JPH05333359A - Packaging structure for panel - Google Patents
Packaging structure for panelInfo
- Publication number
- JPH05333359A JPH05333359A JP13847792A JP13847792A JPH05333359A JP H05333359 A JPH05333359 A JP H05333359A JP 13847792 A JP13847792 A JP 13847792A JP 13847792 A JP13847792 A JP 13847792A JP H05333359 A JPH05333359 A JP H05333359A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- parts
- liquid crystal
- panel
- peripheral portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はパネルの実装構造に関
し、より詳しくは、周縁部に回路配線が形成されたパネ
ル、例えば液晶パネルに駆動用ＩＣ(集積回路)などの部
品を搭載して接続する実装構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a panel mounting structure, and more particularly, to a panel having circuit wiring formed on its peripheral edge, for example, a liquid crystal panel, on which components such as a driving IC (integrated circuit) are mounted and connected. Related to the mounting structure.
【０００２】[0002]
【従来の技術】かつては、図４に示すように、液晶パネ
ル(２枚のガラス基板１０１,１０２の間に液晶を挟持し
ている。一方のガラス基板１０１の周縁部１０１aに図
示しない回路配線が形成されている。)１００に駆動用
ＩＣ１０３を接続する場合、駆動用ＩＣ１０３をフィル
ム１０５に取り付け、さらにこのフィルム１０５をガラ
ス基板１０１に接続していた(テープキャリア方式)。し
かし、最近、液晶パネルの高画質化に伴って、駆動用Ｉ
Ｃを直接基板上に搭載する方式(ＣＯＧ方式)が開発さ
れ、実用化されている。このＣＯＧ方式の実装構造とし
ては、図５に示すように、駆動用ＩＣ１０３にバンプ電
極１０８を設けてガラス基板１０１にフェイスダウン・
ボンディングするもの、または、図６に示すように、ガ
ラス基板１０１上に駆動用ＩＣ１０３を載せてワイヤボ
ンディング１０９を行うものがある。さらに、耐環境
性、特に耐湿性を高めるために、図７に示すように、駆
動用ＩＣ１０３を硬質キャップ部材で覆ったものもあ
る。なお、図５〜図７において、１０４は、駆動用ＩＣ
１０３の耐環境性を向上させるために滴下または注入さ
れた保護用樹脂を示している。１２０は液晶、１２１は
シール部材である。2. Description of the Related Art In the past, as shown in FIG. 4, a liquid crystal panel (a liquid crystal is sandwiched between two glass substrates 101 and 102. A circuit wiring (not shown) is provided on a peripheral edge portion 101a of one glass substrate 101. When the drive IC 103 is connected to 100, the drive IC 103 is attached to the film 105, and the film 105 is further connected to the glass substrate 101 (tape carrier system). However, recently, with the improvement in image quality of liquid crystal panels, the driving I
A method of directly mounting C on a substrate (COG method) has been developed and put into practical use. As shown in FIG. 5, the mounting structure of the COG method is such that bump electrodes 108 are provided on the driving IC 103 and face down on the glass substrate 101.
There is a method of bonding or a method of performing wire bonding 109 by placing the driving IC 103 on the glass substrate 101 as shown in FIG. Further, in order to improve the environment resistance, especially the humidity resistance, there is also one in which the driving IC 103 is covered with a hard cap member as shown in FIG. 5 to 7, reference numeral 104 denotes a driving IC.
10 shows the protective resin dropped or injected to improve the environment resistance of 103. Reference numeral 120 is a liquid crystal, and 121 is a seal member.
【０００３】[0003]
【発明が解決しようとする課題】ところで、液晶表示装
置とその利用技術の進展に伴って、表示装置に求められ
る耐環境性のスペックが、非常に厳しいものとなってき
ている。例えば、液晶表示素子が自動車の内装部品とし
て使用される場合、屋内で使用される場合に比して、高
温・高湿耐性が厳しく要求される。By the way, with the progress of liquid crystal display devices and their utilization techniques, the environmental resistance specifications required for display devices have become extremely severe. For example, when the liquid crystal display element is used as an interior part of an automobile, high temperature and high humidity resistance is strictly required as compared with the case where it is used indoors.
【０００４】上に述べたように、従来技術では保護用樹
脂１０４や硬質キャップ部材１０６によって耐環境性改
善を試みているが、保護用樹脂１０４だけで改善するこ
とは難しく、また、硬質キャップ部材１０６を使用する
場合は部品点数が増えてコストアップするという問題が
ある。As described above, the prior art attempts to improve the environment resistance with the protective resin 104 and the hard cap member 106, but it is difficult to improve only with the protective resin 104, and the hard cap member is also difficult. When 106 is used, there is a problem that the number of parts increases and the cost increases.
【０００５】そこで、この発明の目的は、低コストで簡
単に耐環境性、特に耐湿性を改善できるパネルの実装構
造を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a mounting structure for a panel, which can easily improve environment resistance, especially humidity resistance, at low cost.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、この発明は、互いに対向する２枚の基板のうち一方
の基板の周縁部に、所定の部品を搭載して接続するパネ
ルの実装構造において、上記部品は上記他方の基板の周
縁部に覆われ、上記部品と上記他方の基板の周縁部との
隙間に、上記部品を保護する樹脂が設けられていること
を特徴としている。In order to achieve the above object, the present invention provides a panel mounting structure in which a predetermined component is mounted and connected to the peripheral portion of one of two substrates facing each other. In the above, the component is covered by the peripheral portion of the other substrate, and a resin for protecting the component is provided in a gap between the component and the peripheral portion of the other substrate.
【０００７】また、上記他方の基板の周縁部の内側に、
断面Ｌ字状の片溝が設けられているのが望ましい。Also, inside the peripheral portion of the other substrate,
It is desirable that a single groove having an L-shaped cross section is provided.
【０００８】また、上記他方の基板の周縁部の内側に、
断面凹状の溝が設けられているのが望ましい。Also, inside the peripheral portion of the other substrate,
It is desirable that a groove having a concave cross section is provided.
【０００９】また、上記他方の基板の周縁部に、基板面
を貫通する貫通孔が設けられているのが望ましい。Further, it is desirable that a through hole penetrating the surface of the substrate is provided in the peripheral portion of the other substrate.
【００１０】[0010]
【作用】この発明によれば、一方の基板の周縁部に搭載
された所定の部品が他方の基板の周縁部に覆われてい
る。したがって、パネル外部から上記部品に対する水分
の侵入経路が狭くなっている。したがって、上記部品と
上記他方の基板の周縁部との隙間に設けられた樹脂によ
る保護効果と相まって、実装状態の耐湿性が改善され
る。しかも、硬質キャップ部材などの特別の部品を要し
ないので、低コストで簡単に実装がなされる。According to the present invention, the predetermined component mounted on the peripheral portion of one substrate is covered by the peripheral portion of the other substrate. Therefore, the invasion path of moisture from the outside of the panel to the above-mentioned component is narrowed. Therefore, the moisture resistance in the mounted state is improved in combination with the protective effect of the resin provided in the gap between the component and the peripheral portion of the other substrate. Moreover, since no special parts such as a hard cap member are required, the mounting can be easily performed at low cost.
【００１１】また、上記他方の基板の周縁部の内側に、
断面Ｌ字状の片溝が設けられている場合、上記片溝内に
上記部品を収容することによって上記部品が簡単に覆わ
れる。Further, inside the peripheral portion of the other substrate,
When the one-sided groove having an L-shaped cross section is provided, the above-mentioned part is easily covered by accommodating the above-mentioned part in the one-sided groove.
【００１２】また、上記他方の基板の周縁部の内側に、
断面凹状の溝が設けられている場合、上記溝内に上記部
品を収容することによって上記部品が簡単に覆われる。Also, inside the peripheral portion of the other substrate,
When a groove having a concave cross section is provided, the component is easily covered by accommodating the component in the groove.
【００１３】また、上記他方の基板の周縁部に、基板面
を貫通する貫通孔が設けられている場合、上記貫通孔内
に上記部品を収容することによって上記部品が簡単に覆
われる。Further, when a through hole penetrating the surface of the substrate is provided in the peripheral portion of the other substrate, the component is easily covered by accommodating the component in the through hole.
【００１４】[0014]
【実施例】以下、この発明のパネルの実装構造を実施例
により詳細に説明する。EXAMPLES The panel mounting structure of the present invention will be described in detail below with reference to examples.
【００１５】図１(a)は第１実施例の液晶パネルの実装
構造を斜めから見たところを示し、同図(b)は同図(a)に
おけるIB−IB線矢視断面を示している。この液晶パネル
１０は、従来の液晶パネルと同様に、２枚のガラス基板
１,２の間に液晶２０を挟持しており、一方のガラス基
板１の周縁部１aに図示しない回路配線が形成されてい
る。液晶パネル１０の他方のガラス基板２の周縁部２a
の内側には、断面Ｌ字状の片溝６が形成されている。上
記ガラス基板１の周縁部１aに駆動用ＩＣ３が載置さ
れ、フリップチップ方式またはワイヤボンディング方式
により接続されている。この結果、駆動用ＩＣ３は、上
記片溝６による隙間に収容されて、ガラス基板２の周縁
部２aに覆われた状態となっている。駆動用ＩＣ３と片
溝６との隙間には、保護用樹脂４が注入されている。２
１はシール部材である。FIG. 1A is a perspective view of the mounting structure of the liquid crystal panel of the first embodiment, and FIG. 1B is a sectional view taken along the line IB-IB in FIG. 1A. There is. The liquid crystal panel 10 has a liquid crystal 20 sandwiched between two glass substrates 1 and 2 as in the conventional liquid crystal panel, and a circuit wiring (not shown) is formed on the peripheral edge portion 1a of one glass substrate 1. ing. The peripheral portion 2a of the other glass substrate 2 of the liquid crystal panel 10
A single groove 6 having an L-shaped cross section is formed inside. A driving IC 3 is mounted on the peripheral edge 1a of the glass substrate 1 and is connected by a flip chip method or a wire bonding method. As a result, the driving IC 3 is accommodated in the gap defined by the one-sided groove 6 and covered by the peripheral edge portion 2a of the glass substrate 2. A protective resin 4 is injected into the gap between the driving IC 3 and the one-sided groove 6. Two
Reference numeral 1 is a seal member.
【００１６】このように駆動用ＩＣ３はガラス基板２の
周縁部２aに覆われているので、パネル１０の外部から
駆動用ＩＣ３に対する水分の侵入経路が狭くなってい
る。したがって、駆動用ＩＣ３と片溝６との隙間に設け
られた樹脂４による保護効果と相まって、実装状態の耐
湿性を改善することができる。しかも、従来と異なり、
硬質キャップ部材などの特別の部品を要しないので、低
コストで簡単に実装を行うことができる。Since the driving IC 3 is covered by the peripheral edge portion 2a of the glass substrate 2 as described above, the entry path of moisture from the outside of the panel 10 into the driving IC 3 is narrowed. Therefore, the moisture resistance in the mounted state can be improved in combination with the protection effect of the resin 4 provided in the gap between the driving IC 3 and the one-sided groove 6. Moreover, unlike the past,
Since no special component such as a hard cap member is required, the mounting can be easily performed at low cost.
【００１７】図２(a)は第２実施例の液晶パネルの実装
構造を斜めから見たところを示し、同図(b)は同図(a)に
おけるIIB−IIB線矢視断面、同図(c)は同図(a)における
IIC−IIC線矢視断面を示している。この液晶パネル３０
は、従来の液晶パネルと同様に、２枚のガラス基板３
１,３２の間に液晶５０を挟持しており、一方のガラス
基板３１の周縁部３１aに図示しない回路配線が形成さ
れている。液晶パネル３０の他方のガラス基板３２の周
縁部３２aには、内側に断面凹状の溝３６が形成されて
いる。上記ガラス基板３１の周縁部３１aに駆動用ＩＣ
３３が載置され、フリップチップ方式またはワイヤボン
ディング方式により接続されている。この結果、駆動用
ＩＣ３３は、上記溝３６による隙間に収容されて、ガラ
ス基板３２の周縁部３２aに覆われた状態となってい
る。駆動用ＩＣ３３と溝３６との隙間には、保護用樹脂
３４が注入されている。５１,５２はシール部材であ
る。FIG. 2A shows the mounting structure of the liquid crystal panel of the second embodiment as seen obliquely, and FIG. 2B shows the sectional view taken along the line IIB-IIB in FIG. 2A. (c) is the same as in (a)
The IIC-IIC line arrow cross section is shown. This liquid crystal panel 30
Is the same as the conventional liquid crystal panel, the two glass substrates 3
A liquid crystal 50 is sandwiched between 1 and 32, and a circuit wiring (not shown) is formed on a peripheral edge portion 31 a of one glass substrate 31. A groove 36 having a concave cross section is formed inside the peripheral edge portion 32a of the other glass substrate 32 of the liquid crystal panel 30. A driving IC is provided on the peripheral portion 31a of the glass substrate 31.
33 is placed and connected by a flip chip method or a wire bonding method. As a result, the driving IC 33 is accommodated in the gap defined by the groove 36 and is in a state of being covered by the peripheral edge portion 32a of the glass substrate 32. A protective resin 34 is injected into the gap between the drive IC 33 and the groove 36. 51 and 52 are sealing members.
【００１８】このように駆動用ＩＣ３３がガラス基板３
２の周縁部３２aに覆われているので、パネル３０の外
部から駆動用ＩＣ３３に対する水分の侵入経路が狭くな
っている。したがって、第１実施例と同様に、駆動用Ｉ
Ｃ３３と溝３６との隙間に設けられた樹脂３４による保
護効果と相まって、実装状態の耐湿性を改善することが
できる。しかも、低コストで簡単に実装を行うことがで
きる。In this way, the driving IC 33 is mounted on the glass substrate 3
Since it is covered by the peripheral edge portion 32a of the second portion 2, the moisture invasion path from the outside of the panel 30 to the driving IC 33 is narrowed. Therefore, as in the first embodiment, the driving I
The moisture resistance in the mounted state can be improved in combination with the protective effect of the resin 34 provided in the gap between the C33 and the groove 36. Moreover, the mounting can be easily performed at low cost.
【００１９】なお、上記第１実施例,第２実施例では、
ガラス基板２,３２の周縁部２a,３２aにそれぞれ断面Ｌ
字状の片溝６,断面凹状の溝３６を設けて、駆動用ＩＣ
３,３３を覆うようにしたが、これに限られるものでは
ない。例えば、図３に示すように、液晶パネル６０を構
成する基板６２の周縁部６２aに、基板面を貫通する貫
通孔６６を設けて、この貫通孔６６内に駆動用ＩＣが収
容されるようにしても良い。この場合、基板６２の周縁
部６２aによって駆動用ＩＣの側部が覆われる状態とな
る。したがって、パネル外部から駆動用ＩＣに対する水
分の侵入経路を狭くして、実装状態の耐湿性を改善する
ことができる。しかも、低コストで簡単に実装を行うこ
とができる。この構造は、基板がプラスチックからなる
場合に、特に有用である。なお、駆動用ＩＣのための保
護用樹脂は、上記貫通孔６６内に注入すれば良い。In the first and second embodiments described above,
Cross-sections L are formed on the peripheral portions 2a and 32a of the glass substrates 2 and 32, respectively.
The driving IC is provided with the single-sided groove 6 and the groove 36 having a concave cross section.
Although it covers 3 and 33, it is not limited to this. For example, as shown in FIG. 3, a through hole 66 penetrating the surface of the substrate is provided in the peripheral portion 62a of the substrate 62 constituting the liquid crystal panel 60, and the driving IC is accommodated in the through hole 66. May be. In this case, the peripheral portion 62a of the substrate 62 covers the side portion of the driving IC. Therefore, it is possible to improve the moisture resistance of the mounted state by narrowing the path of moisture intrusion into the driving IC from the outside of the panel. Moreover, the mounting can be easily performed at low cost. This structure is particularly useful when the substrate is made of plastic. The protective resin for the driving IC may be injected into the through hole 66.
【００２０】[0020]
【発明の効果】以上より明らかなように、この発明は、
互いに対向する２枚の基板のうち一方の基板の周縁部
に、所定の部品を搭載して接続するパネルの実装構造に
おいて、上記部品は上記他方の基板の周縁部で覆われ、
上記部品と上記他方の基板の周縁部との隙間に上記部品
を保護する樹脂が設けられているので、水分の侵入経路
を狭くして、実装状態の耐湿性を改善することができ
る。しかも、硬質キャップ部材などの特別な部品を要し
ないので、低コストで簡単に実装することができる。As is apparent from the above, the present invention is
In a mounting structure of a panel in which a predetermined component is mounted and connected to the peripheral portion of one of the two substrates facing each other, the component is covered with the peripheral portion of the other substrate,
Since the resin that protects the component is provided in the gap between the component and the peripheral portion of the other substrate, the moisture entry path can be narrowed and the moisture resistance in the mounted state can be improved. Moreover, since no special parts such as a hard cap member are required, the mounting can be easily performed at low cost.
【００２１】また、上記他方の基板の周縁部の内側に、
断面Ｌ字状の片溝が設けられている場合、上記片溝内に
上記部品を収容することによって上記部品を簡単に覆う
ことができる。Further, inside the peripheral portion of the other substrate,
When the one-sided groove having an L-shaped cross section is provided, the above-mentioned part can be easily covered by accommodating the above-mentioned part in the one-sided groove.
【００２２】また、上記他方の基板の周縁部の内側に、
断面凹状の溝が設けられている場合、上記溝内に上記部
品を収容することによって上記部品を簡単に覆うことが
できる。Further, inside the peripheral portion of the other substrate,
When a groove having a concave cross section is provided, the component can be easily covered by accommodating the component in the groove.
【００２３】また、上記他方の基板の周縁部に、貫通孔
が設けられている場合、上記貫通孔内に上記部品を収容
することによって上記部品を簡単に覆うことができる。When a through hole is provided in the peripheral portion of the other substrate, the component can be easily covered by accommodating the component in the through hole.
【図１】 この発明の第１実施例の液晶パネルの実装構
造を示す図である。FIG. 1 is a diagram showing a mounting structure of a liquid crystal panel according to a first embodiment of the present invention.
【図２】 この発明の第２実施例の液晶パネルの実装構
造を示す図である。FIG. 2 is a diagram showing a mounting structure of a liquid crystal panel according to a second embodiment of the present invention.
【図３】 この発明の他の実施例の液晶パネルの実装構
造を示す図である。FIG. 3 is a diagram showing a mounting structure of a liquid crystal panel of another embodiment of the present invention.
【図４】 従来のテープキャリア方式による液晶パネル
の実装構造を示す斜視図である。FIG. 4 is a perspective view showing a mounting structure of a liquid crystal panel by a conventional tape carrier method.
【図５】 従来のＣＯＧ方式による液晶パネルの実装構
造を示す断面図である。FIG. 5 is a cross-sectional view showing a mounting structure of a conventional COG liquid crystal panel.
【図６】 従来のＣＯＧ方式による液晶パネルの実装構
造を示す断面図である。FIG. 6 is a cross-sectional view showing a mounting structure of a conventional COG liquid crystal panel.
【図７】 従来のＣＯＧ方式による液晶パネルの実装構
造を示す断面図である。FIG. 7 is a cross-sectional view showing a mounting structure of a conventional COG liquid crystal panel.
１,２,３１,３２,６１,６２ ガラス基板 １a,２a,３１a,３２a６１a,６２a 周縁部 ３,３３ 駆動用ＩＣ ４,３４ 保護用樹脂 ６ 片溝 １０,３０,６０ 液晶パネル ３６ 溝 ６６ 貫通孔 1,2,31,32,61,62 Glass substrate 1a, 2a, 31a, 32a 61a, 62a Peripheral part 3,33 Driving IC 4,34 Protective resin 6 Single groove 10,30,60 Liquid crystal panel 36 Groove 66 Penetration Hole
Claims (4)
基板の周縁部に、所定の部品を搭載して接続するパネル
の実装構造において、 上記部品は上記他方の基板の周縁部に覆われ、 上記部品と上記他方の基板の周縁部との隙間に、上記部
品を保護する樹脂が設けられていることを特徴とするパ
ネルの実装構造。1. In a mounting structure of a panel in which a predetermined component is mounted and connected to a peripheral portion of one of two substrates facing each other, the component is covered with a peripheral portion of the other substrate. A panel mounting structure, wherein a resin for protecting the component is provided in a gap between the component and the peripheral portion of the other substrate.
Ｌ字状の片溝が設けられていることを特徴とする請求項
１に記載のパネルの実装構造。2. The panel mounting structure according to claim 1, wherein a groove having an L-shaped cross section is provided inside a peripheral portion of the other substrate.
凹状の溝が設けられていることを特徴とする請求項１に
記載のパネルの実装構造。3. The panel mounting structure according to claim 1, wherein a groove having a concave cross section is provided inside a peripheral portion of the other substrate.
通する貫通孔が設けられていることを特徴とする請求項
１に記載のパネルの実装構造。4. The mounting structure for a panel according to claim 1, wherein a through hole penetrating a substrate surface is provided in a peripheral portion of the other substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13847792A JPH05333359A (en) | 1992-05-29 | 1992-05-29 | Packaging structure for panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13847792A JPH05333359A (en) | 1992-05-29 | 1992-05-29 | Packaging structure for panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05333359A true JPH05333359A (en) | 1993-12-17 |
Family
ID=15222990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13847792A Pending JPH05333359A (en) | 1992-05-29 | 1992-05-29 | Packaging structure for panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05333359A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998005999A1 (en) * | 1996-08-06 | 1998-02-12 | Seiko Epson Corporation | Liquid crystal display and electronics equipment using the same |
| KR100441696B1 (en) * | 2000-06-13 | 2004-07-27 | 세이코 엡슨 가부시키가이샤 | Electro-optical device, method for manufacturing electro-optical device, light guide, liquid crystal device, method for manufacturing liquid crystal device, and electronic equipment |
| JP2007025200A (en) * | 2005-07-15 | 2007-02-01 | Toshiba Matsushita Display Technology Co Ltd | Liquid crystal display element and manufacturing method thereof |
| KR100712108B1 (en) * | 2004-12-10 | 2007-04-27 | 삼성에스디아이 주식회사 | Organic electroluminescence device and method for fabricating thereof |
| JP2008034232A (en) * | 2006-07-28 | 2008-02-14 | Asahi Kasei Electronics Co Ltd | Anisotropic conductive film |
| JP2010010122A (en) * | 2008-06-26 | 2010-01-14 | Samsung Mobile Display Co Ltd | Organic light-emitting display device, and manufacturing method thereof |
-
1992
- 1992-05-29 JP JP13847792A patent/JPH05333359A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998005999A1 (en) * | 1996-08-06 | 1998-02-12 | Seiko Epson Corporation | Liquid crystal display and electronics equipment using the same |
| US6819376B1 (en) | 1996-08-06 | 2004-11-16 | Seiko Epson Corporation | Liquid crystal display device with a light-shielding portion |
| US7126655B2 (en) | 1996-08-06 | 2006-10-24 | Seiko Epson Corporation | Liquid crystal display device and electronic device using the same |
| KR100441696B1 (en) * | 2000-06-13 | 2004-07-27 | 세이코 엡슨 가부시키가이샤 | Electro-optical device, method for manufacturing electro-optical device, light guide, liquid crystal device, method for manufacturing liquid crystal device, and electronic equipment |
| US7256856B2 (en) | 2000-06-13 | 2007-08-14 | Seiko Epson Corporation | Electro-optical device, method for manufacturing electro-optical device, light guide, liquid crystal device, method for manufacturing liquid crystal device, and electronic equipment |
| KR100712108B1 (en) * | 2004-12-10 | 2007-04-27 | 삼성에스디아이 주식회사 | Organic electroluminescence device and method for fabricating thereof |
| JP2007025200A (en) * | 2005-07-15 | 2007-02-01 | Toshiba Matsushita Display Technology Co Ltd | Liquid crystal display element and manufacturing method thereof |
| JP2008034232A (en) * | 2006-07-28 | 2008-02-14 | Asahi Kasei Electronics Co Ltd | Anisotropic conductive film |
| JP2010010122A (en) * | 2008-06-26 | 2010-01-14 | Samsung Mobile Display Co Ltd | Organic light-emitting display device, and manufacturing method thereof |
| US8851952B2 (en) | 2008-06-26 | 2014-10-07 | Samsung Display Co., Ltd. | Method of manufacturing an organic light emitting diode display device |
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