JPH05337827A - Method of dressing inner peripheral blade of slicing machine - Google Patents

Abstract

PURPOSE:To subject an inner peripheral blade of a slicing machine to effective automatic dressing. CONSTITUTION:When a sensor 32 detects an axial, displacement of a blade 14, an air pad 30 jets air having a pressure in accordance with the displacement in order to correct the displacement. A control part 26, a dressing device drive part 52 drive motors 44, 47, 48 so as to perform a necessary dressing process in accordance with a variation in the pressure of the air pad 30 which is used as a parameter.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of dressing an inner peripheral blade used in a slicing machine for cutting an ingot of silicon or the like into a thin wafer in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art In a slicing machine, when the sharpness of the inner peripheral blade deteriorates, the blade of the inner peripheral blade is appropriately dressed. Here, the blade is formed by fixing diamond powder to the inner peripheral edge of the inner peripheral blade of a donut-shaped metal plate, and dressing is performed by applying a grindstone having a high density to this.

Feedback control of automatic dressing of a conventional slicing machine is performed as follows. That is, the displacement of the inner peripheral blade is detected, and when the displacement of the inner peripheral blade increases, it is determined that the sharpness of the blade has deteriorated. As a result, the blade displacement amount is fed back as a parameter for automatic dressing control.

[0004]

However, the parameter of the blade displacement amount is also used for the warp servo control of the inner peripheral blade, and the warp servo control of the inner peripheral blade always makes this blade displacement a target displacement (for example, zero). Acts like. Therefore, the conventional automatic dressing control using the blade displacement as a parameter has a drawback that it does not work effectively because the blade displacement does not appear even if the blade sharpness actually deteriorates as a result of the warp servo control.

[0005]

In order to achieve the above-mentioned object, the present invention attaches an inner peripheral blade to a rotating spindle, presses a semiconductor material against the inner peripheral blade, and relatively approaches the inner peripheral blade or the semiconductor material. Is a slicing machine that cuts the semiconductor material into thin pieces by moving like a semiconductor wafer, slicing while detecting the axial displacement of the inner peripheral blade with a sensor and correcting the displacement with air pressure from the air pad In the machine, the dressing control of the inner peripheral blade by the automatic dressing device is performed by using the air pressure change of the air pad as a parameter.

[0006]

According to the present invention, when the warp servo control is performed, the feedback control of the automatic dressing is performed using the air pressure change of the air pad as a parameter.
Unlike the conventional automatic dressing that uses the blade displacement as a parameter, the dressing work can be performed effectively.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of an inner peripheral blade dressing method for a slicing machine according to the present invention will be described in detail below with reference to the accompanying drawings. In FIG. 1, a chuck body 12 is fixed to the upper end of the spindle 10, and a motor 13 is connected to the lower end of the spindle 10 so that the spindle 10 and the chuck body 12 can rotate. ing.

An outer peripheral edge of a donut-shaped blade 14 is pulled up on the chuck body 12, and an inner peripheral blade 16 is formed on the inner peripheral edge of the blade 14. The inner peripheral blade 16 is composed of fine diamond abrasive grains or the like. Also,
The outer peripheral edge of the blade 14 can be adjusted in tension by a known tensioning mechanism (not shown) of the chuck body 12.

The upper end of the semiconductor ingot 18 is fixed to a work support (not shown). Also, the ingot 18
Can be moved in the cutting feed direction by a cutting feed mechanism (not shown), and the work support can be moved in the work indexing direction by a work indexing mechanism. Further, the upper surface of the blade 14 is shown in FIGS.
As shown in, a pair of non-contact type air pads 30, 3
0, blade sensors 32, 32 are arranged. The displacement of the blade 14 can be detected by the blade sensors 32, 32, and the displacement of the blade 14 can be corrected by the air pads 30, 30. Furthermore, this blade sensor 3
Reference numerals 2 and 32 are connected to the control unit 26, and the control unit 26 controls an air pressure adjusting device (not shown) to control the air pad 3.
The air pressure from 0 and 30 is adjusted.

A dressing device 40 is shown for convenience in FIG. 1, and an arm 41 is provided with a screw rod 42 in a lateral direction, and the screw rod 42 has an inverted L-shaped horizontal moving table 43.
Are screwed together. The screw rod 42 is rotationally driven by a motor 44, which causes the moving base 43 to move in the horizontal direction. The horizontal moving table 43 is provided with a screw rod 45 in the vertical direction,
A vertical moving table 46 is screwed onto the screw rod 45. The screw rod 45 is rotationally driven by a motor 47, which moves the movable table 46 in the vertical direction. A motor 48 is attached to the moving base 46, and the motor 48 is connected to the gear transmission mechanism 4
The dressing stick 50 is rotationally driven via 9. The dressing stick 50 performs the necessary dressing procedure on the inner peripheral blade 16 shown in FIG. 1 for the sake of convenience.

When the air pad 30 operates, the control unit 26 determines the necessity of dressing and the dressing execution mode, and sends a signal to the dressing device drive unit 52, and the drive unit 52 operates the motors 44, 47, 48 to drive the internal operation. Perform the necessary dressing of the peripheral blade 16. The inner peripheral blade dressing method of the slicing machine of the present invention is carried out as follows by the slicing machine configured as described above.

First, the ingot 18 is moved toward the inner peripheral blade 16 to start cutting. Generally, regarding the relationship between the cutting resistance, the cutting diameter, and the ingot feeding speed, the cutting resistance increases as the cutting diameter increases, and the cutting resistance increases as the ingot feeding speed increases. Also,
As the cutting resistance increases, it goes without saying that the blade 1
The displacement of blade 4 becomes large, and the blade 14 is easily warped.
The blade displacement is detected by the sensor 32, and the air pad 30
Performs warp servo control so that the blade displacement always reaches the target value.

At this time, feedback control of automatic dressing is performed using the change in air pressure of the air pad 30 as a parameter. For example, when the sensor 32 detects that the blade 14 is displaced to the plus side by 10 microns, the control unit 26 sends a signal to the air pad 30 and air of 1 kg of air pressure is ejected from the air pad 30 to correct the signal. . At this time, the control unit 26 feeds back a value of 1 kg to the dressing device drive unit 52 to perform automatic dressing according to the air pressure of 1 kg.

[0014]

As described above, according to the inner peripheral blade dressing method of the slicing machine of the present invention, the dressing device is operated with the air pressure of the air pad for correcting the axial displacement of the inner peripheral blade as a parameter. Effectively, automatic dressing of the inner peripheral blade is possible.

[Brief description of drawings]

FIG. 1 is a control block diagram for explaining a dressing device of a slicing machine.

FIG. 2 is a plan view of an inner peripheral blade.

[Explanation of symbols]

 10 ... Spindle 14 ... Blade 16 ... Inner peripheral blade 18 ... Ingot 26 ... Control device 30 ... Air pad 32 ... Sensor 50 ... Dressing stick 52 ... Dressing device drive unit

Claims (1)

[Claims] 1. An inner peripheral blade is attached to a rotating spindle,
It is a slicing machine that presses the semiconductor material against the inner peripheral blade and moves the inner peripheral blade or the semiconductor material relatively close to each other to cut the semiconductor material into thin pieces, and detects the axial displacement of the inner peripheral blade with a sensor. In addition, in the slicing machine for semiconductor wafers that cuts the displacement while correcting it with the air pressure from the air pad, the dressing control of the inner peripheral blade by the automatic dressing device is performed using the air pressure change of the air pad as a parameter. Dressing method for slicing machine.