JPH05291765A - Electronic circuit board mounter and its mounting method - Google Patents

Electronic circuit board mounter and its mounting method

Info

Publication number
JPH05291765A
JPH05291765A JP9047092A JP9047092A JPH05291765A JP H05291765 A JPH05291765 A JP H05291765A JP 9047092 A JP9047092 A JP 9047092A JP 9047092 A JP9047092 A JP 9047092A JP H05291765 A JPH05291765 A JP H05291765A
Authority
JP
Japan
Prior art keywords
circuit board
electric circuit
hole
pin
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9047092A
Other languages
Japanese (ja)
Inventor
Masayuki Inoue
雅之 井上
Hideyuki Fujishima
秀幸 藤嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP9047092A priority Critical patent/JPH05291765A/en
Publication of JPH05291765A publication Critical patent/JPH05291765A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PURPOSE:To easily remove a board from a pin without the margin of the through hole of a board getting caught between the head of a mounting pin and a support by giving a projection to the introduction part of a pin for attachment of a board. CONSTITUTION:An introduction part 22 is equipped with a projection 24 which projects in the opposite direction to the groove 13 of a through hole 12a and the side face 24a of which forms the same face as the periphery of the head 21. In case of removing a board 11 from a pin 20, the board 11 is shifted horizontally in Z direction until the inside margin of the through hole 12 abuts on the side face 24a of the projection. Hereby, the positions of the through hole 12 of the board 11 and the head 21 of the pin 20 are decided easily, and the board 11 can be removed of the pin 20 without the margin of the through hole 12 getting caught between the head 21 and the support 23.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電気回路基板取付装置と
その取付方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric circuit board mounting device and a mounting method thereof.

【0002】[0002]

【従来の技術】近年、電気回路基板を筐体内部に固定す
る方法は、様々な手段が提案されている。電気回路基板
の筐体への取付けを容易にすることにより作業工数を減
少させるとともに、保守管理時に分解組立性を向上させ
るため従来のねじ止め式とは異なる方法が要求されてい
る。
2. Description of the Related Art In recent years, various means have been proposed as a method for fixing an electric circuit board inside a housing. There is a demand for a method different from the conventional screw-fastening method in order to reduce the number of work steps by facilitating the attachment of the electric circuit board to the housing and to improve the disassembly and assembly during maintenance management.

【0003】以下に従来の電気回路基板取付装置とその
取付方法について説明する。図1において11は電気回
路基板(以下、基板という)、12は基板11を取付け
る際に取付用のピンの頭部が貫通するための貫通孔、1
3は貫通孔12の直径よりも幅の狭い溝である。図6に
おいて31は貫通孔12の直径よりも小さな直径を持つ
頭部、32はピン30の溝13の幅よりも小さな直径を
持つ導入部、33は貫通孔12よりも大きな直径を持つ
基板11を支える支持部である。
A conventional electric circuit board mounting device and its mounting method will be described below. In FIG. 1, 11 is an electric circuit board (hereinafter referred to as a board), 12 is a through hole through which a head of a mounting pin penetrates when the board 11 is mounted, 1
Reference numeral 3 is a groove having a width narrower than the diameter of the through hole 12. In FIG. 6, 31 is a head having a diameter smaller than the diameter of the through hole 12, 32 is an introducing portion having a diameter smaller than the width of the groove 13 of the pin 30, and 33 is a substrate 11 having a diameter larger than the through hole 12. It is a support part that supports.

【0004】上記のように構成された基板11とピン3
0を用いて基板11を筐体(図示していない)に取付け
る手順を説明する。基板11を図7に示すように筐体側
に固定されたピン30の頭部31を貫通孔12に合わせ
る。この状態で基板11は支持部33によって支えられ
る。さらに基板11を図8の甲の方向に水平移動するこ
とにより導入部22が基板11の溝13に入り基板11
は頭部31により上方からも固定される。この状態で水
平方向に対する固定を行うことにより基板11は筐体に
固定される。また基板11を取り外す際には図9に示す
ように基板11を乙の方向に水平移動させ、頭部31の
位置まで貫通孔12を移動し、その状態で基板11を上
方に持ち上げることにより取り外しを行う。
The substrate 11 and the pins 3 configured as described above
A procedure for attaching the substrate 11 to the housing (not shown) using 0 will be described. As shown in FIG. 7, the head 31 of the pin 30 fixed to the housing of the board 11 is aligned with the through hole 12. In this state, the substrate 11 is supported by the supporting portion 33. Further, by horizontally moving the substrate 11 in the direction of the upper side of FIG.
Is also fixed from above by the head 31. By fixing the substrate 11 in the horizontal direction in this state, the substrate 11 is fixed to the housing. When removing the substrate 11, the substrate 11 is horizontally moved in the direction of B as shown in FIG. I do.

【0005】[0005]

【発明が解決しようとする課題】しかしながらこの従来
例では、図9に示すように基板11を取り外す際に貫通
孔12と頭部31を正確に位置決めしないと貫通孔12
の内縁が頭部31と支持部33の間に入ってしまい基板
11を取り外すことができなくなる。さらに筐体に設け
られている複数の取付けピンの一部でこの現象が発生し
た場合に無理に基板11を持ち上げることによって基板
11を破損してしまうという問題があった。本発明はこ
のような問題を解決するもので、容易にピンから基板を
取り外しができる電気回路基板取付装置とその取付方法
を提供することを目的とする。
However, in this prior art example, as shown in FIG. 9, the through hole 12 and the head portion 31 must be accurately positioned when removing the substrate 11, as shown in FIG.
Since the inner edge of the substrate enters between the head portion 31 and the support portion 33, the substrate 11 cannot be removed. Further, when this phenomenon occurs in some of the plurality of mounting pins provided on the housing, there is a problem that the substrate 11 is forcibly lifted and damaged. The present invention solves such a problem, and an object of the present invention is to provide an electric circuit board mounting device and a mounting method thereof, by which a substrate can be easily removed from a pin.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
本発明の電気回路基板取付装置は、導入部に貫通孔の溝
の反対方向に突出し、その突出面が頭部の外周と同一面
を形成する突起を設けることにより、電気回路基板をピ
ンから取り外す際、貫通孔の内縁が頭部と支持部の間に
入り込むのを防止するものである。
In order to achieve the above object, an electric circuit board mounting device of the present invention has an introduction portion projecting in a direction opposite to a groove of a through hole, and the projecting surface is flush with the outer periphery of the head. By providing the projection to be formed, the inner edge of the through hole is prevented from entering between the head portion and the support portion when the electric circuit board is removed from the pin.

【0007】[0007]

【作用】この構成により、電気回路基板をピンから取り
外す際、電気回路基板を水平移動してピンの導入部の突
出面を基板の貫通孔の内縁に当接した後、電気回路基板
を上方に移動することにより、電気回路基板を容易にピ
ンから取り外すことができることとなる。
With this configuration, when the electric circuit board is removed from the pin, the electric circuit board is horizontally moved so that the projecting surface of the lead-in portion of the pin abuts the inner edge of the through hole of the board, and then the electric circuit board is moved upward. By moving, the electric circuit board can be easily removed from the pins.

【0008】[0008]

【実施例】以下本発明の一実施例の電気回路基板取付装
置とその取付方法について図面を参照して説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An electric circuit board mounting device and a mounting method thereof according to an embodiment of the present invention will be described below with reference to the drawings.

【0009】図1,図2において、基板11は、筐体
(図示していない)に固定されたピン20の頭部21が
貫通する貫通孔12と、貫通孔12の一端側と連続した
ピン20の導入部22が導入される貫通孔12の径より
幅の狭い溝13とを備え、ピン20は、下部に設けられ
た貫通孔12より大径の基板11を支持する支持部23
と、支持部23の上方に設けられた溝13の幅より小径
の導入部22と、導入部22の上方に設けられた貫通孔
12より小径で、かつ溝13の幅より大径の頭部21と
を備え、導入部22に貫通孔12の溝13の反対方向に
突出し、その突出面24aが頭部21の外周と同一面を
形成する突起24を備えている。
1 and 2, the substrate 11 has a through hole 12 through which a head portion 21 of a pin 20 fixed to a housing (not shown) penetrates, and a pin which is continuous with one end side of the through hole 12. 20 is provided with a groove 13 having a width narrower than the diameter of the through hole 12 into which the introducing portion 22 is introduced, and the pin 20 has a supporting portion 23 that supports the substrate 11 having a diameter larger than that of the through hole 12 provided in the lower portion.
And an introduction part 22 having a diameter smaller than the width of the groove 13 provided above the support part 23, and a head having a diameter smaller than that of the through hole 12 provided above the introduction part 22 and larger than the width of the groove 13. 21 and a protrusion 24 that protrudes in the introduction portion 22 in the direction opposite to the groove 13 of the through hole 12 and has a protrusion surface 24 a that is flush with the outer periphery of the head portion 21.

【0010】本実施例のピン20に対する基板11の取
付方法は従来例の図7,図8に示す方法と同様である
が、基板11をピン20から取り外す場合は、図4に示
すように、貫通孔12の内縁を突起24の突起面24a
に当接するまで乙の方向に基板11を水平移動する。こ
の時点で基板11の貫通孔12とピン20の頭部21の
位置決めが自動的になされる。この状態から図5に示す
ように、上方に基板11を持ち上げることによって基板
11をピン20から取り外すことができる。
The method of attaching the board 11 to the pins 20 of this embodiment is the same as the method shown in FIGS. 7 and 8 of the conventional example, but when the board 11 is removed from the pins 20, as shown in FIG. The inner surface of the through hole 12 is formed with the protrusion surface 24a of the protrusion 24.
The substrate 11 is horizontally moved in the direction of B until it touches. At this time, the through hole 12 of the substrate 11 and the head 21 of the pin 20 are automatically positioned. From this state, as shown in FIG. 5, the substrate 11 can be removed from the pin 20 by lifting the substrate 11 upward.

【0011】以上のように本実施例によれば、基板11
の取り外しの際に貫通孔12の内縁が突起24の突出面
24aに当接することによって基板11の貫通孔12と
ピン20の頭部21の位置が容易に決まり、貫通孔12
の縁がピン20の頭部21と支持部23の間に引っ掛か
ることなく容易にピン20から基板11を取り外すこと
ができる。
As described above, according to this embodiment, the substrate 11
When the inner edge of the through hole 12 abuts the projecting surface 24a of the protrusion 24 when removing, the positions of the through hole 12 of the substrate 11 and the head 21 of the pin 20 are easily determined, and the through hole 12
The substrate 11 can be easily removed from the pin 20 without the edge of the pin being caught between the head portion 21 of the pin 20 and the support portion 23.

【0012】[0012]

【発明の効果】以上の実施例の説明により明らかなよう
に本発明の電気回路基板の取付方法によれば、基板取付
用のピンの導入部に突起を付けることによって、基板を
筐体から取り外す場合、基板の孔の縁を突起に当接する
ことによって基板の貫通孔と取付用ピンの頭部の位置が
容易に決まり基板の貫通孔の縁が取付用ピンの頭部と支
持部の間に引っ掛かることなく容易に基板をピンから取
り外すことができる電気回路基板取付装置とその取付方
法を提供するものである。
As is apparent from the above description of the embodiments, according to the electric circuit board mounting method of the present invention, the board is removed from the housing by providing the projections of the board mounting pins. In this case, the position of the through hole of the board and the head of the mounting pin can be easily determined by bringing the edge of the hole of the board into contact with the protrusion so that the edge of the through hole of the board is between the head of the mounting pin and the supporting portion. Provided is an electric circuit board mounting device and a mounting method thereof, which can easily remove a board from a pin without being caught.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例および従来の電気回路基板取
付装置の電気回路基板の貫通孔の形状を示す斜視図
FIG. 1 is a perspective view showing a shape of a through hole of an electric circuit board of an embodiment of the present invention and a conventional electric circuit board mounting device.

【図2】(a)本発明の一実施例の電気回路基板取付装
置の取付用のピンの形状を示す平面図 (b)同正面図
FIG. 2A is a plan view showing a shape of a mounting pin of an electric circuit board mounting device according to an embodiment of the invention. FIG.

【図3】同電気回路基板を固定した状態を示す斜視図FIG. 3 is a perspective view showing a state in which the electric circuit board is fixed.

【図4】同電気回路基板を取り外す方法を示す斜視図FIG. 4 is a perspective view showing a method for removing the electric circuit board.

【図5】同電気回路基板を取り外した状態を示す斜視図FIG. 5 is a perspective view showing a state in which the electric circuit board is removed.

【図6】(a)従来の電気回路基板取付装置に用いる取
付用のピンの形状を示す平面図 (b)同正面図
FIG. 6 (a) is a plan view showing the shape of a mounting pin used in a conventional electric circuit board mounting device. FIG.

【図7】同電気回路基板を固定する方法を示す斜視図FIG. 7 is a perspective view showing a method for fixing the electric circuit board.

【図8】同電気回路基板を固定した状態を示す斜視図FIG. 8 is a perspective view showing a state in which the electric circuit board is fixed.

【図9】同電気回路基板を取り外す場合の問題点を説明
する斜視図
FIG. 9 is a perspective view illustrating a problem when the electric circuit board is removed.

【符号の説明】[Explanation of symbols]

11 電気回路基板 12 貫通孔 13 溝 20 ピン 21 頭部 22 導入部 23 支持部 24 突起 24a 突出面 11 Electric Circuit Board 12 Through Hole 13 Groove 20 Pin 21 Head 22 Introduction Part 23 Supporting Part 24 Protrusion 24a Projecting Surface

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 電子部品が搭載された電気回路基板と、
この電気回路基板を筐体に固定するピンを主体として構
成する電気回路基板取付装置であって、前記電気回路基
板は、前記ピンの頭部が貫通する貫通孔と、この貫通孔
の一端側と連続した前記ピンの導入部が導入される前記
貫通孔の径より幅の狭い溝とを備え、前記ピンは、下部
に設けられた前記貫通孔より大径の前記電気回路基板を
支持する支持部と、この支持部の上方に設けられた前記
溝の幅より小径の導入部と、この導入部の上方に設けら
れた前記貫通孔より小径で、かつ前記溝の幅より大径の
頭部とを備え、前記導入部に、前記貫通孔の溝の反対方
向に突出し、その突出面が前記頭部の外周と同一面を形
成する突起を具備した電気回路基板取付装置。
1. An electric circuit board on which an electronic component is mounted,
An electric circuit board mounting device mainly composed of pins for fixing the electric circuit board to a housing, wherein the electric circuit board has a through hole through which a head of the pin penetrates, and one end side of the through hole. A support part for supporting the electric circuit board having a diameter smaller than the diameter of the through hole into which the continuous introduction part of the pin is introduced, the pin supporting the electric circuit board having a diameter larger than that of the through hole provided in the lower part. And an introduction part having a diameter smaller than the width of the groove provided above the support part, and a head having a diameter smaller than the through hole provided above the introduction part and having a diameter larger than the width of the groove. An electric circuit board mounting device, comprising: a protrusion that protrudes in a direction opposite to the groove of the through hole and has a protrusion surface that is flush with the outer periphery of the head.
【請求項2】 電子部品が搭載された電気回路基板を筐
体に固定されたピンにより前記筐体に固定する電気回路
基板取付方法であって、前記電気回路基板は、前記ピン
の頭部が貫通する貫通孔と、この貫通孔の一端側と連続
した前記ピンの導入部が導入される前記貫通孔の径より
幅の狭い溝とを備え、前記ピンは、下部に設けられた前
記貫通孔より大径の前記電気回路基板を支持する支持部
と、この支持部の上方に設けられた前記溝の幅より小径
の導入部と、この導入部の上方に設けられた前記貫通孔
より小径で、かつ前記溝の幅より大径の頭部とを備え、
前記導入部に、前記貫通孔の溝の反対方向に突出し、そ
の突出面が前記頭部の外周と同一面を形成する突起を備
え、前記電気回路基板を前記ピンに固定する際は、前記
頭部を前記貫通孔に軸合わせし、前記電気回路基板を下
方に移動して電気回路基板の下面に支持部の上面を当接
した後、前記電気回路基板を水平移動して前記導入部を
前記溝に導入して固定し、前記電気回路基板を前記ピン
から取り外す際は、前記電気回路基板を水平移動して前
記導入部の突出面を貫通孔の内縁に当接した後、前記電
気回路基板を上方に移動して取り外す電気回路基板取付
方法。
2. An electric circuit board mounting method for fixing an electric circuit board on which an electronic component is mounted to the housing by a pin fixed to the housing, wherein the electric circuit board has a head portion of the pin. A through hole that penetrates the groove and a groove that is narrower in diameter than the diameter of the through hole into which the introduction portion of the pin that is continuous with the one end side of the through hole are provided, and the pin is the through hole that is provided in the lower portion. With a support portion supporting the electric circuit board having a larger diameter, an introduction portion having a diameter smaller than the width of the groove provided above the support portion, and a diameter smaller than the through hole provided above the introduction portion. And a head having a diameter larger than the width of the groove,
The lead-in portion is provided with a protrusion that projects in the direction opposite to the groove of the through hole, and the projecting surface thereof forms the same plane as the outer periphery of the head, and when fixing the electric circuit board to the pin, the head A portion of the electric circuit board, the electric circuit board is moved downward to bring the lower surface of the electric circuit board into contact with the upper surface of the support portion, and then the electric circuit board is horizontally moved to move the introduction portion When the electric circuit board is introduced into the groove and fixed, and the electric circuit board is removed from the pin, the electric circuit board is horizontally moved to bring the protruding surface of the introduction portion into contact with the inner edge of the through hole, and then the electric circuit board. How to attach the electric circuit board by moving it upwards and removing it.
JP9047092A 1992-04-10 1992-04-10 Electronic circuit board mounter and its mounting method Pending JPH05291765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9047092A JPH05291765A (en) 1992-04-10 1992-04-10 Electronic circuit board mounter and its mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9047092A JPH05291765A (en) 1992-04-10 1992-04-10 Electronic circuit board mounter and its mounting method

Publications (1)

Publication Number Publication Date
JPH05291765A true JPH05291765A (en) 1993-11-05

Family

ID=13999484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9047092A Pending JPH05291765A (en) 1992-04-10 1992-04-10 Electronic circuit board mounter and its mounting method

Country Status (1)

Country Link
JP (1) JPH05291765A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239007A (en) * 2008-03-27 2009-10-15 Fujifilm Corp Flexible circuit board, flexible circuit board positioning method, flexible circuit board positioning structure, droplet ejection head and image forming device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239007A (en) * 2008-03-27 2009-10-15 Fujifilm Corp Flexible circuit board, flexible circuit board positioning method, flexible circuit board positioning structure, droplet ejection head and image forming device
JP4625106B2 (en) * 2008-03-27 2011-02-02 富士フイルム株式会社 Flexible substrate positioning method, flexible substrate positioning structure, droplet discharge head, and image forming apparatus

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