JPH05315838A - Crystal oscillator - Google Patents

Abstract

PURPOSE:To provide a thin profile and to improve the impact resistance by arranging a conductor pattern to a crystal oscillator having a node in a two- dimension plane and mounting an IC having a bump to the node of the crystal oscillator. CONSTITUTION:Two drive electrodes 5 to excite vibration are provided to almost the entire face symmetrical to a center line of a vibrator 1 of a vibration section 2 and a conductor pattern 6 in electric continuity with each drive electrode 5 is provided near the center of the vibration section 2. An IC chip 10 is provided to cover the conductor pattern 6 and a solder bump 11 is provided to one side of the chip 10 and soldered to a position corresponding to the conuctor pattern 6. The solder bump 11 consists of in total five bumps for power supply, ground, output and two drive electrodes to play a roll of connection of the oscillation circuit, the crystal vibrator mounted on the chip 10 and an external device. The crystal oscillator is formed by covering a glass cap 12 by the arrangement as above. As a result, thin profile is facilitated and impact resistance performance is improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal oscillator used in information devices such as wristwatches, microcomputers, cordless telephones and automobile radios.

[0002]

2. Description of the Related Art Conventionally, after mounting an IC on a circuit board on which a conductive pattern is arranged, wire bonding is performed for conduction with the board, and a crystal oscillator is held by a spring having conductivity and a holding function. In addition, a structure has been known which is electrically connected to the circuit board.

[0003]

In a structure in which an IC is mounted on a circuit board, and then wire bonding is performed and a crystal resonator is provided on the IC, there is a bonding loop portion, a circuit board, etc. when thinning. Constraints occur. Further, by using the holding portion such as a spring material, the oscillation frequency is shifted and the oscillation is stopped against the impact. In such a case, changing the shape and structure of the holding portion requires a large cost.

Therefore, an object of the present invention is to facilitate thinning and to improve impact resistance.

[0005]

In order to solve the above-mentioned problems, the present invention is directed to a crystal unit having a node in a two-dimensional plane (for example, CT, GT cut oscillator, vertical oscillator, A conductive pattern is arranged on a bending oscillator or the like), and an IC having a bump is mounted on the node of the crystal oscillator.

[0006]

The crystal oscillator of the present invention can be made thinner because the circuit board can be eliminated by eliminating the wire portion and having the conductive pattern on the upper surface of the crystal oscillator. Moreover, since the cage is not used, impact resistance can be improved.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings. FIG. 1 is a plan view showing an embodiment of the present invention.
Is a sectional view. As shown in the figure, the CT-cut crystal unit 1 includes a vibrating section 2, a buffer section 3 for absorbing and absorbing vibration leakage, and a supporting section 4 for supporting these. further,
In the vibrating portion 2, drive electrodes 5 for exciting the vibration are provided in two places on the substantially entire surface symmetrically with respect to the center line of the vibrator 1, and are electrically connected to the respective drive electrodes 5 near the center of the vibrating portion 2. A conductive pattern 6 is provided. The support portion 4 is fixed to the pedestal of the ceramic case 8 with the conductive adhesive 7,
Moreover, it is electrically connected to the lead terminal 9 of the ceramic case. In addition to this, near the center of the vibrating part 2 for power supply,
A conductive pattern 6 for ground and output is provided, and is electrically connected to the lead terminal 9 through the vibrating section 2, the impact section 3, and the supporting section 4.

An IC chip 10 is provided so as to cover the conductive pattern 6 provided near the center of the vibrating section 2,
Solder bumps 11 are provided on one surface of the chip 10 and soldered at positions corresponding to the conductive patterns 6. The solder bump 11 is composed of a total of five bumps for power, ground, output, and two drive electrodes.
It plays the role of connecting the oscillation circuit mounted on the C chip 10, the crystal unit, and the outside. After arranging in this manner, the glass cap 12 is covered to form a crystal oscillator.

In the vibrator of this embodiment, since the vibration node is at the center of the vibrating portion 2, the IC chip 10 is provided at the central portion where the vibration is least affected. Next, another embodiment will be described with reference to the plan view of FIG. 3 and the sectional view of FIG. The IC chip 10 is provided at the node of the tuning fork type crystal unit 1 that flexurally vibrates.
Similar to the above-described embodiment, the five solder bumps 11 are ICs.
The oscillator circuit mounted on the chip 10 plays a role of connecting the crystal oscillator and the outside, and the oscillator can be configured only by connecting the three lead terminals 9 of the power supply, the ground, and the output to the outside.

[0010]

As described above, according to the present invention, not only thinning is facilitated, but also impact resistance is improved. Further, since the number of parts can be reduced, the cost can be significantly reduced, and the number of steps can be reduced, so that the number of steps can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a sectional view of an embodiment of the present invention.

FIG. 3 is a plan view of another embodiment of the present invention.

FIG. 4 is a sectional view of another embodiment of the present invention.

[Explanation of symbols]

 1 Crystal oscillator 2 Vibrating part 6 Conductive pattern 7 Conductive adhesive 8 Ceramic case 11 Bump

Claims (1)

[Claims] 1. A crystal oscillator and I for driving the crystal oscillator.
A crystal oscillator comprising a C chip, characterized in that a conductive pattern is provided on a node in the plane of the crystal resonator, and an IC chip having bumps on the conductive pattern is mounted.