JPH05326481A - Board cleaning device - Google Patents

Board cleaning device

Info

Publication number
JPH05326481A
JPH05326481A JP12917192A JP12917192A JPH05326481A JP H05326481 A JPH05326481 A JP H05326481A JP 12917192 A JP12917192 A JP 12917192A JP 12917192 A JP12917192 A JP 12917192A JP H05326481 A JPH05326481 A JP H05326481A
Authority
JP
Japan
Prior art keywords
substrate
nozzle
cleaning
cleaning liquid
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP12917192A
Other languages
Japanese (ja)
Inventor
Kiyoshi Ozaki
喜義 尾崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12917192A priority Critical patent/JPH05326481A/en
Publication of JPH05326481A publication Critical patent/JPH05326481A/en
Withdrawn legal-status Critical Current

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  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To improve removing effect of foreign materials adhered to a board by an impact of cleanser from all directions. CONSTITUTION:The board cleaning device comprises a board support base 2 for holding a board 1 to be rotatably driven, and at least two nozzles 5 arranged above the base 2 to inject cleanser 4 pressurized while oscillating along a trace 3 passing a meeting center of the base 2. At least one of the nozzles 5 injects the cleanser 4 in parallel with the trace 3 obliquely from above toward the board 1, and at least the other injects cleaner 4 crossing the trace 3 obliquely from above toward the board 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は基板洗浄装置に係わり、
少なくとも2本のノズルを配設し、基板の表面に付着し
ている夾雑物をあらゆる方向から叩いて除去効果を向上
させてなる基板洗浄装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus,
The present invention relates to a substrate cleaning apparatus in which at least two nozzles are provided and foreign substances adhering to the surface of a substrate are hit from all directions to improve the removal effect.

【0002】近年、例えば、半導体装置ならばシリコン
などの半導体のウェーハ、LCDのような平面ディスプ
レイならばガラス板、磁気ディスクのような記録媒体な
らばAl板というように、いろいろな基板上に成膜やパ
ターニングなどを施して各種電子デバイスを作るプロセ
ス技術の進展が目覚ましい。
In recent years, for example, semiconductor devices such as silicon wafers for semiconductor devices, glass plates for flat displays such as LCDs, and Al plates for recording media such as magnetic disks have been formed on various substrates. The progress of process technology for making various electronic devices by applying films and patterning is remarkable.

【0003】これらの各種電子デバイスの製造工程にお
ける基板の表面処理においては、成膜やエッチング、剥
離などの処理に対して、いろいろな物理的、化学的なプ
ロセス技術が用いられている。
In the surface treatment of the substrate in the manufacturing process of these various electronic devices, various physical and chemical process techniques are used for the treatments such as film formation, etching and peeling.

【0004】しかし、何れの処理においても、まず基板
を汚染している夾雑物を除去して基板の表面を清浄にす
る洗浄工程が、製造歩留りを上げて生産性を高めたり信
頼性を向上させたりする上から欠かせない。特に洗浄工
程の最終仕上げを如何に効果的に行うかが重要である。
However, in any of the treatments, a cleaning process for removing contaminants contaminating the substrate and cleaning the surface of the substrate first raises the manufacturing yield and improves the productivity and reliability. It is indispensable from the top. In particular, how effectively the final finishing of the cleaning process is performed is important.

【0005】[0005]

【従来の技術】洗浄工程には、最終工程で洗浄剤を何で
置換するかによっていろいろな方法が採られているが、
安価で取り扱い易くしかも環境保護の上からも最後に水
洗を行って終わらせることがよく行われている。そし
て、この水洗には一般にイオン交換樹脂を通した脱イオ
ン水、いわゆる純水が用いられている。
2. Description of the Related Art In the cleaning process, various methods are adopted depending on what is replaced with the cleaning agent in the final process.
It is cheap and easy to handle, and it is often done from the viewpoint of environmental protection by finally rinsing with water. Deionized water that has passed through an ion exchange resin, so-called pure water, is generally used for this water washing.

【0006】図4は従来の洗浄装置の一例の説明図で、
図4(A)は模式的な斜視図、図4(B)は主要部の拡
大斜視図である。1は基板、2は基板支持台、3は軌
跡、4は洗浄液、5はノズル、6は夾雑物、10は洗浄装
置である。
FIG. 4 is an explanatory view of an example of a conventional cleaning device.
FIG. 4A is a schematic perspective view, and FIG. 4B is an enlarged perspective view of the main part. 1 is a substrate, 2 is a substrate support, 3 is a locus, 4 is a cleaning liquid, 5 is a nozzle, 6 is a contaminant, and 10 is a cleaning device.

【0007】図4において、従来の洗浄装置10は、基板
1を保持して回転駆動される基板支持台2と、その基板
支持台2の上方に配設されて揺動するノズル5から構成
されている。
In FIG. 4, a conventional cleaning apparatus 10 is composed of a substrate support base 2 which holds a substrate 1 and is driven to rotate, and a nozzle 5 which is arranged above the substrate support base 2 and swings. ing.

【0008】基板1は円形のシリコンウェーハや平面デ
ィスプレイなどで用いられる方形のガラス板などであ
る。そして、回転駆動される基板支持台2に真空チャッ
クなどによって保持されるようになっている。
The substrate 1 is a circular silicon wafer or a rectangular glass plate used in a flat display or the like. Then, it is held by a vacuum chuck or the like on the substrate support base 2 that is rotationally driven.

【0009】洗浄液4は、有機、無機のいろいろな洗浄
剤の溶液で、洗浄工程の仕上げで用いられる純水もその
一つである。そして、洗浄液4は、基板支持台2に保持
されて洗浄しようとする基板1の上に、ノズル5から加
圧されてビーム状に噴出するようになっている。
The cleaning liquid 4 is a solution of various organic or inorganic cleaning agents, and pure water used for finishing the cleaning process is one of them. Then, the cleaning liquid 4 is held by the substrate support base 2 and is sprayed in a beam shape on the substrate 1 to be cleaned by being pressurized by the nozzles 5.

【0010】このノズル5は、基板支持台2の回転中心
を通って円弧状の軌跡3に沿って揺動するようにしてい
る。この軌跡3は、回転中心を横切る直線上に揺動して
いる場合もある。
The nozzle 5 swings along an arcuate locus 3 through the center of rotation of the substrate support 2. The locus 3 may oscillate on a straight line that crosses the center of rotation.

【0011】また、基板1に垂直に洗浄液4を噴出する
と洗浄液4が飛び散って洗浄効果が上がらない。そこ
で、ノズル5は、基板1の斜め上方から軌跡3に平行に
洗浄液4を噴出するように傾斜して支持されている。従
って、洗浄液4は基板1の表面を斜め上方向から叩いて
おり、回転している基板1の表面に作用する遠心力と相
乗して、基板1の表面に付着して表面を汚している夾雑
物6を洗い飛ばす。
If the cleaning liquid 4 is jetted perpendicularly to the substrate 1, the cleaning liquid 4 scatters and the cleaning effect is not improved. Therefore, the nozzle 5 is inclined and supported so as to eject the cleaning liquid 4 in parallel with the trajectory 3 from diagonally above the substrate 1. Therefore, the cleaning liquid 4 strikes the surface of the substrate 1 obliquely from above, synergistically with the centrifugal force acting on the surface of the rotating substrate 1, and adheres to the surface of the substrate 1 to contaminate the surface. Wash away item 6.

【0012】洗浄に際しては、例えば、基板1を毎分 2
00回転程度の速度で回しながらノズル5を適宜回数揺動
させて洗浄液4で基板1の表面を叩く。このように、従
来の洗浄装置10においては、1本のノズル5を用い、そ
のノズル5を斜め上方向から洗浄液4がビーム状に噴出
するように配設し、回転する基板1の表面を洗浄してい
た。
For cleaning, the substrate 1 is, for example, 2
While rotating at a speed of about 00 rotations, the nozzle 5 is rocked a proper number of times to hit the surface of the substrate 1 with the cleaning liquid 4. As described above, in the conventional cleaning device 10, one nozzle 5 is used, and the nozzle 5 is arranged so that the cleaning liquid 4 is jetted in a beam shape from an obliquely upper direction to clean the surface of the rotating substrate 1. Was.

【0013】[0013]

【発明が解決しようとする課題】ところが、このような
従来の洗浄装置10においては、矢印Rの方向に回転する
基板1の表面に付着している1個の夾雑物6に着目する
と、この夾雑物6は、噴出する洗浄液4によって、軌跡
3に平行な方向、つまり(O→A、B→O)と、(A→
O、B→O)の2方向からしか叩かれない。そのため
に、夾雑物6の形状や基板1の表面に付着している状
態、向きによっては、例えば、図4(B)に示したよう
に、夾雑物6の長手方向に平行に洗浄液4が衝撃するの
で、衝撃断面が狭くて除去効果が上がらないことが間々
起こる。
However, in such a conventional cleaning apparatus 10, if one foreign matter 6 adhering to the surface of the substrate 1 rotating in the direction of the arrow R is noticed, this foreign matter is detected. The object 6 is sprayed by the cleaning liquid 4 in a direction parallel to the trajectory 3, that is, (O → A, B → O) and (A →
You can only hit from two directions (O, B → O). Therefore, depending on the shape of the contaminants 6, the state in which they are attached to the surface of the substrate 1, and the orientation, for example, as shown in FIG. 4B, the cleaning liquid 4 impacts in parallel to the longitudinal direction of the contaminants 6. Therefore, it often happens that the impact cross section is narrow and the removal effect is not improved.

【0014】また、基板1の表面を覆っている洗浄液4
の膜の緩衝効果によって、ビーム状に噴出した洗浄液4
が基板1の表面を叩く衝撃が緩和されてしまい、夾雑物
6の除去効果が減殺されてしまう問題があった。
Further, the cleaning liquid 4 covering the surface of the substrate 1
Cleaning solution 4 spouted into a beam due to the buffer effect of the film
There was a problem that the impact of hitting the surface of the substrate 1 was alleviated, and the effect of removing the contaminants 6 was diminished.

【0015】そこで本発明は、少なくとも2本のノズル
を配設し、基板の表面に付着している夾雑物をビーム状
に噴出した洗浄液4であらゆる方向から叩いて除去効果
を向上させてなる基板洗浄装置を提供することを目的と
している。
Therefore, according to the present invention, at least two nozzles are provided, and the removal effect is improved by hitting the contaminants adhering to the surface of the substrate with the cleaning liquid 4 ejected in a beam shape from all directions. The purpose is to provide a cleaning device.

【0016】[0016]

【課題を解決するための手段】上で述べた課題は、基板
を保持して回転駆動される基板支持台と、該基板支持台
の上方に配設されて、該基板支持台の回転中心を通る軌
跡に沿って揺動しながら加圧された洗浄液を噴出させる
少なくとも2本のノズルを有し、前記ノズルは、少なく
とも一方が、前記基板に向かって斜め上方から前記軌跡
に平行に前記洗浄液を噴出し、少なくとも他方が、該基
板に向かって斜め上方から該軌跡に交叉するよう該洗浄
液を噴出するように構成された基板洗浄装置によって解
決される。
SUMMARY OF THE INVENTION The above-mentioned problems are solved by a substrate supporting base which holds a substrate and is rotationally driven, and a rotation center of the substrate supporting base which is disposed above the substrate supporting base. It has at least two nozzles for ejecting a pressurized cleaning liquid while swinging along a trajectory, at least one of the nozzles ejects the cleaning liquid parallel to the trajectory from obliquely upward toward the substrate. At least the other of the jets is solved by a substrate cleaning apparatus configured to jet the cleaning liquid obliquely from above toward the substrate so as to intersect the trajectory.

【0017】[0017]

【作用】従来の基板洗浄装置は、一本のノズルで洗浄液
を噴出していたので、基板を回転させノズルを揺動させ
ても、基板に付着した夾雑物に対して、2方向からしか
衝撃を加えられなかったのに対して、本発明において
は、夾雑物のあらゆる方向から洗浄液の衝撃を加えられ
るようにしている。
In the conventional substrate cleaning apparatus, since the cleaning liquid is jetted by one nozzle, even if the substrate is rotated and the nozzle is rocked, the contaminants adhering to the substrate are impacted from only two directions. However, in the present invention, the impact of the cleaning liquid can be applied from all directions of the contaminants.

【0018】すなわち、少なくとも2本のノズルを具
え、ノズルが揺動する軌跡に対して、一方のノズルは平
行に、他方のノズルは交叉するようにして、洗浄液を噴
出させるようにしている。
That is, at least two nozzles are provided, and one nozzle is in parallel with the trajectory of the nozzles and the other nozzle is intersected with the nozzle so that the cleaning liquid is ejected.

【0019】そうすると、基板上に付着している夾雑物
は、揺動しているノズルに対して基板の回転に連動して
自転しているので、交叉して噴出する洗浄液によってあ
らゆる方向から衝撃を加えられる。その結果、従来なら
ば除去し難かった夾雑物を除去することができ、洗浄工
程の効率化が図れる。
As a result, the contaminants adhering to the substrate rotate about the oscillating nozzle in association with the rotation of the substrate, so that the cleaning liquid ejected in a crossed manner causes impact from all directions. Added. As a result, it is possible to remove contaminants that were difficult to remove in the conventional case, and the efficiency of the cleaning process can be improved.

【0020】[0020]

【実施例】図1は本発明の第一の実施例の説明図で、図
1(A)は全体の構成を示す一部切欠き斜視図、図1
(B)は主要部の拡大斜視図、図2は洗浄効果の説明
図、図3は本発明の第二の実施例の説明図で、図3
(A)は模式的な斜視図、図3(B)はノズルの一例の
斜視図である。図において、1は基板、2は基板支持
台、3は軌跡、4は洗浄液、5はノズル、5aは第一のノ
ズル、5bは第二のノズル、5cは第三のノズル、5dは第四
のノズル、6は夾雑物、10は洗浄装置である。
1 is an explanatory view of a first embodiment of the present invention, and FIG. 1 (A) is a partially cutaway perspective view showing the entire structure, FIG.
3B is an enlarged perspective view of a main part, FIG. 2 is an explanatory view of a cleaning effect, FIG. 3 is an explanatory view of a second embodiment of the present invention, and FIG.
FIG. 3A is a schematic perspective view, and FIG. 3B is a perspective view of an example of a nozzle. In the figure, 1 is a substrate, 2 is a substrate support, 3 is a locus, 4 is a cleaning liquid, 5 is a nozzle, 5a is a first nozzle, 5b is a second nozzle, 5c is a third nozzle, and 5d is a fourth nozzle. No. 6, No. 6 is a contaminant, and No. 10 is a cleaning device.

【0021】実施例:1 図1において、本発明になる洗浄装置10は、基板1を保
持して回転駆動される基板支持台2と、その基板支持台
2の上方に配設されて基板支持台2の回転中心Oを通る
軌跡3、つまりO→A→O→B→Oに沿って揺動するノ
ズル5から構成されている。このノズル5からは図示し
てないポンプによって加圧された例えば純水などの洗浄
液4が噴出するようになっている。
Embodiment 1 In FIG. 1, a cleaning apparatus 10 according to the present invention comprises a substrate support base 2 which holds a substrate 1 and is driven to rotate, and a substrate support base 2 which is disposed above the substrate support base 2. It is composed of a locus 3 passing through a rotation center O of the table 2, that is, a nozzle 5 swinging along O → A → O → B → O. A cleaning liquid 4 such as pure water pressurized by a pump (not shown) is ejected from the nozzle 5.

【0022】ノズル5は、図1(B)に示したように先
端が第一のノズル5aと第二のノズル5bに分岐している。
そして、第一のノズル5aは洗浄液4を揺動する軌跡3に
平行に噴出し、第二のノズル5bは洗浄液4を軌跡3に交
叉するように噴出するようになっている。
As shown in FIG. 1B, the tip of the nozzle 5 is branched into a first nozzle 5a and a second nozzle 5b.
The first nozzle 5a ejects the cleaning liquid 4 in parallel with the trajectory 3 of rocking, and the second nozzle 5b ejects the cleaning liquid 4 so as to intersect the trajectory 3.

【0023】ところで、ノズル5がO→A→Oを通る際
とO→B→Oを通る際には、夾雑物6の向きが逆にな
る。従って、基板1が回転しながらノズル5が陽動を繰
り返すと、図2に示したように基板1に付着している夾
雑物6は、あらゆる方向から洗浄液4の衝撃を受ける機
会が生じる。その結果、従来の洗浄装置のような主とし
て2方向からだけの洗浄液4の衝撃で除去され難かった
夾雑物6も除去されるようになる。
By the way, when the nozzle 5 passes through O → A → O and when passes through O → B → O, the directions of the impurities 6 are reversed. Therefore, when the nozzle 5 repeats positive and negative movements while the substrate 1 rotates, the contaminants 6 adhering to the substrate 1 have an opportunity to be impacted by the cleaning liquid 4 from all directions as shown in FIG. As a result, the contaminants 6 which are difficult to be removed by the impact of the cleaning liquid 4 mainly from only two directions as in the conventional cleaning device are also removed.

【0024】実施例:2 図3(A)において、洗浄液4が、軌跡3に沿って平行
に、かつ対向した2方向から、軌跡3に交叉するよう
に、かつ対向した2方向から噴出し、それぞれが異なる
位置を衝撃するようになっている。
Example 2 In FIG. 3 (A), the cleaning liquid 4 is jetted in parallel along the locus 3 from two opposite directions so as to intersect with the locus 3 and from two opposite directions. Each is designed to impact different positions.

【0025】こうした機能は、例えば、図3(B)に示
したようなノズル5を用いれば実現できる。すなわち、
ノズル5の先端が、第一のノズル5aに対向した第三のノ
ズル5cと、第二のノズル5bに対向した第四のノズル5dを
具え、四叉に分岐した構成になっている。
Such a function can be realized by using the nozzle 5 as shown in FIG. 3 (B), for example. That is,
The tip of the nozzle 5 is provided with a third nozzle 5c facing the first nozzle 5a and a fourth nozzle 5d facing the second nozzle 5b, and is branched into four arms.

【0026】こうすると、実施例1で述べたような基板
1を回転させながらノズル5を揺動して夾雑物6の向き
が逆になる機会が倍増することになる。従って、短時間
に夾雑物6を除去する効果を発揮することができる。
In this case, the chances of swinging the nozzle 5 and rotating the substrate 1 as described in the first embodiment to reverse the direction of the contaminants 6 are doubled. Therefore, the effect of removing the impurities 6 can be exhibited in a short time.

【0027】ノズル5の形状は、先端部分をユニット化
し、このノズルユニットを揺動するアームの先端に取り
付ける構成もあり、種々の変形が可能である。また、ノ
ズル5が揺動する軌跡3は、基板1の回転中心を通る円
弧状でも直線状でもよい。さらに、洗浄液4は、純水の
他に有機溶剤や洗剤の水溶液などでもよい。
The shape of the nozzle 5 may be modified in various ways such that the tip portion is unitized and attached to the tip of an arm that swings the nozzle unit. Further, the locus 3 on which the nozzle 5 swings may be arcuate or linear, passing through the center of rotation of the substrate 1. Further, the cleaning liquid 4 may be an organic solvent, an aqueous solution of detergent, or the like in addition to pure water.

【0028】[0028]

【発明の効果】本発明になる基板洗浄装置によれば、基
板に付着している夾雑物をノズルから噴出する洗浄液の
衝撃によって除去する際に、夾雑物のあらゆる方向から
衝撃を加えることができる。
According to the substrate cleaning apparatus of the present invention, when the contaminants adhering to the substrate are removed by the impact of the cleaning liquid ejected from the nozzle, the impacts can be applied from all directions of the contaminants. ..

【0029】従って、従来の洗浄装置においては、形状
や付着状態に依存して除去し難かった夾雑物も除去する
ことができ、特に加圧純水による洗浄工程の効率化に対
して、本発明は寄与するところが大である。
Therefore, in the conventional cleaning apparatus, it is possible to remove the contaminants which are difficult to remove depending on the shape and the adhered state. Has a large contribution.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の第一の実施例の説明図で、(A)は
全体の構成を示す一部切欠き斜視図、(B)は主要部の
拡大斜視図である。
FIG. 1 is an explanatory view of a first embodiment of the present invention, (A) is a partially cutaway perspective view showing the entire configuration, and (B) is an enlarged perspective view of a main part.

【図2】 洗浄効果の説明図である。FIG. 2 is an explanatory diagram of a cleaning effect.

【図3】 本発明の第二の実施例の説明図で、(A)は
模式的な斜視図、(B)はノズルの一例の斜視図であ
る。
3A and 3B are explanatory views of a second embodiment of the present invention, FIG. 3A is a schematic perspective view, and FIG. 3B is a perspective view of an example of a nozzle.

【図4】 従来の洗浄装置の一例の説明図で、(A)は
模式的な斜視図、(B)は主要部の拡大斜視図である。
FIG. 4 is an explanatory view of an example of a conventional cleaning apparatus, (A) is a schematic perspective view, and (B) is an enlarged perspective view of a main part.

【符号の説明】[Explanation of symbols]

1 基板 2 基板支持台 3 軌跡 4 洗浄液 5 ノズル 5a 第一のノズル 5b
第二のノズル 5c 第三のノズル 5d 第四のノズル 6 夾雑物 10 洗浄装置
1 substrate 2 substrate support 3 trajectory 4 cleaning liquid 5 nozzle 5a first nozzle 5b
2nd nozzle 5c 3rd nozzle 5d 4th nozzle 6 Contaminants 10 Cleaning device

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 基板(1) を保持して回転駆動される基板
支持台(2) と、該基板支持台(2) の上方に配設されて、
該基板支持台(2) の回転中心を通る軌跡(3)に沿って揺
動しながら加圧された洗浄液(4) を噴出させる少なくと
も2本のノズル(5) を有し、 前記ノズル(5) は、少なくとも一方が、前記基板(1) に
向かって斜め上方から前記軌跡(3) に平行に前記洗浄液
(4) を噴出し、少なくとも他方が、該基板(1)に向かっ
て斜め上方から該軌跡(3) に交叉するよう該洗浄液(4)
を噴出することを特徴とする基板洗浄装置。
1. A substrate supporting base (2) which holds a substrate (1) and is driven to rotate, and a substrate supporting base (2) disposed above the substrate supporting base (2),
The substrate support base (2) has at least two nozzles (5) for ejecting the cleaning liquid (4) pressurized while swinging along a locus (3) passing through the center of rotation of the substrate support base (2). ) Indicates that at least one of the cleaning solutions is parallel to the trajectory (3) from diagonally above toward the substrate (1).
(4) is jetted, and the cleaning liquid (4) is so arranged that at least the other crosses the locus (3) obliquely from above toward the substrate (1).
A substrate cleaning apparatus, characterized in that the substrate is ejected.
【請求項2】 前記洗浄液(4) が純水である請求項1記
載の基板洗浄装置。
2. The substrate cleaning apparatus according to claim 1, wherein the cleaning liquid (4) is pure water.
【請求項3】 前記洗浄液(4) は、前記ノズル(5) から
噴出した際、前記基板(1) の上のそれぞれ異なる位置を
衝撃する請求項1記載の基板洗浄装置。
3. The substrate cleaning apparatus according to claim 1, wherein the cleaning liquid (4) impacts different positions on the substrate (1) when ejected from the nozzle (5).
JP12917192A 1992-05-22 1992-05-22 Board cleaning device Withdrawn JPH05326481A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12917192A JPH05326481A (en) 1992-05-22 1992-05-22 Board cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12917192A JPH05326481A (en) 1992-05-22 1992-05-22 Board cleaning device

Publications (1)

Publication Number Publication Date
JPH05326481A true JPH05326481A (en) 1993-12-10

Family

ID=15002903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12917192A Withdrawn JPH05326481A (en) 1992-05-22 1992-05-22 Board cleaning device

Country Status (1)

Country Link
JP (1) JPH05326481A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5779816A (en) * 1997-01-30 1998-07-14 Trinh; Tieu T. Nozzle and system for use in wafer cleaning procedures
US5785068A (en) * 1995-05-11 1998-07-28 Dainippon Screen Mfg. Co., Ltd. Substrate spin cleaning apparatus
US6691719B2 (en) * 2001-01-12 2004-02-17 Applied Materials Inc. Adjustable nozzle for wafer bevel cleaning
JP2011155131A (en) * 2010-01-27 2011-08-11 Disco Abrasive Syst Ltd Wafer carrying mechanism
KR101330319B1 (en) * 2011-10-11 2013-11-14 세메스 주식회사 Injection unit and Apparatus for treating substrate with the unit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5785068A (en) * 1995-05-11 1998-07-28 Dainippon Screen Mfg. Co., Ltd. Substrate spin cleaning apparatus
US5779816A (en) * 1997-01-30 1998-07-14 Trinh; Tieu T. Nozzle and system for use in wafer cleaning procedures
US6691719B2 (en) * 2001-01-12 2004-02-17 Applied Materials Inc. Adjustable nozzle for wafer bevel cleaning
JP2011155131A (en) * 2010-01-27 2011-08-11 Disco Abrasive Syst Ltd Wafer carrying mechanism
KR101330319B1 (en) * 2011-10-11 2013-11-14 세메스 주식회사 Injection unit and Apparatus for treating substrate with the unit

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Effective date: 19990803