JPH05305432A - Wave soldering apparatus - Google Patents

Abstract

PURPOSE:To prevent scattering of foreign matter at a part dropping molten solder jetted from a nozzle in a solder vessel on the solder surface in the vessel. CONSTITUTION:A shield plate 43 for preventing the scattering of the foreign matter is arranged between a work carry-in side edge 11a of the solder vessel 11 and a work carry-in side fin 31 of a primary nozzle 15. This shield plate 43 is fixed to a supporting plate 41 inserted in the solder vessel through a fitting plate 42. A shield plate 45 for preventing the scattering of the foreign matter, fixed to a fitting plate 44 is arranged between a work carry-out side fin 32 of the primary nozzle 15 and a work carry-in side fin 33 in a secondary nozzle 16. A shield plate 48 is arranged between work carry-out side weir plate 35 of the secondary nozzle 16 and a work carry-out side edge 11b of the solder vessel 11. This shield plate 48 is fixed to a supporting plate 46 inserted in the solder vessel through a fitting plate 47. Then, the scattering of the foreign matter 51 generated at the part dropping the waved solder on the solder surface 14, etc., in the vessel from the nozzles 15, 16 is prevented by the shield plates 43, 45, 48.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet type in which molten solder jetted from a nozzle protruding from a molten solder surface of a solder bath is used for soldering a work such as a printed wiring board conveyed on the solder bath. The present invention relates to a soldering device.

[0002]

2. Description of the Related Art In a jet-type soldering apparatus of this type, when molten solder jetted from the nozzle and dropped and collides strongly with the solder surface in the bath, the solder and floating substances such as antioxidant oil are scattered and the work Since there is a possibility that it will adhere as foreign matter to etc., the molten solder that jets from the nozzle and falls,
The slope having a gentle slope is guided to the solder surface in the bath to prevent the foreign matter from scattering.

Further, the antioxidant oil itself has an effect of preventing fine scattering of the molten solder.

[0004]

The above-mentioned antioxidant oil (vegetable oil) emits an offensive odor and smoke along with thermal decomposition and contaminates the environment, the device and the work (printed wiring board) itself. The oil that has been caught and jetted from the nozzle also adheres to the work, so this oil is being abolished.

Further, in order to miniaturize the jet type soldering apparatus of this type, a gentle and long slope provided from the nozzle to the solder surface in the bath poses a problem.

Further, when the solder bath is operated in a nitrogen atmosphere, the sherbet-like solder oxide, which had a buffering function for the dropped solder on the solder surface, does not accumulate, so that the scattering of the foreign matter becomes remarkable. Prone.

Since most of the foreign matter thus scattered adheres to the work (printed wiring board), it is necessary to clean the work in a later step. Further, the foreign matter scattered around the solder bath may contaminate the environment and may adhere to a machine portion such as a work transfer conveyor to cause a functional failure, which is not preferable in terms of maintenance.

The present invention has been made in view of the above circumstances, and provides a jet-type soldering device capable of effectively preventing foreign matter from scattering due to solder drop from a nozzle without relying on conventional antioxidant oil or slope. It is intended to be provided.

[0009]

SUMMARY OF THE INVENTION The present invention is a jet soldering apparatus for soldering a work carried on a solder bath with molten solder jetted from a nozzle projecting from a molten solder surface of a solder bath. In the above, the shield plate for preventing foreign matter from scattering, which has a shape that covers the upper part of the portion where the molten solder jetted and dropped from the nozzle strongly collides with the in-vessel solder surface and the drop flow from other nozzles, It is a jet type soldering device provided on the lower side.

[0010]

According to the present invention, the shielding plate positioned between the portion where molten solder dropped from the nozzle collides with the solder surface in the bath and the workpiece to be conveyed, and the foreign matter scattered from the solder colliding portion is transferred to the workpiece. Cut off so that it does not reach.

[0011]

The present invention will be described in detail below with reference to the embodiment shown in FIG.

A pump 12 is provided in the molten solder in the solder bath 11, and the pump chamber 13 and the molten solder surface of the solder bath 11 are provided.
A primary nozzle 15 and a secondary nozzle 16 protruding from 14 communicate with each other.

The primary nozzle 15 conveys on the solder bath by a convex solder wave 23 jetted from a small hole 22 of a perforated plate 21.
Reliable soldering is performed to every corner of the work (component mounting board) 25 conveyed by 24, and the secondary nozzle 16 shapes the soldered portion of the work 25 by the solder surface 26 that jets smoothly.

Fins 3 are provided on the work loading side and the work unloading side of the primary nozzle 15 and the secondary nozzle 16, respectively.
1, 32, 33, 34 are provided in a protruding manner, and a dam plate 35 for obtaining the smooth solder surface 26 is provided on the work discharge side fin 34 of the secondary nozzle 16.

Between the work loading side edge 11a of the solder bath 11 and the work loading side fin 31 of the primary nozzle 15, a foreign matter fixed to a support plate 41 inserted in the solder bath via a mounting plate 42. A scattering prevention shield plate 43 is arranged. Further, the work discharge side fin 32 of the primary nozzle 15 and the secondary nozzle 16
A foreign matter scattering prevention shielding plate 45 fixed to the mounting plate 44 is disposed between the work loading side fins 33. Further, the work discharge side weir plate 35 of the secondary nozzle 16 and the solder bath.
A foreign matter scattering prevention shield plate 48 fixed to a support plate 46 inserted into the solder bath via a mounting plate 47 is arranged between the workpiece discharge side edge 11b.

That is, the molten solder dropped from the nozzles 15 and 16 is strongly collided with the in-vessel solder surface 14, and the upper portions of the nozzles 15 and 16 where the dropped flows interfere with each other. Shielding plates 43, 45, 48 for preventing foreign matter from scattering are provided below the conveying path of the work 25 so as to cover the collision portion of the dropped solder.

Accordingly, in the solder drop portion from the nozzles 15 and 16 to the in-vessel solder surface 14 and the drop flow interference portion between the nozzles, molten solder particles and floating substances such as antioxidant oil are foreign matter.
It tries to scatter upward as 51, but the shielding plates 43, 4
Since 5, 48 block the scattering of foreign matter in each part, the scattered foreign matter 51 does not reach the conveyor or the work being conveyed, and does not contaminate the periphery of the solder bath 11.

The foreign matter scattering prevention shield plate may be provided over the entire circumference of each nozzle 15, 16.

[0019]

According to the present invention, a foreign matter scattering prevention shield plate covering the upper portion of the portion where the solder dropped from the nozzle strongly collides with the solder surface in the bath is provided below the work transfer path. As a result, foreign substances scattered during the jet operation of the solder bath do not adhere to the work, and the quality can be improved. Further, it is possible to prevent foreign matters from adhering to the periphery of the solder bath and machine parts such as the work transfer conveyor, so that the environment is not polluted and the machine function is not impaired, and the maintenance is easy.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a jet type soldering device of the present invention.

[Explanation of symbols]

 11 Solder tank 14 Solder surface 15, 16 Nozzle 25 Workpiece 43, 45, 48 Shielding plate

Claims (1)

[Claims] 1. A jet type soldering device for soldering a work carried on a solder bath by a molten solder jetted from a nozzle projecting from a molten solder surface of a solder bath. A shielding plate for preventing foreign matter from scattering is provided below the work transfer path, in a shape that covers the upper part of the portion where the dropped molten solder strongly collides with the solder surface in the bath or the drop flow from another nozzle. Jet-type soldering device.