JPH05327270A - Electromagnetic shielding of circuit board - Google Patents
Electromagnetic shielding of circuit boardInfo
- Publication number
- JPH05327270A JPH05327270A JP13081292A JP13081292A JPH05327270A JP H05327270 A JPH05327270 A JP H05327270A JP 13081292 A JP13081292 A JP 13081292A JP 13081292 A JP13081292 A JP 13081292A JP H05327270 A JPH05327270 A JP H05327270A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electromagnetic
- electromagnetic shielding
- shield material
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は回路基板の電磁シールド
方法に係り,詳しくは実装品を含む回路基板の電磁シー
ルド方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic shielding method for a circuit board, and more particularly to an electromagnetic shielding method for a circuit board including mounted products.
【0002】[0002]
【従来の技術】電磁ノイズ発生源に対する対策として
は,電磁ノイズ発生を無くするか,又は発生した電磁ノ
イズが広く拡散する前に押さえ込むかの2種類がある。
前者は回路方法の選択の問題であって,後者はその回路
の組み立ての問題となる。従来の後者の手段としては, 1.多層基板を採用することにより回路相互のインピー
ダンスを押さえ込む。 2.信号線に電子部品を付加してノイズエネルギを押さ
え込む。 3.回路ユニット相互間の結線を短くする。 4.回路ユニット相互間の結線をシールドする。 5.回路ユニット相互間の結線に電子部品を付加してノ
イズエネルギを押さえ込む。 6.製品ケース内部の金属をフレームアースと同一電位
に接続し浮かさない。 7.製品ケースをシールドする。 など色々な手法が有る。従来よりこれらの手法を駆使し
ながら電磁ノイズの拡散を押さえ込んでいる。電磁ノイ
ズの拡散押さえ込みは,発生源の根元で行うのが効果的
手段であって,その方法は上記1〜7の項目の若い数字
の内容ほど効果が有る。その上位手段の一つとして,回
路基板の外面に対して銅ペースト層を印刷することによ
り回路基板を導電層で包み込み電磁シールドを形成する
手法が知られている。以下,この手法について略述す
る。図4は従来の回路基板Aの組み立て工程の一例を示
すブロック図,図5は基板Aの概略構造を示す断面図で
ある。図4に示す如く,従来の回路基板Aの組み立てで
は,まずプリント基板を基板メーカで多層基板として作
成する(プリント基板工程F4.1〜F4.4)。次
に,アッセンブルメーカでそのプリント基板に電子部品
と搭載の上,半田付けを行い,回路基板Aを作り上げる
(基板組立工程F4.5〜F4.6)。そして,回路基
板Aの上記電磁シールドは部品搭載部以外の基板面に対
して行われており,回路基板Aは図5に示すような断面
構造となる。このようにして回路基板Aからの電磁ノイ
ズの拡散を抑制することができた。2. Description of the Related Art There are two types of countermeasures against an electromagnetic noise generation source: to eliminate generation of electromagnetic noise or to suppress generated electromagnetic noise before it spreads widely.
The former is a matter of selecting the circuit method, and the latter is a matter of assembling the circuit. The conventional latter means are: By using a multi-layer substrate, the mutual impedance of the circuits is suppressed. 2. Electronic components are added to the signal line to suppress noise energy. 3. Shorten the wiring between circuit units. 4. Shield the wiring between circuit units. 5. Noise energy is suppressed by adding electronic components to the connections between circuit units. 6. Connect the metal inside the product case to the same potential as the frame ground to prevent it from floating. 7. Shield the product case. There are various methods. The diffusion of electromagnetic noise has been suppressed while making full use of these methods. The effective means for suppressing diffusion of electromagnetic noise is to perform it at the root of the source, and the method is more effective as the contents of the younger numbers in the items 1 to 7 above. As one of the upper means, a method is known in which a copper paste layer is printed on the outer surface of the circuit board to wrap the circuit board with a conductive layer to form an electromagnetic shield. The method will be briefly described below. FIG. 4 is a block diagram showing an example of a conventional process for assembling the circuit board A, and FIG. 5 is a sectional view showing a schematic structure of the board A. As shown in FIG. 4, in the conventional assembly of the circuit board A, a printed circuit board is first manufactured as a multi-layer circuit board by a circuit board maker (printed circuit board steps F4.1 to F4.4). Next, an assembly maker mounts electronic components on the printed circuit board and solders them to make a circuit board A (board assembly steps F4.5 to F4.6). The electromagnetic shielding of the circuit board A is performed on the board surface other than the component mounting portion, and the circuit board A has a sectional structure as shown in FIG. In this way, the diffusion of electromagnetic noise from the circuit board A could be suppressed.
【0003】[0003]
【発明が解決しようとする課題】上記したような従来の
回路基板Aの電磁シールド方法では搭載部品の面積が増
加すると電磁ノイズの拡散抑制効果が薄れる傾向が有
る。特に最近の高密度実装手段としての平面実装におい
ては,この傾向が顕著に現れる。即ち,現在求められて
いる高密度実装基板技術では平面実装部品を多用してい
るため,表搭載部品の取り付け足が裏面に現れる。この
取り付け足が裏の部品搭載の制約にならないように工夫
しながら両面に多くの部品を搭載することにより高密度
化を実現している。この場合電磁シールドの立場で見る
と部品を搭載しない面が減少し,結果として電磁シール
ドを行っている効果が半減する場合があった。本発明
は,このような従来の技術における課題を解決するため
に,回路基板の電磁シールド方法を改良し,電磁ノイズ
の拡散をより効果的に抑制し得る回路基板の電磁シール
ド方法を提供することを目的とするものである。In the conventional electromagnetic shielding method for the circuit board A as described above, the effect of suppressing the diffusion of electromagnetic noise tends to be diminished as the area of mounted components increases. This tendency is particularly noticeable in the recent planar mounting as a high-density mounting method. That is, since the high-density mounting board technology that is currently demanded uses a large number of planar mounting components, the mounting feet of the front mounting components appear on the back surface. We have achieved high density by mounting many parts on both sides while devising so that the mounting feet do not restrict the mounting of parts on the back. In this case, when viewed from the standpoint of the electromagnetic shield, the surface on which no parts are mounted was reduced, and as a result, the effect of electromagnetic shielding was sometimes halved. In order to solve the problems in the related art, the present invention provides an electromagnetic shield method for a circuit board by improving the electromagnetic shield method for the circuit board and more effectively suppressing the diffusion of electromagnetic noise. The purpose is.
【0004】[0004]
【課題を解決するための手段】上記目的を達成するため
に本発明は,実装品を含む回路基板の電磁シールド方法
において,上記基板形状に合せた熱軟化性の電磁シール
ド素材により上記実装品を含めて上記基板全体を被覆
し,少なくとも上記シールド素材を加熱した後冷却して
上記基板に密着させることを特徴とする回路基板の電磁
シールド方法として構成されている。更には,上記シー
ルド素材が絶縁層と導電層とを貼り合せてなる回路基板
の電磁シールド方法である。更には,上記シールド素材
の上記導電層が上記基板のグランドに接するように上記
絶縁層を一部切欠かれてなる回路基板の電磁シールド方
法である。更には,上記シールド素材が該シールド素材
により被覆される上記実装品周辺に適宜空気抜きを設け
ることにより形成されてなる回路基板の電磁シールド方
法である。In order to achieve the above object, the present invention provides a method for electromagnetically shielding a circuit board including a mounted product, wherein the mounted product is made of a heat-softening electromagnetic shield material matching the shape of the substrate. An electromagnetic shield method for a circuit board is characterized in that the entire board including the above is covered, and at least the shield material is heated and then cooled and brought into close contact with the board. Furthermore, it is an electromagnetic shielding method for a circuit board in which the shield material is formed by bonding an insulating layer and a conductive layer together. Furthermore, it is an electromagnetic shielding method for a circuit board in which the insulating layer is partially cut so that the conductive layer of the shield material is in contact with the ground of the board. Further, there is provided an electromagnetic shielding method for a circuit board, wherein the shield material is formed by appropriately providing an air vent around the mounted product covered with the shield material.
【0005】[0005]
【作用】本発明によれば,回路基板形状に合せた軟化性
の電磁シールド素材により実装品を含めて上記基板全体
が被覆され,少なくとも上記シールド素材を加熱した後
冷却することにより該シールド素材が上記基板に密着さ
せられる。更に,上記シールド素材が絶縁層と導電層と
を張り合せることにより形成される。更に,上記シール
ド素材の上記導電層が上記基板のグランドに接するよう
に上記絶縁層が一部切欠かれる。更に,上記シールド素
材が該シールド素材により被覆される上記実装品周辺に
適宜空気抜きを設けることにより形成される。その結
果,回路基板からの電磁ノイズの拡散がより効果的に抑
制される。According to the present invention, the above-mentioned entire substrate including the mounted product is covered with the electromagnetic shielding material having a softening property adapted to the shape of the circuit board, and at least the shielding material is heated and then cooled to cool the shielding material. It is brought into close contact with the substrate. Furthermore, the shield material is formed by bonding an insulating layer and a conductive layer together. Further, the insulating layer is partially cut out so that the conductive layer of the shield material is in contact with the ground of the substrate. Further, the shield material is formed by appropriately providing an air vent around the mounted product covered with the shield material. As a result, the diffusion of electromagnetic noise from the circuit board is more effectively suppressed.
【0006】[0006]
【実施例】以下,添付図面を参照して本発明を具体化し
た実施例につき説明し,本発明の理解に供する。尚,以
下の実施例は,本発明を具体化した一例であって,本発
明の技術的範囲を限定する性格のものではない。ここ
に,図1は本発明の一実施例に係る回路基板A′の組み
立て工程を示すブロック図,図2は基板A′の概略構造
を示す断面図,図3は基板A′の組み立て工程での各状
態を示す説明図である。また,前記図4に示した従来の
回路基板Aの組み立て工程の一例を示すブロック図及び
図5の基板Aの概略構造を示す断面図と共通する要素に
は同一符号を使用する。図1に示す如く,本実施例の回
路基板A′の組み立て工程では,まず,プリント基板工
程(F1.1及びF1.2)で電磁シールドをしない普
通のプリント基板Bを作る。次に基板組み立て工程(F
1.3〜F1.7)で電子部品搭載半田付け後,絶縁層
S1と導電層S2とを重ねて熱加工することにより電磁
シールドを行う。この一連の工程で作成される回路基板
A′の断面構造を図2に示す。以下,この一連の工程の
内,基板組み立て工程の詳細について図3(a)〜
(d)を参照して説明する。図3(a)は部品搭載し
(F1.3),半田付けした(F1.4)後の基板組み
立て途中の状態である。図中のP1〜P4は電子部品
(実装品に相当),基板の四隅の〇部分は基板取り付け
用の穴を示す。又,この穴と各部品との間に引かれてい
る線は電子回路を構成する配線Lを示す。図3(b)は
絶縁シート(絶縁層)S1を生成した状態である(F
1.5)。絶縁シートS1の形状はグランド接続部G
(図では四隅)を取り除いたもので,各部品P1〜P4
の輪郭に相当する部分に空気穴H1を設けた形となって
いる。図3(c)は導電シート(導電層)S2を生成し
た状態である(F1.6)。導電シートS2の形状は絶
縁シートS1に設けられた空気穴H1と同じ場所に空気
穴H2を設けた基板形状となっている。Embodiments of the present invention will be described below with reference to the accompanying drawings for the understanding of the present invention. The following embodiments are examples of embodying the present invention and are not of the nature to limit the technical scope of the present invention. 1 is a block diagram showing an assembling process of a circuit board A'according to an embodiment of the present invention, FIG. 2 is a sectional view showing a schematic structure of the substrate A ', and FIG. 3 is an assembling process of the substrate A'. It is explanatory drawing which shows each state of. Further, the same symbols are used for the elements common to the block diagram showing an example of the assembling process of the conventional circuit board A shown in FIG. 4 and the sectional view showing the schematic structure of the board A of FIG. As shown in FIG. 1, in the process of assembling the circuit board A'of this embodiment, first, in the printed circuit board process (F1.1 and F1.2), an ordinary printed circuit board B without electromagnetic shield is made. Next, the board assembly process (F
After soldering the electronic component in 1.3 to F1.7), the insulating layer S1 and the conductive layer S2 are overlapped and heat-processed to perform electromagnetic shielding. FIG. 2 shows a cross-sectional structure of the circuit board A'produced by this series of steps. The details of the board assembling step in this series of steps will be described below with reference to FIGS.
This will be described with reference to (d). FIG. 3A shows a state in which the board is being assembled after components are mounted (F1.3) and soldered (F1.4). P1 to P4 in the figure represent electronic components (corresponding to mounted products), and the circles at the four corners of the board indicate holes for mounting the board. The line drawn between this hole and each part shows the wiring L which constitutes an electronic circuit. FIG. 3B shows a state in which the insulating sheet (insulating layer) S1 is generated (F
1.5). The shape of the insulating sheet S1 is the ground connection portion G.
(The four corners in the figure) are removed.
The air hole H1 is provided in the portion corresponding to the contour of the. FIG. 3C shows a state in which the conductive sheet (conductive layer) S2 is generated (F1.6). The shape of the conductive sheet S2 is a substrate shape in which the air holes H2 are provided at the same locations as the air holes H1 provided in the insulating sheet S1.
【0007】次に,この導電シートS2を絶縁シートS
1上に貼り合わせて電磁シールド素材Sを形成する。こ
の時,両シートS1,S2の空気穴H1,H2はつなが
った状態となる。又,各シートS1,S2は,基板にコ
ネクタなどが有れば必要に応じ当該部に穴を明けた形状
で対応する。又,各シートS1,S2は特定温度Taで
の熱軟化性の材料で作られ,その温度Taが部品取り付
けの半田付け温度Tbより低いものが用いられる。即
ち,一般に従来の基板加工材料としてのオーバコート
層,銅ペースト層に使用した材料などから熱軟化性の条
件を満たすものとする。次に,両シートS1,S2を貼
り合せた状態で部品搭載半田付け後の基板全体を被覆す
るように設置して基板ユニットを作る。この基板ユニッ
トを温度Taにて加熱して両シートS1,S2を軟化さ
せた後,冷却することにより熱加工を行う(F1.
7)。この熱加工は半田付け温度Tbより低い温度でな
されるため半田付けを損なうことがなく,又両シートS
1,S2の空気穴H1,H2はシートと基板との間の空
気を逃がすため,両シートS1,S2は電子部品P1〜
P4を覆うように基板に密着する。そして,図4(d)
に示す如く,基板全体の電磁シールドがなされる。その
結果,回路基板A′からの電磁ノイズの拡散が従来例よ
りもさらに効果的に抑制される。この効果は高密度の平
面実装において特に顕著なものとなる。この電磁シール
ドにより逆に外部からの電磁ノイズから回路基板A′を
保護し,回路の誤動作等を防ぐ効果も奏する。又,上記
実施例では絶縁シートS1と導電シートS2とを1組用
いたが複数組用いることにより,更にシールド効果を向
上させることができる。尚,上記実施例では絶縁シート
S1と導電シートS2とを貼り合せたものを部品搭載半
田付け後の基板全体に被覆したが,実使用に際しては各
シートS1,S2を順次被覆しても何ら支障はない。Next, the conductive sheet S2 is replaced with the insulating sheet S
An electromagnetic shield material S is formed by laminating it on top of 1. At this time, the air holes H1 and H2 of both sheets S1 and S2 are in a connected state. Further, each sheet S1 and S2 has a shape in which a hole is formed in the corresponding portion, if necessary, if the substrate has a connector or the like. Further, each of the sheets S1 and S2 is made of a heat softening material at a specific temperature Ta, and the temperature Ta thereof is lower than the soldering temperature Tb for mounting components. That is, generally, the material used for the overcoat layer, the copper paste layer, etc., which is a conventional substrate processing material, satisfies the thermal softening condition. Next, the two sheets S1 and S2 are attached to each other and installed so as to cover the entire substrate after the component mounting and soldering to form a substrate unit. This substrate unit is heated at a temperature Ta to soften both sheets S1 and S2, and then cooled to perform thermal processing (F1.
7). Since this thermal processing is performed at a temperature lower than the soldering temperature Tb, the soldering is not impaired, and both sheets S
The air holes H1 and H2 of 1 and S2 allow air between the sheet and the substrate to escape, so that the sheets S1 and S2 have electronic parts P1 to P1.
It adheres to the substrate so as to cover P4. And FIG. 4 (d)
As shown in, the electromagnetic shielding of the entire board is performed. As a result, diffusion of electromagnetic noise from the circuit board A'is suppressed more effectively than in the conventional example. This effect is particularly remarkable in high-density planar mounting. On the contrary, the electromagnetic shield protects the circuit board A ′ from electromagnetic noise from the outside and also has an effect of preventing malfunction of the circuit. Further, in the above embodiment, one set of the insulating sheet S1 and the conductive sheet S2 is used, but by using a plurality of sets, the shield effect can be further improved. In the above-mentioned embodiment, the insulating sheet S1 and the conductive sheet S2 are attached to each other, and the whole substrate after the component mounting and soldering is covered. However, in actual use, the sheets S1 and S2 may be sequentially covered without any problem. There is no.
【0008】[0008]
【発明の効果】本発明に係る回路基板の電磁シールド方
法は,上記したように構成されているため,回路基板か
らの電磁ノイズの拡散が従来例よりもさらに効果的に抑
制される。この効果は高密度の平面実装において特に顕
著なものとなる。また,この電磁シールドにより逆に外
部から電磁ノイズから回路基板を保護し,回路の誤動作
等を防ぐ効果も奏する。Since the circuit board electromagnetic shielding method according to the present invention is configured as described above, the diffusion of electromagnetic noise from the circuit board can be suppressed more effectively than in the conventional example. This effect is particularly remarkable in high-density planar mounting. In addition, the electromagnetic shield conversely protects the circuit board from electromagnetic noise from the outside, and has an effect of preventing malfunction of the circuit.
【図1】 本発明の一実施例に係る回路基板A′の組み
立て工程を示すブロック図。FIG. 1 is a block diagram showing an assembly process of a circuit board A ′ according to an embodiment of the present invention.
【図2】 基板A′の概略構造を示す断面図。FIG. 2 is a sectional view showing a schematic structure of a substrate A ′.
【図3】 基板A′の組み立て工程での各状態を示す説
明図。FIG. 3 is an explanatory view showing each state in the assembly process of the board A ′.
【図4】 従来の回路基板Aの組み立て工程の一例を示
すブロック図。FIG. 4 is a block diagram showing an example of a conventional assembly process of a circuit board A.
【図5】 基板Aの概略構造を示す断面図。5 is a sectional view showing a schematic structure of a substrate A. FIG.
A…回路基板(基板) B…プリント基板 P1〜P4…電子部品(実装品) S…電磁シールド素材(シールド素材) S1…絶縁シート(絶縁層) S2…導電シート(導電層) H1,H2…空気抜 A ... Circuit board (board) B ... Printed circuit board P1-P4 ... Electronic component (mounting product) S ... Electromagnetic shield material (shield material) S1 ... Insulating sheet (insulating layer) S2 ... Conductive sheet (conductive layer) H1, H2 ... Deflated
Claims (4)
法において,上記基板形状に合せた熱軟化性の電磁シー
ルド素材により上記実装品を含めて上記基板全体を被覆
し,少なくとも上記シールド素材を加熱した後冷却して
上記基板に密着させることを特徴とする回路基板の電磁
シールド方法。1. A method of electromagnetically shielding a circuit board including a mounted product, wherein the entire substrate including the mounted product is covered with a heat-softening electromagnetic shield material matching the shape of the substrate, and at least the shield material is heated. After that, the circuit board is cooled and brought into close contact with the board, and an electromagnetic shield method for a circuit board is provided.
貼り合せてなる請求項1記載の回路基板の電磁シールド
方法。2. The electromagnetic shielding method for a circuit board according to claim 1, wherein the shield material is formed by bonding an insulating layer and a conductive layer together.
板のグランドに接するように上記絶縁層を一部切欠かれ
てなる請求項1又は2記載の回路基板の電磁シールド方
法。3. The electromagnetic shielding method for a circuit board according to claim 1, wherein the insulating layer is partially cut so that the conductive layer of the shield material is in contact with the ground of the substrate.
り被覆される上記実装品周辺に適宜空気抜きを設けるこ
とにより形成されてなる請求項1,2又は3記載の回路
基板の電磁シールド方法。4. The electromagnetic shielding method for a circuit board according to claim 1, wherein the shield material is formed by appropriately providing an air vent around the mounted product covered with the shield material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13081292A JPH05327270A (en) | 1992-05-22 | 1992-05-22 | Electromagnetic shielding of circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13081292A JPH05327270A (en) | 1992-05-22 | 1992-05-22 | Electromagnetic shielding of circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05327270A true JPH05327270A (en) | 1993-12-10 |
Family
ID=15043291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13081292A Pending JPH05327270A (en) | 1992-05-22 | 1992-05-22 | Electromagnetic shielding of circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05327270A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019582A (en) * | 2003-06-25 | 2005-01-20 | Sony Corp | High-speed signal circuit board and method of improving signal transmission property thereof |
KR20170013202A (en) | 2014-06-02 | 2017-02-06 | 다츠다 덴센 가부시키가이샤 | Electroconductive adhesive film, printed circuit board, and electronic device |
JP2019091866A (en) * | 2017-11-17 | 2019-06-13 | 東洋インキScホールディングス株式会社 | Method for manufacturing electronic element |
-
1992
- 1992-05-22 JP JP13081292A patent/JPH05327270A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019582A (en) * | 2003-06-25 | 2005-01-20 | Sony Corp | High-speed signal circuit board and method of improving signal transmission property thereof |
JP4496721B2 (en) * | 2003-06-25 | 2010-07-07 | ソニー株式会社 | High speed signal circuit board and method for improving signal transmission characteristics thereof. |
KR20170013202A (en) | 2014-06-02 | 2017-02-06 | 다츠다 덴센 가부시키가이샤 | Electroconductive adhesive film, printed circuit board, and electronic device |
JP2019091866A (en) * | 2017-11-17 | 2019-06-13 | 東洋インキScホールディングス株式会社 | Method for manufacturing electronic element |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3002539B2 (en) | Circuit board with lateral conductive pattern and shielding area and method of manufacturing the circuit board | |
US5571608A (en) | Apparatus and method of making laminate an embedded conductive layer | |
US20010005042A1 (en) | Method of manufacturing a surface mount package | |
JPH05243736A (en) | Manufacture of printed circuit board | |
JPH08125380A (en) | Shielded flexible wiring-board and manufacturing method thereof | |
CA2142611A1 (en) | A Multiple Layer Printed Circuit Board | |
US5955704A (en) | Optimal PWA high density routing to minimize EMI substrate coupling in a computer system | |
GB2248971A (en) | Shielded printed wiring board | |
US5008656A (en) | Flexible cable assembly | |
JPH05327270A (en) | Electromagnetic shielding of circuit board | |
JPS61148706A (en) | Flexible cable assembly | |
JPH08195566A (en) | Multilayer electronic board, method of manufacture and arithmetic processing board | |
US7162793B2 (en) | Apparatus for clamping printed circuit boards inside an electronic module housing | |
GB2137422A (en) | Printed circuit board | |
JPH04257286A (en) | Composite printed wiring board | |
JPH04101491A (en) | Mounting method for chip component | |
JPH02143498A (en) | Shielding structure of circuit board | |
JPH0438160B2 (en) | ||
JP2681292B2 (en) | Multilayer printed wiring board | |
GB2145574A (en) | Multi-layer printed circuit boards | |
JPH08162765A (en) | Multilayer printed wiring board | |
JP2584476Y2 (en) | Printed board | |
JPH09283867A (en) | Printed wiring board | |
JPS61189688A (en) | Printed circuit board | |
JPH1051181A (en) | Electronic device package |