JPH05298917A - Composition for conductive aluminum paste - Google Patents

Composition for conductive aluminum paste

Info

Publication number
JPH05298917A
JPH05298917A JP4099656A JP9965692A JPH05298917A JP H05298917 A JPH05298917 A JP H05298917A JP 4099656 A JP4099656 A JP 4099656A JP 9965692 A JP9965692 A JP 9965692A JP H05298917 A JPH05298917 A JP H05298917A
Authority
JP
Japan
Prior art keywords
composition
powder
paste
hydride
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4099656A
Other languages
Japanese (ja)
Other versions
JP3374194B2 (en
Inventor
Toru Higo
徹 肥後
Masatoshi Wada
正敏 和田
Yukikazu Moritsu
幸和 森津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okuno Chemical Industries Co Ltd
Original Assignee
Okuno Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chemical Industries Co Ltd filed Critical Okuno Chemical Industries Co Ltd
Priority to JP09965692A priority Critical patent/JP3374194B2/en
Publication of JPH05298917A publication Critical patent/JPH05298917A/en
Application granted granted Critical
Publication of JP3374194B2 publication Critical patent/JP3374194B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To provide a composition for a conductive aluminum paste which has high oxidation resistance and conductivity even if fired in air. CONSTITUTION:A composition for a conductive paste consists of (i) 40-90wt.% of aluminum powder, (ii) 1-30wt.% of at least one kind of powders selected from carbon, germanium, tin, metal hydrides, and metal phosphides, and (iii) 9-40wt.% of glass powder.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、導電性アルミニウムペ
ースト用組成物に関する。
FIELD OF THE INVENTION The present invention relates to a conductive aluminum paste composition.

【0002】[0002]

【従来技術とその問題点】従来、抵抗体素子、セラミッ
クスコンデンサー、サーミスタ、バリスタ、ガス放電表
示管等の電極形成に用いられる導電性ペーストとして
は、銀粉末等を導電体として配合してなる導電性銀ペー
ストが用いられている。しかし、かかる銀ペーストを用
いて作製される電極は、その使用時の電気的負荷によっ
て電極中の銀成分が相互間で移動する現象(マイグレー
ション)を惹き起こす。しかも、直流型ガス放電パネル
の電極に使用した場合には、銀とガス中に添加された水
銀とがアマルガムを生成するという問題もある。従っ
て、これらの問題を解消するために卑金属であるアルミ
ニウムを導電体として配合した導電性アルミニウムペー
ストが開発されている。
2. Description of the Related Art Conventionally, as a conductive paste used for forming electrodes of resistor elements, ceramic capacitors, thermistors, varistors, gas discharge display tubes, etc., a conductive paste prepared by blending silver powder or the like as a conductor is used. A conductive silver paste is used. However, an electrode manufactured using such a silver paste causes a phenomenon (migration) in which silver components in the electrode move between each other due to an electric load during use. Moreover, when used as an electrode of a DC type gas discharge panel, there is a problem that silver and mercury added to the gas form amalgam. Therefore, in order to solve these problems, a conductive aluminum paste containing aluminum, which is a base metal, as a conductor has been developed.

【0003】しかしながら、上記導電性アルミニウムペ
ーストでは、電極形成時の焼成により導電体たるアルミ
ニウムが容易に酸化されてしまい、電極中でその酸化物
が生成する。そのため、その電極の抵抗値の増大、即ち
導電性の低下が惹き起こされるという問題が生じる。従
って、上記導電性アルミニウムペーストを焼成する場
合、これを還元性雰囲気下で焼成せざるを得なかった。
However, in the above-mentioned conductive aluminum paste, aluminum as a conductor is easily oxidized by firing during electrode formation, and the oxide is generated in the electrode. Therefore, there arises a problem that the resistance value of the electrode is increased, that is, the conductivity is lowered. Therefore, when firing the above-mentioned conductive aluminum paste, it had to be fired in a reducing atmosphere.

【0004】[0004]

【問題点を解決するための手段】本発明は、酸化抵抗性
に優れ、空気雰囲気下での焼成後でも優れた導電性を発
揮できる導電性アルミニウムペースト用組成物を提供す
ることを目的とする。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a composition for a conductive aluminum paste which has excellent oxidation resistance and can exhibit excellent conductivity even after firing in an air atmosphere. ..

【0005】本発明者らは、上記問題に鑑み、鋭意検討
した結果、アルミニウムとガラスからなる混合物に特定
の金属又は金属化合物を添加し、これを電極等に採用し
た場合には、空気雰囲気下での焼成による電極の酸化が
抑制されることを見出し、本発明を完成するに至った。
In view of the above problems, the inventors of the present invention have made earnest studies, and as a result, when a specific metal or metal compound was added to a mixture of aluminum and glass and this was used for an electrode or the like, it was exposed to air atmosphere. It was found that the oxidation of the electrode due to the firing in the above was suppressed, and the present invention was completed.

【0006】即ち、本発明は、導電性ペースト用組成物
において、 (i) アルミニウム粉末 40〜90重量% (ii) 炭素、ゲルマニウム、スズ、水素化金属化合物及
びリン化金属化合物から選ばれた少なくとも1種の粉末
1〜30重量%、及び (iii) ガラス粉末 9〜40重量%からなることを特徴
とする導電性アルミニウムペースト用組成物に係るもの
である。
That is, the present invention provides a composition for a conductive paste containing at least 40% to 90% by weight of (i) aluminum powder, and (ii) at least one selected from carbon, germanium, tin, a metal hydride compound and a metal phosphide compound. The present invention relates to a composition for electrically conductive aluminum paste, which comprises 1 to 30% by weight of one kind of powder, and 9 to 40% by weight of (iii) glass powder.

【0007】以下、本発明について詳細に説明する。The present invention will be described in detail below.

【0008】まず、第1の成分としてはアルミニウム粉
末を用いる。このアルミニウム粉末は、例えば市販され
ているアルミニウム粉末等の通常のものが使用できる。
配合量は40〜90重量%、好ましくは60〜80重量
%とする。40重量%を下回ると導電体であるアルミニ
ウム量が少なくなるために導電性アルミニウムペースト
としての特性が低下する。また90重量%を上回ると基
板と導電体を密着させるバインダー量が少なくなるため
に基板と導電体との密着性が低下するので好ましくな
い。また、上記粉末の粒径は通常0.05〜100μm
程度とする。上記粒径が0.05μmを下回ると粉末保
存時あるいはペースト加工時に酸化され易くなり、その
安定性が失われる。また100μmを上回ると均一な分
散を行なうことが困難となり、安定な電気抵抗値が得ら
れなくなるので好ましくない。
First, aluminum powder is used as the first component. As this aluminum powder, for example, a commercially available aluminum powder or the like can be used.
The compounding amount is 40 to 90% by weight, preferably 60 to 80% by weight. If the amount is less than 40% by weight, the amount of aluminum as a conductor decreases, and the properties of the conductive aluminum paste deteriorate. On the other hand, if it exceeds 90% by weight, the amount of the binder that adheres the substrate and the conductor to each other decreases, and the adhesion between the substrate and the conductor decreases, which is not preferable. The particle size of the powder is usually 0.05 to 100 μm.
The degree. If the particle size is less than 0.05 μm, the powder is likely to be oxidized during storage or paste processing, and its stability is lost. On the other hand, if it exceeds 100 μm, it becomes difficult to perform uniform dispersion, and a stable electric resistance value cannot be obtained, which is not preferable.

【0009】第2の成分としては水素化金属化合物、リ
ン化金属化合物、炭素、ゲルマニウム及びスズから選ば
れた少なくとも1種の粉末を用いる。ここで水素化金属
化合物は、例えば水素化チタン、水素化ジルコニウム、
水素化ランタン、水素化ホルミウム、水素化セリウム、
水素化バナジウム、水素化イットリウム、水素化ネオジ
ウム、水素化ジスプロシウム、水素化エルビニウム、水
素化ユーロピウム、水素化ガドリニウム、水素化ハフニ
ウム、水素化ルテチウム、水素化ネオジウム、水素化イ
ッテルビウム等等が挙げられる。またリン化金属化合物
は、例えばリン化アルミニウム、リン化ホウ素、2リン
化3カドミウム、2リン化カドミウム、3リン化コバル
ト、リン化銅、リン化鉄、リン化ガリウム、リン化イン
ジウム、2リン化3マンガン、リン化ニッケル、2リン
化3亜鉛、2リン化亜鉛等が挙げられる。また炭素、ゲ
ルマニウム及びスズは、その結晶構造がダイヤモンド形
のものが好ましく、この結晶構造形であれば市販されて
いる試薬などでも使用できる。配合量は1〜30重量
%、好ましくは5〜10重量%とする。1重量%を下回
ると充分な添加効果が得られず、30重量%を上回ると
抵抗値増加抑制の効果が却って低下する。また、上記粉
末の粒径は、通常0.05〜100μm程度とする。上
記粒径が0.05μmを下回ると保存時或いは加工時に
金属粉末は酸化され易く、また金属化合物は分解され易
くなり、100μmを上回ると均一な分散を行なうのが
困難となり、安定な電気抵抗値が得られなくなるので好
ましくない。
As the second component, at least one powder selected from metal hydride compounds, metal phosphide compounds, carbon, germanium and tin is used. Here, the metal hydride compound is, for example, titanium hydride, zirconium hydride,
Lanthanum hydride, holmium hydride, cerium hydride,
Examples thereof include vanadium hydride, yttrium hydride, neodymium hydride, dysprosium hydride, erbium hydride, europium hydride, gadolinium hydride, hafnium hydride, lutetium hydride, neodymium hydride and ytterbium hydride. The metal phosphide compound is, for example, aluminum phosphide, boron phosphide, cadmium phosphide, cadmium phosphide, cobalt phosphide, cobalt phosphide, copper phosphide, iron phosphide, gallium phosphide, indium phosphide, indium phosphide. Examples include manganese trioxide, nickel phosphide, trizinc phosphide, and zinc phosphide. Further, carbon, germanium and tin preferably have a diamond crystal structure, and a commercially available reagent or the like can be used as long as it has this crystal structure. The compounding amount is 1 to 30% by weight, preferably 5 to 10% by weight. If it is less than 1% by weight, a sufficient addition effect cannot be obtained, and if it exceeds 30% by weight, the effect of suppressing the increase in resistance is rather decreased. The particle size of the powder is usually about 0.05 to 100 μm. If the particle size is less than 0.05 μm, the metal powder is easily oxidized during storage or processing, and the metal compound is easily decomposed. If the particle size is more than 100 μm, it is difficult to disperse uniformly and a stable electric resistance value is obtained. Is not obtained, which is not preferable.

【0010】第3の成分としてはガラス粉末を用いる。
この場合、使用できるガラス粉末は、その軟化点が通常
350〜500℃程度のものを用いるのが望ましい。ま
た、ガラス組成は特に制限されず、例えばホウケイ酸鉛
系ガラス、ホウケイ酸亜鉛系ガラス、ホウケイ酸ビスマ
ス系ガラス、或いはこれらの系にLi2 O、Na2 O、
2 O、BaO、CaO、MgO、ZnO、TiO2
ZrO2 、Al2 3、NaF、P2 5 等の公知の成分を1
種又は2種以上含有するもの等が使用できる。配合量は
9〜40重量%、好ましくは10〜30重量%とする。
9重量%を下回ると導電体形成組成物と基盤素材との密
着力が不充分となり、40重量%を上回ると抵抗値増加
抑制の効果が却って低下する。また、上記粉末の粒径は
通常100μm程度以下とする。100μmを上回ると
均一な分散を行なうのが困難となり、抵抗値が増加する
ことになるので好ましくない。
Glass powder is used as the third component.
In this case, it is preferable that the glass powder that can be used has a softening point of usually about 350 to 500 ° C. The glass composition is not particularly limited, and examples thereof include lead borosilicate glass, zinc borosilicate glass, bismuth borosilicate glass, or Li 2 O, Na 2 O,
K 2 O, BaO, CaO, MgO, ZnO, TiO 2 ,
ZrO 2, Al 2 O 3, NaF, a well-known components, such as P 2 O 5 1
It is possible to use one kind or one containing two or more kinds. The compounding amount is 9 to 40% by weight, preferably 10 to 30% by weight.
If it is less than 9% by weight, the adhesion between the conductor-forming composition and the base material will be insufficient, and if it exceeds 40% by weight, the effect of suppressing the increase in resistance will be rather decreased. The particle size of the above powder is usually about 100 μm or less. If it exceeds 100 μm, it becomes difficult to disperse uniformly, and the resistance value increases, which is not preferable.

【0011】以上の3成分の粉末を均一に混合すれば、
本発明の導電性アルミニウムペースト用組成物が得られ
る。かかる組成物の使用に際しては、そのままの形態で
使用することもできるが、エポキシ樹脂、その他有機溶
剤に溶解させたセルロース系樹脂、アクリル系樹脂、ロ
ジン系樹脂、高融点脂肪酸等の汎用されている有機ビヒ
クル(バインダー)と共に混練することによってインク
化してペースト状の形態で用いる場合には好適に印刷す
ることが可能となる。尚、この場合の印刷は通常のパタ
ーン印刷等と同様の方法に従って行なうことができる。
If the above three component powders are uniformly mixed,
The composition for conductive aluminum paste of the present invention is obtained. When using such a composition, it can be used as it is, but it is widely used as an epoxy resin, a cellulose resin dissolved in other organic solvent, an acrylic resin, a rosin resin, a high melting point fatty acid, or the like. When kneading with an organic vehicle (binder) to form an ink into a paste form, suitable printing can be performed. The printing in this case can be performed according to the same method as that for normal pattern printing.

【0012】本発明組成物が適用できる素材としては、
400℃程度以上の耐熱性を有する材料であれば特に限
定されず、実質的にあらゆる素材に適用することが可能
である。この中でも特に、ソーダ石灰ガラス、石英ガラ
ス、ホウケイ酸ガラス、ホウケイ酸鉛ガラス等のガラス
類、アルミナ系セラミックス、ジルコニア系セラミック
ス、チタン酸バリウム系セラミックス、酸化亜鉛系セラ
ミックス、ベリリア系セラミックス、ホルステライト系
セラミックス、マグネシア系セラミックス、チタン酸ジ
ルコン酸鉛系セラミックス等の酸化物系セラミックス、
窒化ケイ素、炭化ケイ素、窒化アルミニウム等の非酸化
物系セラミックス等には最適である。
The materials to which the composition of the present invention can be applied include
The material is not particularly limited as long as it has a heat resistance of about 400 ° C. or more, and it can be applied to virtually any material. Among these, in particular, soda-lime glass, quartz glass, borosilicate glass, lead borosilicate glass, and other glasses, alumina-based ceramics, zirconia-based ceramics, barium titanate-based ceramics, zinc oxide-based ceramics, beryllia-based ceramics, forsterite-based Ceramics, magnesia-based ceramics, oxide-based ceramics such as lead zirconate titanate-based ceramics,
It is most suitable for non-oxide ceramics such as silicon nitride, silicon carbide and aluminum nitride.

【0013】[0013]

【発明の効果】本発明の導電性アルミニウムペースト用
組成物は、酸化抵抗性に優れ、空気雰囲気下で焼成して
も優れた導電性を発揮することができるので、抵抗体素
子、セラミックスコンデンサー、サーミスタ等の各種電
子部品の電極用形成材料等として最適である。
The composition for conductive aluminum paste of the present invention is excellent in oxidation resistance and can exhibit excellent conductivity even when fired in an air atmosphere. Therefore, a resistor element, a ceramic capacitor, It is optimal as a material for forming electrodes of various electronic parts such as thermistors.

【0014】[0014]

【実施例】以下に実施例及び比較例を示し、本発明の特
徴とするところをより一層明瞭にする。
EXAMPLES Examples and comparative examples will be shown below to further clarify the characteristics of the present invention.

【0015】実施例1〜20 アルミニウム粉末(粒径約3μm、球状粒子)及びガラ
ス粉末(B2 3 16%、SiO2 10%、PbO66
%、ZnO8%、軟化温度485℃)、並びに炭素、ゲ
ルマニウム、スズ、水素化チタン粉末、水素化ホルミニ
ウム粉末又はリン化アルミニウム粉末を表1に示すよう
な配合で混合し、これに有機ビヒクルとしてエステル系
有機溶剤にセルロース系樹脂を溶解させたものを添加し
て混練し、インク化してペースト状とした。
Examples 1 to 20 Aluminum powder (particle size: about 3 μm, spherical particle) and glass powder (B 2 O 3 16%, SiO 2 10%, PbO66).
%, ZnO 8%, softening temperature 485 ° C.), and carbon, germanium, tin, titanium hydride powder, holmium hydride powder or aluminum phosphide powder in a composition as shown in Table 1, and an ester as an organic vehicle is added thereto. A solution of a cellulosic resin in a system organic solvent was added and kneaded to form an ink into a paste.

【0016】次にこのペーストを250メッシュ(乳剤
厚15μm)のスクリーンにてソーダ石灰ガラス基板上
に直径1.5cmの円形パターンを常法に従って印刷
し、これを580℃で10分間焼成し、試料を作成し
た。
Next, this paste was printed on a soda-lime glass substrate with a 250 mesh (emulsion thickness of 15 μm) screen to form a circular pattern having a diameter of 1.5 cm according to a conventional method, and the paste was baked at 580 ° C. for 10 minutes to prepare a sample. It was created.

【0017】次いで、得られた試料のシート抵抗値を測
定した。その結果を表1に記す。
Next, the sheet resistance value of the obtained sample was measured. The results are shown in Table 1.

【0018】[0018]

【表1】 [Table 1]

【0019】[0019]

【表2】 [Table 2]

【0020】[0020]

【表3】 [Table 3]

【0021】[0021]

【表4】 [Table 4]

【0022】実施例21〜25 アルミニウム粉末(粒径約3μm、りん片状粒子)及び
ガラス粉末(B2 316%、SiO2 10%、PbO66%、
ZnO8%、軟化温度485℃)、並びに炭素、ゲルマ
ニウム又はスズを表2に示すような配合で混合し、これ
に有機ビヒクルとしてエステル系有機溶剤にセルロース
系樹脂を添加して混練し、インク化してペースト状とし
た。
Examples 21 to 25 Aluminum powder (particle size of about 3 μm, flaky particles) and glass powder (B 2 O 3 16%, SiO 2 10%, PbO 66%,
ZnO 8%, softening temperature 485 ° C.) and carbon, germanium or tin are mixed in a composition as shown in Table 2, and a cellulose resin is added to an ester organic solvent as an organic vehicle and kneaded to form an ink. It was made into a paste.

【0023】次にこのペーストを250メッシュ(乳剤
厚15μm)のスクリーンにてソーダ石灰ガラス基板上
に直径1.5cmの円形パターンを常法に従って印刷
し、これを580℃で10分間焼成し、試料を作成し
た。
Next, this paste was printed on a soda-lime glass substrate with a 250 mesh (emulsion thickness of 15 μm) screen to form a circular pattern having a diameter of 1.5 cm according to a conventional method, and this was baked at 580 ° C. for 10 minutes to prepare a sample. It was created.

【0024】次いで、得られた試料のシート抵抗値を測
定した。その結果を表2に記す。
Then, the sheet resistance value of the obtained sample was measured. The results are shown in Table 2.

【0025】[0025]

【表5】 [Table 5]

【0026】比較例1〜3 表3に示すように、本発明の組成の範囲外の組成につい
て実施例1と同様にして得られた試料のシート抵抗値を
測定した。その結果を表3に記す。
Comparative Examples 1 to 3 As shown in Table 3, the sheet resistance value of the sample obtained in the same manner as in Example 1 was measured for the composition outside the range of the composition of the present invention. The results are shown in Table 3.

【0027】[0027]

【表6】 [Table 6]

【0028】比較例4〜5 表4に示すように、本発明の組成の範囲外の組成につい
て実施例21と同様にして得られた試料のシート抵抗値
を測定した。その結果を表4に記す。
Comparative Examples 4 to 5 As shown in Table 4, the sheet resistance value of the sample obtained in the same manner as in Example 21 was measured for the composition outside the range of the composition of the present invention. The results are shown in Table 4.

【0029】[0029]

【表7】 [Table 7]

【0030】以上の結果より、本発明の組成物により得
られる試料は、シート抵抗値が低く、優れた導電性を発
揮していることがわかる。
From the above results, it is understood that the sample obtained from the composition of the present invention has a low sheet resistance value and exhibits excellent conductivity.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H01G 4/12 427 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location H01G 4/12 427

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】導電性ペースト用組成物において、 (i) アルミニウム粉末 40〜90重量% (ii) 炭素、ゲルマニウム、スズ、水素化金属化合物及
びリン化金属化合物から選ばれた少なくとも1種の粉末
1〜30重量%、及び (iii) ガラス粉末 9〜40重量%からなることを特徴
とする導電性アルミニウムペースト用組成物。
1. A composition for a conductive paste comprising: (i) aluminum powder 40 to 90% by weight (ii) at least one powder selected from carbon, germanium, tin, metal hydride compounds and metal phosphide compounds. 1-30 weight% and (iii) glass powder 9-40 weight%, The composition for electroconductive aluminum pastes characterized by the above-mentioned.
JP09965692A 1992-04-20 1992-04-20 Composition for conductive aluminum paste Expired - Fee Related JP3374194B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP09965692A JP3374194B2 (en) 1992-04-20 1992-04-20 Composition for conductive aluminum paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP09965692A JP3374194B2 (en) 1992-04-20 1992-04-20 Composition for conductive aluminum paste

Publications (2)

Publication Number Publication Date
JPH05298917A true JPH05298917A (en) 1993-11-12
JP3374194B2 JP3374194B2 (en) 2003-02-04

Family

ID=14253100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09965692A Expired - Fee Related JP3374194B2 (en) 1992-04-20 1992-04-20 Composition for conductive aluminum paste

Country Status (1)

Country Link
JP (1) JP3374194B2 (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1400987A2 (en) * 2002-09-19 2004-03-24 Murata Manufacturing Co., Ltd. Conductive paste, method for manufacturing solar battery, and solar battery
JP2005317898A (en) * 2004-03-31 2005-11-10 Toyo Aluminium Kk Paste composition and solar cell element using the same
WO2007032151A1 (en) * 2005-09-13 2007-03-22 Toyo Aluminium Kabushiki Kaisha Aluminum paste composition and solar cell element making use of the same
JP2008010527A (en) * 2006-06-28 2008-01-17 Sharp Corp Conductive paste for solar cell electrode
WO2010100893A1 (en) 2009-03-06 2010-09-10 東洋アルミニウム株式会社 Electrically conductive paste composition and electrically conductive film formed by using the same
WO2010113581A1 (en) * 2009-03-31 2010-10-07 東レ株式会社 Photosensitive conductive paste, method for manufacturing display using photosensitive conductive paste, and display
JP2010533379A (en) * 2007-07-09 2010-10-21 フエロ コーポレーション A solar cell contact containing aluminum and at least one of boron, titanium, nickel, tin, silver, gallium, zinc, indium, and copper
CN102938260A (en) * 2012-11-14 2013-02-20 东方电气集团(宜兴)迈吉太阳能科技有限公司 Solar energy electrical conduction slurry and preparation method thereof
US8759668B2 (en) 2006-03-20 2014-06-24 Heraeus Precious Metals North America Conshohocken Llc Aluminum-boron solar cell contacts
JP2016189433A (en) * 2015-03-30 2016-11-04 京セラ株式会社 Solar cell element and manufacturing method of the same
WO2017051775A1 (en) * 2015-09-24 2017-03-30 東洋アルミニウム株式会社 Paste composition and method for forming silicon germanium layer
JP2017528871A (en) * 2014-08-28 2017-09-28 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company Copper-containing conductive paste and electrode made from copper-containing conductive paste
US9786463B2 (en) 2010-03-23 2017-10-10 Hitachi, Ltd. Electronic component, conductive paste, and method for manufacturing an electronic component
JP2017535024A (en) * 2014-08-28 2017-11-24 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company Copper-containing conductive paste and electrode made from copper-containing conductive paste
US10672922B2 (en) 2014-08-28 2020-06-02 Dupont Electronics, Inc. Solar cells with copper electrodes

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1400987A3 (en) * 2002-09-19 2004-04-07 Murata Manufacturing Co., Ltd. Conductive paste, method for manufacturing solar battery, and solar battery
EP1400987A2 (en) * 2002-09-19 2004-03-24 Murata Manufacturing Co., Ltd. Conductive paste, method for manufacturing solar battery, and solar battery
JP2005317898A (en) * 2004-03-31 2005-11-10 Toyo Aluminium Kk Paste composition and solar cell element using the same
WO2007032151A1 (en) * 2005-09-13 2007-03-22 Toyo Aluminium Kabushiki Kaisha Aluminum paste composition and solar cell element making use of the same
US8759668B2 (en) 2006-03-20 2014-06-24 Heraeus Precious Metals North America Conshohocken Llc Aluminum-boron solar cell contacts
JP2008010527A (en) * 2006-06-28 2008-01-17 Sharp Corp Conductive paste for solar cell electrode
JP2010533379A (en) * 2007-07-09 2010-10-21 フエロ コーポレーション A solar cell contact containing aluminum and at least one of boron, titanium, nickel, tin, silver, gallium, zinc, indium, and copper
WO2010100893A1 (en) 2009-03-06 2010-09-10 東洋アルミニウム株式会社 Electrically conductive paste composition and electrically conductive film formed by using the same
KR20110118841A (en) 2009-03-06 2011-11-01 도요 알루미늄 가부시키가이샤 Electrically conductive paste composition and electrically conductive film formed by using the same
WO2010113581A1 (en) * 2009-03-31 2010-10-07 東レ株式会社 Photosensitive conductive paste, method for manufacturing display using photosensitive conductive paste, and display
JP4862962B2 (en) * 2009-03-31 2012-01-25 東レ株式会社 Photosensitive conductive paste, display manufacturing method using the same, and display
JPWO2010113581A1 (en) * 2009-03-31 2012-10-11 東レ株式会社 Photosensitive conductive paste, display manufacturing method using the same, and display
US9786463B2 (en) 2010-03-23 2017-10-10 Hitachi, Ltd. Electronic component, conductive paste, and method for manufacturing an electronic component
CN102938260A (en) * 2012-11-14 2013-02-20 东方电气集团(宜兴)迈吉太阳能科技有限公司 Solar energy electrical conduction slurry and preparation method thereof
US10325693B2 (en) 2014-08-28 2019-06-18 E I Du Pont De Nemours And Company Copper-containing conductive pastes and electrodes made therefrom
US10672922B2 (en) 2014-08-28 2020-06-02 Dupont Electronics, Inc. Solar cells with copper electrodes
JP2017528871A (en) * 2014-08-28 2017-09-28 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company Copper-containing conductive paste and electrode made from copper-containing conductive paste
JP2017535024A (en) * 2014-08-28 2017-11-24 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company Copper-containing conductive paste and electrode made from copper-containing conductive paste
JP2016189433A (en) * 2015-03-30 2016-11-04 京セラ株式会社 Solar cell element and manufacturing method of the same
JPWO2017051775A1 (en) * 2015-09-24 2018-07-12 東洋アルミニウム株式会社 Paste composition and method for forming silicon germanium layer
US20180301334A1 (en) * 2015-09-24 2018-10-18 Toyo Aluminium Kabushiki Kaisha Paste composition and method for forming silicon germanium layer
CN108028187A (en) * 2015-09-24 2018-05-11 东洋铝株式会社 The forming method of paste composition and germanium-silicon layer
WO2017051775A1 (en) * 2015-09-24 2017-03-30 東洋アルミニウム株式会社 Paste composition and method for forming silicon germanium layer
EP3355340B1 (en) * 2015-09-24 2020-09-09 Toyo Aluminium Kabushiki Kaisha Use of paste composition and method for forming silicon germanium layer
US10916423B2 (en) 2015-09-24 2021-02-09 Toyo Aluminium Kabushiki Kaisha Paste composition and method for forming silicon germanium layer

Also Published As

Publication number Publication date
JP3374194B2 (en) 2003-02-04

Similar Documents

Publication Publication Date Title
JP3374194B2 (en) Composition for conductive aluminum paste
US3902102A (en) Ceramic capacitor with base metal electrodes
JPH08253342A (en) Thick film paste composition containing no cadmium and lead
JPS6130365B2 (en)
KR0142577B1 (en) Reristance masses for firing under nirogen
JP4174051B2 (en) Resistor paste, resistor and electronic components
JP2001222912A (en) Conductive paste and ceramic electronic part
JP2003077336A (en) Conductive paste and laminated ceramic capacitor using the same
JP3230394B2 (en) Porcelain capacitors
JP2003257242A (en) Thick membrane resistor paste
JPS6210552B2 (en)
JPH11340090A (en) Manufacture of grain boundary insulated multilayer ceramic capacitor
JPH08273434A (en) Conductive aluminum alloy paste composition
JP2006261350A (en) Resistor paste and resistor
JP2002280248A (en) Copper paste composition for external electrode, and stacked ceramic capacitor using the same
EP0033979B1 (en) Thick film silver compositions for silver terminations for reduced barium titanate capacitors
JPH06243788A (en) Discharge display tube
JP3829959B2 (en) Dielectric material for plasma display panel
JPS6127003A (en) Conductive paste composition
JPH0589718A (en) Conductor paste
WO2021221174A1 (en) Thick film resistor paste, thick film resistor, and electronic component
JP2937073B2 (en) Resistance material composition, resistance paste and resistor
JP2841586B2 (en) Conductive paste
WO2021221175A1 (en) Thick film resistor paste, thick film resistor, and electronic component
KR910001506B1 (en) Conductive paste composition

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071129

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081129

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees