JPH05325787A - Manufacture of fluorescent film substrate - Google Patents

Abstract

PURPOSE:To form an undamaged conductor layer on the phosphors of a transparent substrate. CONSTITUTION:A peel layer 4 having the thermal decomposition temperature of 225 deg.C, a fluorescent film layer 5 using a resin binder having the thermal decomposition temperature of 300 deg.C, and an adhesive layer 6 having the thermal decomposition temperature of 150-390 deg.C are formed in sequence on a base film made of polyethylene terephthalate to obtain a transfer material, and the adhesive layer 6 is overlapped on a glass substrate 2. It is heated and pressurized with a silicone pad to peel the base film, the glass substrate 2 is heated for 3hr at the heating temperature of 200-300 deg.C to remove part of organic constituents. A conductor layer 7 is formed at the film thickness of 2000Angstrom on the peel layer 4 by deposition. The glass substrate 2 is heated for 30min at 450-500 deg.C, and all the organic constituents other than phosphors are removed as pyrolytic gases.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a fluorescent film substrate used for fluorescent display tubes, cathode ray tubes and the like, and it is an object of the present invention to prevent the conductive layer from being blown up.

[0002]

2. Description of the Related Art Conventionally, in order to manufacture a fluorescent film substrate, a transfer material in which a release layer, a fluorescent film layer and an adhesive layer are sequentially formed on a base film is used as follows. (1) A transfer layer of a transfer material is transferred onto a glass substrate, then a conductor layer is formed by a vapor deposition method, and then heated to remove all organic components as pyrolysis gas.

(2) A transfer layer of a transfer material is transferred onto a glass substrate, then heated to remove all organic components as a pyrolysis gas, and then a conductor layer is formed by a vapor deposition method.

(3) The step (1) or (2) is performed while reducing the content of the organic component constituting each layer of the transfer layer of the transfer material.

[0005]

However, in (1), all organic components must be removed at once after being covered with the conductor layer. For this reason, the thermally decomposed gas of the organic component is difficult to escape smoothly, and the phenomenon of pushing up the conductor layer, so-called blistering occurs.

In (2), all the organic components are removed before being covered with the conductor layer. Therefore, the conductor layer is
It is formed on innumerable large phosphor particles. However, the film of the conductor layer is difficult to be formed at the boundary between the phosphor particles and the deeply recessed part. Therefore, cracks or holes are formed in places in the conductor layer, which deteriorates conductivity and brightness.

In (3), although the amount of pyrolysis gas generated is reduced,
Due to the shortage of organic components, the peelability of the peeling layer and the adhesiveness of the adhesive layer are significantly reduced, and the transfer layer cannot be satisfactorily transferred onto the glass substrate.

[0008]

The method for manufacturing a fluorescent film substrate of the present invention is configured as follows in order to solve the above problems. That is, a transfer material in which a transfer layer including a release layer, a fluorescent film layer, and an adhesive layer is formed on a base material film is laminated and heated and pressed so that the transfer layer side is in contact with the surface of the glass substrate. To form a transfer layer on the glass substrate, and then heating the glass substrate to thermally decompose and remove a part of the organic component of the transfer layer so that at least a part of the release layer remains, and a conductor is formed on the transfer layer. A layer was formed, and then the glass substrate was heated to remove all the organic components of the transfer layer as pyrolysis gas.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. 1 to 6 are cross-sectional views showing a step of an embodiment of the method for manufacturing a phosphor film substrate of the present invention. First, using the transfer material 1 (see FIG. 2) in which the peeling layer 4, the fluorescent film layer 5, and the adhesive layer 6 are sequentially formed on the base film 3, the peeling layer 4, the fluorescent film layer 5, and the adhesive layer 6 are used. Is formed on the surface of the glass substrate 2 (see FIG. 3).

That is, the transfer material 1 is laminated so that the adhesive layer 6 side is in contact with the glass substrate 2 made of soda-lime glass or the like. Next, the surface of the glass substrate 2 is heated and pressed with a silicon pad or the like to bond the adhesive layer 6 to the surface of the glass substrate 2. The heating temperature is 130-230 ℃, the pressure is
It is about 3 to 200 kg and should be adjusted appropriately. Finally, the base film 3 is peeled off, and the peeling layer 4, the fluorescent film layer 5, and the adhesive layer 6 are peeled off.
Are formed on the surface of the glass substrate 2.

The base film 3 may be the one used as the base film 3 of the ordinary transfer material 1 such as polyester. The base film 3 may be one having irregularities formed on one side by hairline processing, sandblast processing, press processing, or the like.

The peeling layer 4 is a layer formed by a usual forming means such as a gravure printing method or a screen printing method using an inked resin made of a thermoplastic resin or natural rubber or synthetic rubber. The resin constituting the release layer 4 has a thermal decomposition temperature of about 225 to 300 ° C.

The phosphor film layer 5 is made of phosphor ink composed of phosphor, resin and solvent. As the phosphor, ZnO: Zn, ZnS: Cl + In ₂ O ₃ , ZnS: Cu, Al, Z
nS: Ag, Al, Y ₂ O ₃ S: Eu, Y ₂ O ₂ S: Tb and other sulfide-based or oxide-based phosphor powders are used, and a fluorescent film layer 5 such as a gravure printing method or a screen printing method is used. It is formed by the usual forming means of. The resin constituting the fluorescent film layer 5 has a thermal decomposition temperature of about
It is recommended to use one having a temperature of 250 to 300 ° C.

The adhesive layer 6 is a layer formed of a thermosensitive pressure sensitive resin such as polyamide or acrylic and formed by a usual forming means such as a gravure printing method or a screen printing method. The resin constituting the adhesive layer 6 preferably has a thermal decomposition temperature of about 150 to 390 ° C.

Next, the peeling layer 4, the fluorescent film layer 5, and the adhesive layer 6
The glass substrate 2 on which is formed is heated to remove a part of the organic component of the transfer layer as a pyrolysis gas so that at least a part of the peeling layer 4 remains (see FIG. 4).

The heating temperature at this time is suitably 200 to 230 ° C., and the heating time is suitably 2 to 4 hours. At least in accordance with the properties of the organic components constituting the peeling layer 4, the peeling layer 4 can be heated. The heating temperature and the heating time may be appropriately set so that all the organic components are not thermally decomposed and removed.

Next, the conductor layer 7 is formed on the peeling layer 4 from which the organic components have been partially removed (see FIG. 5). Conductor layer 7
Examples of the forming method include a vacuum deposition method, a sputtering method, an ion plating method, and the like, and the material of the conductor layer 7 includes aluminum and the like.

Next, the glass substrate 2 is heated to remove all organic components other than the phosphor as a pyrolysis gas (see FIG. 6).
reference).

The organic components other than the phosphor are the resin binder and solvent of the peeling layer 4 and the adhesive layer 6 and the phosphor film layer 5 which are sandwiched between the conductor layer 7 and the glass substrate 2. The pyrolysis gas passes through the gap between the conductor layer 7 and the glass substrate 2, reaches the end portion, and is removed to the outside.
The fluorescent film layer 5 and the conductor layer 7 are stacked on the glass substrate 2.

Example First, a release layer 4 having a thermal decomposition temperature of 225 ° C. and a thermal decomposition temperature of 300 are formed on a base film 3 made of polyethylene terephthalate.
Fluorescent film layer 5 using resin binder at ℃, thermal decomposition temperature 15
The adhesive layer 6 of the transfer material 1 on which the adhesive layer 6 of 0 to 390 ° C. is sequentially formed and the glass substrate 2 are overlapped. Next, the base film 3 is peeled off by applying heat and pressure using a silicon pad. Next, the glass substrate 2 is heated at a heating temperature of 200 to 300 ° C. for 3 hours to remove some organic components. Next, the conductor layer 7 is formed on the release layer 4 by a vapor deposition method to have a film thickness of 2000 liters. Next, the glass substrate 2 is heated at 450 to 500 ° C. for 30 minutes to remove all organic components other than the phosphor as a pyrolysis gas.

[0021]

According to the manufacturing method of the present invention, the pyrolysis gas is generated from the transfer layer to remove the organic component before and after the formation of the conductor layer.

Therefore, the amount of pyrolysis gas generated after being covered with the conductor layer is reduced. Therefore, the pyrolysis gas easily escapes, and no blisters, cracks, or pinholes occur in the conductor layer.

Further, since vapor deposition can be performed on the surface of the peeling layer, not on the phosphor particles having innumerable large diameters,
No cracks occur. Therefore, a conductor layer having good conductivity and brightness can be obtained.

Further, since it is not necessary to reduce the content of the organic component constituting each layer of the transfer layer of the transfer material, the releasability of the release layer and the adhesiveness of the adhesive layer are good, and the transfer layer is formed on the glass substrate. Good transfer is possible.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing one step of an embodiment of a method for manufacturing a phosphor film substrate of the present invention.

FIG. 2 is a sectional view showing a transfer material used in the present invention.

FIG. 3 is a sectional view showing a step of the embodiment of the present invention.

FIG. 4 is a sectional view showing a step of the embodiment of the present invention.

FIG. 5 is a sectional view showing a step of the embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a fluorescent film substrate formed by the manufacturing method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transfer material 2 Glass substrate 3 Base film 4 Release layer 5 Fluorescent film layer 6 Adhesive layer 7 Conductor layer

Claims (1)

[Claims] 1. A release layer, a fluorescent film layer, and
The transfer material on which the transfer layer consisting of the adhesive layer is formed is superposed on the surface of the glass substrate so that the transfer layer side is in contact with it, and heated and pressed, and then the substrate film is peeled off to form the transfer layer on the glass substrate. The glass substrate is heated to remove the organic components of the transfer layer by thermal decomposition so that at least a part of the release layer remains, and a conductor layer is formed on the organic layer, and then the glass substrate is heated to transfer. A method for manufacturing a fluorescent film substrate, characterized in that all of the organic components of the layer are removed as pyrolysis gas.