JPH053092B2 - - Google Patents
Info
- Publication number
- JPH053092B2 JPH053092B2 JP58080485A JP8048583A JPH053092B2 JP H053092 B2 JPH053092 B2 JP H053092B2 JP 58080485 A JP58080485 A JP 58080485A JP 8048583 A JP8048583 A JP 8048583A JP H053092 B2 JPH053092 B2 JP H053092B2
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- solder material
- cylindrical part
- lead wire
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 32
- 229910000679 solder Inorganic materials 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005219 brazing Methods 0.000 description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- 229910052750 molybdenum Inorganic materials 0.000 description 5
- 239000011733 molybdenum Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 2
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910000929 Ru alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- OUFGXIPMNQFUES-UHFFFAOYSA-N molybdenum ruthenium Chemical compound [Mo].[Ru] OUFGXIPMNQFUES-UHFFFAOYSA-N 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- WLTSUBTXQJEURO-UHFFFAOYSA-N thorium tungsten Chemical compound [W].[Th] WLTSUBTXQJEURO-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J23/00—Details of transit-time tubes of the types covered by group H01J25/00
- H01J23/02—Electrodes; Magnetic control means; Screens
- H01J23/04—Cathodes
- H01J23/05—Cathodes having a cylindrical emissive surface, e.g. cathodes for magnetrons
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、直熱形マグネトロンの陰極構体の製
造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a cathode assembly for a directly heated magnetron.
従来例の構成とその問題点
電子レンジ等に用いられる直熱形マグネトロン
は、通常、第１図に示すような陰極構体を内蔵し
ている。この陰極構体は、トリウム・タングステ
ンからなる螺旋状陰極１と、陰極１の一端縁およ
び他端縁に鑞材２，３によりそれぞれ鑞着された
モリブデン製鳩目状の第１および第２のエンドハ
ツト４，５と、ステム絶縁基体６を気密に貫通し
たモリブデン製の第１および第２のステムリード
線７，８とからなり、第１のエンドハツト４は鑞
材９により第１のステムリード線７の内端縁に鑞
着され、第２のエンドハツト５は第２のステムリ
ード線８の内端縁にアーク溶接されている。Construction of conventional examples and their problems Directly heated magnetrons used in microwave ovens and the like usually have a built-in cathode structure as shown in FIG. This cathode structure includes a spiral cathode 1 made of thorium tungsten, and first and second molybdenum eyelet-shaped end hats 4 soldered to one end edge and the other end edge of the cathode 1 with solder materials 2 and 3, respectively. , 5, and first and second stem lead wires 7, 8 made of molybdenum that hermetically penetrate a stem insulating base 6. The second end hat 5 is arc welded to the inner end edge of the second stem lead wire 8.
ところで、このように構成された陰極構体で
は、モリブデン・ルテニウム合金等からなる鑞材
２，３が第１および第２のエンドハツトの内面に
不定形に盛り上つて形成されるため、前記内面に
チタン等からなるゲツタ金属の粉末を強固に溶着
することが困難になる。また、鑞材２，３の量お
よび陰極１との接触面積にばらつきを生じやす
く、これが陰極１の電気的特性にばらつきを与え
るという欠点があつた。 By the way, in the cathode structure configured in this way, the solder materials 2 and 3 made of molybdenum-ruthenium alloy or the like are formed in irregular shapes on the inner surfaces of the first and second end hats. It becomes difficult to firmly weld the getter metal powder made of such materials. Further, there is a drawback that the amount of the solder materials 2 and 3 and the contact area with the cathode 1 tend to vary, which causes variations in the electrical characteristics of the cathode 1.
発明の目的
したがつて本発明の目的とするところは、エン
ドハツトの内面の限られた領域にのみ鑞材をはみ
出すことなく支給でき、しかも鑞材の流出がな
く、かつ前記内面にゲツタ金属の粉末を強固に固
着できる陰極構体の製造方法を提供することにあ
る。OBJECTS OF THE INVENTION Therefore, it is an object of the present invention to be able to supply the solder material only to a limited area of the inner surface of the end hat without protruding, and to prevent the solder material from flowing out, and to prevent the solder material from flowing out, and to prevent the solder material from flowing out. An object of the present invention is to provide a method for manufacturing a cathode assembly that can firmly fix the cathode structure.
発明の構成
本発明のマグネトロン用陰極構体の製造方法に
よると、鳩目状エンドハツトの鍔状部の内面に、
同エンドハツトの筒状部を囲繞する凹溝を有せし
め、この凹溝内にあらかじめ納めたリング状の焼
結鑞材および前記筒状部の径小先端部に嵌め込ん
だリング状の焼結鑞材をともに加熱し、陰極の一
端縁を覆う鑞材層およびステムリード線の一部分
を覆う鑞材層を形成し、しかるのち、前記内面の
うちの前記凹溝を避けた外周縁領域にゲツタ金属
の粉末を溶着するのであり、これを以下図面に示
した実施例とともに詳しく説明する。Structure of the Invention According to the method of manufacturing a cathode assembly for a magnetron of the present invention, on the inner surface of the flange-like part of the eyelet-like end hat,
The end hat has a concave groove surrounding the cylindrical part, and a ring-shaped sintered solder material is placed in advance in this concave groove, and a ring-shaped sintered solder material is fitted into the small diameter tip of the cylindrical part. The materials are heated together to form a solder material layer covering one end edge of the cathode and a solder material layer covering a portion of the stem lead wire, and then a getter metal is applied to the outer peripheral edge area of the inner surface avoiding the groove. This will be described in detail below along with examples shown in the drawings.
実施例の説明
第２図においてモリブデンからなる第１のエン
ドハツト１０は、第１のステムリード線７の内端
縁を嵌入した筒状部１０ａと、この筒状部１０ａ
の一端から張り出した鍔状部１０ｂとを有する鳩
目状のもので、鍔状部１０ｂの内面（陰極１に向
き合う面）に、筒状部１０ａを囲繞する凹溝１１
を有している。そして、この凹溝１１内にリング
状の焼結鑞材１２が納められており、筒状部１０
ａの径小先端部にもリング状の焼結鑞材１３が嵌
め込まれている。DESCRIPTION OF THE EMBODIMENTS In FIG. 2, the first end hat 10 made of molybdenum includes a cylindrical portion 10a into which the inner edge of the first stem lead wire 7 is fitted, and a cylindrical portion 10a.
It is eyelet-shaped and has a flange-like part 10b projecting from one end, and a groove 11 surrounding the cylindrical part 10a is formed on the inner surface of the flange-like part 10b (the surface facing the cathode 1).
have. A ring-shaped sintered brazing material 12 is housed in this groove 11, and the cylindrical portion 10
A ring-shaped sintered filler material 13 is also fitted into the small diameter tip of a.
モリブデンからなる第２のエンドハツト１４
は、第２のステムリード線８の内端線にアーク溶
接されており、第１のステムリード線７を非接触
で挿通させる筒状部１４ａと、この筒状部１４ａ
の一端から張り出した鍔状部１４ｂとを有し、鍔
状部１４ｂの内面に筒状部１４ａを囲繞する凹溝
１５が形成されており、凹溝１５内にリング状の
焼結鑞材１６が納められている。焼結鑞材１２，
１３，１６は、たとえばルテニウム（Ru）粉末
とモリブデン（Mo）粉末とを重量比３対７の割
合で混合したものまたはかかる組成比のRu−Mo
合金の粉末を素材とする。かかる素材は、ニトロ
セルローズ溶液等からなる結着剤とともに成形型
内に入れられ、圧縮して1000〜1500℃の温度化で
加熱処理を受ることにより焼結体となる。 Second end hat 14 made of molybdenum
is arc welded to the inner end line of the second stem lead wire 8, and has a cylindrical portion 14a through which the first stem lead wire 7 is inserted without contact;
A concave groove 15 is formed on the inner surface of the flanges 14b to surround the cylindrical part 14a, and a ring-shaped sintered brazing material 16 is formed in the concave groove 15. is stored. Sintered brazing material 12,
13 and 16 are, for example, a mixture of ruthenium (Ru) powder and molybdenum (Mo) powder at a weight ratio of 3:7, or Ru-Mo with such a composition ratio.
Made from alloy powder. Such a material is put into a mold together with a binder such as a nitrocellulose solution, compressed, and heat-treated at a temperature of 1000 to 1500°C to form a sintered body.
第２図に示す組立状態において焼結鑞材１２，
１３，１６を高周波誘導加熱により真空中で加熱
溶融すると、第３図に１２′，１３′，１６′で示
すような鑞材層が形成される。凹溝１１，１５内
の鑞材による鑞材層１２′，１６′はそれぞれ陰極
１の端縁の表面を覆い、陰極１側へはみ出すこと
はあつても外側方へ流出してはみ出すことはな
い。また、鑞材１３′は第１のエンドハツト１０
を第１のステムリード線７に強固に固着する。 In the assembled state shown in FIG.
When 13 and 16 are heated and melted in a vacuum by high-frequency induction heating, solder layers as shown at 12', 13', and 16' in FIG. 3 are formed. The solder material layers 12' and 16' made of the solder material in the grooves 11 and 15 respectively cover the surface of the edge of the cathode 1, and although they may protrude toward the cathode 1 side, they do not flow outward and protrude. . Further, the solder material 13' is connected to the first end hat 10.
is firmly fixed to the first stem lead wire 7.
かかる鑞付け後の第１および第２のエンドハツ
ト１０，１４の各内面は、凹溝１１，１５の領域
を除いて素地のままであり、この素地のままの外
周縁領域に、チタン等からなるゲツタ金属の粉末
１７，１８を部分的に溶着させる。なお、鑞材層
の表面はきわめて平滑であるが、エンドハツトの
素地表面はミクロ的にみて多数の凹凸を有してい
るので、ゲツタ金属の粉末はエンドハツト内面の
周縁領域に粉末の状態を保つて強固に溶着する。 After such brazing, the inner surfaces of the first and second end hats 10 and 14 remain as a base material except for the regions of the grooves 11 and 15, and a material made of titanium or the like is applied to the outer peripheral area of the base material as it is. Getter metal powders 17 and 18 are partially welded. Although the surface of the solder metal layer is extremely smooth, the base surface of the end hat has many irregularities from a microscopic perspective, so the getter metal powder remains in a powder state in the peripheral area of the inner surface of the end hat. Strongly welded.
発明の効果
本発明の陰極構体の製造方法は前述のように構
成されるので、エンドハツト鍔状部の凹溝内に支
給された鑞材が溶融により陰極側へ盛り上がるこ
とはあつても外側方へ流出することはほとんどな
く、支給量に応じた量が陰極端縁の表面に層状に
付着する。エンドハツト筒状部の径小先端部に嵌
め込まれたリング状焼結鑞材も溶けてステムリー
ド線の一部分を覆うので、エンドハツトとステム
リード線とが離脱不能に鑞付けされる。リング状
の焼結鑞材は、その量および支給位置の均一化に
役立つので、その過不足による陰極の機械的およ
び電気的特性のばらつき発生はほとんどない。ま
た、ゲツタ金属の粉末は鑞付後のエンドハツトに
溶着されるので、鑞付け時に発生するガスを吸蔵
しない。とくにこの粉末状のゲツタ金属は、板状
または平滑膜状のものに比してきわめて大きい表
面積となるので、旺盛なガス吸気作用を営ませる
ことができる。Effects of the Invention Since the method for manufacturing a cathode structure of the present invention is configured as described above, even if the solder material provided in the groove of the end hat flange may swell toward the cathode side due to melting, it will not bulge outward. There is almost no outflow, and an amount corresponding to the amount supplied is deposited in a layer on the surface of the cathode edge. The ring-shaped sintered solder material fitted into the small-diameter tip of the end hat cylindrical portion also melts and covers a portion of the stem lead wire, so that the end hat and the stem lead wire are irremovably brazed. Since the ring-shaped sintered brazing material helps to equalize its amount and supply position, there is almost no variation in the mechanical and electrical properties of the cathode due to excess or deficiency. Further, since the getter metal powder is welded to the end hat after brazing, it does not absorb gas generated during brazing. In particular, this powdered getter metal has a much larger surface area than those in the form of a plate or a smooth film, so it can perform a vigorous gas intake action.
第１図は従来のマグネトロン用陰極構体の側断
面図、第２図および第３図は本発明を実施したマ
グネトロン用陰極構体の鑞付け前後における側断
面図である。
１……陰極、１０，１４……エンドハツト、１
１，１５……凹溝、１２′，１３′，１６′……鑞
材層、１８……ゲツタ金属の粉末。
FIG. 1 is a side sectional view of a conventional magnetron cathode assembly, and FIGS. 2 and 3 are side sectional views of a magnetron cathode assembly according to the present invention before and after brazing. 1... Cathode, 10, 14... End hat, 1
1, 15...concave groove, 12', 13', 16'...brazing material layer, 18...getta metal powder.
Claims (1)
するために前記一端縁に筒状部を嵌入したエンド
ハツトと、前記筒状部に内端縁を挿通したステム
リード線とを備え、前記筒状部の一端から張り出
した鍔状部がその内面に前記筒状部を囲繞する凹
溝を有し、前記凹溝内に納められたリング状の焼
結鑞材および前記筒状部の径小先端部に嵌め込ま
れたリング状の焼結鑞材をともに加熱し、前記一
端縁を覆う鑞材層および前記ステムリード線の一
部分を覆う鑞材層を形成し、しかるのち、前記内
面のうちの前記凹溝を避けた外周縁領域にゲツタ
金属の粉末を溶着することを特徴とするマグネト
ロン用陰極構体の製造方法。1 A spiral cathode, an end hat having a cylindrical part fitted into the one end edge for supporting and fixing one end edge of the cathode, and a stem lead wire having an inner end inserted through the cylindrical part, A flange-shaped part protruding from one end of the flange-shaped part has a concave groove surrounding the cylindrical part on its inner surface, and a ring-shaped sintered solder material and a small diameter of the cylindrical part are housed in the concave groove. The ring-shaped sintered solder material fitted into the tip is heated together to form a solder material layer covering the one end edge and a solder material layer covering a portion of the stem lead wire, and then the inner surface of the inner surface is heated. A method for manufacturing a cathode assembly for a magnetron, characterized in that powder of getter metal is welded to the outer peripheral region avoiding the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8048583A JPS59205132A (en) | 1983-05-09 | 1983-05-09 | Cathode structure for magnetron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8048583A JPS59205132A (en) | 1983-05-09 | 1983-05-09 | Cathode structure for magnetron |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59205132A JPS59205132A (en) | 1984-11-20 |
| JPH053092B2 true JPH053092B2 (en) | 1993-01-14 |
Family
ID=13719585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8048583A Granted JPS59205132A (en) | 1983-05-09 | 1983-05-09 | Cathode structure for magnetron |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59205132A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4520275Y1 (en) * | 1966-07-25 | 1970-08-14 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5816118Y2 (en) * | 1975-01-06 | 1983-04-01 | 株式会社日立製作所 | Denshikan ink yokukoutai |
-
1983
- 1983-05-09 JP JP8048583A patent/JPS59205132A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4520275Y1 (en) * | 1966-07-25 | 1970-08-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59205132A (en) | 1984-11-20 |
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