JPH05335194A - Manufacture of electronic component - Google Patents

Abstract

PURPOSE:To provide an electronic component manufacturing method, where cutting reference dimensions can be determined without actually cutting a mother substrate so as to enhance a dicer in operating efficiency when many electronic components are cut out of the mother substrate. CONSTITUTION:A full-face electrode 8 is formed on one side of a mother substrate 5, partial electrodes 6a to 6d different in area and a mother electrode 7 are formed on the other side, a voltage is applied between the partial electrodes 6a to 6d and the full-face electrode 8 to measure electrical properties, a partial electrode where required properties are displayed is selected, a part of the mother substrate 5 where the mother electrode 7 and the full-face electrode 8 opposed to each other is cut out corresponding to the side of the partial electrode concerned to obtain a separate electronic component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component including a step of cutting out a large number of electronic components from a mother board, and more particularly, to an electronic component improved in the step of determining the dimensions for cutting out the individual electronic components. It relates to a manufacturing method.

[0002]

2. Description of the Related Art In electronic parts such as capacitors, a large number of electronic parts are formed on a mother board and the mother board is cut into individual electronic parts to mass-produce the electronic parts. An example of a method of manufacturing such an electronic component will be described with reference to FIG. 2 by taking a high frequency chip type capacitor as an example. First, as shown in FIG. 2A, full-surface electrodes 2 and 3 are formed on the upper surface and the lower surface of the mother substrate 1 made of a dielectric material by screen printing or the like.
Next, the mother board 1 is set on a dicer as a cutting device, and a plurality of capacitor chips 4a to 4a to 4c are attached according to preset reference dimensions as shown in FIG. 2B.
Cut out 4f. At this time, the capacitor chips 4a-4
f is cut out so that the dimensions in the direction of arrow x in FIG. 2B are different. Then, the capacitance of each of the capacitor chips 4a to 4f is measured, the capacitor chip closest to the target capacitance is selected, and the size of the mother chip 1 of the mother board 1 is adjusted according to the dimension of the capacitor chip in the arrow X direction. The cutting dimension in the direction orthogonal to the arrow X was determined, and the remaining mother substrate 1 was cut according to the dimension to obtain a large number of chip capacitors.

[0003]

As described above, in the conventional method of manufacturing an electronic component, after setting the mother substrate 1 on the dicer, the capacitor chips 4a to 4f are cut out and the capacitance is measured. The operation of the dicer is stopped during the series of steps. Therefore, when mass-producing a large number of electronic parts, the capacitor chips 4a-4
There is a problem that the operating efficiency of the dicer is reduced by the time required to cut out f and measure the electrostatic capacitance.

An object of the present invention is to provide a manufacturing method capable of increasing the operating efficiency of a dicer when cutting out a large number of electronic components from a mother board, and thus enhancing the mass productivity of electronic components.

[0005]

SUMMARY OF THE INVENTION The present invention is a method for cutting out a large number of electronic components from a mother substrate to obtain individual electronic components, in which a full-scale electrode is formed on one side and an object is formed on the other side. A plurality of partial electrodes having different areas according to the electrode area of the element and a mother substrate on which a mother electrode is formed are prepared, and a voltage is applied between each of the plurality of partial electrodes and the entire surface electrode. Apply the voltage and measure the electrical performance of each part where each partial electrode and the whole surface electrode face each other, and the mother electrode and the whole surface electrode face each other according to the dimension of the partial electrode having the desired performance. Cut the mother board part,
It is a method of manufacturing an electronic component, which is characterized by obtaining individual electronic components.

[0006]

According to the present invention, the size of the mother substrate to be cut to obtain individual electronic components from the mother substrate is determined by applying a voltage between the partial electrode and the full surface electrode formed on the mother substrate, This is performed by measuring the electrical performance of the facing portion of each partial electrode and the entire surface electrode. That is, the dimensions for finally cutting the mother substrate can be determined without cutting the mother substrate. Therefore, since the electrical performance measuring operation for determining the cutting dimension can be performed before setting the mother substrate in the dicer, the dicer only needs to perform the final cutting process of the mother substrate. Therefore, the operating efficiency of the dicer can be effectively increased.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be clarified by describing one embodiment of the present invention with reference to the drawings. In this embodiment, first, the mother substrate 5 shown in FIG. 1 is prepared. On the upper surface of the mother substrate 5, a plurality of partial electrodes 6a to 6d are formed in an elongated region 5b near the end line 5a. The partial electrodes 6a to 6d have different dimensions in the arrow X direction shown in the drawing, and are configured in a rectangular shape in which the dimensions in the direction orthogonal to the X direction are constant. Further, the mother electrode 7 is formed in the entire remaining area except the elongated area 5b. On the other hand, the whole surface electrode 8 is formed on the lower surface of the mother substrate 5.

The partial electrodes 6a to 6d, the mother electrode 7 and the whole surface electrode 8 can be formed by an appropriate method such as screen printing. Next, in the mother substrate 5, a voltage is applied between each of the partial electrodes 6a to 6d and the whole surface electrode 8 to make each of the partial electrodes 6a to 6d and the whole surface electrode 8
Measure the capacitance of the part where and are facing each other. Based on this measurement result, the partial electrode closest to the target capacitance is selected, and the length dimension of the partial electrode in the X direction is adopted as the cutting dimension of the mother substrate 5.

Next, the mother board 5 is set in a cutting device such as a dicer, and the mother board 5 is cut in the direction orthogonal to the arrow X direction according to the cutting dimension selected as described above, and the X direction is cut. For the above-mentioned partial electrodes 6a to 6d
By cutting with a size equal to the width (length in the direction orthogonal to the arrow x direction), a large number of chip-type capacitors having a desired capacitance can be obtained. As described above, since the partial electrodes 6a to 6d are formed in order to determine the dimension in the X direction that can obtain the capacitance closest to the target capacitance, the target capacitance is usually set. It is necessary to form a plurality of types from a dimension shorter than the dimension to a dimension longer than the dimension for obtaining the dimension.

In the illustrated embodiment, the partial electrode 6 is
Although a to 6d are different only in the dimension in the X direction,
A plurality of partial electrodes having different dimensions in the direction orthogonal to the X direction may be formed. Further, although the above-mentioned embodiment is applied to the method for obtaining the chip type capacitor, the present invention is such that the electrodes are opposed to each other via the substrate and the electrical performance between the opposed electrodes is improved. The present invention can be generally applied to a method of manufacturing an electronic component that draws out the electric field, and can also be applied to a method of manufacturing another electronic component such as a piezoelectric resonator.

[0011]

As described above, in the present invention, the mother substrate is cut by measuring the electrical performance between each of the plurality of partial electrodes and the entire surface electrode without cutting the mother substrate. A reference dimension for is determined. Therefore, since the mother substrate can be set in the dicer and the mother substrate cutting process can be performed after the reference dimension for cutting the mother substrate is determined, the operating efficiency of the dicer and thus the mass productivity of electronic components are dramatically improved. It becomes possible.

[Brief description of drawings]

FIG. 1 is a perspective view for explaining a method of manufacturing an electronic component according to an embodiment of the present invention.

2A and 2B are perspective views for explaining a conventional method for manufacturing an electronic component.

[Simple explanation of symbols]

 5 ... Mother substrate 6a-6d ... Partial electrode 7 ... Mother electrode 8 ... Full surface electrode

Claims (1)

[Claims] 1. A full-scale electrode is formed on one surface, and a plurality of types of partial electrodes having different areas according to the electrode area of a target electronic component, and a mother electrode are formed on the other surface. A mother substrate is prepared, a voltage is applied between each of the plurality of partial electrodes and the full-scale electrode, and the electrical performance of each of the facing portions of each partial electrode and the full-scale electrode is measured to obtain the objective. A method for manufacturing an electronic component, characterized in that an individual electronic component is obtained by cutting a mother substrate portion where the mother electrode and the entire surface electrode face each other according to the dimension of the partial electrode having the performance.