JPH05337677A - Chamber for soldering and formation of its atmosphere - Google Patents

Chamber for soldering and formation of its atmosphere

Info

Publication number
JPH05337677A
JPH05337677A JP14571692A JP14571692A JPH05337677A JP H05337677 A JPH05337677 A JP H05337677A JP 14571692 A JP14571692 A JP 14571692A JP 14571692 A JP14571692 A JP 14571692A JP H05337677 A JPH05337677 A JP H05337677A
Authority
JP
Japan
Prior art keywords
chamber body
chamber
soldering
inert gas
oxidation reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14571692A
Other languages
Japanese (ja)
Other versions
JP3182209B2 (en
Inventor
Teruo Okano
輝男 岡野
Junichi Onozaki
純一 小野崎
Hidemasa Sato
秀政 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP14571692A priority Critical patent/JP3182209B2/en
Publication of JPH05337677A publication Critical patent/JPH05337677A/en
Application granted granted Critical
Publication of JP3182209B2 publication Critical patent/JP3182209B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To enable the formation of the atmosphere of an extremely low oxygen concn. in a short time even if an inert gas is not excessively supplied into a chamber body. CONSTITUTION:The chamber body 36 is internally delineated and formed by many partition plates to preheating zones 41, 42, 43, reflow zones 44, 45 and a cooling zone 46. An alcohol tank 62 housing isopropyl alcohol 61 is provided on the outside of the chamber body 36. A pipeline 63 led out of the tank 62 is internally provided with a pump 64 for controlling the supply rate of the alcohol to the inside of the chamber body according to the oxygen concn. in the chamber body. The pipeline 63 is connected to nozzles 65 mounted to the upper parts of the respective zones of the chamber body 36. The oxygen concn. in the chamber body decreases when the alcohol sprayed and gasified from the nozzles 65 into the chamber body 36 and the residual oxygen in the chamber body are brought into a vigorous reaction by a heater 66 for combustion.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、不活性雰囲気下ではん
だ付けを行うリフロー式あるいはフロー式(噴流式)の
自動はんだ付け装置に使用されるはんだ付け用チャンバ
およびその雰囲気形成方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering chamber used in a reflow type or flow type (jet type) automatic soldering apparatus for soldering in an inert atmosphere and a method for forming an atmosphere thereof. is there.

【0002】[0002]

【従来の技術】例えば噴流式の自動はんだ付け装置は、
図4に示されるように被はんだ付けワーク(基板)Wを
搬送するコンベヤ11に沿って、フラックス塗布用スプレ
ーフラクサのノズルユニット12およびこれと対向する余
剰フラックス回収ユニット13と、ワークWを予加熱する
プリヒータ14と、ワークWにはんだ付けを行う一次噴流
ノズル15および二次噴流ノズル16を備えたはんだ槽17と
が順次配列されている。
2. Description of the Related Art For example, a jet type automatic soldering apparatus is
As shown in FIG. 4, along the conveyor 11 that conveys the work (substrate) W to be soldered, the nozzle unit 12 of the spray fluxer for flux application, the surplus flux collecting unit 13 facing the nozzle unit 12, and the work W are prepared. A preheater 14 for heating and a solder bath 17 having a primary jet nozzle 15 and a secondary jet nozzle 16 for soldering a work W are sequentially arranged.

【0003】前記プリヒータ14および噴流ノズル15,16
は酸化防止用のチャンバ本体18により覆われており、酸
素濃度計19により測定されたチャンバ本体内酸素濃度に
応じて不活性ガス流量計20が制御され、不活性ガス供給
パイプ21からチャンバ本体18内に窒素等の不活性ガスが
供給される。
The preheater 14 and the jet nozzles 15 and 16
Is covered with a chamber body 18 for preventing oxidation, the inert gas flow meter 20 is controlled according to the oxygen concentration in the chamber body measured by the oxygen concentration meter 19, and the chamber body 18 is fed from the inert gas supply pipe 21. An inert gas such as nitrogen is supplied into the inside.

【0004】このように従来は、ほぼ密閉されたチャン
バ本体18内に窒素等の不活性ガスを注入し、チャンバ本
体内が所望の低酸素濃度に到達するまで不活性ガスの注
入量を増加させる方式を採用している。そして、はんだ
付け時にチャンバ本体内でワークWから放出されたワー
ク塗布フラックス等の有機溶剤のガスや、ワークWとと
もにチャンバ本体18内に持込まれた酸素は、チャンバ本
体内の酸素濃度を上昇させるので、この酸素濃度の上昇
を酸素濃度計19により検出して、不活性ガス流量計20に
より不活性ガス供給量を増加させるようにコントロール
している。
As described above, conventionally, an inert gas such as nitrogen is injected into the chamber body 18 which is substantially sealed, and the injection amount of the inert gas is increased until the inside of the chamber body reaches a desired low oxygen concentration. The method is adopted. The gas of the organic solvent such as the work coating flux released from the work W in the chamber body at the time of soldering and the oxygen brought into the chamber body 18 together with the work W increase the oxygen concentration in the chamber body. The increase in oxygen concentration is detected by the oxygen concentration meter 19, and the inert gas flow meter 20 is controlled so as to increase the amount of inert gas supplied.

【0005】[0005]

【発明が解決しようとする課題】このように従来は、不
活性ガスの供給流量を増加させることにより酸素濃度の
上昇を防止しているため、不活性ガスのランニングコス
トが大きく、好ましくなかった。すなわち、これまでは
残存酸素を希釈、排出するための大流量の不活性ガスが
必要であったし、酸素の希釈、排出の効果が現れるまで
に相当な時間がかかり、濃度コントロールが困難であっ
た。
As described above, conventionally, since the increase in the oxygen concentration is prevented by increasing the supply flow rate of the inert gas, the running cost of the inert gas is large, which is not preferable. In other words, until now, a large flow rate of inert gas was needed to dilute and discharge residual oxygen, and it took a considerable amount of time for the effects of diluting and discharging oxygen to appear, making concentration control difficult. It was

【0006】本発明は、このような点に鑑みなされたも
ので、チャンバ本体内に不活性ガスを過剰に供給しなく
ても極めて低酸素濃度の雰囲気を短時間で形成できるよ
うにすることを目的とするものである。
The present invention has been made in view of the above circumstances, and it is possible to form an atmosphere having an extremely low oxygen concentration in a short time without excessively supplying an inert gas into the chamber body. It is intended.

【0007】[0007]

【課題を解決するための手段】請求項1に記載の発明
は、チャンバ本体内に不活性ガスを供給し、低酸素濃度
雰囲気下ではんだ付けを行うはんだ付け用チャンバにお
いて、可燃性流体をチャンバ本体内に供給する可燃性流
体供給部と、チャンバ本体内酸素濃度に応じてチャンバ
本体内への可燃性流体の供給量を制御する可燃性流体制
御部と、前記チャンバ本体内に配置され可燃性流体とチ
ャンバ本体内残留酸素とを化合させる酸化反応部とを具
備したはんだ付け用チャンバである。
According to a first aspect of the present invention, in a soldering chamber in which an inert gas is supplied into a chamber body and soldering is performed in a low oxygen concentration atmosphere, a flammable fluid is added to the chamber. A combustible fluid supply unit that supplies the main body, a combustible fluid control unit that controls the supply amount of the combustible fluid into the chamber body according to the oxygen concentration in the chamber body, and a combustible fluid disposed in the chamber body. It is a soldering chamber provided with an oxidation reaction part for combining a fluid and residual oxygen in the chamber body.

【0008】請求項2に記載の発明は、請求項1記載の
はんだ付け用チャンバにおいて、チャンバ本体内がワー
ク搬送経路に沿って複数のゾーンに区画形成され、各ゾ
ーン間の境界であってワーク搬送経路に臨む部分にも酸
化反応部が配置されたはんだ付け用チャンバである。
According to a second aspect of the present invention, in the soldering chamber according to the first aspect, the inside of the chamber main body is divided into a plurality of zones along the work transfer path, and the boundaries between the zones are the work pieces. This is a soldering chamber in which the oxidation reaction part is arranged also in the part facing the transport path.

【0009】請求項3に記載の発明は、運転初期は急激
な酸化反応が起きないようにチャンバ本体内への可燃性
流体の供給を停止したまま不活性ガスのみをチャンバ本
体内に注入し、不活性ガスによりチャンバ本体内酸素濃
度が一定濃度まで低下した後はチャンバ本体内に可燃性
流体を供給し、チャンバ本体内に設けられた酸化反応部
により可燃性流体とチャンバ本体内残留酸素とを化合さ
せてチャンバ本体内酸素濃度をさらに低下させるはんだ
付け用チャンバの雰囲気形成方法である。
According to the third aspect of the invention, only the inert gas is injected into the chamber main body while the supply of the flammable fluid into the chamber main body is stopped so that a rapid oxidation reaction does not occur at the initial stage of operation, After the oxygen concentration in the chamber body is reduced to a certain level by the inert gas, a combustible fluid is supplied into the chamber body, and the oxidizing reaction section provided in the chamber body separates the combustible fluid and residual oxygen in the chamber body. This is a method for forming an atmosphere in a soldering chamber in which the oxygen concentration in the chamber body is further reduced by combining them.

【0010】[0010]

【作用】請求項1に記載の発明は、チャンバ本体内へ可
燃性流体を供給するとともに、チャンバ本体内の酸化反
応部により可燃性流体とチャンバ本体内残留酸素とを化
合させて残留酸素を消費することにより、チャンバ本体
内の酸素濃度を低下させる。チャンバ本体内酸素濃度が
上昇すれば可燃性流体の供給量を増やし、また、ワーク
がチャンバ本体内に次々と投入されてワークに塗布され
たフラックス溶剤等の可燃性ガスが燃焼することでチャ
ンバ本体内酸素濃度が十分下がっていれば、可燃性流体
の投入を減少または停止させる。
According to the first aspect of the present invention, the combustible fluid is supplied into the chamber body, and at the same time the combustible fluid and the residual oxygen in the chamber body are combined by the oxidation reaction section in the chamber body to consume the residual oxygen. By doing so, the oxygen concentration in the chamber body is lowered. If the oxygen concentration in the chamber body rises, the supply amount of flammable fluid increases, and the chamber body is continuously burned by burning flammable gas such as flux solvent applied to the workpiece. If the internal oxygen concentration is sufficiently low, the input of the combustible fluid is reduced or stopped.

【0011】請求項2に記載の発明は、チャンバ本体内
のゾーン間にて雰囲気移動の集中する境界部分に設けら
れた酸化反応部によって、ゾーン間で移動する可燃性流
体と酸素との酸化反応を促すことにより、ゾーン間の酸
素移動を防止する。
According to a second aspect of the present invention, the oxidation reaction part provided between the zones in the chamber main body at the boundary portion where the atmosphere movement is concentrated provides an oxidation reaction between the combustible fluid moving between the zones and oxygen. Oxygen transfer between zones is prevented by encouraging.

【0012】請求項3に記載の発明は、運転初期は不活
性ガスのみをチャンバ本体内に注入し、不活性ガスによ
りチャンバ本体内の酸素濃度が一定濃度まで低下した後
は爆発等の急激な酸化反応のおそれがないので、チャン
バ本体内に可燃性流体を供給し、酸化反応部により可燃
性流体とチャンバ本体内残留酸素とを化合させてチャン
バ本体内酸素濃度を一層低下させる。
According to the third aspect of the invention, only the inert gas is injected into the chamber body at the initial stage of operation, and after the oxygen concentration in the chamber body is reduced to a certain concentration by the inert gas, a rapid explosion or the like occurs. Since there is no risk of oxidation reaction, a flammable fluid is supplied into the chamber body, and the flammable fluid and residual oxygen in the chamber body are combined by the oxidation reaction section to further reduce the oxygen concentration in the chamber body.

【0013】[0013]

【実施例】以下、本発明を図1乃至図3に示される実施
例を参照して詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the embodiments shown in FIGS.

【0014】図1は窒素雰囲気によるリフロー式はんだ
付け装置を示し、装置本体31内にワーク(基板)Wを搬
送するコンベヤ32が無端状に設けられ、このコンベヤ32
のワーク搬入部33とワーク搬出部34との間に、入口スロ
ート35、チャンバ本体36および出口スロート37が一連に
設けられている。入口スロート35および出口スロート37
は、不活性ガス供給源(図示せず)から管路38を経てチ
ャンバ本体36内に供給された不活性ガス(窒素ガス等)
に抵抗を与え、チャンバ本体内からの漏れを抑制してい
る。
FIG. 1 shows a reflow type soldering apparatus using a nitrogen atmosphere. An endless conveyor 32 for transferring a work (substrate) W is provided in the apparatus main body 31.
An inlet throat 35, a chamber body 36, and an outlet throat 37 are provided in series between the work loading unit 33 and the work unloading unit 34. Entrance throat 35 and exit throat 37
Is an inert gas (such as nitrogen gas) supplied from an inert gas supply source (not shown) into the chamber main body 36 through the pipe 38.
To suppress the leakage from the inside of the chamber body.

【0015】前記チャンバ本体36の内部では、前記ワー
ク搬送コンベヤ32の下側に落下ワークを回収するネット
コンベヤ40が設けられ、さらにこのワーク搬送コンベヤ
32およびネットコンベヤ40を避けるように設けられた多
数の隔壁板により、第1プリヒートゾーン41、第2プリ
ヒートゾーン42、第3プリヒートゾーン43、第1リフロ
ーゾーン44、第2リフローゾーン45および冷却ゾーン46
が、ワーク搬送経路に沿って区画形成されている。さら
に、各ゾーン間の境界には酸化反応室47がそれぞれ配置
されている。
Inside the chamber main body 36, a net conveyor 40 for collecting the falling work is provided below the work transfer conveyor 32, and this work transfer conveyor is further provided.
The first preheat zone 41, the second preheat zone 42, the third preheat zone 43, the first reflow zone 44, the second reflow zone 45, and the cooling zone are provided by a large number of partition plates provided so as to avoid the 32 and the net conveyor 40. 46
Are formed along the work transfer path. Further, the oxidation reaction chambers 47 are arranged at the boundaries between the zones.

【0016】チャンバ本体36の各ゾーン41〜46には、モ
ータ51によって駆動される雰囲気攪拌用ファン52が設け
られ、また各加熱ゾーン41〜45には雰囲気温度制御用ヒ
ータ53がそれぞれ設けられ、さらに冷却ゾーン46には冷
却コイル54が設けられている。加熱ゾーン41〜45の雰囲
気温度制御用ヒータ53は表面温度400 ℃程度に制御され
る。
An atmosphere stirring fan 52 driven by a motor 51 is provided in each zone 41 to 46 of the chamber body 36, and an atmosphere temperature control heater 53 is provided in each heating zone 41 to 45. Further, a cooling coil 54 is provided in the cooling zone 46. The heater 53 for controlling the ambient temperature in the heating zones 41 to 45 is controlled to have a surface temperature of about 400 ° C.

【0017】前記チャンバ本体36の外部に、可燃性流体
(イソプロピルアルコール等)61をチャンバ本体36内の
各ゾーン41〜46に供給する可燃性流体供給部(アルコー
ル槽)62が設けられ、この可燃性流体供給部62から引出
された管路63中に、チャンバ本体内酸素濃度に応じて可
燃性流体61のチャンバ本体内への供給を制御する可燃性
流体制御部(ポンプまたは電磁弁)64が設けられ、その
管路63が前記チャンバ本体36の各ゾーン上部に取付けら
れたノズル65に接続されている。
A flammable fluid supply unit (alcohol tank) 62 for supplying a flammable fluid (isopropyl alcohol, etc.) 61 to each zone 41 to 46 in the chamber body 36 is provided outside the chamber body 36. A combustible fluid control unit (pump or solenoid valve) 64 that controls the supply of the combustible fluid 61 into the chamber body according to the oxygen concentration in the chamber body is provided in the pipe 63 drawn from the oxidative fluid supply unit 62. The conduit 63 is provided and connected to a nozzle 65 attached to the upper part of each zone of the chamber body 36.

【0018】このチャンバ本体36内の各ゾーン41〜46に
は、ワークWに熱影響をあまり与えない位置にて、可燃
性流体とチャンバ本体内残留酸素とを化合させる酸化反
応部66が設けられている。この酸化反応部66としては、
表面温度700 ℃程度に制御される燃焼用ヒータ(ニクロ
ム線ヒータ等)か、またはチャンバ本体内温度(100℃
〜300 ℃)に保たれる白金、ニッケル、銅等の触媒を使
用する。触媒としての使用では通電しない場合もある。
In each of the zones 41 to 46 in the chamber main body 36, an oxidation reaction section 66 for combining the combustible fluid with the residual oxygen in the chamber main body is provided at a position where the work W is not so affected by heat. ing. As the oxidation reaction section 66,
A combustion heater (nichrome wire heater, etc.) whose surface temperature is controlled to about 700 ° C, or the temperature inside the chamber body (100 ° C
Use a catalyst such as platinum, nickel, copper, etc., which is kept at ~ 300 ° C. When used as a catalyst, it may not be energized.

【0019】さらに、各ゾーン41〜46間の境界に配置さ
れた前記酸化反応室47にも、ワーク搬送経路に臨む部分
に酸化反応部(燃焼用ヒータまたは触媒)67が設けられ
ている。
Further, the oxidation reaction chamber 47 arranged at the boundary between the zones 41 to 46 is also provided with an oxidation reaction section (combustion heater or catalyst) 67 at a portion facing the work transfer path.

【0020】図2はチャンバ本体36内の一部を拡大して
示したもので、前記酸化反応部(燃焼用ヒータまたは触
媒)66が、ワークWに熱影響をあまり与えることなく内
部雰囲気ガスと接触し易いように、隔壁板71に垂直に取
付けられている。また、チャンバ本体36の上部からサン
プリングガス取出管72が引出され、この管72の先に酸素
濃度計73が接続され、この酸素濃度計73に酸素濃度に応
じて前記可燃性流体制御部(ポンプまたは電磁弁)64を
駆動する制御回路74が接続されている。
FIG. 2 is an enlarged view of a part of the chamber main body 36. The oxidation reaction part (combustion heater or catalyst) 66 does not affect the work W so much as to generate an internal atmosphere gas. It is vertically attached to the partition plate 71 so as to be easily contacted. A sampling gas extraction pipe 72 is drawn out from the upper part of the chamber main body 36, and an oxygen concentration meter 73 is connected to the end of the pipe 72, and the flammable fluid control unit (pump Alternatively, a control circuit 74 for driving the solenoid valve) 64 is connected.

【0021】次に、図1に示される実施例の作用を主と
して図2を参照して説明する。
Next, the operation of the embodiment shown in FIG. 1 will be described mainly with reference to FIG.

【0022】運転初期は急激な酸化反応が起きないよう
にチャンバ本体36内への可燃性流体の供給を停止したま
ま窒素(N2 )ガス等の不活性ガスのみをチャンバ本体
36内に注入する。そして、チャンバ本体36内の大部分の
空気がこの不活性ガスにより置換されるから、雰囲気攪
拌用ファン52および雰囲気温度制御用ヒータ53により温
度制御された低酸素濃度高温雰囲気中でリフローはんだ
付けが行われる。
In the initial stage of operation, only an inert gas such as nitrogen (N 2 ) gas is supplied to the chamber body 36 while the supply of the combustible fluid into the chamber body 36 is stopped so that a rapid oxidation reaction does not occur.
Inject into 36. Since most of the air in the chamber body 36 is replaced by this inert gas, reflow soldering can be performed in a low oxygen concentration high temperature atmosphere whose temperature is controlled by the atmosphere stirring fan 52 and the atmosphere temperature control heater 53. Done.

【0023】不活性ガスによりチャンバ本体内酸素濃度
が一定濃度まで低下した後は急激な酸化反応のおそれが
ないので、前記可燃性流体制御部(ポンプまたは電磁
弁)64を作動させてノズル65よりチャンバ本体36内に可
燃性流体(イソプロピルアルコール)を間欠噴霧または
点滴注入する。
Since there is no fear of a rapid oxidation reaction after the oxygen concentration in the chamber body is lowered to a certain concentration by the inert gas, the flammable fluid control unit (pump or solenoid valve) 64 is operated to cause the nozzle 65 to operate. A flammable fluid (isopropyl alcohol) is intermittently sprayed or instilled into the chamber body 36.

【0024】上記アルコール(沸点80℃)は、間欠噴霧
する場合は言うまでもなく点滴注入の場合でも、チャン
バ本体内のプリヒート温度またはリフロー温度により気
化して可燃性ガス61a に相変化するので、チャンバ本体
内に設けられた酸化反応部66により可燃性ガス61a とチ
ャンバ本体内残留酸素とが酸化反応してチャンバ本体内
酸素濃度は一層低下する。すなわち、チャンバ本体36内
へ供給された可燃性ガス61a とチャンバ本体内残留酸素
とがチャンバ本体内の酸化反応部66により化合(燃焼)
して残留酸素を消費することにより、不活性ガスのみで
は実現困難な領域までチャンバ本体内酸素濃度を短時間
のうちに低下させることができる。
The alcohol (boiling point 80 ° C.) is vaporized by the preheat temperature or the reflow temperature in the chamber main body and undergoes a phase change to the flammable gas 61a not only in the case of intermittent spraying but also in the case of drip injection. The flammable gas 61a and the residual oxygen in the chamber body are oxidized by the oxidation reaction section 66 provided inside, and the oxygen concentration in the chamber body further decreases. That is, the combustible gas 61a supplied into the chamber body 36 and the residual oxygen in the chamber body are combined (combusted) by the oxidation reaction section 66 in the chamber body.
By consuming the residual oxygen, it is possible to reduce the oxygen concentration in the chamber body to a region that is difficult to achieve with only the inert gas in a short time.

【0025】前記酸化反応部66が燃焼用ヒータである場
合は、この酸化反応部66によりフラックスガスが燃焼し
てチャンバ本体36内の汚れを低減できる効果もある。
When the oxidation reaction section 66 is a combustion heater, the oxidation reaction section 66 has the effect of burning the flux gas to reduce the contamination in the chamber body 36.

【0026】前記制御回路74は、チャンバ本体内酸素濃
度が高いときは噴霧量または点滴量が多くなるように可
燃性流体制御部64を制御し、酸素濃度が低いときは可燃
性流体61の噴霧量または点滴量が減量または零となるよ
うに可燃性流体制御部64を制御する。すなわち、前記チ
ャンバ本体内酸素濃度が上昇すれば可燃性流体61の供給
を増加させ、また、ワークWがチャンバ本体36内に次々
と投入されてワークWに塗布されたフラックス溶剤から
発生した可燃性ガスが燃焼することでチャンバ本体内酸
素濃度が十分下がっていれば、可燃性流体61の供給を減
少または停止させる。
The control circuit 74 controls the combustible fluid control unit 64 so that the amount of spray or drip increases when the oxygen concentration in the chamber body is high, and the spray of the combustible fluid 61 is performed when the oxygen concentration is low. The flammable fluid control unit 64 is controlled so that the amount or drip amount is reduced or becomes zero. That is, if the oxygen concentration in the chamber body increases, the supply of the flammable fluid 61 is increased, and the work W is introduced into the chamber body 36 one after another and the flammability generated from the flux solvent applied to the work W is increased. If the oxygen concentration in the chamber body is sufficiently lowered by the combustion of the gas, the supply of the combustible fluid 61 is reduced or stopped.

【0027】このように、チャンバ本体内可燃性ガス61
a の酸化反応によりチャンバ本体内残留酸素を減らすよ
うにしたので、雰囲気形成用不活性ガス(窒素ガス等)
は、可燃性ガス61a の内部濃度が上がっても爆発等の危
険のないレベルまで酸素濃度を下げるに十分な能力の純
度および流量があればよく、一定の低酸素濃度を得るの
に従来ほど高純度で多量の不活性ガスは必要ない。
In this way, the flammable gas 61 in the chamber body is
Since the residual oxygen in the chamber body is reduced by the oxidation reaction of a, an inert gas for forming the atmosphere (nitrogen gas, etc.)
It is sufficient if the purity and flow rate are sufficient to reduce the oxygen concentration to a level where there is no danger of explosion even if the internal concentration of the flammable gas 61a rises. Purity does not require large amounts of inert gas.

【0028】チャンバ本体36内のゾーン間にて雰囲気移
動の集中する境界部分に設けられた酸化反応部67は、ゾ
ーン41〜46間で移動する可燃性ガスと酸素との酸化反応
を促すことにより、ゾーン毎に酸素濃度を制御する。
The oxidation reaction portion 67 provided at the boundary portion where the atmosphere movement is concentrated between the zones in the chamber main body 36, by promoting the oxidation reaction between the combustible gas and the oxygen moving between the zones 41 to 46. , Control the oxygen concentration for each zone.

【0029】図3は本発明をフロー式はんだ付け装置に
適用した例であり、前記雰囲気温度制御用ヒータ53の代
りに、ワーク搬送コンベヤ32の下側に噴流式はんだ槽81
が設けられ、そのノズル82から噴流される溶融はんだ83
によってワークWにはんだ付けがなされる点を除くと、
図2に示された実施例と同様であるから、図2と同一の
符号を付してその説明を省略する。
FIG. 3 shows an example in which the present invention is applied to a flow type soldering apparatus. Instead of the atmosphere temperature control heater 53, a jet type solder bath 81 is provided below the work transfer conveyor 32.
And the molten solder 83 jetted from its nozzle 82.
Except that the work W is soldered by
Since it is the same as the embodiment shown in FIG. 2, the same reference numerals as those in FIG.

【0030】なお、本発明にかかる可燃性流体供給手段
および酸化反応部66は、少なくとも第1リフローゾーン
44には必ず設けるものとする。
The combustible fluid supply means and the oxidation reaction section 66 according to the present invention are provided at least in the first reflow zone.
Must be provided on 44.

【0031】また、可燃性流体61は、加熱されることに
より可燃性ガスに相変化する可燃性液体(アルコール
等)を使用したが、常温で気相の可燃性ガスをチャンバ
本体内に直接供給するようにしても良い。
As the flammable fluid 61, a flammable liquid (alcohol, etc.) that changes its phase into a flammable gas when heated is used. It may be done.

【0032】[0032]

【発明の効果】請求項1に記載の発明によれば、チャン
バ本体内に高純度の不活性ガスを多量に供給しなくて
も、酸化反応によりチャンバ本体内に極めて低酸素濃度
の雰囲気を短時間で形成できる。このため、不活性ガス
は比較的低純度のガスで良く、例えば液体窒素等を大型
タンクから供給することなく、小型の窒素発生装置等か
ら供給した安価な低純度不活性ガスでも、前記酸化反応
によって低酸素濃度のはんだ付け雰囲気をチャンバ本体
内に形成できるから、不活性ガス供給に要するランニン
グコストを著しく改善できる。しかも、この酸化反応を
利用すると早いタイミングでチャンバ本体内酸素濃度を
低下できる。
According to the first aspect of the present invention, even if a large amount of high-purity inert gas is not supplied into the chamber body, the atmosphere having an extremely low oxygen concentration can be shortened by the oxidation reaction. Can be formed in time. Therefore, the inert gas may be a relatively low-purity gas, for example, the low-purity inert gas supplied from a small-sized nitrogen generator or the like without supplying liquid nitrogen or the like from a large tank can be used for the oxidation reaction. Since a soldering atmosphere having a low oxygen concentration can be formed in the chamber body, the running cost required to supply the inert gas can be significantly improved. Moreover, by utilizing this oxidation reaction, the oxygen concentration in the chamber body can be lowered at an early timing.

【0033】請求項2に記載の発明によれば、チャンバ
本体内にあってガス移動の集中するゾーン間境界部分に
設けられた酸化反応部により酸化反応を促して、ゾーン
間で移動しようとする酸素を除去できるから、ゾーン毎
に酸素濃度の制御が可能である。
According to the second aspect of the present invention, the oxidation reaction portion provided in the boundary portion between the zones in the chamber body where the gas movement is concentrated promotes the oxidation reaction to move between the zones. Since oxygen can be removed, it is possible to control the oxygen concentration for each zone.

【0034】請求項3に記載の発明によれば、運転初期
はチャンバ本体内への可燃性流体の供給を停止したまま
不活性ガスのみをチャンバ本体内に注入し、チャンバ内
が一定の低酸素濃度となった後にチャンバ本体内に可燃
性流体を供給して酸化反応によりチャンバ本体内残留酸
素を除去するようにしたから、急激な酸化反応による爆
発等のおそれを防止でき、安全性を確保できる。
According to the third aspect of the invention, only the inert gas is injected into the chamber body while the supply of the combustible fluid into the chamber body is stopped at the beginning of the operation, and the inside of the chamber is kept at a low oxygen content. After the concentration is reached, a combustible fluid is supplied into the chamber body to remove the residual oxygen in the chamber body by an oxidation reaction, so the risk of explosion due to a rapid oxidation reaction can be prevented, and safety can be ensured. ..

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のはんだ付け用チャンバがリフロー式は
んだ付け装置に適用された例を示す断面図である。
FIG. 1 is a cross-sectional view showing an example in which a soldering chamber of the present invention is applied to a reflow type soldering device.

【図2】同上リフロー式はんだ付け装置の一部を拡大し
て示した断面図である。
FIG. 2 is an enlarged sectional view showing a part of the reflow soldering device of the above.

【図3】本発明のはんだ付け用チャンバが噴流式はんだ
付け装置に適用された例を示す断面図である。
FIG. 3 is a cross-sectional view showing an example in which the soldering chamber of the present invention is applied to a jet type soldering device.

【図4】従来のはんだ付け用チャンバの使用例を示す断
面図である。
FIG. 4 is a sectional view showing a usage example of a conventional soldering chamber.

【符号の説明】[Explanation of symbols]

36 チャンバ本体 41〜46 ゾーン 61 可燃性流体 62 可燃性流体供給部 64 可燃性流体制御部 66 酸化反応部 67 酸化反応部 36 Chamber body 41 to 46 Zone 61 Flammable fluid 62 Flammable fluid supply section 64 Flammable fluid control section 66 Oxidation reaction section 67 Oxidation reaction section

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 チャンバ本体内に不活性ガスを供給し、
低酸素濃度雰囲気下ではんだ付けを行うはんだ付け用チ
ャンバにおいて、 可燃性流体をチャンバ本体内に供給する可燃性流体供給
部と、 チャンバ本体内酸素濃度に応じてチャンバ本体内への可
燃性流体の供給量を制御する可燃性流体制御部と、 前記チャンバ本体内に配置され可燃性流体とチャンバ本
体内残留酸素とを化合させる酸化反応部とを具備したこ
とを特徴とするはんだ付け用チャンバ。
1. An inert gas is supplied into the chamber body,
In a soldering chamber where soldering is performed in a low oxygen concentration atmosphere, a combustible fluid supply unit that supplies a combustible fluid into the chamber body, and a combustible fluid that flows into the chamber body depending on the oxygen concentration in the chamber body A soldering chamber comprising: a flammable fluid control unit that controls a supply amount; and an oxidation reaction unit that is disposed in the chamber body to combine the flammable fluid and residual oxygen in the chamber body.
【請求項2】 チャンバ本体内がワーク搬送経路に沿っ
て複数のゾーンに区画形成され、各ゾーン間の境界であ
ってワーク搬送経路に臨む部分にも酸化反応部が配置さ
れたことを特徴とする請求項1記載のはんだ付け用チャ
ンバ。
2. The chamber main body is divided into a plurality of zones along the work transfer path, and the oxidation reaction section is also arranged at the boundary between the zones and facing the work transfer path. The chamber for soldering according to claim 1.
【請求項3】 運転初期は急激な酸化反応が起きないよ
うにチャンバ本体内への可燃性流体の供給を停止したま
ま不活性ガスのみをチャンバ本体内に注入し、不活性ガ
スによりチャンバ本体内酸素濃度が一定濃度まで低下し
た後はチャンバ本体内に可燃性流体を供給し、チャンバ
本体内に設けられた酸化反応部により可燃性流体とチャ
ンバ本体内残留酸素とを化合させてチャンバ本体内酸素
濃度をさらに低下させることを特徴とするはんだ付け用
チャンバの雰囲気形成方法。
3. In the initial stage of operation, only the inert gas is injected into the chamber body while the supply of the combustible fluid into the chamber body is stopped so that a rapid oxidation reaction does not occur, and the chamber body is filled with the inert gas. After the oxygen concentration has dropped to a certain level, a combustible fluid is supplied into the chamber body, and the oxidizing reaction part provided in the chamber body combines the combustible fluid and residual oxygen in the chamber body to generate oxygen in the chamber body. A method for forming an atmosphere in a soldering chamber, which further reduces the concentration.
JP14571692A 1992-06-05 1992-06-05 Method for forming atmosphere in soldering chamber Expired - Fee Related JP3182209B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14571692A JP3182209B2 (en) 1992-06-05 1992-06-05 Method for forming atmosphere in soldering chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14571692A JP3182209B2 (en) 1992-06-05 1992-06-05 Method for forming atmosphere in soldering chamber

Publications (2)

Publication Number Publication Date
JPH05337677A true JPH05337677A (en) 1993-12-21
JP3182209B2 JP3182209B2 (en) 2001-07-03

Family

ID=15391480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14571692A Expired - Fee Related JP3182209B2 (en) 1992-06-05 1992-06-05 Method for forming atmosphere in soldering chamber

Country Status (1)

Country Link
JP (1) JP3182209B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005294561A (en) * 2004-03-31 2005-10-20 Tamura Seisakusho Co Ltd Reflow apparatus
JP2007329376A (en) * 2006-06-09 2007-12-20 Tamura Furukawa Machinery:Kk Reflow furnace
JP2017505543A (en) * 2014-01-23 2017-02-16 イリノイ トゥール ワークス インコーポレイティド Flux management system for wave soldering machine and method for removing contaminants
CN107283014A (en) * 2017-08-17 2017-10-24 芜湖市海源铜业有限责任公司 One Albatra metal atomizing crest welder equipment
JP2021085652A (en) * 2019-11-26 2021-06-03 鐘瑩瑩 Oxidation prevention device for organic chemistry experiment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005294561A (en) * 2004-03-31 2005-10-20 Tamura Seisakusho Co Ltd Reflow apparatus
JP2007329376A (en) * 2006-06-09 2007-12-20 Tamura Furukawa Machinery:Kk Reflow furnace
JP4721352B2 (en) * 2006-06-09 2011-07-13 株式会社タムラ製作所 Reflow furnace
JP2017505543A (en) * 2014-01-23 2017-02-16 イリノイ トゥール ワークス インコーポレイティド Flux management system for wave soldering machine and method for removing contaminants
CN107283014A (en) * 2017-08-17 2017-10-24 芜湖市海源铜业有限责任公司 One Albatra metal atomizing crest welder equipment
JP2021085652A (en) * 2019-11-26 2021-06-03 鐘瑩瑩 Oxidation prevention device for organic chemistry experiment

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