JPH05334420A - Image signal processor for judging parts arrangement status - Google Patents

Abstract

PURPOSE:To quickly judge the validity of arrangement status by inputting images obtained by simultaneously and collectively photographing an object to be judged at its arrangement by a photographing device provided with plural polarizing plates corresponding to respective irradiation angles. CONSTITUTION:When LEDs 21a to 21f are turned on, an object 28 to be judged is irradiated with beams having respectively different polarized light from respective polarizing plates 22a to 22f, reflected light beams from the object 28 are individually photographed by respective CCD cameras 26a to 26c through polarizing plates 27a to 27c and these image signals are individually sent. Consequently images obtained by the object 28 to be judged at its arrangement status can be simultaneously and collectively entered and the validity of the arrangement status can quickly be judged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component arrangement state determination image signal processing apparatus for extracting a characteristic of an arrangement state determination object by an irradiation angle and making a determination.

[0002]

2. Description of the Related Art Conventionally, an image signal processing device for determining a component arrangement state of this kind changes an irradiation angle in order to extract a feature of an object and captures an image for each irradiation angle to obtain image data of a good product. Compared with. Alternatively, the quality of the object is judged by comparing the degree of change of the image data depending on the irradiation angle.

FIG. 4 shows the structure of such a conventional image signal processing device for determining the component arrangement state. In FIG. 4, 11 is a CCD camera, and this CCD camera 11
Outputs an image signal, and this image signal is supplied to a signal processing device (not shown) for determining the quality of the arrangement state.
12 is a boundary cylinder, 13a, 13b, 13c, 13d, 13
e and 13f are LEDs arranged on a hemisphere, and LED1
3a, 13b and LED 13c, 13d and LED 13e,
13f and 13f are arranged at the same height. 14
Is an electronic component that is surface-mounted on the circuit board, and is an object to be determined for determining the quality of the arrangement state. Reference numeral 15 is a soldering portion to which the determination object 14 is connected.

LEDs 13a to 13f arranged in a hemispherical shape
Irradiates the judgment object 14 and the soldering portion 15. The light reflected here passes through the boundary cylinder 12 and the CCD camera 11
Is incident on.

FIG. 5 shows an image taken by the CCD camera 11. In addition, this image shows all LEDs 13a-
13C is an image captured by the CCD camera 11 when all the objects 13f are turned on and the determination target 14 is illuminated.

Next, the operation of this conventional configuration will be described. LEDs 13a, 13b, LEDs 13c, 13d and LEDs for determining the state of the soldering portion 15
13e and 13f are sequentially turned on and illuminated in three stages. The CCD camera 11 captures an image of the soldering portion 15 with the three-step irradiation angles and captures the image data. This 3
By lighting in stages, that is, by changing the irradiation angle, a characteristic corresponding to the reflection state shown by the shaded portions a, b, and c occurs in the imaging of the soldering portion 15 as shown in FIG. The characteristics of the shaded portions a, b, and c are compared with the empirical soldering state to determine the connection state of the soldering portion 15, the quality of the solder amount, and the like.

[0007]

However, in the image capturing method by the conventional image signal processing device for determining the component arrangement state, one NTSC system C having general versatility is used.
When using the CD camera 11, the image data acquisition time for each irradiation angle is 30 ms according to the NTSC standard.
Every ec hours. That is, at least 90 ms when capturing image data according to irradiation angles from three directions
ec time is required.

This time is longer than the judgment processing time when the image data is taken in when a real-time application in which the task of taking the image data and the task of carrying out the data judgment process is developed at the same time. Most of the processing time is a determination task, and there is a problem that the quality of the placement state cannot be determined quickly.
The present invention solves such conventional problems,
Providing an excellent image signal processing device for component placement state determination that enables simultaneous image capturing of placement state determination targets at the same time by an imaging device equipped with a polarizing plate for each irradiation angle to quickly determine whether the placement state is good or bad With the goal.

[0009]

In order to achieve the above object, an image signal processing device for determining a component arrangement state according to the present invention comprises:
Light emitting means arranged so that the irradiation angles are different from each other, light from the light emitting means are incident, and a plurality of first polarizing means having different polarizability are respectively arranged, and light having different polarization from the first polarizing means is arranged. Arrangement state determination that has the same polarization property as the first polarization hand with which the state determination target member is irradiated and its reflected light is incident and that has the same number of second polarization means and the second polarization means. Only the reflected light from the target member is individually incident, and a plurality of photographing means for transmitting the image signal is provided.

Further, the light emitting means is arranged stepwise in the hemispherical member so that the irradiation angles are different from each other.

The members for which the arrangement state is to be determined are components and soldering parts which are surface-mounted on the circuit board.

[0012]

With such a configuration, in the image signal processing device for component placement state determination according to the present invention, light having different polarizations is applied to the placement state determination target member from the first polarizing means, and the reflected light is reflected by the first member. The image signals are transmitted by individually photographing through the same number of second polarization means having the same polarization property as the polarization hands.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of an image signal processing device for determining a component arrangement state of the present invention will be described in detail below with reference to the drawings.

FIG. 1 shows the configuration of the embodiment. In FIG. 1, 21a, 21b, 21c, 21d, 21e, 2
Reference numeral 1f is an LED (corresponding to the light emitting means in the claims) arranged on the hemispherical surface, and includes LEDs 21a and 21b and LE.
D21c and 21d and LED21e and 21f are arrange | positioned at the same height, respectively.

22a, 22b, 22c, 22d, 22
The polarizing plates e and 22f are provided in front of the LEDs 21a to 21f and have different polarizability (the first in the claims.
Corresponding to the polarization means). Reference numeral 25 is an optical system lens that disperses light, and 26a, 26b, and 26c are CCD cameras (corresponding to the photographing means in the claims). The CCD cameras 26a to 26c output image signals,
This image signal is supplied to a signal processing device (not shown) for determining the quality of the arrangement state. 27a, 27b, 27
Reference numeral c is a polarizing plate (in front of the CCD cameras 26a to 26c) having different polarizability and having the same characteristics as the polarizing plates 22a to 22f (corresponding to the second polarizing means in the claims). Reference numeral 28 denotes an electronic component surface-mounted on the circuit board, which is a determination target for determining the quality of the arrangement state. 29a and 29b are soldering portions.

The light reflected by the object to be judged 28 and the soldering portions 29a, 29b emitted from the LEDs 21a to 21f is divided into respective directions by the optical system lens 25 and passes through the polarizing plates 22a to 22f. The images are captured by the CCD cameras 26a to 26c. Next, the operation of the configuration of this embodiment will be described.

FIG. 2 shows a composite image of the object to be judged 28 and the soldering portions 29a and 29b directly photographed by the CCD cameras 26a to 26c. 3 (a) (b)
(C) shows respective images taken by the CCD cameras 26a to 26c.

LEDs 21 having different irradiation angles
a, 21b and LEDs 21c, 21d and LEDs 21e, 2
With respect to the illumination from 1f, the respective lights that have passed through the polarizing plates 22a to 22f having different polarizability in front thereof are reflected by the determination target object 28 and the soldering portions 29a and 29b.
Part of it is incident on the optical system lens 25.

The optical system lens 25 is designed so as to split light into the same number of different irradiation angles, and the incident light there is split into three directions.

These spectra are obtained by the polarizing plate 2 having different polarizability.
7a-27c, CCD26a-26 respectively
It is incident on c.

FIGS. 3A, 3B, and 3C are image data of the images incident on the CCDs 26a to 26c, respectively. The determination target object 28 and the object 28 in FIGS. 3A, 3B, and 3C are shown. In the soldering portions 29a and 29b, the soldering portion 29
The shaded portions a, b, and c of a and 29b indicate reflections due to the soldering state when the irradiation angles are different. C
The composite image of the CDs 26a to 26c includes hatched portions a, b and c as shown in FIG. Next, the CCDs 26a-2
The image pickup incident on 6c will be described in detail. Here, C
Only one direction of the CD 26a will be described. Note that CC
The same applies to D26b and 26c.

From the LEDs 21a, 21b to the polarizing plates 22a,
The light that has passed through 22b is the object to be judged 28 and the soldering portion 2
Irradiate 9a and 29b. In this case, the LEDs 21a, 2
Corresponding to the irradiation angle of 1b, it is reflected based on the soldering state of the soldering portion 29a, and the reflected light passes through the optical system lens 25 and is incident on the polarizing plate 27a.

In this case, the polarizing plates 22c, 22d, 22
Part of the light that has passed through e and 22f is also incident on the polarizing plate 27a. Since the polarizing plate 27a allows only light of a specific direction to pass, only the light polarized by the polarizing plates 22a and 22b is C
It is incident on the CD camera 26a. Other polarized light is blocked. That is, only the reflected light from the polarizing plates 22a and 22b is incident on the CCD camera 26a. As shown in FIG. 3C, in the image data of the image captured by this incident, only the features in the vicinity of the outer periphery of the soldering portion 29a appear.

The characteristics corresponding to this reflection state, that is,
The characteristics of the shaded portions a, b, and c are compared with the empirical soldering state to determine the connection state of the soldering portion 15, the quality of the solder amount, and the like. As described above, according to the above-described embodiment, the polarizing plates 22a to 22f and the optical system lens 25, which have different polarizability depending on the irradiation angle, are used.
Also, it is possible to simultaneously capture image data similar to that obtained by imaging at apparently different irradiation angles by using the polarizing plates 27a to 27c.

[0025]

As is apparent from the above description, in the image signal processing device for component placement state determination according to the present invention, light having different polarizations is applied to the placement state determination target member from the first polarizing means and reflected. The light has the same polarization as the first polarizing hand,
Moreover, since the image signals are individually shot and transmitted through the same number of second polarization means, the images of the placement state determination target objects can be captured at the same time, and the quality of the placement state can be quickly determined. It has the effect that

[Brief description of drawings]

FIG. 1 is a side view showing the configuration of an embodiment of an image signal processing device for component placement state determination of the present invention.

FIG. 2 is a top view showing a composite image obtained by photographing a determination target and a soldering portion with three CCD cameras, which is used for explaining the embodiment.

3 (a), (b) and (c) are provided for explaining an embodiment,
Top view showing an image captured by a CCD camera

FIG. 4 is a side view showing a configuration of a conventional image signal processing device for component placement state determination.

FIG. 5 is a top view used to explain a conventional example and showing an image captured by a CCD camera.

[Description of Reference Signs] 21a, 21b, 21c, 21d, 21e, 21f L
ED 22a, 22b, 22c, 22d, 22e, 22f Polarizing plate 25 Optical system lens 26a, 26b, 26c CCD camera 27a, 27b, 27c Polarizing plate 28 Judgment target object 29a, 29b Soldering part

Claims (3)

[Claims] 1. A light emitting means arranged so that the irradiation angles are different from each other, a plurality of first polarizing means having different polarizability upon which light from the light emitting means is incident, and the first polarizing means. Light having different polarizations from the first polarization hand is irradiated to the arrangement state determination target member, and the reflected light is incident on the member, and the same number of second polarization means and the second polarization means are provided. The image signal processing device for component placement state determination, comprising: a plurality of image pickup means that individually receive only the reflected light from the placement state determination target member that has passed through the polarization means and send out the image signals thereof. 2. The image signal processing device for component arrangement state determination according to claim 1, wherein the light emitting means is arranged stepwise in the hemispherical member so that the irradiation angles are different from each other. 3. The image signal processing device for component placement state determination according to claim 1, wherein the placement state determination target member is a component and a soldering portion which are surface-mounted on the circuit board.