JPH05290633A - Transparent conductive base and manufacture thereof - Google Patents
Transparent conductive base and manufacture thereofInfo
- Publication number
- JPH05290633A JPH05290633A JP4088980A JP8898092A JPH05290633A JP H05290633 A JPH05290633 A JP H05290633A JP 4088980 A JP4088980 A JP 4088980A JP 8898092 A JP8898092 A JP 8898092A JP H05290633 A JPH05290633 A JP H05290633A
- Authority
- JP
- Japan
- Prior art keywords
- transparent conductive
- substrate member
- overcoat layer
- substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Laminated Bodies (AREA)
- Surface Treatment Of Glass (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、タッチパネル，液晶装
置又はエレクトロルミネセント表示素子等における透明
電極等として用いられる透明導電性基板とその製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent conductive substrate used as a transparent electrode or the like in a touch panel, a liquid crystal device, an electroluminescent display element or the like, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】一般に透明導電膜は、インジウム−錫酸
化物（ＩＴＯ）や錫−アンチモン酸化物（ＡＴＯ）等の
酸化物をスパッター法やＣＶＤ法によりガラス又はプラ
スチックフィルム上に成膜して得られるが、これらの方
法は高価な装置を必要とし、生産性が低く而も分止りが
悪いため安価に得ることは困難であり、又大面積の膜を
得るのに適していない。2. Description of the Related Art Generally, a transparent conductive film is obtained by forming an oxide such as indium-tin oxide (ITO) or tin-antimony oxide (ATO) on a glass or plastic film by a sputtering method or a CVD method. However, these methods require expensive equipment, have low productivity, and are difficult to obtain because they are difficult to obtain at low cost, and are not suitable for obtaining a large-area membrane.
【０００３】そこで、従来これらの問題を解決するため
に、可視光の波長よりも粒径の小さい導電性超微粉を含
む透明導電インクを基板に印刷し硬化させて透明導電回
路を形成する印刷法が行われて来た。Therefore, in order to solve these problems, a printing method of forming a transparent conductive circuit by printing a transparent conductive ink containing a conductive ultrafine powder having a particle size smaller than the wavelength of visible light on a substrate and curing it to form a transparent conductive circuit. Has been done.
【０００４】[0004]
【発明が解決しようとする課題】ところで、この透明導
電インクは、導電性超微粉をフイラーとし、熱可塑性樹
脂，熱硬化性樹脂又は紫外線硬化性樹脂等の添加剤を含
んでいる。そして、この透明導電インクをガラスやプラ
スチックフィルム上に印刷した後硬化（乾燥硬化，熱硬
化，紫外線硬化）させると、フイラーとしての導電性超
微粉がバインダーとしての樹脂により相互に接触した状
態で固定されて、導電性塗膜となる。従って、バインダ
ーとして用いられる樹脂の量が多過ぎても少な過ぎても
塗膜特性を悪くする。即ち、バインダー量が多過ぎる
と、フイラー粒子間にバインダーが介在して粒子同志の
接触を妨害するため、塗膜の表面抵抗が増大する。逆
に、バインダー量が少なくなると、フイラー粒子の接触
は良好で塗膜の表面抵抗は低下して行くが、粒子間の隙
間を完全に埋めるだけの樹脂量が存在しないため粒子間
に空隙が生じ、この空隙が光の散乱因子となって塗膜の
光学特性である光の透過率が低下し、塗膜のヘーズ値
（くもりの度合）が増大すると同時に膜強度や密着力が
低下して行く。このような理由により、バインダーとし
て用いる樹脂量には最適値が存在するが、例えば、抵抗
を重視すれば塗膜のヘーズ値が増大して光学的には不十
分な膜となり、結局従来の印刷法では、塗膜の表面抵抗
と光学特性（光線透過率とヘーズ値）に対する要求を共
に満足させることは不可能であった。By the way, this transparent conductive ink uses conductive ultrafine powder as a filler and contains additives such as a thermoplastic resin, a thermosetting resin or an ultraviolet curable resin. When this transparent conductive ink is printed on glass or plastic film and then cured (dry cure, heat cure, UV cure), the conductive ultrafine powder as a filler is fixed in a state where they are in contact with each other by a resin as a binder. As a result, a conductive coating film is formed. Therefore, if the amount of the resin used as the binder is too large or too small, the coating film characteristics are deteriorated. That is, when the amount of the binder is too large, the binder intervenes between the filler particles and interferes with the contact between the particles, so that the surface resistance of the coating film increases. On the other hand, when the amount of the binder decreases, the contact of the filler particles is good and the surface resistance of the coating film decreases, but voids occur between the particles because there is not enough resin to completely fill the gaps between the particles. , The voids act as a light scattering factor and the light transmittance, which is an optical property of the coating film, decreases, and the haze value (degree of cloudiness) of the coating film increases, and at the same time, the film strength and the adhesive force decrease. .. For this reason, there is an optimum value for the amount of resin used as the binder, but for example, if importance is attached to the resistance, the haze value of the coating film increases and the film becomes an optically inadequate film. With the method, it was impossible to satisfy both the requirements for surface resistance and optical properties (light transmittance and haze value) of the coating film.
【０００５】また、ＩＴＯ超微粒子を含むインクをガラ
ス等の基板に塗布した後５００℃以上の高温で焼成する
ことにより透明導電膜を形成する方法も行われている。
この方法では、高温でＩＴＯ超微粒子同志が緩やかに焼
結するために、常温で行う上記印刷法に較べて膜の表面
抵抗は著しく低下するが、基板としてポリエステル等の
プラスチックフィルムを用いることはできず、又ＩＴＯ
超微粒子間に空隙が残るため透明導電膜の光学特性につ
いては印刷法と同様に問題があった。Another method is also used in which an ink containing ITO ultrafine particles is applied to a substrate such as glass and then baked at a high temperature of 500 ° C. or higher to form a transparent conductive film.
In this method, since the ITO ultrafine particles are gently sintered at a high temperature, the surface resistance of the film is remarkably reduced as compared with the above printing method performed at a normal temperature, but a plastic film such as polyester cannot be used as a substrate. No, also ITO
Since the voids remain between the ultrafine particles, the optical properties of the transparent conductive film have the same problems as in the printing method.
【０００６】本発明は、従来の技術の有するこのような
問題点に鑑みてなされたものであり、その目的とすると
ころは、表面抵抗が低く且つ光学特性の優れた透明導電
性基板及びその製造方法を提供しようとするものであ
る。The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to provide a transparent conductive substrate having a low surface resistance and excellent optical characteristics and its manufacture. It is intended to provide a method.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明による透明導電性基板は、可視光線を透過す
る基板部材と、基板部材上に形成された透明なオーバー
コート層と、このオーバーコート層の表面上に焼成され
た導電性の超微粒子から成る透明導電層とを備えてい
る。In order to achieve the above object, a transparent conductive substrate according to the present invention comprises a substrate member that transmits visible light, a transparent overcoat layer formed on the substrate member, and And a transparent conductive layer made of fired conductive ultrafine particles on the surface of the overcoat layer.
【０００８】又、本発明によれば、この透明導電性基板
は、基材上に透明導電インクを印刷又は塗布して乾燥し
た後焼成して透明導電膜を形成し、次にこの透明導電膜
上に樹脂と溶剤から成るオーバーコート液を塗布してオ
ーバーコート層を形成し、次にこのオーバーコート層上
に基板部材を貼り合わせた後加熱処理し、その後オーバ
ーコート層を硬化させることにより基材と基板部材とを
接着させ、最後にその基材を剥離することにより基板部
材上にオーバーコート層と透明導電膜を転写させて、製
造される。According to the present invention, the transparent conductive substrate is printed or coated with a transparent conductive ink on a base material, dried and baked to form a transparent conductive film, and then the transparent conductive film is formed. An overcoat liquid consisting of a resin and a solvent is applied onto the overcoat layer to form an overcoat layer, and then a substrate member is bonded onto the overcoat layer, followed by heat treatment, and then the overcoat layer is cured to form a base material. It is manufactured by adhering the material and the substrate member, and finally peeling the base material to transfer the overcoat layer and the transparent conductive film onto the substrate member.
【０００９】本発明によれば、基材としてガラス板が用
いられ、基板部材としてポリエステル（ＰＥＴ）やポリ
エーテルサルフオン等の可視光線を透過する物質が用い
られ、透明導電インクとしてインジウム−錫酸化物の超
微粒子を溶剤又は樹脂を溶解した溶剤に分散させた液が
用いられ、オーバーコート液として紫外線硬化性樹脂溶
液又は熱硬化性樹脂溶液が用いられ得、焼成は先づ大気
中４００℃で次に不活性ガス雰囲気中４００℃以上で行
われる。According to the present invention, a glass plate is used as a substrate, a visible light-transmitting substance such as polyester (PET) or polyether sulfone is used as a substrate member, and indium-tin oxide is used as a transparent conductive ink. A liquid in which the ultrafine particles of the product are dispersed in a solvent or a solvent in which a resin is dissolved can be used, and an ultraviolet-curable resin solution or a thermosetting resin solution can be used as an overcoat liquid. Next, it is performed at 400 ° C. or higher in an inert gas atmosphere.
【００１０】[0010]
【作用】基材としてガラス板が用いられるため、得られ
る透明導電性基板表面の平滑度は、このガラス板表面の
平滑度となる。従来の印刷法では、２〜５μｍの膜厚で
印刷するため、印刷された部分と基板表面との間で２〜
５μｍの凹凸が生じるが、本発明方法によれば、この凹
凸を０．２μｍ以下に抑えることができる。Since the glass plate is used as the base material, the smoothness of the surface of the transparent conductive substrate obtained is the smoothness of the surface of the glass plate. In the conventional printing method, since the printing is performed with a film thickness of 2 to 5 μm, it is possible to print 2 to between the printed portion and the substrate surface.
Although unevenness of 5 μm occurs, the unevenness can be suppressed to 0.2 μm or less by the method of the present invention.
【００１１】基材上への印刷にはスクリーン印刷法やグ
ラビア印刷法等が用いられ、又塗布にはワイヤーバーコ
ーティング法，ドクターブレードコーティング法，ロー
ルコーティング法等が用いられる。透明導電インクの粘
度はアクリル等の樹脂を添加することにより調節され
る。A screen printing method, a gravure printing method or the like is used for printing on the substrate, and a wire bar coating method, a doctor blade coating method, a roll coating method or the like is used for coating. The viscosity of the transparent conductive ink is adjusted by adding a resin such as acrylic resin.
【００１２】基材上に透明導電インクを印刷又は塗布し
乾燥した後、大気中で約４００℃に加熱してインク中の
樹脂及び少量残留している溶剤を酸化燃焼させ、更に不
活性ガス雰囲気中で４００℃以上に加熱して、ＩＴＯ超
微粒子間の焼結を促進させると同時にＩＴＯに酸素欠損
を導入して、導電膜の低抵抗化を行う。透明導電膜の特
性は、ＩＴＯ膜の膜厚により決まるが、例えば５５０℃
の焼成では約１μｍの膜厚で約３０Ω／□程度の抵抗値
の膜が得られる。After the transparent conductive ink is printed or coated on the substrate and dried, the transparent resin is heated to about 400 ° C. in the atmosphere to oxidize and burn the resin remaining in the ink and a small amount of the remaining solvent, and further in an inert gas atmosphere. In order to accelerate the sintering between the ITO ultrafine particles, oxygen vacancies are introduced into the ITO to lower the resistance of the conductive film. The characteristics of the transparent conductive film are determined by the thickness of the ITO film, for example, 550 ° C.
By firing, a film having a resistance value of about 30 Ω / □ is obtained with a film thickness of about 1 μm.
【００１３】このようにして、ガラス板上に低抵抗のＩ
ＴＯ透明導電膜を形成することができるが、形成された
ＩＴＯ膜には粒子間に空隙が存在し光を散乱させるた
め、膜の光学特性にも問題があり、このままでは透明導
電膜として用いるのに不十分である。そこで、焼成した
ＩＴＯ膜をオーバーコート液でオーバーコートした後、
透明なフィルム等から成る基板部材上に転写することに
より、これらの問題を解決した。オーバーコート液に
は、紫外線硬化性樹脂又は熱硬化性樹脂を溶剤で希釈し
たものを用いるが、このオーバーコート液を塗布して溶
剤の乾燥を行うと、樹脂分がＩＴＯ粒子間の間隙を埋め
て光の散乱が減少し、膜の光学特性が著しく向上する。
この状態ではオーバーコート液中の樹脂分は未だ硬化し
ていないので、これを可視光線に対し透明なプラスチッ
クフィルム等から成る基板部材と貼り合わせた後、樹脂
を紫外線又は熱により硬化させ、基材であるガラス板と
基板部材とを接着させる。貼り合わせは、スチールロー
ル又はゴムロール等を用い、２〜３kg／cmの線圧力で行
う。In this way, the low resistance I
A TO transparent conductive film can be formed, but since the formed ITO film has a gap between particles and scatters light, there is a problem in the optical characteristics of the film. Is insufficient. Therefore, after overcoating the baked ITO film with an overcoat solution,
These problems were solved by transferring onto a substrate member made of a transparent film or the like. As the overcoat liquid, an ultraviolet curable resin or a thermosetting resin diluted with a solvent is used. When the overcoat liquid is applied and the solvent is dried, the resin component fills the gaps between the ITO particles. Light scattering is reduced and the optical properties of the film are significantly improved.
In this state, the resin component in the overcoat liquid is not yet cured, so after bonding this with a substrate member made of a plastic film or the like that is transparent to visible light, the resin is cured by ultraviolet rays or heat to form a base material. The glass plate and the substrate member are bonded together. The lamination is performed by using a steel roll, a rubber roll or the like at a linear pressure of 2 to 3 kg / cm.
【００１４】このようにして基材と基板部材を接着した
後基材を基板部材から剥がすと、基材上のＩＴＯ膜は基
板部材上に転写される。この場合、ＩＴＯ膜が基材から
基板部材へ完全に転写されるようにするためには、基板
部材とオーバーコート層との間の密着力が大きいことが
必要で、基板部材としてプラスチックを用いる場合は、
コロナ放電処理，プライマー処理，短波長紫外線照射処
理等の密着力向上処理を行う必要がある。When the substrate is peeled from the substrate member after the substrate and the substrate member are thus bonded, the ITO film on the substrate is transferred onto the substrate member. In this case, in order to completely transfer the ITO film from the base material to the substrate member, it is necessary that the adhesive force between the substrate member and the overcoat layer is large, and when plastic is used as the substrate member. Is
It is necessary to perform adhesion improvement treatments such as corona discharge treatment, primer treatment, and short wavelength ultraviolet ray irradiation treatment.
【００１５】上述のような密着向上処理を行っても、基
材としてのガラス板上に焼成されたＩＴＯ導電膜はガラ
スとの密着力が高いため、基板部材へのＩＴＯ導電膜の
転写は困難である。そこで本発明では基材と基板部材を
貼り合わせた後全体を加熱してからオーバーコート層を
硬化させる。一般にガラスよりも樹脂部分（プラスチッ
クの基板部材及びオーバーコート層）は、約１０倍程度
熱膨張係数が大きいため、高温で硬化させた後常温まで
冷却すると、ガラス板と樹脂部分の間に膨張係数の差に
よる応力が生じ、この応力分だけガラス板とオーバーコ
ート層との間の密着力が低下して、転写が可能となるの
である。Even if the adhesion improving treatment as described above is performed, it is difficult to transfer the ITO conductive film to the substrate member because the ITO conductive film baked on the glass plate as the base material has a high adhesion to the glass. Is. Therefore, in the present invention, after the base material and the substrate member are bonded together, the whole is heated and then the overcoat layer is cured. Generally, the resin portion (plastic substrate member and overcoat layer) has a thermal expansion coefficient about 10 times larger than that of glass. Therefore, when the resin portion is cured at high temperature and then cooled to room temperature, the expansion coefficient between the glass plate and the resin portion is increased. A stress is generated due to the difference between the two, and the adhesive force between the glass plate and the overcoat layer is reduced by the amount of this stress, and transfer is possible.
【００１６】基板部材に転写されたＩＴＯ膜は、オーバ
ーコート層の存在により光学特性が著しく改善され、ま
た高温で焼成して形成されるため、従来の印刷法では得
られない１００Ω／□程度の低抵抗の膜が得られる。The optical properties of the ITO film transferred to the substrate member are remarkably improved by the presence of the overcoat layer, and the ITO film is formed by baking at a high temperature. A low resistance film is obtained.
【００１７】[0017]
【実施例】実施例１ 基材としてのソーダライムガラス板（厚さ１mm）に、Ｉ
ＴＯ超微粉を溶剤に分散させた液（東北化工（株）製Ｄ
Ｘ─１０１）を、線径０．１mmのワイヤーバーで塗布し
て約８０℃で乾燥した後、大気中５５０℃で３０分続い
て窒素雰囲気下５５０℃で１０分間焼成した。これに、
オーバーコート液（紫外線硬化性樹脂（広栄化学工業
（株）製コーエイハードＭ−１０１改１１）６０重量％
と、メチルエチルケトン４０重量％から成る溶液）を、
ウエット膜厚５０μｍにオーバーコートした後、約１２
０℃で１０分間加熱して溶剤を揮発させた。これを、基
板部材としてのポリエステルフィルム（帝人（株）製プ
ライマー処理品，テトロンＨＰ−７，厚さ１００μｍ）
と貼り合わせた。貼り合わせは、スチールロールで２Kg
f/cm の線圧力を掛けて行った。貼り合わせ後、全体を
１２０℃に加熱してから直ちにメタルハライドランプで
照度１５０ｍＷ／cm2 を以て１５秒間紫外線硬化を行
い、ポリエステルフィルム（基板部材）とソーダライム
ガラス板（基材）とを接着させた。冷却後ガラス板を剥
がしてＩＴＯ導電膜をポリエステルフィルム上に転写
し、透明導電性基板を作成した。 EXAMPLE 1 A soda lime glass plate (thickness 1 mm) as a substrate was prepared by applying I
Liquid in which TO ultrafine powder is dispersed in a solvent (D manufactured by Tohoku Kako Co., Ltd.
X-101) was applied with a wire bar having a wire diameter of 0.1 mm, dried at about 80 ° C., and then baked in the atmosphere at 550 ° C. for 30 minutes and then in a nitrogen atmosphere at 550 ° C. for 10 minutes. to this,
Overcoat liquid (UV curable resin (Koei Chemical Co., Ltd. Koei Hard M-101 Kai 11) 60% by weight
And a solution consisting of 40% by weight of methyl ethyl ketone),
About 12 after overcoating to a wet film thickness of 50 μm
The solvent was volatilized by heating at 0 ° C. for 10 minutes. This is a polyester film as a substrate member (primer product manufactured by Teijin Ltd., Tetron HP-7, thickness 100 μm)
Pasted together. 2Kg with a steel roll
It was performed by applying a linear pressure of f / cm. After the bonding, the whole body was heated to 120 ° C. and immediately UV-cured with an illuminance of 150 mW / cm 2 for 15 seconds using a metal halide lamp to bond the polyester film (substrate member) and the soda lime glass plate (base material). .. After cooling, the glass plate was peeled off, and the ITO conductive film was transferred onto the polyester film to prepare a transparent conductive substrate.
【００１８】実施例２ 基材として、無アルカリガラス板（厚さ１mm）を用い、
実施例１と同様の方法でＩＴＯ膜を成膜した後、空気中
６５０℃で３０分続いて窒素雰囲気下６５０℃で１０分
間焼成した。以後は実施例１と同様の方法で透明導電性
基板を得た。 Example 2 A non-alkali glass plate (thickness 1 mm) was used as a substrate,
After forming an ITO film by the same method as in Example 1, the film was baked in air at 650 ° C. for 30 minutes and subsequently in a nitrogen atmosphere at 650 ° C. for 10 minutes. Thereafter, a transparent conductive substrate was obtained by the same method as in Example 1.
【００１９】実施例３ 基材として無アルカリガラス（厚さ１mm）を用い、ＩＴ
Ｏ分散液（東北化工（株）製ＤＸ−１０１）を線径０．
１５mmのワイヤーバーで塗布した後、約８０℃で乾燥さ
せた。これを実施例２と同様の方法及び手順で処理し
て、透明導電性基板を得た。 Example 3 A non-alkali glass (thickness 1 mm) was used as a base material, and IT
The O dispersion liquid (DX-101 manufactured by Tohoku Kako Co., Ltd.) had a wire diameter of 0.
After coating with a 15 mm wire bar, it was dried at about 80 ° C. This was treated by the same method and procedure as in Example 2 to obtain a transparent conductive substrate.
【００２０】比較例 基材としてソーダライムガラス板（厚さ１mm）を、基板
部材としてポリエステルフィルム（帝人（株）製プライ
マー処理品，テトロンＨＰ−７，厚さ１００μｍ）を夫
々用い、実施例１と同様の方法及び手順で基材と基板部
材を貼り合わせた後、オーバーコート層を１２０℃に加
熱せずに常温で紫外線硬化を行い、ＩＴＯ膜の転写を行
うことにより、透明導電性基板を作成した。 Comparative Example A soda lime glass plate (thickness: 1 mm) was used as a substrate, and a polyester film (a primer-treated product manufactured by Teijin Ltd., Tetron HP-7, thickness: 100 μm) was used as a substrate member. After bonding the base material and the substrate member by the same method and procedure as described above, ultraviolet curing is performed at room temperature without heating the overcoat layer to 120 ° C., and the ITO film is transferred to form a transparent conductive substrate. Created.
【００２１】尚、上記各実施例及び比較例において、紫
外線照射装置として、アイグラフイック（株）製のメタ
ルハライドランプＭ０１−Ｌ２１２，照射器（コールド
ミラー型）ＵＥ０１１−２０１Ｃ，電源装置ＵＢＯ１．
５１−３Ａ／ＢＭ─Ｅ２及び熱線カットフィルターを用
いた。In each of the above-mentioned examples and comparative examples, the metal halide lamps M01-L212 manufactured by Igraphic Inc., the irradiator (cold mirror type) UE011-201C, the power supply unit UBO1.
51-3A / BM-E2 and a heat ray cut filter were used.
【００２２】下記の表には、本発明方法によって得られ
た透明導電膜の表面抵抗及び光学特性が、転写前後で比
較して示されている。尚、これらの測定に際して、透明
導電膜の全光線透過率及びヘーズ値は、基板部材である
ポリエステルフィルム又は基材であるガラス板と一緒に
スガ試験機械（株）製の直読ヘーズコンピューターＨＧ
Ｍ−ＺＤＰにより、更に表面抵抗は、三菱油化（株）製
のローレスタＭＣＰ−Ｔ４００により、夫々測定した。The following table shows the surface resistance and optical characteristics of the transparent conductive film obtained by the method of the present invention before and after transfer. In these measurements, the total light transmittance and the haze value of the transparent conductive film are the same as those of the polyester film which is the substrate member or the glass plate which is the substrate, which are directly read by the Suga Test Machine Co., Ltd.
The surface resistance was measured by M-ZDP, and the surface resistance was measured by Loresta MCP-T400 manufactured by Mitsubishi Petrochemical Co., Ltd., respectively.
【００２３】 [0023]
【００２４】尚、上記実施例では、何れも基材としてガ
ラス板を用いたが、その代わりに、合成樹脂とは熱膨張
係数を異にする材料より成るローラーを用いても同様の
結果を得ることができる。In each of the above examples, the glass plate was used as the base material, but instead, a roller made of a material having a different thermal expansion coefficient from that of the synthetic resin can be used to obtain the same result. be able to.
【００２５】[0025]
【発明の効果】上述の如く本発明によれば、従来の印刷
法では得られなかった２０Ω／□程度の低い抵抗値と優
れた光学特性とを有する透明導電性基板を提供すること
ができる。As described above, according to the present invention, it is possible to provide a transparent conductive substrate having a low resistance value of about 20 Ω / □ and excellent optical characteristics which cannot be obtained by the conventional printing method.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ３２Ｂ 31/28 7141−4Ｆ Ｃ０３Ｃ 17/42 7003−4Ｇ Ｇ０２Ｆ 1/1343 9018−2Ｋ Ｈ０１Ｂ 13/00 ５０３ Ｂ 7244−5Ｇ // Ｂ３２Ｂ 27/00 Ｚ 7717−4Ｆ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location B32B 31/28 7141-4F C03C 17/42 7003-4G G02F 1/1343 9018-2K H01B 13/00 503 B 7244-5G // B32B 27/00 Z 7717-4F
Claims (7)
部材上に形成された透明なオーバーコート層と、該オー
バーコート層の表面上に焼成された導電性の超微粒子か
ら成る透明導電層とを有する透明導電性基板。1. A transparent conductive layer comprising a substrate member that transmits visible light, a transparent overcoat layer formed on the substrate member, and conductive ultrafine particles baked on the surface of the overcoat layer. And a transparent conductive substrate.
して乾燥した後焼成して透明導電膜を形成し、次に該透
明導電膜上に樹脂と溶剤から成るオーバーコート液を塗
布してオーバーコート層を形成し、次に該オーバーコー
ト層上に基板部材を貼り合わせた後加熱処理し、その後
オーバーコート層を硬化させることにより上記基材と上
記基板部材とを接着させ、最後に上記基材を剥離するこ
とにより上記基板部材上に上記オーバーコート層と透明
導電膜を転写するようにした透明導電性基板部材の製造
方法。2. A transparent conductive ink is printed or coated on a base material, dried and baked to form a transparent conductive film, and then an overcoat liquid comprising a resin and a solvent is coated on the transparent conductive film. To form an overcoat layer, then a substrate member is bonded onto the overcoat layer, followed by heat treatment, and then the overcoat layer is cured to bond the substrate and the substrate member, and finally A method for producing a transparent conductive substrate member, wherein the overcoat layer and the transparent conductive film are transferred onto the substrate member by peeling off the base material.
記載の製造方法。3. The manufacturing method according to claim 2, wherein a glass plate is used as the base material.
構成した請求項２に記載の製造方法。4. The manufacturing method according to claim 2, wherein the substrate member is made of a substance that transmits visible light.
酸化物の超微粒子を溶剤又は樹脂を溶解した溶剤に分散
させた液を用いた請求項２に記載の製造方法。5. The manufacturing method according to claim 2, wherein a liquid in which ultrafine particles of indium-tin oxide are dispersed in a solvent or a solvent in which a resin is dissolved is used as the transparent conductive ink.
樹脂溶液又は熱硬化性樹脂溶液を用いた請求項２に記載
の製造方法。6. The method according to claim 2, wherein an ultraviolet curable resin solution or a thermosetting resin solution is used as the overcoat liquid.
い、次に不活性ガス雰囲気中４００℃以上の温度で行う
請求項２に記載の製造方法。7. The manufacturing method according to claim 2, wherein the firing is first performed in the atmosphere at a temperature of 400 ° C. and then in an inert gas atmosphere at a temperature of 400 ° C. or higher.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08898092A JP3190416B2 (en) | 1992-04-09 | 1992-04-09 | Method for manufacturing transparent conductive substrate |
| TW082100971A TW434575B (en) | 1992-02-27 | 1993-02-11 | Transparent conductive substrate and method of making the same |
| US08/021,338 US5411792A (en) | 1992-02-27 | 1993-02-23 | Transparent conductive substrate |
| KR1019930002828A KR950014928B1 (en) | 1992-02-27 | 1993-02-26 | Transparent electric conduction substrate and process for making the same |
| US08/184,695 US5421926A (en) | 1992-02-27 | 1994-01-21 | Transparent conductive substrate and method of making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08898092A JP3190416B2 (en) | 1992-04-09 | 1992-04-09 | Method for manufacturing transparent conductive substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05290633A true JPH05290633A (en) | 1993-11-05 |
| JP3190416B2 JP3190416B2 (en) | 2001-07-23 |
Family
ID=13957951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08898092A Expired - Fee Related JP3190416B2 (en) | 1992-02-27 | 1992-04-09 | Method for manufacturing transparent conductive substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3190416B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009072478A1 (en) * | 2007-12-07 | 2009-06-11 | Daido Corporation | Method for producing carbon nanotube-containing conductor |
-
1992
- 1992-04-09 JP JP08898092A patent/JP3190416B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009072478A1 (en) * | 2007-12-07 | 2009-06-11 | Daido Corporation | Method for producing carbon nanotube-containing conductor |
| JP5431960B2 (en) * | 2007-12-07 | 2014-03-05 | 大同塗料株式会社 | Method for producing carbon nanotube-containing conductor |
| US8778116B2 (en) | 2007-12-07 | 2014-07-15 | Meijyo Nano Carbon Co., Ltd. | Method for producing carbon nanotube-containing conductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3190416B2 (en) | 2001-07-23 |
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