JP3330637B2 - Method for manufacturing fluorescent film substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a fluorescent film substrate having a conductive layer used for a fluorescent display tube, a cathode ray tube, and the like. It was made.

[0002]

2. Description of the Related Art In a conventional method of manufacturing a fluorescent film substrate, first, a fluorescent film is partially formed on a glass substrate by screen printing. Next, a filming liquid layer is coated in order to eliminate unevenness on the surface of the fluorescent film and obtain a smooth surface. Next, a conductor layer is formed by an evaporation method so as to cover the fluorescent film. Finally, heating is performed, and the organic components other than the phosphor in the fluorescent film and the organic components of the filming liquid layer are converted into a pyrolysis gas. A laminated film of a body and a conductor layer is formed on a glass substrate.

[0003] An end of the conductor layer is connected to an external lead wire. For this reason, the conductor layer is formed so as to cover the entire fluorescent film portion and have an area as large as near the end of the glass substrate.

[0004]

SUMMARY OF THE INVENTION In the conventional manufacturing method,
Since the area of the conductor layer is large, it is difficult to pass through a pyrolysis gas of an organic component generated by heating. For this reason,
A phenomenon in which the residual pyrolysis gas partially pushes up the conductor layer, so-called blistering, occurs, and peeling occurs between the phosphor and the glass substrate or between the phosphor and the conductor layer.

[0005] Further, cracks and pinholes occur in the conductor layer formed directly on the fluorescent film, so that light emitted from the fluorescent film is not sufficiently reflected. For this reason, the brightness of the fluorescent film is reduced.

[0006]

Means for Solving the Problems A method of manufacturing a fluorescent film substrate according to the present invention is configured as follows in order to solve the above problems. That is, a release layer is formed on a base film, a water-soluble resin layer is partially formed thereon by a printing method, a conductor layer is formed on the entire surface, and then a water-soluble resin is formed by washing with water. At the same time, the conductor layer on top is removed to form a gas escape hole in the conductor layer, an adhesive layer is formed thereon to obtain a transfer material, and then the glass on which the fluorescent film is partially formed. The transfer material is overlapped on the substrate so that the gas escape hole of the conductor layer and the fluorescent film do not overlap, and the substrate film is peeled off after heating and pressurizing, and then the glass substrate is heated to thereby release the phosphor. Other organic components were removed as thermally decomposed gas.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1, 7, and 8 are front views showing a phosphor film substrate manufactured by the present invention. 2 to 6
FIG. 2 is a sectional view showing one step of the embodiment of the present invention.

First, a gas escape hole 4 is formed on a glass substrate 8.
The transfer material 1 for forming the conductor layer 4 having 0 is obtained (see FIGS. 2 to 4).

First, a method of forming the gas escape hole 40 using a water-soluble resin will be described (see FIGS. 2 and 4).

First, a release layer 3 is formed on a base film 2. The base film 2 may be one used as the base film 2 of the ordinary transfer material 1 such as polyester or polypropylene.

The release layer 3 is formed by an ordinary method such as a gravure printing method or a screen printing method using an ink composed of a thermoplastic resin, natural rubber, synthetic rubber, or the like.

Next, a gas escape hole 40 is formed on the release layer 3.
Is formed partially on the conductor layer 4 by a printing method (see FIG. 2A). The printed portion of the water-soluble resin corresponds to a portion where the gas escape hole 40 of the conductor layer 4 on the release layer 3 is to be provided.

In the present invention, the conductive layer 4 is formed by the transfer material 1 on the glass substrate 8 on which the fluorescent film 9 is formed, and the gas escape hole 40 of the conductive layer 4 is formed with the fluorescent film 9. It is intended to be formed only on a portion that is not provided (see FIGS. 1, 7, and 8). Therefore, the water-soluble resin layer 6 is formed on the release layer 3 so that the gas escape hole 40 is not arranged on the fluorescent film 9 when the transfer material 1 is superimposed on the glass substrate 8 on which the fluorescent film 9 is formed. Form on top.
For example, it may be appropriately designed according to the design of the pattern of the fluorescent film 9 formed on the glass substrate 8 such that the fluorescent film 9 is arranged so as to surround the fluorescent film 9 when superposed on the glass substrate 8. The pattern of the water-soluble resin layer has an arbitrary shape such as a circle or an ellipse (see FIG. 7).

The printing method for forming the water-soluble resin layer 6 includes a gravure printing method and a screen printing method. Since the water-soluble resin layer 6 is formed by a printing method,
A pattern having a width of μm or more is obtained. The water-soluble resin layer 6 is preferably made of sodium acrylate, polyvinyl alcohol, polyvinyl pyrrolidone, hydroxypropyl cellulose, or the like.

Next, a conductor layer 4 is formed on the entire surface (see FIG. 2B). The method for forming the conductor layer 4 includes:
There are a vacuum deposition method, a sputtering method, an ion plating method and the like, and a material of the conductor layer 4 is aluminum or the like.

Next, the water-soluble resin and the conductor layer 4 thereon are removed by washing with water to form gas escape holes 40 in the conductor layer 4 (see FIG. 2C). By washing with water, the water-soluble resin layer 6 below the conductor layer 4 is melted, and the conductor layer 4 formed on the water-soluble resin layer 6 is removed together. Gas escape holes 40 having the same pattern as the pattern of the water-soluble resin layer 6 are formed in the conductor layer 4.

Finally, the transfer material 1 is obtained by forming the adhesive layer 5 on the conductor layer 4 in which the gas escape holes 40 are formed. The adhesive layer 5 is formed by a usual forming method such as a gravure printing method or a screen printing method using an ink composed of a vinyl resin, an acrylic resin, a polyolefin resin, a styrene resin, or the like. The transfer material 1 used in the present invention is obtained as described above (see FIG. 3).

Using the transfer material 1 obtained as described above,
The conductor layer 4 is formed on the glass substrate 8 on which the fluorescent film 9 is partially formed (see FIGS. 4 and 5).

That is, first, the adhesive layer 5 of the transfer material 1
The side is overlaid on the glass substrate 8 on which the fluorescent film 9 is formed. At this time, the gas escape hole 40 of the conductor layer 4 and the fluorescent film 9 are prevented from overlapping (see FIG. 4).

The gas escape holes 40 are arranged at several places so as to surround the fluorescent film 9. The shorter the distance between the gas escape hole 40 and the fluorescent film 9 is, the better.

The glass substrate 8 is made of a heat-resistant transparent material such as glass. Examples of the shape of the glass substrate 8 include a flat plate shape and a dish shape with an end rising.

The fluorescent film 9 is composed of a phosphor, a resin binder and a solvent. As a phosphor,
ZnO: Zn, ZnS: Cl + In ₂ O ₃ , ZnS: Cu, Al, ZnS: Ag, A
_{l, Y 2 O 3 S:} Eu, Y 2 O 3 S: may be used a powder of the sulfide or oxide-based fluorescent material of Tb or the like. As the resin binder, there are acrylic and ethylcellulose binders.

The method of forming the fluorescent film 9 on the surface of the glass substrate 8 includes a printing method such as screen printing, gravure printing, coater blade printing, a slurry method and a coating method. Alternatively, a method in which the transfer material having the fluorescent film 9 is pressed against the surface of the glass substrate 8 with a silicon pad and heated to transfer and form the fluorescent film 9 of the transfer material 1 on the surface of the glass substrate 8 may be used.

Next, a silicon roll heated to 130 to 230 ° C. is pressed from the base film 2 side of the transfer material 1. The pressing pressure is 3 to 200 kg / cm ² . This heat causes the adhesive layer 5 to melt and adhere to the glass substrate 8.

Next, the base film 2 is peeled off, and the adhesive layer 5, the conductor layer 4, and the peeling layer 3 are laminated on the glass substrate 8 (see FIG. 4).

Next, by heating the glass substrate 8, organic components other than the phosphor are removed as pyrolysis gas (see FIG. 5). FIG. 5 is a view showing a state in which the peeling layer 3 is removed and then the adhesive layer 5 is about to be removed.
Heating is preferably performed at a temperature of 200 to 500 ° C. for about 30 minutes.

As described above, the fluorescent film substrate 11 in which the fluorescent film 9 and the conductor layer 4 are laminated on the glass substrate 8 is obtained.

The conductor layer 4 is incorporated in a cathode ray tube such as a cathode ray tube, functions as an electrode for catching electron beams and thermoelectrons, prevents light emission of the phosphor from leaking backward, and efficiently emits fluorescence to the front. It functions as a reflective surface to make it come out. The end of the conductor layer 4 is connected to the external lead wire 1.
It also has a function of removing electrons that are connected to 0 and accumulated in the conductor layer 4 to the outside.

First, a release layer 3 made of a thermoplastic resin is formed on a base film 2 made of polyethylene terephthalate, and a water-soluble resin layer 6 made of polyvinyl alcohol is partially formed thereon by gravure printing. (See FIG. 2 (a)), and a conductive layer 4 made of aluminum is formed on the entire surface by vacuum evaporation (see FIG. 2 (b)). The body layer 4 is removed to form a gas escape hole 40 in the conductor layer 4 (see FIG. 2C), and an adhesive layer 5 made of an acrylic resin is formed thereon by gravure printing to form the transfer material 1. (Figure 3
reference). Next, the transfer material 1 is stacked on the glass substrate 8 on which the fluorescent film 9 is partially formed, on the portion where the fluorescent film 9 is not formed, so that the gas escape hole 40 of the conductor layer 4 is arranged. After being combined and heated and pressurized, the substrate film 2 was peeled off (see FIG. 4), and then the glass substrate 8 was heated to remove organic components other than the phosphor as pyrolysis gas (see FIG. 5).

An external lead wire 10 was attached to the conductor layer 4 formed near the end of the fluorescent film substrate 11 to remove electricity (see FIG. 6).

[0031]

According to the manufacturing method of the present invention, a gas escape hole is formed by a printing method in a conductor layer formed in a portion where no fluorescent film is formed.

Accordingly, the pyrolysis gas of the organic component generated by the heating is smoothly removed from the pores, causing blisters to occur in the conductor layer, or between the phosphor and the glass substrate or between the phosphor and the conductor layer. No peeling occurs between them.

Further, since there is no gas escape hole on the fluorescent film, the brightness of the fluorescent film is good.

[Brief description of the drawings]

FIG. 1 is a top view showing an example of a fluorescent film substrate manufactured according to the present invention.

FIG. 2 is a sectional view showing one step of the embodiment of the present invention.

FIG. 3 is a sectional view showing one step of the embodiment of the present invention.

FIG. 4 is a sectional view showing one step of the embodiment of the present invention.

FIG. 5 is a sectional view showing one step of the embodiment of the present invention.

FIG. 6 is a sectional view showing an example of a fluorescent film substrate manufactured according to the present invention.

FIG. 7 is a front view showing an example of a fluorescent film substrate manufactured according to the present invention.

FIG. 8 is a front view showing an example of a fluorescent film substrate manufactured according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 transfer material 2 base film 3 release layer 4 conductor layer 40 gas escape hole 5 adhesive layer 6 water-soluble resin layer 7 resist resin layer 8 glass substrate 9 fluorescent film 10 external lead wire 11 fluorescent film substrate

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01J 9/22

Claims (1)

(57) [Claims] 1. A release layer is formed on a base film, a water-soluble resin layer is partially formed thereon by a printing method, and a conductor layer is formed on the entire surface thereof. The conductor layer on top of the water-soluble resin is removed to form a gas escape hole in the conductor layer, an adhesive layer is formed on the hole, and a transfer material is obtained. Then, a fluorescent film is partially formed. The transfer material is superimposed on the glass substrate so that the gas escape hole of the conductor layer does not overlap with the fluorescent film, the base film is peeled off after heating and pressing, and then the glass substrate is heated. And removing an organic component other than the phosphor as a thermally decomposed gas.