JPH05337932A - Method for cutting stone by diamond chip saw - Google Patents

Method for cutting stone by diamond chip saw

Info

Publication number
JPH05337932A
JPH05337932A JP14776592A JP14776592A JPH05337932A JP H05337932 A JPH05337932 A JP H05337932A JP 14776592 A JP14776592 A JP 14776592A JP 14776592 A JP14776592 A JP 14776592A JP H05337932 A JPH05337932 A JP H05337932A
Authority
JP
Japan
Prior art keywords
band
cutting
cut
guide layer
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14776592A
Other languages
Japanese (ja)
Inventor
Saburo Oishi
三郎 大石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OISHI ENG YUGEN
Original Assignee
OISHI ENG YUGEN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OISHI ENG YUGEN filed Critical OISHI ENG YUGEN
Priority to JP14776592A priority Critical patent/JPH05337932A/en
Publication of JPH05337932A publication Critical patent/JPH05337932A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/08Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws
    • B28D1/086Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with saw-blades of endless cutter-type, e.g. chain saws, i.e. saw chains, strap saws consisting of strap saws

Abstract

PURPOSE:To accurately bite and cut without slowing sending speed of a band by forming a guide layer with soft material on a front side of a work in the biting direction when cutting is performed by letting a running diamond chip saw bite the work of stone. CONSTITUTION:As for material and thickness of a guide layer 13, a soft material into which a diamond chip 7 can bite easily and which can guide a band 5 is acceptable. When a running band 5 bites a work 11 having the guide layer 13, the biting can be performed accurately at a normal band conveying speed. Thereafter, a groove formed on the guide layer 13 plays a role of guide without generating clearances right and left, so that cutting is performed accurately along a cutting line.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ダイヤモンドチップソ
ーによる石材等の切断方法に係り、特に、硬質の石材等
を切断する場合に、バンドの送り速度を落とすことな
く、正確に切断できるようにしたものに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting stones or the like with a diamond tip saw, and particularly, when cutting hard stones or the like, it is possible to cut the stones accurately without lowering the feed rate of the band. Regarding things.

【0002】[0002]

【従来の技術】ダイヤモンドチップソーの切断機構は、
図1に示すように、まず、駆動回転体1、従動回転体3
が配置されていて、これら駆動回転体1、従動回転体3
間には鋼板製のバンド5が捲回されている。上記バンド
5の一側には、複数個のダイヤモンドチップ7が、所定
のピッチで金属接着されて取り付けられている。そし
て、バンド5を図1中矢印aで示す方向に回転させ、ワ
ーク(たとえば石材)11に対し、図1中矢印bで示す
方向に切り込んでいく。(または、石材11をバンド5
に押し込んでいく。)それによってワーク11が切断さ
れる。
2. Description of the Related Art The cutting mechanism of a diamond tip saw is
As shown in FIG. 1, first, the driving rotary body 1 and the driven rotary body 3
Are arranged, and these driving rotary body 1 and driven rotary body 3 are arranged.
A band 5 made of a steel plate is wound between them. A plurality of diamond tips 7 are attached to one side of the band 5 by metal bonding at a predetermined pitch. Then, the band 5 is rotated in the direction indicated by the arrow a in FIG. 1, and the work (for example, stone material) 11 is cut in the direction indicated by the arrow b in FIG. (Or stone 11 and band 5
Push into. ) Thereby, the work 11 is cut.

【0003】近時は上記のダイヤモンドチップソーによ
り、硬質の石材等から厚さ3〜5ミリメートル程度の薄
板を切断することができるようになっている。この場
合、従来は図7に示すようにバンドを石材に直接切り込
ませるようにしている。
Recently, it has become possible to cut a thin plate having a thickness of about 3 to 5 mm from a hard stone material or the like with the above-mentioned diamond tip saw. In this case, conventionally, the band is directly cut into the stone as shown in FIG.

【0004】[0004]

【発明が解決しようとする課題】上記従来の構成による
と次のような問題があった。まず、薄板の寸法を正確に
切断するのが困難であった。これは、ダイヤモンドチッ
プソーが丸鋸と異なり、バンドの全面が石材に一様に当
接し、しかも石材の表面も予め研磨されて平に仕上げら
れているにも拘らず、図7中一点鎖線で示すように、硬
い石材にダイヤモンドチップをいきなり切り込ませる
と、ダイヤモンドチップが左右に逃げる傾向が生じ、切
断線がずれてしまうものであった。そして、そのため従
来は、切り込み箇所に案内となる溝ができるまでバンド
の送り速度を落とし、一定量の切り込み溝ができてから
送り速度を上げ、切断を行うようにしていたが、作業が
面倒な上、長時間を要してしまう問題があった。
According to the above conventional structure, there are the following problems. First, it was difficult to accurately cut the thin plate. This is shown by the one-dot chain line in FIG. 7, even though the diamond tip saw is different from the circular saw in that the entire surface of the band is evenly contacted with the stone material and the surface of the stone material is also polished and flattened in advance. As described above, when a diamond tip is suddenly cut into a hard stone, the diamond tip tends to escape to the left and right, and the cutting line shifts. Therefore, conventionally, the feed speed of the band was lowered until a groove serving as a guide was formed at the cut position, and the feed speed was increased after a certain amount of the cut groove was formed to perform the cutting, but the work is troublesome. Moreover, there is a problem that it takes a long time.

【0005】本発明はこのような点に基づいてなされた
ものでその目的とするところは、バンドを石材等のワー
クに切り込む際に、バンドの送り速度を落とすことな
く、正確に切り込み及び切断ができるダイヤモンドチッ
プソーによる石材等の切断方法を提供することにある。
The present invention has been made on the basis of such a point, and an object thereof is to accurately cut and cut a band when cutting it into a work such as a stone material without reducing the feeding speed of the band. Another object of the present invention is to provide a method of cutting stones and the like with a diamond tip saw that can be used.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するべく
本願発明によるダイヤモンドチップソーによる石材等の
切断方法は、走行するバンドの一側に複数個のダイヤモ
ンドチップを取り付けてなるダイヤモンドチップソーを
ワークに切り込ませて切断するダイヤモンドチップソー
による石材等の切断方法において、上記ワークにおける
バンド切り込み方向前面側に柔らかい材質の案内層を形
成し、これによりバンドを案内するようにしたことを特
徴とするものである。又、案内層に砂等の研磨剤を含有
させることによって、案内とともにダイヤモンドチップ
の目立て機能を保持させることができる。
In order to achieve the above object, a method of cutting a stone material or the like by a diamond tip saw according to the present invention is to cut a diamond tip saw having a plurality of diamond tips attached to one side of a running band into a work. In a method of cutting a stone material or the like with a diamond tip saw that cuts by inserting, a guide layer made of a soft material is formed on the front side of the band cutting direction in the work, thereby guiding the band. .. Further, by including an abrasive such as sand in the guide layer, the setting function of the diamond tip can be maintained together with the guide.

【0007】[0007]

【作用】上述のように、本発明の切断方法は、石材等の
ワークにおけるバンド切り込み方向前面側に柔らかい材
質の案内層を形成したものであり、バンドをワークに切
り込ませる際、まず柔らかい材質の案内層に切り込ませ
るので、バンドの送り速度を落とさずに正確に切り込み
ができ、石材等のワークに切り込む際は、案内層がガイ
ドとなるのでダイヤモンドチップの左右への逃げが無く
正確に切り込みおよび切断ができる。又、案内層に砂等
の研磨剤を含有させると、ダイヤモンドチップは切り込
みする毎に、自動的に目立てされるので、目詰まりやク
ラックの発生を防止できる。
As described above, according to the cutting method of the present invention, the guide layer of a soft material is formed on the front side of the band cutting direction in a work such as a stone material, and when the band is cut into the work, the soft material is first used. Since it cuts into the guide layer, it can be cut accurately without reducing the feed rate of the band, and when cutting into a work such as stone material, the guide layer serves as a guide, so there is no escape to the left and right of the diamond tip accurately Can be cut and cut. Further, when the guide layer contains an abrasive such as sand, the diamond tip is automatically set up every time it is cut, so that clogging and cracking can be prevented.

【0008】[0008]

【実施例】以下、図1ないし図6を参照して本発明の一
実施例を説明する。まず、ダイヤモンドチップソーの切
断機構は、図1に示したように従来のものをそのまま適
用する。すなわち、駆動回転体1、従動回転体3が配置
されていて、これら駆動回転体1、従動回転体3間には
鋼板製のバンド5が捲回されている。上記バンド5の一
側には、複数個のダイヤモンドチップ7が、所定のピッ
チで取り付けられている。そして、バンドを図中矢印a
で示す方向に回転させ、ワーク11に対し、バンド5を
図中矢印bで示す方向に切り込んでいく。それによって
ワーク11が切断される。ここで用いられる石材等のワ
ーク11は、図2に示すように表面が平らな直方体状ブ
ロックであり、たとえば幅3メートル、高さ1メートル
程度のものを使用し、このものを3〜5ミリメートルの
厚さの薄板にスライスする切断作業を行う。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. First, as the cutting mechanism of the diamond tip saw, as shown in FIG. 1, the conventional cutting mechanism is applied as it is. That is, the drive rotating body 1 and the driven rotating body 3 are arranged, and the band 5 made of a steel plate is wound between the drive rotating body 1 and the driven rotating body 3. A plurality of diamond chips 7 are attached to one side of the band 5 at a predetermined pitch. Then, the band is indicated by an arrow a in the figure.
By rotating in the direction indicated by, the band 5 is cut into the work 11 in the direction indicated by arrow b in the figure. Thereby, the work 11 is cut. The work 11 such as a stone material used here is a rectangular parallelepiped block having a flat surface as shown in FIG. Perform the cutting work to slice into thin plates of thickness.

【0009】本発明は、上記ワーク11におけるバンド
5の切り込み方向前面側に案内層13を形成する。案内
層13は、図示のようにワーク11の全面を被うように
してもよいし、切断する箇所だけに部分的に形成しても
よい。要は、切断線の部分に案内層13が形成されてい
ればよい。案内層13は、砂とセメントとを混合して発
泡させた発泡気泡コンクリートを使用する。そして、こ
のものを所定の厚さに形成してワーク11の表面に接着
剤により接着する。尚、案内層13の材質および厚さは
柔らかい材質であってダイヤモンドチップが容易に切り
込みでき、しかも、切り込み後はバンドを案内できれば
良いものであり、任意に選択される。
In the present invention, the guide layer 13 is formed on the front surface side of the band 5 in the work 11 in the cutting direction. The guide layer 13 may cover the entire surface of the work 11 as shown in the drawing, or may be partially formed only at a cutting position. The point is that the guide layer 13 may be formed at the cutting line. The guide layer 13 is made of foamed cellular concrete in which sand and cement are mixed and foamed. Then, this is formed to a predetermined thickness and adhered to the surface of the work 11 with an adhesive. The guide layer 13 is made of a soft material and has a thickness that allows the diamond tip to be easily cut and can guide the band after the cut, and is arbitrarily selected.

【0010】次に、本発明の切断方法を説明する。案内
層13を形成したワーク11に走行するバンド5を切り
込ませると、図4に示すように、バンド5に取り付けた
ダイヤモンドチップ7が、まず案内層13に切り込む。
このとき、案内層13は柔らかい材質であるので、通常
のバンド送り速度で切断され、所定の寸法に正確に切り
込ませることができる。又、案内層13に砂等の研磨剤
15を含有させた場合は、ダイヤモンドチップは砂によ
って目立てされ、新たなダイヤモンド砥粒が露出した状
態となる。
Next, the cutting method of the present invention will be described. When the traveling band 5 is cut into the work 11 on which the guide layer 13 is formed, as shown in FIG. 4, the diamond tip 7 attached to the band 5 first cuts into the guide layer 13.
At this time, since the guide layer 13 is made of a soft material, the guide layer 13 is cut at a normal band feeding speed and can be accurately cut into a predetermined size. Further, when the guide layer 13 contains an abrasive 15 such as sand, the diamond tips are sharpened by the sand, and new diamond abrasive grains are exposed.

【0011】次に、ダイヤモンドチップがワーク11に
到達すると、図5に示すように、バンド5及びダイヤモ
ンドチップ7は案内層13にできた溝がガイドの役割を
果たし、左右に逃げを生じないので、正確な位置に切り
込まれ、切断線どおりに正確に切断される。又、ダイヤ
モンドチップ7は目立てされた状態であるので、切れが
よい状態でワーク11の切断ができることとなる。
Next, when the diamond tip reaches the work 11, as shown in FIG. 5, the band 5 and the diamond tip 7 have grooves formed in the guide layer 13 which serve as guides and do not cause escape to the left and right. , Cut to the correct position and cut exactly according to the cutting line. Further, since the diamond tip 7 is in a sharpened state, the work 11 can be cut in a good cutting condition.

【0012】以上本実施例によると次のような効果を奏
することができる。まず、石材等のワーク11における
バンド5の切り込み方向前面側に柔らかい材質の案内層
13を形成したので、バンド5を案内層13を形成した
ワーク11に切り込ませる際、まず柔らかい材質の案内
層13に切り込ませるので、バンド5の送り速度を落と
さずに正確に切り込みができる。そして石材等のワーク
11に切り込む際は、案内層13がガイドとなってダイ
ヤモンドチップ7の左右への逃げを無くし、正確に切り
込みおよび切断ができる。よって、正確な寸法の製品を
得ることができる。
According to this embodiment, the following effects can be obtained. First, since the guide layer 13 made of a soft material is formed on the front surface side of the work 5 such as a stone material in the cutting direction of the band 5, when the band 5 is cut into the work 11 having the guide layer 13, the guide layer 13 made of a soft material is first formed. Since it is cut into 13, the cut can be accurately made without reducing the feed rate of the band 5. When cutting into the work 11 such as a stone material, the guide layer 13 serves as a guide to prevent the diamond tip 7 from escaping to the left and right, and it is possible to cut and cut accurately. Therefore, a product with accurate dimensions can be obtained.

【0013】又、案内層13に砂等の研磨剤15を含有
させると、ダイヤモンドチップ7は切り込みする毎に、
自動的に目立てされるので、目詰まりが抑えられ、切れ
具合の低下や、図7に示すようなクラック17の発生を
防止できる。
If the guide layer 13 contains an abrasive 15 such as sand, the diamond tip 7 is cut every time it is cut.
Since it is automatically sharpened, clogging can be suppressed, and it is possible to prevent deterioration of cutting quality and generation of cracks 17 as shown in FIG. 7.

【0014】尚、本発明は前記実施例に限定されない。
例えば、案内層13としては、発泡気泡コンクリートの
みで形成してもよく、又、普通のコンクリート、樹脂材
料等他の材質のものを使用してもよい。又、その取り付
け方法も接着に限らず任意である。又、ワーク11は石
材以外の硬質材であっても良く、その形状も直方体状の
ものに限らず任意である。又、案内層13は少なくとも
ワーク11のバンド切り込み方向前面側に形成されてい
れば良く、ワークの他の面とともに、又は、前面側を含
むワーク全面に形成されていても良い。
The present invention is not limited to the above embodiment.
For example, the guide layer 13 may be formed of foamed concrete alone, or may be made of other materials such as ordinary concrete and resin material. Also, the method of attachment is not limited to adhesion and is arbitrary. Further, the work 11 may be a hard material other than a stone material, and the shape thereof is not limited to the rectangular parallelepiped shape and may be any shape. Further, the guide layer 13 may be formed at least on the front surface side of the work 11 in the band cutting direction, and may be formed on the entire surface of the work including the other surface of the work or the front surface side.

【0015】[0015]

【発明の効果】以上詳述したように本発明によるダイヤ
モンドチップソーによる石材等の切断方法によると、案
内層を形成したのでバンドの送り速度を落とさずに正確
に切り込みができ、石材等のワークに切り込む際は、案
内層がガイドとなるのでダイヤモンドチップの左右への
逃げが無く、正確に切り込み及び切断ができる。又、案
内層に砂等の研磨剤を含有させると、ダイヤモンドチッ
プは切り込みする毎に、自動的に目立てされるので、目
詰まりやクラックの発生を防止できる。
As described above in detail, according to the method for cutting stones or the like by the diamond tip saw according to the present invention, since the guide layer is formed, it is possible to accurately cut without lowering the feed rate of the band, and to the work such as stones. When cutting, the guide layer serves as a guide, so there is no escape of the diamond tip to the left and right, and accurate cutting and cutting can be performed. Further, when the guide layer contains an abrasive such as sand, the diamond tip is automatically set up every time it is cut, so that clogging and cracking can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す図でダイヤモンドチッ
プソーによる切断機構を示す斜視図である。
FIG. 1 is a perspective view showing a cutting mechanism by a diamond tip saw according to an embodiment of the present invention.

【図2】本発明の一実施例を示す図でダイヤモンドチッ
プソーによる切断部分を示す斜視図である。
FIG. 2 is a perspective view showing a portion cut by a diamond tip saw according to an embodiment of the present invention.

【図3】本発明の一実施例を示す図でダイヤモンドチッ
プソーによる切断部分を示す断面図である。
FIG. 3 is a cross-sectional view showing a portion cut by a diamond tip saw in a view showing an embodiment of the present invention.

【図4】本発明の一実施例を示す図でダイヤモンドチッ
プソーによる切断部分を示す断面図である。
FIG. 4 is a cross-sectional view showing a portion cut by a diamond tip saw according to an embodiment of the present invention.

【図5】本発明の一実施例を示す図でダイヤモンドチッ
プソーによる切断部分を示す断面図である。
FIG. 5 is a cross-sectional view showing a section cut by a diamond tip saw in a view showing an embodiment of the present invention.

【図6】従来例を示す図でダイヤモンドチップソーによ
る切断部分を示す断面図である。
FIG. 6 is a cross-sectional view showing a portion cut by a diamond tip saw in a conventional example.

【図7】従来例を示す図でダイヤモンドチップソーによ
る切断部分を示す断面図である。
FIG. 7 is a cross-sectional view showing a portion cut by a diamond tip saw in a conventional example.

【符号の説明】[Explanation of symbols]

5 バンド 7 ダイヤモンドチップ 11 ワーク 13 案内層 15 研磨剤 5 band 7 diamond tip 11 work piece 13 guide layer 15 abrasive

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 走行するバンドの一側に複数個のダイヤ
モンドチップを取り付けてなるダイヤモンドチップソー
をワークに切り込ませて切断するダイヤモンドチップソ
ーによる石材等の切断方法において、上記ワークにおけ
るバンド切り込み方向前面側に柔らかい材質の案内層を
形成し、これによりバンドを案内するようにしたことを
特徴とするダイヤモンドチップソーによる石材等の切断
方法。
1. A method for cutting a stone or the like by a diamond tip saw in which a diamond tip saw having a plurality of diamond tips attached to one side of a running band is cut into a workpiece to cut the front side of the workpiece in the band cutting direction. A method of cutting a stone or the like with a diamond tip saw, characterized in that a guide layer made of a soft material is formed on the inner surface of the guide layer to guide the band.
【請求項2】 請求項1記載のダイヤモンドチップソー
による石材等の切断方法において、案内層は砂等の研磨
剤を含有し、案内とともにダイヤモンドチップの目立て
機能を保持させたことを特徴とするダイヤモンドチップ
ソーによる石材等の切断方法。
2. The diamond tip saw cutting method according to claim 1, wherein the guide layer contains an abrasive such as sand, and the function of setting the diamond tip is maintained together with the guide. Method for cutting stones, etc.
JP14776592A 1992-06-08 1992-06-08 Method for cutting stone by diamond chip saw Pending JPH05337932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14776592A JPH05337932A (en) 1992-06-08 1992-06-08 Method for cutting stone by diamond chip saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14776592A JPH05337932A (en) 1992-06-08 1992-06-08 Method for cutting stone by diamond chip saw

Publications (1)

Publication Number Publication Date
JPH05337932A true JPH05337932A (en) 1993-12-21

Family

ID=15437672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14776592A Pending JPH05337932A (en) 1992-06-08 1992-06-08 Method for cutting stone by diamond chip saw

Country Status (1)

Country Link
JP (1) JPH05337932A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2377661A4 (en) * 2008-12-23 2017-03-08 EHWA Diamond Industrial Co., Ltd. Workpiece for frame gang saw, method for cutting the workpiece, and product cut by the method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2377661A4 (en) * 2008-12-23 2017-03-08 EHWA Diamond Industrial Co., Ltd. Workpiece for frame gang saw, method for cutting the workpiece, and product cut by the method

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