JPH05311498A - Device for supplying plating solution to plating cell in electroplating line - Google Patents

Abstract

PURPOSE:To save equipment cost by reducing the number of pumps in a device for supplying plating solution to plating cell. CONSTITUTION:In the device for supplying plating solution in electroplating line to supply a plating solution to a plurality of the plating cells 3 from a plating solution recycle tank 1, branched pipes 6 to supply the plating solution to each of the plating cells 3 communicate with a collecting pipe 5, the collecting pipe 5 communicates with the plating solution recycle tank 1, a large capacity pump 4 is provided in the collecting pipe 5 and each of the branched pipes 6 is provided respectively with a flow meter 7 and a valve 8 for adjusting flow rate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating liquid supply device for a plating cell in an electroplating line on a continuous strip.

[0002]

2. Description of the Related Art In an electroplating line for continuous striping, it is common to install several stages of plating cells as disclosed in Japanese Patent Laid-Open No. 1-215997 to improve the line speed. Is. In order to stably secure the amount of plating liquid, this plating liquid supply is independent by installing one plating liquid feeding pump for each plating cell.
With this method, even if the distance between the plating cell electrodes changes,
Although the amount of plating liquid is secured, a dedicated pump and its motor for only several stages of plating cells are required, and installation space for it and maintenance of each pump / motor are required.

[0003]

It is necessary to suspend the line for a long period of time when updating the plating liquid supply equipment in the existing operating line, and one pump installation device per plating cell of the prior art, It is difficult to install the device adjacent to the existing device because the same installation space as the existing device is required.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in order to advantageously solve the above-mentioned problems of the prior art.
In a plating solution supply device in an electroplating line that supplies plating solution from a plating solution circulation tank to a plurality of plating cells, a branch pipe that supplies the plating solution to each plating cell is connected to a collecting pipe, and the collecting pipe and the plating solution are circulated. A plating solution supply device in an electroplating line, characterized in that tanks are connected to each other, a large-capacity pump is provided in a collecting pipe, and a flow meter and a flow rate adjusting valve are provided in each branch pipe. Is.

[0005]

[Function] Adjusting the supply amount of the plating liquid by supplying the plating liquid through the branch pipes for a plurality of plating cells to the plating cell by adjusting the supply amount of the plating liquid to the plating cell. The installation space can be reduced by ensuring the flow rate and reducing the number of pumps and motors.

[0006]

EXAMPLE FIG. 1 shows an example of a plating solution supply apparatus according to the present invention, in which the plating solution circulating tank 1 is supplied to a collecting pipe 5 by a large-capacity pump 4 and plated by each pipe branch 6. The liquid was divided, and the flow rate to each plating cell 3 was secured by the valve 8 and the flow meter 7.

FIG. 2 shows a conventional plating liquid supply apparatus, which includes a plating liquid circulation tank 1 for accumulating the plating liquid and supplying it to a pump.
It is composed of a pump 2 for feeding a plating solution to a plating cell, a plating cell 3 for plating a steel plate, and pipes thereof.

[0008]

As described above, according to the present invention, since the number of pumps and motors is reduced by increasing the capacity of pumps, the installation space can be reduced and the number of maintenance targets can be reduced. Further, by installing a valve and a flow meter in the branch pipe, it is possible to secure the flow rate to each plating cell.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a plating liquid supply device according to the present invention.

FIG. 2 is a configuration diagram of an existing plating liquid supply device.

[Explanation of symbols]

 1 plating solution circulation tank 3 electroplating cell 4 large capacity pump 5 collecting pipe 6 branch pipe 7 flow meter 8 valve

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akira Tsuki 1 Kimitsu, Kimitsu, Chiba Shin Nippon Steel Co., Ltd. Kimitsu Steel Co., Ltd.

Claims (1)

[Claims] 1. In a plating solution supply device in an electroplating line for supplying a plating solution from a plating solution circulation tank to a plurality of plating cells, a branch pipe for supplying the plating solution to each plating cell is communicated with a collecting pipe, A plating solution supply device in an electroplating line, characterized in that a pipe and a plating solution circulation tank are connected to each other, a large-capacity pump is provided in the collecting pipe, and a flow meter and a flow rate adjusting valve are provided in each branch pipe. .