JPH05304029A - Flyback transformer - Google Patents

Abstract

PURPOSE:To diminish the defective soldering step of a primary coil within the title flyback transformer generating high voltage. CONSTITUTION:The start-of-winding and the end-of-winding of the copper wire 15 of the primary coil are wound up around the end of the stepped part 13 provided in the holding part 12 with a terminal pin 14 inserted thereinto of the primary coil bobbin so that a gap 17 may be made between the wound up copper wire 15 and the holding part 12 by the stepped part 13. Through these procedures, the copper wire 15 wound up around the terminal pin 14 and the stepped part 13 are immersed in the solder layer of a molten solder 16 so that the solder 16 may thoroughly creep in the gap 17 between the wound up copper wire 15 and the holding part 12 to diminish the defective soldering step.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flyback transformer used in a television receiver or the like.

[0002]

2. Description of the Related Art In recent years, there has been a demand for a flyback transformer having a high focus voltage and a high reliability in order to make a television receiver bright.

A conventional flyback transformer will be described below with reference to FIG. In FIG. 3, reference numeral 1 is a ferrite core forming a magnetic circuit, and 2 is a primary coil. Reference numeral 3 denotes a laminated winding type secondary coil, which is formed of a bobbin 4, a coil copper wire 5, and an insulating layer 6. A high voltage diode 7 rectifies the voltage generated in the secondary coil 3.

FIG. 4 shows a terminal pin holding portion of a bobbin around which the primary coil 2 is wound. In the figure, 8 is a holding portion of the bobbin, 9 is a terminal pin, and 10 is a copper wire of a coil wound around the terminal pin 9. FIG. 5 shows a soldered state of the terminal pin holding portion shown in FIG. 4, and 11 is molten solder. The copper wire 10 of the coil wound around the terminal pin 9 is dipped in the melted solder 11 to perform solder dipping.

[0005]

In such a conventional structure as described above, since the molten solder has a surface tension, the solder does not sufficiently reach the winding at the base of the holding portion of the copper wire 10 and a soldering failure occurs. It had a problem that it occurred.

[0006]

In order to achieve this object, the present invention provides a step in a holding portion for holding a terminal pin,
The solder is dipped in the molten solder up to the step and soldered.

[0007]

With this structure, a step is formed in the holding portion at the terminal pin portion where the copper wire is not wound between the holding portion of the bobbin and the copper wire wound around the terminal pin. It is possible to reduce the surface tension of the solder.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a terminal pin holding portion. In the figure, reference numeral 12 is a holding portion of the bobbin, and 13 is a step of the holding portion 12. 14 is a terminal pin, 15 is a terminal pin 1
It is a copper wire of a coil wound around 4. FIG. 2 shows a soldered state of the terminal pin holding portion of FIG. 1, 16 is molten solder, and the copper wire 15 of the coil wound around the terminal pin 14 is dipped in the molten solder 16 to remove the solder dip. To do.

Thus, the holding portion 12 of the primary coil bobbin
A step 13 is provided at the end of the step 13 in which the terminal pin 14 is inserted into the holding portion 12, and the copper wire 15 of the primary coil is wound at the beginning and end of the winding. Step 1 with terminal pin 14 in which copper wire 15 is wound around the solder dip layer of molten solder 16
When 3 is immersed together, the terminal pin 14 and the copper wire 15 receive the surface tension of the solder 16 at the moment of immersion. However, since the edge portion 17 is submerged in the solder 16 as shown in FIG.
The solder 16 enters into the gap formed by the step 13. Therefore, the solder is sufficiently circulated to the winding start and winding end of the copper wire 15, which is the end of the step 13, and the soldering failure of the primary coil can be reduced.

Further, although the step 13 of the holding portion 12 is deformed by soldering, the holding portion 12 and the terminal pin 14 are not deformed and a stable terminal is constituted.

[0011]

As described above, according to the present invention, since the step of the terminal pin where the copper wire is not wound is provided in the holding portion, the surface tension of the solder on the wound copper wire is reduced, and the root of the holding portion is reduced. Solder is fully wound up to the winding to reduce defective soldering.

[Brief description of drawings]

FIG. 1 is a plan view of a terminal pin holding portion according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a soldered state of a terminal pin holding portion according to an embodiment.

FIG. 3 is a sectional view of a conventional flyback transformer.

FIG. 4 is a plan view of a conventional terminal pin holding portion.

FIG. 5 is a cross-sectional view of a conventional terminal pin holding portion in a soldered state.

[Explanation of symbols]

 12 holding part 13 step 14 terminal pin 15 copper wire 16 solder 17 edge part

Claims (1)

[Claims] 1. A coil terminal of a flyback transformer, wherein a holding portion of a bobbin is provided with a terminal pin, a step is provided on the holding portion, and a coil copper wire winding start and winding end are provided at an end of the step. , Flyback transformer characterized by solder dip.