JPH05334420A - Image signal processor for judging parts arrangement status - Google Patents

Image signal processor for judging parts arrangement status

Info

Publication number
JPH05334420A
JPH05334420A JP4144070A JP14407092A JPH05334420A JP H05334420 A JPH05334420 A JP H05334420A JP 4144070 A JP4144070 A JP 4144070A JP 14407092 A JP14407092 A JP 14407092A JP H05334420 A JPH05334420 A JP H05334420A
Authority
JP
Japan
Prior art keywords
image signal
state determination
light
image
signal processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4144070A
Other languages
Japanese (ja)
Other versions
JP3196321B2 (en
Inventor
Isao Udagawa
勲 宇田川
Hiroo Uchiyama
博夫 内山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14407092A priority Critical patent/JP3196321B2/en
Publication of JPH05334420A publication Critical patent/JPH05334420A/en
Application granted granted Critical
Publication of JP3196321B2 publication Critical patent/JP3196321B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Image Input (AREA)
  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)

Abstract

PURPOSE:To quickly judge the validity of arrangement status by inputting images obtained by simultaneously and collectively photographing an object to be judged at its arrangement by a photographing device provided with plural polarizing plates corresponding to respective irradiation angles. CONSTITUTION:When LEDs 21a to 21f are turned on, an object 28 to be judged is irradiated with beams having respectively different polarized light from respective polarizing plates 22a to 22f, reflected light beams from the object 28 are individually photographed by respective CCD cameras 26a to 26c through polarizing plates 27a to 27c and these image signals are individually sent. Consequently images obtained by the object 28 to be judged at its arrangement status can be simultaneously and collectively entered and the validity of the arrangement status can quickly be judged.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、照射角度により配置状
態判定対象物の特徴を抽出して判定を行なう部品配置状
態判定用画像信号処理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component arrangement state determination image signal processing apparatus for extracting a characteristic of an arrangement state determination object by an irradiation angle and making a determination.

【0002】[0002]

【従来の技術】従来、この種の部品配置状態判定用画像
信号処理装置は対象物の特徴を抽出するために照射角度
を変化させ、その照射角度ごとに画像の取り込みを行っ
て良品の画像データと比較している。あるいは照射角度
による画像データの変化の度合いを比較して対象物の良
否を判定している。
2. Description of the Related Art Conventionally, an image signal processing device for determining a component arrangement state of this kind changes an irradiation angle in order to extract a feature of an object and captures an image for each irradiation angle to obtain image data of a good product. Compared with. Alternatively, the quality of the object is judged by comparing the degree of change of the image data depending on the irradiation angle.

【0003】図4は、このような従来の部品配置状態判
定用画像信号処理装置の構成を示している。図4におい
て、11はCCDカメラであり、このCCDカメラ11
は画像信号を出力し、この画像信号が配置状態の良否を
判定するための図示しない信号処理装置に供給される。
12は境筒、13a,13b,13c,13d,13
e,13fは半球面に配置したLEDであり、LED1
3a,13bとLED13c,13dとLED13e,
13fとがそれぞれ同一の高さに配置されている。14
は回路基板に表面実装された電子部品であり、配置状態
の良否を判定する判定対象物である。15は判定対象物
14を接続した半田付け部である。
FIG. 4 shows the structure of such a conventional image signal processing device for determining the component arrangement state. In FIG. 4, 11 is a CCD camera, and this CCD camera 11
Outputs an image signal, and this image signal is supplied to a signal processing device (not shown) for determining the quality of the arrangement state.
12 is a boundary cylinder, 13a, 13b, 13c, 13d, 13
e and 13f are LEDs arranged on a hemisphere, and LED1
3a, 13b and LED 13c, 13d and LED 13e,
13f and 13f are arranged at the same height. 14
Is an electronic component that is surface-mounted on the circuit board, and is an object to be determined for determining the quality of the arrangement state. Reference numeral 15 is a soldering portion to which the determination object 14 is connected.

【0004】半球面状に配置したLED13a〜13f
は判定対象物14及び半田付け部15を照射する。ここ
で反射された光は境筒12を通過してCCDカメラ11
に入射される。
LEDs 13a to 13f arranged in a hemispherical shape
Irradiates the judgment object 14 and the soldering portion 15. The light reflected here passes through the boundary cylinder 12 and the CCD camera 11
Is incident on.

【0005】図5は、このCCDカメラ11で撮影した
画像を示している。なお、この画像は全LED13a〜
13fを全部点灯して判定対象物14を照射した場合の
CCDカメラ11での撮像である。
FIG. 5 shows an image taken by the CCD camera 11. In addition, this image shows all LEDs 13a-
13C is an image captured by the CCD camera 11 when all the objects 13f are turned on and the determination target 14 is illuminated.

【0006】次に、この従来例の構成における動作につ
いて説明する。半田付け部15の状態を判定するために
LED13a,13bとLED13c,13dとLED
13e,13fとを順次3段階で点灯して照射する。こ
の3段階の照射角度による半田付け部15をCCDカメ
ラ11で撮像して、その画像データを取り込む。この3
段階での点灯、すなわち、照射角度を変化させることに
より図5に示すように半田付け部15の撮像に斜線部
a,b,cで示す反射状態に対応する特徴が生じる。こ
の斜線部a,b,cの特徴を経験的な半田付け状態と比
較し、半田付け部15の接続状態、半田量等の良否を判
定する。
Next, the operation of this conventional configuration will be described. LEDs 13a, 13b, LEDs 13c, 13d and LEDs for determining the state of the soldering portion 15
13e and 13f are sequentially turned on and illuminated in three stages. The CCD camera 11 captures an image of the soldering portion 15 with the three-step irradiation angles and captures the image data. This 3
By lighting in stages, that is, by changing the irradiation angle, a characteristic corresponding to the reflection state shown by the shaded portions a, b, and c occurs in the imaging of the soldering portion 15 as shown in FIG. The characteristics of the shaded portions a, b, and c are compared with the empirical soldering state to determine the connection state of the soldering portion 15, the quality of the solder amount, and the like.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、上記従
来の部品配置状態判定用画像信号処理装置による画像取
り込み方法では、汎用性のある一台のNTSC方式のC
CDカメラ11を使用する場合、照射角度ごとの画像デ
ータの取り込み時間がNTSC方式規格による30ms
ec時間ごとになる。すなわち、3方向からの照射角度
による画像データを取り込む場合、少なくとも90ms
ecの時間が必要となる。
However, in the image capturing method by the conventional image signal processing device for determining the component arrangement state, one NTSC system C having general versatility is used.
When using the CD camera 11, the image data acquisition time for each irradiation angle is 30 ms according to the NTSC standard.
Every ec hours. That is, at least 90 ms when capturing image data according to irradiation angles from three directions
ec time is required.

【0008】この時間は、画像データを取り込むタスク
と、それらのデータ判定処理を行うタスクが同時進行す
るリアルタイム性のあるアプリケーションを開発する場
合、この画像データを取り込む時間が判定処理時間より
長いため、処理時間の大部分が判定タスクとなり、迅速
に配置状態の良否を判定できないという問題があった。
本発明はこのような従来の問題を解決するものであり、
照射角度ごとに偏光板を備えた撮影装置で同時に一括し
て配置状態判定対象物を撮像した画像を取り込み迅速な
配置状態の良否の判定ができる優れた部品配置状態判定
用画像信号処理装置の提供を目的とする。
This time is longer than the judgment processing time when the image data is taken in when a real-time application in which the task of taking the image data and the task of carrying out the data judgment process is developed at the same time. Most of the processing time is a determination task, and there is a problem that the quality of the placement state cannot be determined quickly.
The present invention solves such conventional problems,
Providing an excellent image signal processing device for component placement state determination that enables simultaneous image capturing of placement state determination targets at the same time by an imaging device equipped with a polarizing plate for each irradiation angle to quickly determine whether the placement state is good or bad With the goal.

【0009】[0009]

【課題を解決するための手段】上記目的を達成するため
に、本発明の部品配置状態判定用画像信号処理装置は、
照射角度がそれぞれ異なるように配置された発光手段
と、発光手段からの光が入射され、それぞれに偏光性が
異なる複数の第1の偏光手段と、第1の偏光手段から偏
光が異なる光が配置状態判定対象部材に照射され、その
反射光が入射される第1の偏光手と同一の偏光性を備
え、かつ、同数の第2の偏光手段と、第2の偏光手段を
通過した配置状態判定対象部材からの反射光のみが個別
に入射されて、その画像信号を送出する複数の撮影手段
とを備える構成である。
In order to achieve the above object, an image signal processing device for determining a component arrangement state according to the present invention comprises:
Light emitting means arranged so that the irradiation angles are different from each other, light from the light emitting means are incident, and a plurality of first polarizing means having different polarizability are respectively arranged, and light having different polarization from the first polarizing means is arranged. Arrangement state determination that has the same polarization property as the first polarization hand with which the state determination target member is irradiated and its reflected light is incident and that has the same number of second polarization means and the second polarization means. Only the reflected light from the target member is individually incident, and a plurality of photographing means for transmitting the image signal is provided.

【0010】さらに、発光手段を、照射角度がそれぞれ
異なるように半球面部材内に段階的に配置する構成とし
ている。
Further, the light emitting means is arranged stepwise in the hemispherical member so that the irradiation angles are different from each other.

【0011】また、配置状態判定対象部材は、回路基板
に表面実装される部品及び半田付け部である。
The members for which the arrangement state is to be determined are components and soldering parts which are surface-mounted on the circuit board.

【0012】[0012]

【作用】このような構成により、本発明の部品配置状態
判定用画像信号処理装置は、第1の偏光手段から偏光が
異なる光が配置状態判定対象部材に照射され、その反射
光を第1の偏光手と同一の偏光性を備え、かつ、同数の
第2の偏光手段を通じて個別に撮影し、この画像信号が
送出される。
With such a configuration, in the image signal processing device for component placement state determination according to the present invention, light having different polarizations is applied to the placement state determination target member from the first polarizing means, and the reflected light is reflected by the first member. The image signals are transmitted by individually photographing through the same number of second polarization means having the same polarization property as the polarization hands.

【0013】[0013]

【実施例】以下、本発明の部品配置状態判定用画像信号
処理装置の実施例を図面に基づいて詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of an image signal processing device for determining a component arrangement state of the present invention will be described in detail below with reference to the drawings.

【0014】図1は実施例の構成を示している。図1に
おいて、21a,21b,21c,21d,21e,2
1fは半球面上に配置されたLED(請求項における発
光手段対応する)であり、LED21a,21bとLE
D21c,21dとLED21e,21fとがそれぞれ
同一の高さに配置されている。
FIG. 1 shows the configuration of the embodiment. In FIG. 1, 21a, 21b, 21c, 21d, 21e, 2
Reference numeral 1f is an LED (corresponding to the light emitting means in the claims) arranged on the hemispherical surface, and includes LEDs 21a and 21b and LE.
D21c and 21d and LED21e and 21f are arrange | positioned at the same height, respectively.

【0015】22a,22b,22c,22d,22
e,22fは、LED21a〜21fの前方に、設けら
れそれぞれ偏向性が異なる偏光板(請求項における第1
の偏光手段に対応する)である。25は光を分光する光
学系レンズであり、26a,26b,26cはCCDカ
メラ(請求項における撮影手段に対応する)であり、こ
のCCDカメラ26a〜26cは、画像信号を出力し、
この画像信号が配置状態の良否を判定するための図示し
ない信号処理装置に供給される。27a,27b,27
cはCCDカメラ26a〜26c前に配置され、それぞ
れ偏向性が異なり、偏光板22a〜22fと対応した同
一特性を有する偏光板(請求項における第2の偏光手段
対応する)である。28は回路基板に表面実装された電
子部品であり、配置状態の良否を判定する判定対象物で
ある。29a,29bは半田付け部である。
22a, 22b, 22c, 22d, 22
The polarizing plates e and 22f are provided in front of the LEDs 21a to 21f and have different polarizability (the first in the claims.
Corresponding to the polarization means). Reference numeral 25 is an optical system lens that disperses light, and 26a, 26b, and 26c are CCD cameras (corresponding to the photographing means in the claims). The CCD cameras 26a to 26c output image signals,
This image signal is supplied to a signal processing device (not shown) for determining the quality of the arrangement state. 27a, 27b, 27
Reference numeral c is a polarizing plate (in front of the CCD cameras 26a to 26c) having different polarizability and having the same characteristics as the polarizing plates 22a to 22f (corresponding to the second polarizing means in the claims). Reference numeral 28 denotes an electronic component surface-mounted on the circuit board, which is a determination target for determining the quality of the arrangement state. 29a and 29b are soldering portions.

【0016】LED21a〜21fから光照射される判
定対象物28及び半田付け部29a,29bで反射され
た光は、光学系レンズ25により、それぞれの方向に分
けられて偏光板22a〜22fを通過してCCDカメラ
26a〜26cで撮像される。次に、この実施例の構成
における動作について説明する。
The light reflected by the object to be judged 28 and the soldering portions 29a, 29b emitted from the LEDs 21a to 21f is divided into respective directions by the optical system lens 25 and passes through the polarizing plates 22a to 22f. The images are captured by the CCD cameras 26a to 26c. Next, the operation of the configuration of this embodiment will be described.

【0017】図2は直接、判定対象物28及び半田付け
部29a,29bをCCDカメラ26a〜26cで撮影
し、その合成画像を示している。図3(a)(b)
(c)はCCDカメラ26a〜26cで撮影したそれぞ
れの画像を示している。
FIG. 2 shows a composite image of the object to be judged 28 and the soldering portions 29a and 29b directly photographed by the CCD cameras 26a to 26c. 3 (a) (b)
(C) shows respective images taken by the CCD cameras 26a to 26c.

【0018】それぞれ照射角度が相違するLED21
a,21bとLED21c,21dとLED21e,2
1fとからの照明に対し、その前方の偏向性の異なる偏
光板22a〜22fを通過した、それぞれの光は判定対
象物28及び半田付け部29a,29bで反射される。
その一部が光学系レンズ25に入射される。
LEDs 21 having different irradiation angles
a, 21b and LEDs 21c, 21d and LEDs 21e, 2
With respect to the illumination from 1f, the respective lights that have passed through the polarizing plates 22a to 22f having different polarizability in front thereof are reflected by the determination target object 28 and the soldering portions 29a and 29b.
Part of it is incident on the optical system lens 25.

【0019】光学系レンズ25は、光を異なる照射角度
と同数だけ分光するように設計されており、ここの入射
光が3方向に分光される。
The optical system lens 25 is designed so as to split light into the same number of different irradiation angles, and the incident light there is split into three directions.

【0020】これらの分光は、偏向性の異なる偏光板2
7a〜27cを通過して、それぞれCCD26a〜26
cに入射される。
These spectra are obtained by the polarizing plate 2 having different polarizability.
7a-27c, CCD26a-26 respectively
It is incident on c.

【0021】図3(a)(b)(c)は、このそれぞれ
CCD26a〜26cに入射される撮像の画像データで
あり、図3(a)(b)(c)中の判定対象物28及び
半田付け部29a,29bにあって、半田付け部29
a,29bのそれぞれの斜線部a,b,cは照射角度が
相違する際の半田付け状態による反射を示している。C
CD26a〜26cの合成画像は図2に示すように斜線
部a,b,cが含まれる。次に、このCCD26a〜2
6cに入射される撮像を詳細に説明する。ここでは、C
CD26aにおける一方向のみを説明する。なお、CC
D26b,26cについても同様である。
FIGS. 3A, 3B, and 3C are image data of the images incident on the CCDs 26a to 26c, respectively. The determination target object 28 and the object 28 in FIGS. 3A, 3B, and 3C are shown. In the soldering portions 29a and 29b, the soldering portion 29
The shaded portions a, b, and c of a and 29b indicate reflections due to the soldering state when the irradiation angles are different. C
The composite image of the CDs 26a to 26c includes hatched portions a, b and c as shown in FIG. Next, the CCDs 26a-2
The image pickup incident on 6c will be described in detail. Here, C
Only one direction of the CD 26a will be described. Note that CC
The same applies to D26b and 26c.

【0022】LED21a,21bから偏光板22a,
22bを通過した光は判定対象物28及び半田付け部2
9a,29bを照射する。この場合、LED21a,2
1bの照射角度に対応し、半田付け部29aの半田付け
の状態に基づいて反射され、この反射光が光学系レンズ
25を通過して偏光板27aに入射される。
From the LEDs 21a, 21b to the polarizing plates 22a,
The light that has passed through 22b is the object to be judged 28 and the soldering portion 2
Irradiate 9a and 29b. In this case, the LEDs 21a, 2
Corresponding to the irradiation angle of 1b, it is reflected based on the soldering state of the soldering portion 29a, and the reflected light passes through the optical system lens 25 and is incident on the polarizing plate 27a.

【0023】この場合、偏光板22c,22d,22
e,22fを通過した一部の光も偏光板27aに入射さ
れる。偏光板27aは特定の方向性の光のみを通過させ
るため、偏光板22a,22bで偏光された光のみがC
CDカメラ26aに入射される。他の偏光性の光は遮断
される。すなわち、偏光板22a,22bからの反射光
のみがCCDカメラ26aに入射される。この入射によ
る撮像の画像データは図3(c)に示すように半田付け
部29aの外周囲い近傍の特徴のみが現れる。
In this case, the polarizing plates 22c, 22d, 22
Part of the light that has passed through e and 22f is also incident on the polarizing plate 27a. Since the polarizing plate 27a allows only light of a specific direction to pass, only the light polarized by the polarizing plates 22a and 22b is C
It is incident on the CD camera 26a. Other polarized light is blocked. That is, only the reflected light from the polarizing plates 22a and 22b is incident on the CCD camera 26a. As shown in FIG. 3C, in the image data of the image captured by this incident, only the features in the vicinity of the outer periphery of the soldering portion 29a appear.

【0024】この反射状態に対応する特徴、すなわち、
斜線部a,b,cの特徴を経験的な半田付け状態と比較
し、半田付け部15の接続状態、半田量等の良否を判定
する。このように上記実施例によれば照射角度ごとに偏
向性の異なる偏光板22a〜22f、光学系レンズ25
及び偏光板27a〜27cを利用して見かけ上別々の照
射角度での撮像と同様の画像データを同時に一括して取
り込むことができる。
The characteristics corresponding to this reflection state, that is,
The characteristics of the shaded portions a, b, and c are compared with the empirical soldering state to determine the connection state of the soldering portion 15, the quality of the solder amount, and the like. As described above, according to the above-described embodiment, the polarizing plates 22a to 22f and the optical system lens 25, which have different polarizability depending on the irradiation angle, are used.
Also, it is possible to simultaneously capture image data similar to that obtained by imaging at apparently different irradiation angles by using the polarizing plates 27a to 27c.

【0025】[0025]

【発明の効果】以上の説明から明らかなように、本発明
の部品配置状態判定用画像信号処理装置は、第1の偏光
手段から偏光が異なる光が配置状態判定対象部材に照射
し、その反射光を第1の偏光手と同一の偏光性を備え、
かつ、同数の第2の偏光手段を通じて個別に撮影して画
像信号を送出しているため、同時に一括して配置状態判
定対象物を撮像した画像の取り込みができ、迅速な配置
状態の良否の判定ができるという効果を有する。
As is apparent from the above description, in the image signal processing device for component placement state determination according to the present invention, light having different polarizations is applied to the placement state determination target member from the first polarizing means and reflected. The light has the same polarization as the first polarizing hand,
Moreover, since the image signals are individually shot and transmitted through the same number of second polarization means, the images of the placement state determination target objects can be captured at the same time, and the quality of the placement state can be quickly determined. It has the effect that

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の部品配置状態判定用画像信号処理装置
の実施例における構成を示す側面図
FIG. 1 is a side view showing the configuration of an embodiment of an image signal processing device for component placement state determination of the present invention.

【図2】実施例の説明に供され、3台のCCDカメラで
判定対象物及び半田付け部を撮影した合成画像を示す上
面図
FIG. 2 is a top view showing a composite image obtained by photographing a determination target and a soldering portion with three CCD cameras, which is used for explaining the embodiment.

【図3】(a)(b)(c)は実施例の説明に供され、
CCDカメラでの撮像による画像を示す上面図
3 (a), (b) and (c) are provided for explaining an embodiment,
Top view showing an image captured by a CCD camera

【図4】従来の部品配置状態判定用画像信号処理装置の
構成を示す側面図
FIG. 4 is a side view showing a configuration of a conventional image signal processing device for component placement state determination.

【図5】従来例の説明に供され、CCDカメラでの撮像
による画像を示す上面図
FIG. 5 is a top view used to explain a conventional example and showing an image captured by a CCD camera.

【符号の説明】 21a,21b,21c,21d,21e,21f L
ED 22a,22b,22c,22d,22e,22f 偏
光板 25 光学系レンズ 26a,26b,26c CCDカメラ 27a,27b,27c 偏光板 28 判定対象物 29a,29b 半田付け部
[Description of Reference Signs] 21a, 21b, 21c, 21d, 21e, 21f L
ED 22a, 22b, 22c, 22d, 22e, 22f Polarizing plate 25 Optical system lens 26a, 26b, 26c CCD camera 27a, 27b, 27c Polarizing plate 28 Judgment target object 29a, 29b Soldering part

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 照射角度がそれぞれ異なるように配置さ
れた発光手段と、上記発光手段からの光が入射され、そ
れぞれに偏光性が異なる複数の第1の偏光手段と、上記
第1の偏光手段から偏光が異なる光が配置状態判定対象
部材に照射され、その反射光が入射される上記第1の偏
光手と同一の偏光性を備え、かつ、同数の第2の偏光手
段と、上記第2の偏光手段を通過した上記配置状態判定
対象部材からの反射光のみが個別に入射されて、その画
像信号を送出する複数の撮影手段とを備える部品配置状
態判定用画像信号処理装置。
1. A light emitting means arranged so that the irradiation angles are different from each other, a plurality of first polarizing means having different polarizability upon which light from the light emitting means is incident, and the first polarizing means. Light having different polarizations from the first polarization hand is irradiated to the arrangement state determination target member, and the reflected light is incident on the member, and the same number of second polarization means and the second polarization means are provided. The image signal processing device for component placement state determination, comprising: a plurality of image pickup means that individually receive only the reflected light from the placement state determination target member that has passed through the polarization means and send out the image signals thereof.
【請求項2】 発光手段を、照射角度がそれぞれ異なる
ように半球面部材内に段階的に配置する構成としたこと
を特徴とする請求項1記載の部品配置状態判定用画像信
号処理装置。
2. The image signal processing device for component arrangement state determination according to claim 1, wherein the light emitting means is arranged stepwise in the hemispherical member so that the irradiation angles are different from each other.
【請求項3】 配置状態判定対象部材は、回路基板に表
面実装される部品及び半田付け部であることを特徴とす
る請求項1記載の部品配置状態判定用画像信号処理装
置。
3. The image signal processing device for component placement state determination according to claim 1, wherein the placement state determination target member is a component and a soldering portion which are surface-mounted on the circuit board.
JP14407092A 1992-06-04 1992-06-04 Image signal processing device for component placement state determination Expired - Fee Related JP3196321B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14407092A JP3196321B2 (en) 1992-06-04 1992-06-04 Image signal processing device for component placement state determination

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14407092A JP3196321B2 (en) 1992-06-04 1992-06-04 Image signal processing device for component placement state determination

Publications (2)

Publication Number Publication Date
JPH05334420A true JPH05334420A (en) 1993-12-17
JP3196321B2 JP3196321B2 (en) 2001-08-06

Family

ID=15353594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14407092A Expired - Fee Related JP3196321B2 (en) 1992-06-04 1992-06-04 Image signal processing device for component placement state determination

Country Status (1)

Country Link
JP (1) JP3196321B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100952703B1 (en) * 2008-12-29 2010-04-13 에이티아이 주식회사 Inspection apparratus of surface using dual camera
KR101381836B1 (en) * 2012-05-15 2014-04-07 주식회사 미르기술 Vision inspection apparatus of improved image visibility
JP2016126005A (en) * 2014-12-29 2016-07-11 三星ディスプレイ株式會社Samsung Display Co.,Ltd. Inspection device of display device and inspection method of display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100952703B1 (en) * 2008-12-29 2010-04-13 에이티아이 주식회사 Inspection apparratus of surface using dual camera
KR101381836B1 (en) * 2012-05-15 2014-04-07 주식회사 미르기술 Vision inspection apparatus of improved image visibility
JP2016126005A (en) * 2014-12-29 2016-07-11 三星ディスプレイ株式會社Samsung Display Co.,Ltd. Inspection device of display device and inspection method of display device

Also Published As

Publication number Publication date
JP3196321B2 (en) 2001-08-06

Similar Documents

Publication Publication Date Title
US20150130925A1 (en) Contactless component-inspecting apparatus and component-inspecting method
US20040125205A1 (en) System and a method for high speed three-dimensional imaging
US7586073B2 (en) Imaging system with high-spectrum resolution and imaging method for the same
JP2003279334A (en) Three-dimensional measuring apparatus, filter lattice moire plate and illuminating means
JPH10187990A (en) Device and method for picking up and processing image
WO2012124260A1 (en) Solder height detection method and solder height detection device
CN105823438A (en) Height measuring method for three dimensional shape measuring device
KR101622628B1 (en) Method and apparatus of inspecting a substrate with electronic devices mounted thereon
JP5890953B2 (en) Inspection device
WO2001029542A1 (en) Machine vision
JPH095253A (en) Defect inspecting equipment
JP2741463B2 (en) Solder appearance inspection method
JP3196321B2 (en) Image signal processing device for component placement state determination
JPH0658731A (en) Pattern inspecting apparatus
KR20120100064A (en) Board inspection method
KR100740250B1 (en) Vision inspection system and method for inspection using thereof
JP2002048731A (en) Mounted base board visual inspection device and its visual inspection method
JPH05288527A (en) Appearance inspecting method for mounted board and its device
JP4329152B2 (en) Component recognition device
JP2021117232A (en) Systems and methods for vision inspection with multiple types of light
JP2863003B2 (en) Video inspection lighting arrangement
JPH0682216A (en) Appearance inspector
JPH05188006A (en) Surface flaw detecting device
JP2997306B2 (en) Method and apparatus for detecting pattern position using transmitted illumination
JPH0926313A (en) Object recognition method in visual inspection apparatus for electronic-component mounting board

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees