンレス板１の上面１ａ側
に配置し、前記下フォトマスク２１を、ステンレス板１
の下面１ｂ側に夫々配置する（図２（ｂ））。Second Embodiment Next, another embodiment of the present invention will be described with reference to FIG. Etching-resistant liquid layers 2 and 3 are formed by coating the etching-resistant coating liquid on the upper surface 1a and the lower surface 1b of the stainless steel plate 1 for forming a metal mask, respectively (FIG. 2).
(A)). Next, an upper photomask 19 having a black portion 18 smaller than the predetermined image 17 to be printed and a transparent portion 18a is formed, and is the same as the upper photomask 19, that is, a black portion 20 smaller than the predetermined image 17. A lower photomask 21 having the transparent portion 20a is formed. The upper photomask 19 is arranged on the upper surface 1a side of the stainless plate 1, and the lower photomask 21 is arranged on the stainless plate 1.
Are arranged on the lower surface 1b side (FIG. 2B).
【００１９】次に、上下フォトマスク１９、２１の外側
から所定の光を当て、上下フォトマスクの透明部分１８
ａ、２０ａに対応する耐エッチング液層２、３を感光さ
せる。Next, predetermined light is applied from the outside of the upper and lower photomasks 19 and 21, and the transparent portions 18 of the upper and lower photomasks are exposed.
The etching resistant liquid layers 2 and 3 corresponding to a and 20a are exposed.
【００２０】次に、ステンレス板１の表面を洗浄し、耐
エッチング液層２の感光しなかった部分（上フォトマス
ク１９の黒色部分１８に応じた部分）を除去し、透孔２
３を形成する。したがって、感光した部分（上フォトマ
スク１９の透明部分１８ａに応じた部分）は耐エッチン
グ被膜２２を形成する。同様に、耐エッチング液層３の
感光しなかった部分（下フォトマスク２１の黒色部分２
０に応じた部分）を除去し、透孔２５を形成する。した
がって、感光した部分（下フォトマスク２１の透明部分
２０ａに応じた部分）は耐エッチング被膜２４を形成す
る（図２（ｃ））。Next, the surface of the stainless steel plate 1 is washed to remove the non-exposed portion of the etching resistant liquid layer 2 (the portion corresponding to the black portion 18 of the upper photomask 19), and the through hole 2 is formed.
3 is formed. Therefore, the exposed portion (the portion corresponding to the transparent portion 18a of the upper photomask 19) forms the etching resistant film 22. Similarly, the non-exposed portion of the etching resistant liquid layer 3 (the black portion 2 of the lower photomask 21
The portion corresponding to 0) is removed and the through hole 25 is formed. Therefore, the exposed portion (the portion corresponding to the transparent portion 20a of the lower photomask 21) forms the etching resistant coating 24 (FIG. 2C).
【００２１】次に、ステンレス板１の上面１ａから所定
時間より短い時間だけ所定のエッチングを施し、ステン
レス板１の上面１ａ側で、透孔２３に対応した部分（耐
エッチング被膜２２を形成していない部分）を溶かす。
また、ステンレス板１の下面１ｂから所定時間より長い
時間だけ所定のエッチングを施し、ステンレス板１の下
面１ｂ側で、透孔２５に対応した部分（耐エッチング被
膜２４を形成していない部分）を溶かす。次に、耐エッ
チング被膜２、３を除去し、ステンレス板１に画像孔２
７を形成し、メタルマスク３１を構成する（図２
（ｄ））。Next, the upper surface 1a of the stainless steel plate 1 is subjected to a predetermined etching for a time shorter than a predetermined time, and the portion corresponding to the through hole 23 (the etching resistant coating 22 is formed on the upper surface 1a side of the stainless steel plate 1). Melt)
Further, the lower surface 1b of the stainless steel plate 1 is subjected to predetermined etching for a time longer than a predetermined time, and a portion corresponding to the through hole 25 (a portion where the etching resistant coating 24 is not formed) is formed on the lower surface 1b side of the stainless steel plate 1. Melt. Next, the etching resistant coatings 2 and 3 are removed, and the image holes 2 are formed in the stainless steel plate 1.
7 to form the metal mask 31 (see FIG. 2).
(D)).
【００２２】前記において、画像孔２７は、前記実施例
１の画像孔１２と同様に、中央２９で所定画像１７に応
じた大きさであり、上端２８で所定画像１７より狭く、
下端３０で所定画像より広く、下に広がった略台形に形
成される。前記において、画像孔２７の中央２９の壁面
の点Ｄを通り、画像孔２７の上口縁２８ａと下口縁３０
ａとを結ぶ直線Ｅと、点Ｄを通る鉛直線Ｆとが成す角θ
2 を１０度とするように、前記画像孔２７は形成されて
いる。従って、このような画像孔２７となるように上面
１ａ及び下面１ｂでのエッチング時間が決められる。In the above description, the image hole 27 has a size corresponding to the predetermined image 17 at the center 29 and is narrower than the predetermined image 17 at the upper end 28, like the image hole 12 of the first embodiment.
The lower end 30 is formed in a substantially trapezoidal shape that is wider than the predetermined image and spreads downward. In the above, passing through the point D on the wall surface of the center 29 of the image hole 27, the upper edge 28a and the lower edge 30 of the image hole 27 are
An angle θ formed by a straight line E connecting a and a vertical line F passing through a point D
The image hole 27 is formed so that 2 is 10 degrees. Therefore, the etching time on the upper surface 1a and the lower surface 1b is determined so that the image hole 27 is formed.
【００２３】上記実施例に基づくメタルマスク３１の使
用は、前記実施例と同様である。また、他のθ2 の角度
も前記実施例１のθ1 と同様である。更に他のステンレ
ス板１に替わる他の金属薄板も前記実施例１と同様であ
る。The use of the metal mask 31 according to the above embodiment is the same as that of the above embodiment. The other angles of θ 2 are the same as those of θ 1 in the first embodiment. Other metal thin plates replacing the other stainless plate 1 are also the same as those in the first embodiment.
【００２４】[0024]
【発明の効果】この発明によれば、メタルマスクの画像
孔は下に広がった略台形に形成されるので、画像の再現
性が良く、印刷精度を向上させることができる。According to the present invention, since the image hole of the metal mask is formed in a substantially trapezoidal shape widening downward, the reproducibility of the image is good and the printing accuracy can be improved.
【図１】（ａ）乃至（ｄ）はこの発明の方法を示す縦端
面図である。1A to 1D are vertical end views showing a method of the present invention.
【図２】（ａ）乃至（ｄ）はこの発明の他の方法を示す
縦端面図である。2A to 2D are vertical end views showing another method of the present invention.
【図３】（ａ）（ｂ）は従来例の縦端面図である。3A and 3B are vertical end views of a conventional example.
【符号の説明】 １ ステンレス板 １ａ 上面 １ｂ 下面 ７ 上フォトマスク ９ 下フォトマスク ８ 耐エッチング被膜（上面） １０ 耐エッチング被膜（下面） １２ 画像孔 １３ （画像孔）上端 １４ （画像孔）中央 １５ （画像孔）下端 １６ メタルマスク １９ 上フォトマスク ２１ 下フォトマスク ２２ 耐エッチング被膜（上面） ２４ 耐エッチング被膜（下面） ２７ 画像孔 ２８ （画像孔）上端 ２９ （画像孔）中央 ３０ （画像孔）下端 ３１ メタルマスク[Explanation of symbols] 1 stainless steel plate 1a upper surface 1b lower surface 7 upper photomask 9 lower photomask 8 etching resistant film (upper surface) 10 etching resistant film (lower surface) 12 image hole 13 (image hole) upper end 14 (image hole) center 15 (Image hole) Lower end 16 Metal mask 19 Upper photomask 21 Lower photomask 22 Etching resistant film (upper surface) 24 Etching resistant film (lower surface) 27 Image hole 28 (Image hole) Upper end 29 (Image hole) Center 30 (Image hole) Bottom edge 31 metal mask
Claims (3)
く、孔下縁で所定画像より広い略台形の画像孔を穿設し
たことを特徴とするメタルマスク。1. A metal mask having a substantially trapezoidal image hole, which is narrower at a top edge of a hole than a predetermined image and wider at a bottom edge of the hole than a predetermined image.
像を形成した上面耐エッチング被膜を形成し、金属薄板
の下面に所定画像より大形の画像を形成した下面耐エッ
チング被膜を形成し、金属薄板の上下両面からエッチン
グを施して画像孔を形成することを特徴としたメタルマ
スクの画像孔形成方法。2. An upper surface etching-resistant coating having a smaller image than a predetermined image is formed on an upper surface of the metal thin plate, and a lower etching-resistant coating having a larger image than the predetermined image is formed on a lower surface of the metal thin plate, A method of forming an image hole in a metal mask, which comprises forming an image hole by performing etching from both upper and lower sides of a thin metal plate.
同一形状の耐エッチング被膜を形成し、前記金属板の上
面で所定時間より短い時間エッチングを施し、前記金属
板の下面で所定時間より長い時間エッチングを施して画
像孔を形成することを特徴としたメタルマスクの画像孔
形成方法。3. An etching resistant film having substantially the same shape as a predetermined image is formed on each of the upper and lower surfaces of the thin metal plate, etching is performed on the upper surface of the metal plate for a time shorter than a predetermined time, and on the lower surface of the metal plate for a predetermined time or longer. A method for forming an image hole in a metal mask, characterized by forming an image hole by performing etching for a long time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4170132A JP3010329B2 (en) | 1992-06-04 | 1992-06-04 | Method for forming image holes in metal mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4170132A JP3010329B2 (en) | 1992-06-04 | 1992-06-04 | Method for forming image holes in metal mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05338108A true JPH05338108A (en) | 1993-12-21 |
| JP3010329B2 JP3010329B2 (en) | 2000-02-21 |
Family
ID=15899254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4170132A Expired - Fee Related JP3010329B2 (en) | 1992-06-04 | 1992-06-04 | Method for forming image holes in metal mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3010329B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016022609A (en) * | 2014-07-17 | 2016-02-08 | 大日本印刷株式会社 | Metal substrate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313393A (en) * | 1989-06-12 | 1991-01-22 | Sony Corp | Mask screen for cream solder printing and preparation thereof |
| JPH05229091A (en) * | 1992-02-25 | 1993-09-07 | Dainippon Printing Co Ltd | Screen mask for screen printing and production thereof |
-
1992
- 1992-06-04 JP JP4170132A patent/JP3010329B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313393A (en) * | 1989-06-12 | 1991-01-22 | Sony Corp | Mask screen for cream solder printing and preparation thereof |
| JPH05229091A (en) * | 1992-02-25 | 1993-09-07 | Dainippon Printing Co Ltd | Screen mask for screen printing and production thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016022609A (en) * | 2014-07-17 | 2016-02-08 | 大日本印刷株式会社 | Metal substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3010329B2 (en) | 2000-02-21 |
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