JPH05310217A - Binding device in paper sheaf collecting binder - Google Patents

Abstract

PURPOSE:To reduce the slack of tape in order to prevent the collapse of paper sheaves by a method wherein, at the time of winding a small paper sheaf group horizontally with a plurality of turns of the tape, the tape winding operation is stopped at each turn to reversely rotate a tape feeding mechanism in order to temporarily wind the tape back thereon in a specified amount. CONSTITUTION:A tape pick and transfer mechanism 40 is operatively associated with a tape feed mechanism 50 to feed tape T and then a tape holder 30 caught therewith to hold the end of the tape T and moves around a group of small paper sheaves in a plane tetragonal manner. The moving amount of the tape holder 30 of the tape pick and transfer mechanism 40 and the amount of tape T fed by the tape feed mechanism 50 are equivalent to one round made by the tape holder 30 of the paper sheaf group. Upon completion of winding with one turn of the tape, the tape pick and transfer mechanism 40 and the tape feed mechanism 50 are stopped and then the tape feed mechanism 50 is temporarily rotated reversely to wind the tape back thereon in a specified amount. The amount of the tape to be wound back is determined based on the detected thickness of the small paper sheaf group. For example, in the case of a sheaf of newly-issued notes small in thickness, a large amount of the tape is wound back.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a large bundle binding machine for forming a large bundle by binding a predetermined number of small bundles previously bundled into small bundles into a cross with a wide tape. In particular, the present invention relates to a band-sealing device that winds and binds a tape around a small number of small bundles.

[0002]

2. Description of the Related Art Heretofore, various types of large bundle binding machines of this type have been known, but a mechanism for double-tapping a tape around a small bundle group is disclosed in, for example, JP-A-60-158020 and JP-A-2-. As disclosed in Japanese Patent No. 180114, the small bundle group loaded on a horizontally rotatable mounting plate is horizontally rotated while holding the tip of the tape, so that the tape is doubly wound around the small bundle group. It was something that was

[0003]

However, when winding the tape around the small bundle group, it is necessary to hold the small bundle group in an aligned state, and when binding the tape wound around the small bundle group. Considering that it is necessary to tighten the small bundle group when rewinding the wound tape, the mechanism for holding the small bundle group and the tightening mechanism are supported so as to be horizontally rotatable together with the placing plate, or , It is necessary to have a mechanism that does not affect the mechanism for holding the small bundle group and the mechanism for tightening even if the mounting plate is horizontally rotated, and in any case, as described in the above publication, These mechanical parts tended to be complicated and large in size.

Therefore, the present applicant holds the tape bundle around the small bundle group around the small bundle group by holding the small bundle group without rotating when winding the tape around the small bundle group and holding the tip of the tape. It has a compact band-wrapping mechanism that feeds and winds a tape that is approximately equal to the amount of movement of the tape pinch, rewinds the tape while compressing a small bundle group and tightens it, and then bonds and cuts to bind the tape. Developed a large bundle binding machine.

By the way, in a large bundle binding machine, for example, a case where a small bundle of only new tickets, which has a relatively thin total thickness of a predetermined number of bundles, is bundled, and a total thickness of a predetermined number of bundles is the same. Since it is required to surely bind the small bundles of only the circulation tickets, which are relatively thick, in the banding mechanism developed earlier, the tape picking It was configured such that the tape can be reliably moved around the small bundle group of the circulation tickets, which becomes thicker, and the tape can be wound around the small bundle group.

As described above, since the tape pick-up is configured to move in a relatively wide range, when binding a small bundle of only new tickets, the total thickness of which a predetermined number of bundles are stacked is relatively thin. In addition, the distance between the small bundle of new tickets and the tape guided by the tape gripping becomes wider, making it easier for the tape to fall down.When rewinding and tightening the tape while compressing the small bundle, In the case of, the tape wound around two turns is bound in a state of being displaced between the first turn and the second turn, and when the shift is large, the wound tape is removed from the small bundle group, or Due to this misalignment, the tape was torn and the tape was easily broken.

The present invention has been made in view of the above problems, and when winding a tape around a small bundle group, the tape can be double wound around the small bundle group without rotating the small bundle group. At the same time, it is an object of the present invention to provide a band-sealing device that reduces the slack between the small bundle group and the tape to prevent the tape from collapsing, and is not bound when the tape is misaligned.

[0008]

In order to solve the above problems, in the first aspect of the present invention, a small bundle group is held in a substantially rectangular parallelepiped shape with a predetermined number of bundles stacked with the thickness direction thereof horizontal. At the same time, a small bundle group holding mechanism capable of holding the held small bundle group in a more compressible manner in the thickness direction thereof, and a tape gripper capable of holding the tape tip end,
A tape picking movement mechanism that horizontally moves the tape picking along a substantially rectangular shape that is larger than the outer circumference of the small bundle group held in a substantially rectangular parallelepiped shape by the small bundle group holding mechanism, and the tape picking When the tape gripping state is released, the tape tip is supplied to the opened tape grip, and after the tape tip is gripped by the tape grip, the tape is moved by the horizontal movement of the tape grip. When winding the bundle around the horizontal direction of the bundle group, while supplying the tape in conjunction with the movement of the tape picking, while winding the tape around the small bundle group, the small bundle group holding mechanism to the thickness of the small bundle group Tape feeding mechanism that rewinds the wound tape and tightens the small bundle group with tape while compressing in the direction, and cuts the tape while thermally bonding it when tightening the small bundle group with the tape. A large bundle bundling machine configured with a tape adhesive cutting mechanism, when winding the tape a plurality of times around the horizontal direction of the small bundle group, each time the tape is wrapped around the horizontal direction of the small bundle group, When the tape winding movement mechanism and the tape supply mechanism are interlocked, the tape winding operation is stopped, and when this winding operation is stopped, the tape supply mechanism is temporarily reversed to rewind the fed tape by a specified amount. It is characterized by further having control means for performing.

In the second aspect of the present invention, further, there is provided a small bundle group thickness amount detecting means for detecting the thickness amount of the small bundle group in which the predetermined bundle number is superposed, and the rewinding amount of the temporary rewinding operation of the tape by the control means. Is determined based on the thickness amount of the small bundle group detected by the small bundle group thickness amount detecting means.

[0010]

According to the first aspect of the invention, the small bundle group held by the small bundle group holding mechanism in a substantially rectangular parallelepiped shape is held in a substantially rectangular parallelepiped shape with the tape pinch holding the tape tip. Since it is moved by the tape gripping movement mechanism along a substantially rectangular shape that is larger than the outer circumference of the bundle group, the tape can be simply and double wound around the small bundle group. When the tape is wound around the small bundle group, the tape feeding mechanism feeds the tape in conjunction with the movement of the tape picking, so that the tape picking, the tape picking moving mechanism, and the tape itself are not impossible. The tape can be wound around the small bundle group in a stable state without load. Furthermore, when winding the tape around the small bundle group, the control means stops the winding operation of the tape by the interlocking of the tape picking movement mechanism and the tape supply mechanism every time the tape is wound around the small bundle group once. When the winding operation is stopped, a temporary rewinding operation is performed in which the tape supply mechanism is temporarily reversed to rewind the fed tape by a predetermined amount. When the tape winding operation is completed, the small bundle group holding mechanism compresses the small bundle group, the tape supply mechanism is reversed, and the tape is rewound to tighten the small bundle group. Is activated, the tape is adhered and cut, and the binding operation is completed. By performing this work in the longitudinal direction and the lateral direction of the small bundle group, the large bundle is completed.

According to the second aspect of the invention, the small bundle group thickness amount detecting means detects the thickness amount of the small bundle group in which the predetermined bundle number is superposed, and the control is performed based on the detected thickness amount of the small bundle group. The amount of rewinding of the temporary rewinding operation of the tape by the means is determined, and when the tape is wound around the small bundle group, the gap between the small bundle group and the tape is reduced every time the tape is wound around the small bundle group once. The tape is rewound on the tape, and the tape does not slacken more than necessary and fall down.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in the drawings. FIG. 1 is an external view showing an outline of an external appearance of a large bundle binding machine to which the present invention is applied, and is a front part (left front side) of a machine body 1.
Has a lower loading portion 2 for easily loading the small bundle group, and a rear portion (on the right rear side) of the machine body 1 has a binding portion 3 for accommodating a mechanism for binding the small bundle group. Between the loading unit 2 and the bundling unit 3, a small number of small bundles of a predetermined number (usually 10 bundles) are horizontally arranged in the longitudinal direction or the lateral direction and in the thickness direction of each small bundle. The small bundle group holding mechanism 10 loaded in the front-back direction of the machine body 1 is provided so as to be movable by the small bundle group moving mechanism 20 (see FIG. 5). Further, between the loading section 2 and the binding section 3 of the machine body 1, the opening 4 of the binding section 3 is normally closed so as to partition the loading section 2 and the binding section 3, and the small bundle group is held at the time of binding. A shutter 5 that opens the opening 4 of the binding portion 3 by the movement of the mechanism 10 is provided.

FIG. 2 is a mechanical view showing the outline of the internal mechanism of the large bundle binding machine, and the internal mechanism will be described below. The small bundle group holding mechanism 10 in which a predetermined number of small bundle groups are loaded
Is formed in a box shape having an open upper part, and its four side wall members are a moving wall 11 which is a front part of the machine body 1 and is moved by the small bundle group moving mechanism 20, and this moving wall 11
And a spring member (not shown) that is supported so as to be opposed to
The holding wall 12 urged in a direction to narrow the space between the moving wall 11 and the side wall of either one of the side walls orthogonal to the moving direction of the small bundle group holding mechanism 10 and supported integrally with the moving wall 11. Between the reference wall 13 and the reference wall 13 supported by the reference wall 13 and attached to the reference wall 13 such that the reference wall 13 can be brought into contact with and separated from the reference wall 13 by a spring member (not shown). The control wall 14 is biased in the direction of narrowing.

When the small bundle group holding mechanism 10 is located in the loading section 2, the holding wall 12 and the regulating wall 14 open between the moving wall 11 and the reference wall 13 which are opposed to each other. In addition to facilitating loading and unloading of the bundle group, when the small bundle group holding mechanism 10 is located on the binding portion 3 side, the gap between the moving wall 11 and the reference wall 13 facing each other is closed, and the small bundle group holding mechanism 10 is held between the moving wall 11 and the reference wall 13. The small bundle group is held between the wall 12 and the wall 12 in the thickness direction, and the position between the reference wall 13 and the regulation wall 14 can be regulated so that the small bundle group is aligned in the longitudinal direction.

The small bundle group holding mechanism 10 located on the side of the binding portion 3 is further moved by the small bundle group moving mechanism 20.
The structure is such that it can be driven to the rear part, and in that case, the movement of the holding wall 12 is restricted by a restriction member (not shown), while only the moving wall 11 tries to move to the rear part of the machine body 1. By doing so, the small bundle group can be further compressed in the thickness direction between the moving wall 11 and the holding wall 12. Furthermore, the bottom member 15 of the small bundle group holding mechanism 10 is formed with a recessed portion 16 whose central portion in the direction orthogonal to the moving direction thereof is lowered by one step, and stepped portions 17, 17 on both sides thereof which are raised by one step. Then, the small bundle group whose longitudinal direction is horizontal is loaded in both step portions 17 and 17, and the concave bundle 16 is loaded with the small bundle group whose vertical direction is vertical. The structure is such that it is retained.

The shutter 5 is supported by a hinge (not shown) provided on the lower side of the shutter 5 so as to be tiltable in the direction of the binding portion 3, and is normally erected by a spring member (not shown) so that the shutter 5 is bound. It is supported so as to close the opening 4 of the part 3. When the small bundle group holding mechanism 10 moves in the direction of the binding portion 3, the holding wall 12 of the small bundle group holding mechanism 10 tilts the shutter 5 against the spring member (not shown). In addition, the shutter 5
Even when the small bundle group holding mechanism 10 has moved into the binding portion 3,
Since the small bundle group holding mechanism 10 is configured to come into contact with the bottom member 15 of the small bundle group holding mechanism 10, the small bundle group holding mechanism 10 maintains a tilted state. Therefore, when the small bundle group holding mechanism 10 returns to the loading unit 2, Thus, the spring member (not shown) stands up to close the opening 4 of the binding portion 3.

Next, the binding mechanism of the binding portion 3 will be described. The bundling mechanism mainly includes a tape picker 30 that holds the tip of the tape, a tape picker moving mechanism 40 that moves the tape picker 30 along the circumference of the small bundle group, and a tape picker moving mechanism 40. It comprises a tape supply mechanism 50 for supplying a tape in cooperation with the tape or for rewinding the tape independently, and a tape adhesive cutting mechanism 60 for cutting the tape wound around the small bundle group while adhering. ..

First, the tape picking / moving mechanism 40 will be described. Above the small bundle group holding mechanism 10 having a planar square shape moved to the binding portion 3 side, and surrounding the small bundle group holding mechanism 10 further. Four horizontally rotating sprocket members 41 are arranged in two upper and lower stages in a flat square shape.
Chain members 42 are respectively wound around the upper and lower two-stage sprocket members 41.
A tape picking support member 43 is attached to the motor, and one set of sprocket members 41 at four corners is a motor (not shown).
As shown in FIG. 2, the tape picking support member 43 is configured to move counterclockwise via the chain member 42 by being rotationally driven counterclockwise.

Further, two slide shafts 44 are attached to the lower surface of the tape picking support member 43 so that their axial directions are vertical, and the tape picking 30 is provided on the lower surface of the slide shaft 44. Is supported so as to be movable in the vertical direction, and the slide member 45 is usually supported by its own weight or a spring member (not shown) at the lower end of the slide shaft 44. Therefore, in this state, the tape picking support member 43 is connected to the chain member 4
By being guided and moved by 2, the tape pinch 30, which is supported below it, moves around the small bundle group held by the small bundle group holding mechanism 10.

Next, the tape pick-up 30 will be described. The tape pick-up 30 has a plate member 31 having a vertical surface.
And two bar-shaped members 32 (see FIG. 7) that extend in the vertical direction and are supported so as to be able to come into contact with and separate from the plate member 31 and a spring member (not shown) that presses the bar-shaped member 32 against the plate member 31. ) And. As shown in FIG. 2, the initial position of the tape picking 30 and the tape picking support member 43 that supports the tape picking 30 is at the rear part and the center of the machine body 1. At this initial position, the tape picking 30 has the tip of the tape T. When the tape T is released, the holding state between the plate member 31 and the rod-shaped member 32 is released and released by the tape picking and releasing mechanism 70 (see FIG. 5). When the tip of the tape T is fed, the tape picking and releasing mechanism is supplied. After the operation of 70 (see FIG. 5) is completed, the tip of the tape T is sandwiched between the plate member 31 and the rod-shaped member 32 that have been opened.

Further, when the tape T, which will be described later, is wound, tightened, and adhesively cut to complete the binding operation, the tape pick-up 30 remaining between the bundle of small bundles and the tape T is at this initial stage. At the position, the slide member 45 is lifted up along the slide shaft 44 by the tape picking-out mechanism 80 (see FIG. 5) so that the tape is pulled out from between the bundle of small bundles and the tape T. It is configured. In addition, in the tape pick-up 30 pulled out upward, the bundled small bundle group is the small bundle group holding mechanism 10
The operation of the tape picking-out mechanism 80 (see FIG. 5) is completed when it is moved to the loading section 2 by the above, and the lower end of the slide shaft 44 is moved by the slide member 45 together with its own weight or a spring member (not shown). It is configured to descend.

On the other hand, a tape feeding mechanism 50 capable of feeding and winding the tape T at a position behind the initial position of the tape pick-up 30 and on the outer side of the plane square around which the chain member 42 is wound. Is provided. That is, the tape supply mechanism 50 is composed of a large number of tape supply rollers 51, and when the pinched state of the tape grip 30 is released, the tip of the tape T is guided to the opened tape grip 30 (see FIG. While feeding while being guided by (not shown), the tip of the tape T is pinched by the tape 3
When the tape T is wound around the horizontal direction of the small bundle group by being horizontally held in the counterclockwise direction in the drawing after being pinched by 0, the tape T is interlocked with the movement of the tape grip 30. Meanwhile, after the tape T is wound around the small bundle group, while the small bundle group is compressed in the thickness direction between the moving wall 11 and the holding wall 12 of the small bundle group holding mechanism 10. , The wound tape T is rewound and the small bundle group is tightened by the tape T. It should be noted that here, supplying the tape T in conjunction with the movement of the tape picker 30 means that the moving amount of the tape picker 30 and the supply amount of the tape T by the tape feeding mechanism 50 are substantially equal to each other. The movement of 30 does not impose an excessive load on the tape T or the tape pick-up 30.

Further, at a position behind the initial position of the tape picker 30 and on the moving direction side of the tape picker 30 with respect to the tape feeding mechanism 50, the tape T tightening the compressed small bundle group. A tape adhesive cutting mechanism 60 is provided for cutting while heat bonding. That is, in the tape adhesive cutting mechanism 60, the tape member T is doubly wound around the compressed small bundle group, and the tape clip 30 is located at the initial position, and the heater member 6 is provided.
1 moves while being pressed against the plate member 21 of the tape picker 30 to thereby move the plate member 2 of the tape picker 30.
1 is for thermally adhering the tape T positioned between the heater member 61 and the heater member 61, and the cutter member 62 (see FIG. 7) from the rear of the heater member 61 in association with the thermal adhering operation of the heater member 61. Is projected to cut the tape T stretched between the tape grip 30 and the tape supply mechanism 50.

When the tape T is thus wound, tightened, and adhesively cut to complete the binding operation, as described above, the tape pick-up remaining between the bundle of small bundles and the tape T is retained. 30 is a group of small bundles and a tape T which are bundled by a tape picking-out mechanism 80 (see FIG. 5).
And the bundled small bundle group is moved to the loading section 2 by the small bundle group holding mechanism 10, and the machine body 1
It can be taken out more.

FIG. 3 shows a state diagram (A) before the small bundle group B having a predetermined number of bundles is bundled with its longitudinal direction horizontal and a state diagram (B) after being bundled by the tape T. It is shown. Further, FIG. 4 is a state diagram (A) before being bundled with the short side direction of the bundled small bundle groups B being horizontal as shown in FIG. 3B, and a state after being bundled by the tape T. Figure (B)
As shown in FIG. 4B, the small bundle group B is bound into a cross shape by the tape T to form a large bundle. As is clear from the above description, the large bundle is created by two binding operations of the binding mechanism described above, and the bundled small bundle group B as shown in FIG. When the small bundle group holding mechanism 10 is located in the loading section 2 at the front of the machine body 1, it is reloaded manually so that the lateral direction thereof becomes horizontal.

FIG. 5 is a control block diagram showing the control mechanism of this large bundle binding machine. In this figure, a small bundle group moving mechanism 20, a tape picking moving mechanism 40, a tape feeding mechanism 5
0, tape adhesive cutting mechanism 60, tape gripping release mechanism 7
No. 0, the tape picking-out mechanism 80 has already been described, and is omitted here.

The operating means 90 loads a power switch (not shown) for turning the power on or off for the large bundle binding machine, and a small bundle group B of a predetermined bundle number for the small bundle group holding mechanism 10 of the loading section 2. However, it has a start switch (not shown) for starting the bundling operation and a stop switch (not shown) for forcibly stopping the bundling operation in an abnormal situation.

The small bundle group thickness amount detecting means 100 detects the thickness amount of a predetermined number of small bundle groups B held by the small bundle group holding mechanism 10, and the detected thickness amount is specific numerical data. Alternatively, it is possible to output as specific data, such as “thickness large”, “thickness medium”, and “thickness small” divided into three stages from concrete numerical data.

The specific means of the small bundle group thickness amount detecting means 100 may be any method, but the following method is conceivable as an example. First, as a first method, a method of directly detecting the thickness of the small bundle group B held by the small bundle group holding mechanism 10 is arranged at an appropriate position between the loading unit 2 and the binding unit 3, Small bundle group holding mechanism 1
0 is the direction orthogonal to the moving direction, that is, the direction in which the reference wall 13 and the restriction wall 14 face each other, and the small bundle group holding mechanism 1
The thickness amount is detected by a light emitting means and a light receiving means (both not shown) which are arranged so as to sandwich 0. In this case, if this optical means is a photosensor having only one optical axis, the thickness amount of the small bundle group B is detected based on the time when the small bundle group B passes through the optical axis of this photosensor. On the other hand, this optical means is
In the case of a line sensor having a large number of detection elements in the thickness direction, the amount of thickness of the small bundle group B is detected based on the number of detection elements in the light-shielded state. Even when the bundle group B has finished moving to the binding portion 3, the thickness amount thereof can be detected.

The second method is a method of indirectly detecting the thickness of the small bundle group B held by the small bundle group holding mechanism 10, which is suitable between the loading section 2 and the binding section 3. Are arranged at various positions, and the moving wall 11 and the holding wall 1 of the small bundle group holding mechanism 10 are arranged.
The positional relationship between the small bundle group B and the small bundle group B is detected based on the result.
The amount of thickness of is detected. That is, based on the time from the detection of the holding wall 12 on the moving direction side of the small bundle group holding mechanism 10 to the detection of the opposing moving wall 11,
The amount of thickness of the small bundle group B held in the meantime is detected. In this case, it is possible to adopt the optical means or a separate mechanical means. In the method of detecting the thickness amount of the small bundle group B by the moving time, the moving speed changes due to the influence of the voltage fluctuation, and the moving time changes accordingly, which may affect the detection data. However, such an influence can be avoided by a known method in advance, and in any case, such a change does not exceed the embodiment of the small bundle group thickness amount detecting means 100.

The control means 110 includes the small bundle group holding mechanism 1
0, small bundle group moving mechanism 20, tape picking moving mechanism 40, tape feeding mechanism 50, tape adhesive cutting mechanism 60, tape picking and releasing mechanism 70, tape picking and removing mechanism 80, operating means 90, small bundle group thickness amount It is electrically connected to the detection means 100 and controls the operations thereof, and is constituted by a microprocessor or the like. In the present invention, the control means 110 controls the operation according to the flowchart shown in FIG.

The operation of this banding device will now be described with reference to the external view shown in FIG. 1, the mechanism diagram shown in FIG. 2, the control block diagram shown in FIG. 5, the flow chart shown in FIG. 6, and the operation explanatory diagram shown in FIG. I will explain.

<Step 1> As shown in FIG. 3A, the small bundle group B having a predetermined number of bundles is arranged such that the thickness direction and the longitudinal direction thereof are horizontal, and the thickness direction of the machine body 1 is horizontal. After being stacked on the step portions 17 of the small bundle group holding mechanism 10 in a substantially rectangular parallelepiped shape in a state of being stacked so that the front-rear direction and the longitudinal direction are the left-right direction of the machine body 1, the operating means 9
The 0 start switch is operated. <Step 2> The small bundle group holding mechanism 10 is moved by the small bundle group moving mechanism 20 from the loading portion 2 at the front portion of the body 1 toward the binding portion 3 at the rear portion of the body 1. Along with this movement, the space between the moving wall 11 and the holding wall 12 and the space between the reference wall 13 and the regulating wall 14, which were in the open state at the time of loading the small bundle group B, are respectively caused by the action of the spring member (not shown). The narrow bundle group B is sandwiched between the moving wall 11 and the sandwiching wall 12, and the longitudinal direction of the small bundle group B is set to the reference wall 13 by the restriction wall 14.
It will be pressed against and aligned. At this time, the distance between the moving wall 11 and the sandwiching wall 12, that is, the thickness amount of the small bundle group B is determined by the condition of the paper quality of the small bundle group B held between them. In the case of a new note, it will be about 90 millimeters, while on the other hand, it can reach up to about 150 millimeters in the case of a highly circulated bill (circulation ticket).

<Step 3> The small bundle group thickness amount detecting means 100 during or after the movement of the small bundle group holding mechanism 10 from the loading portion 2 at the front portion of the fuselage 1 toward the binding portion 3 at the rear portion of the fuselage 1. Thus, the thickness amount of the small bundle group B is detected.

<Step 4> When the small bundle group B has finished moving to the binding portion 3 at the rear of the machine body 1, first, the tape gripping release mechanism 7 is started.
0 operates and the plate member 31 and the rod-shaped member 3 of the tape pick-up 30.
The holding state with 2 is released, and then the tape feeding mechanism 5
0 operates to supply the tip end of the tape T between the plate member 31 and the rod-shaped member 32 of the tape clip 30 in the open state,
When the tip of the tape T is supplied, the tape supply mechanism 50
And the operation of the tape gripping release mechanism 70 are stopped, and the tape T is held between the plate member 31 and the rod-shaped member 32 of the tape gripping 30. <Step 5> Subsequently, the tape picking movement mechanism 40 and the tape feeding mechanism 50 are operated in association with each other, and the tape picking 30 holding the tip of the tape T in conjunction with the feeding of the tape T causes the small bundle group B to move. It moves in the shape of a square in a plane around (see FIG. 7 (A)). At this time, the moving amount of the tape picking 30 by the tape picking moving mechanism 40 and the feeding amount of the tape T by the tape feeding mechanism 50 are both one round of the moving path of the tape picking 30. When the tape is moved, the operation of the tape picking mechanism 40 and the tape feeding mechanism 50 is stopped (see the tape picking 30 of FIG. 7B).

<Step 6> After this, the tape T fed around the small bundle group B for one round (see the solid line portion in FIG. 7B).
Then, the tape supply mechanism 50 is temporarily rotated in the reverse direction to rewind a predetermined amount of the tape T. In this case, the amount of rewinding of the tape T by the tape supply mechanism 50 is determined based on the thickness amount of the small bundle group B detected by the small bundle group thickness amount detecting means 100. In the case of a new ticket having a small thickness amount, the gap between the tape T and the small bundle group B becomes large, so that the rewinding amount is increased, while in the case of a circulation ticket having a large thickness amount, the tape T Since the gap between the small bundle group B becomes small, the amount of rewinding is controlled to be small. In any case, the slack between the small bundle group B and the tape T is reduced. The tape T is prevented from collapsing and is not bound when the tape T is misaligned (see the one-dot chain line in FIG. 7B).

<Step 7> Similar to Step 5,
Again, the tape gripping moving mechanism 40 and the tape feeding mechanism 50 are operated in association with each other, and the tape gripping 30 holding the tip of the tape T in conjunction with the feeding of the tape T is placed in a rectangular plane around the small bundle group B. In a circular motion, and finally, the tape T is doubly wound around the small bundle group B (FIG. 7C).
reference). <Step 8> Similar to step 6, after that, the tape T, which is wound around the small bundle group B for two turns, is temporarily rotated in the reverse direction to detect the small bundle group thickness amount. A predetermined amount of tape T is rewound based on the thickness amount of the small bundle group B detected by the means 100.

<Step 9> When the double winding of the tape T around the small bundle group B and the temporary rewinding operation of a predetermined amount are completed, the small bundle group moving mechanism 20 causes the small bundle group holding mechanism 10 to further move to the rear portion of the machine body 1. By being driven to the side, the small bundle group B
Is compressed in its thickness direction, and at the same time, the tape feeding mechanism 5
0 continues to operate in reverse, so that the small bundle group B compressed
Will be tightened by the tape T (Fig. 7).
(D)). <Step 10> In this state, the tape adhesive cutting mechanism 60 further starts the operation, and the heater member 61 moves while being pressed against the plate member 31 of the tape picker 30 located at the initial position. , Tape clip 30
The tape T located between the plate member 31 and the heater member 61 is heat-bonded, and the heater member 6 is heated by the heat-bonding operation of the heater member 61.
The cutter member 62 projects from the rear of the tape 1 (upward in FIG. 7D), so that the tape pick-up 30 and the tape supply mechanism 5
The tape T stretched between 0 and 0 is cut (see FIG. 7D).

<Step 11> Tape adhesive cutting mechanism 60
When the adhesive cutting operation of the tape T by the above is completed, the tape pick 30 is left between the bound small bundle group B and the tape T. Then, in order to remove the tape pick-up 30 from between the bundled small bundle group B and the tape T, the tape pick-up removing mechanism 80 operates. That is, when the slide member 45 is raised along the slide shaft 44, the slide member 45 is pulled out from between the bundled small bundle group B and the tape T. It should be noted that the tape pick-up mechanism 30 of the tape picking-up mechanism 80 is pulled out upward when the bundled small bundle group B is moved to the loading section 2 by the small bundle group holding mechanism 10 in the next step 12. When the operation is completed, the weight of the slide member 45 is lowered to the lower end of the slide shaft 44 by its own weight or a spring member (not shown). <Step 12> The small bundle group holding mechanism 10 is moved by the small bundle group moving mechanism 20 from the binding portion 3 on the rear portion of the machine body 1 toward the loading portion 2 on the front portion of the machine body 1 in the reverse operation of the step 2. It Along with this movement, when the small bundle group B is bound, between the moving wall 11 and the holding wall 12, which are in the holding state, the reference wall 1
The space between 3 and the regulation wall 14 is opened against the action of the spring member, and a series of binding operations is completed (<step 13>).

In this way, the small bundle group B having a predetermined bundle number is
With the thickness direction and the longitudinal direction being horizontal, the tape T is bound as shown in FIG.
As shown in FIG. 4 (A), the small bundle group B is arranged such that the thickness direction and the lateral direction thereof are horizontal, the thickness direction thereof is the front-back direction of the machine body 1, and the lateral direction thereof is the machine body 1. After being reloaded in the concave portion 16 of the small bundle group holding mechanism 10 in a state of being in the left-right direction, the start switch of the operating means 90 is operated, and thereafter, the same operation as that in steps 2 to 13 is repeated. Then, as shown in FIG. 4B, a large bundle is created.

In this embodiment, the small bundle group B is loaded in the small bundle group holding mechanism 10 at the loading section 2 at the front of the machine body 1, and the small bundle group holding mechanism 10 is moved by the small bundle group moving mechanism 20. After moving to the bundling unit 3 at the rear of the machine body 1, the bundling unit 3 is bound. However, the present invention is not limited to such a configuration, and the small bundle group can be directly loaded into the small bundle group holding mechanism of the bundling unit. It is also possible to omit the small bundle group moving mechanism. However, in the case of such a modified example, the small bundle group holding mechanism is provided with a compressing function of the small bundle group, which is performed by the cooperation of the small bundle group holding mechanism and the small bundle group moving mechanism of the present embodiment. Need to have.

[0042]

According to the present invention, the small bundle group held by the small bundle group holding mechanism in a substantially rectangular parallelepiped shape is held in a substantially rectangular parallelepiped shape with the tape pinch holding the tape tip. Since it is moved by the tape picking and moving mechanism along a substantially rectangular shape that is larger than the outer circumference of the bundle group, there is an effect that the tape can be easily and double wound around the small bundle group. When the tape is wound around the small bundle group, the tape feeding mechanism feeds the tape in conjunction with the movement of the tape picking, so that the tape picking, the tape picking moving mechanism, and the tape itself are not impossible. There is an effect that the tape can be wound around the small bundle group in a stable state without applying a load. Furthermore, when winding the tape around the small bundle group, the control means stops the winding operation of the tape by the interlocking of the tape picking movement mechanism and the tape supply mechanism every time the tape is wound around the small bundle group once. , When the winding operation is stopped, a temporary rewinding operation is performed to temporarily reverse the tape supply mechanism to rewind the fed tape by a predetermined amount, so that the tape is wound to reduce the gap between the small bundle group and the tape. There is an effect that the tape is returned and the tape is prevented from sagging more than necessary and falling down. Further, the small bundle group thickness amount detecting means detects the thickness amount of the small bundle group in which a predetermined number of bundles are stacked,
Since the rewinding amount of the temporary rewinding operation of the tape by the control means is determined based on the detected thickness of the small bundle group, the tape is rewound so as to appropriately reduce the gap between the small bundle group and the tape. The effect is that the tape will not slacken more than necessary and will not fall down.

[Brief description of drawings]

FIG. 1 is an outline view showing the outline of a large bundle binding machine to which the present invention is applied.

FIG. 2 is a mechanism diagram showing an outline of an internal mechanism of a large bundle binding machine.

3A and 3B are a state diagram (A) before a predetermined number of bundles B are bundled with their longitudinal direction horizontal and a state diagram (B) after they are bundled by a tape T.

FIG. 4 is a state diagram (A) before being bound with the short side direction of the bundled small bundle groups B being horizontal as shown in FIG. 3B, and a state diagram after being bound by a tape T ( B).

FIG. 5 is a control block diagram showing a control mechanism of the large bundle binding machine.

6 is a flowchart executed by control means 110. FIG.

FIG. 7 is operation explanatory diagrams (A) to (D) when operating according to a flowchart.

[Explanation of symbols]

 B Small bundle group T Tape 1 Body 2 Loading section 3 Binding section 4 Opening 5 Shutter 10 Small bundle group holding mechanism 11 Moving wall 12 Holding wall 13 Reference wall 14 Restriction wall 15 Bottom member 16 Recess 17 Step section 20 Small bundle group moving mechanism 30 tape picking 31 plate member 32 rod member 40 tape picking moving mechanism 41 sprocket member 42 chain member 43 tape picking support member 44 slide shaft 45 sliding member 50 tape feeding mechanism 51 tape feeding roller 60 tape adhesive cutting mechanism 61 heater member 62 cutter member 70 tape gripping release mechanism 80 tape gripping removal mechanism 90 operating means 100 small bundle group thickness amount detecting means 110 control means

Claims (2)

[Claims] 1. A small bundle group is held in a substantially rectangular parallelepiped shape in a state where a predetermined number of bundles are stacked with the thickness direction horizontal, and the held small bundle group is further compressible in the thickness direction. A small bundle group holding mechanism capable of gripping, a tape gripper capable of gripping the tape tip, and a horizontal direction outer periphery of the small bundle group held in a substantially rectangular parallelepiped shape by the small bundle group holding mechanism. A tape gripping movement mechanism for horizontally moving the tape grip along a large substantially rectangular shape, and when the tape gripping state of the tape grip is released, the tape tip is supplied to the opened tape grip. At the same time, after the tape tip is held by the tape grip,
When the tape is wound around the horizontal direction of the small bundle group by the horizontal movement of the tape sandwich, the tape is supplied in conjunction with the movement of the tape sandwich, and after the tape is wound around the small bundle group, While compressing the small bundle group in the thickness direction by the bundle group holding mechanism, the tape feeding mechanism that rewinds the wound tape and tightens the small bundle group with tape, and the tape is heat-bonded when tightening the small bundle group with tape. A large bundle bundling machine configured with a tape adhesive cutting mechanism that cuts the tape while winding it around the horizontal direction of the small bundle group several times when winding the tape around the horizontal direction of the small bundle group. Each time, the tape winding operation is stopped by the interlocking of the tape picking mechanism and the tape feeding mechanism, and when the winding operation is stopped, the tape feeding mechanism is temporarily reversed. Ri bundling apparatus in Daitaba binding machine further comprising a control means for performing tape a predetermined amount rewind one o'clock rewinding operation issued. 2. A small bundle group thickness amount detecting means for detecting a thickness amount of a small bundle group in which a predetermined number of bundles are superposed, wherein the rewinding amount of the temporary rewinding operation of the tape by the control means is the small amount. The banding device in a large bundle binding machine according to claim 1, wherein the banding device is determined based on the thickness amount of the small bundle group detected by the bundle group thickness amount detecting means.