JPH05283543A - Laser stamp device - Google Patents
Laser stamp deviceInfo
- Publication number
- JPH05283543A JPH05283543A JP4074694A JP7469492A JPH05283543A JP H05283543 A JPH05283543 A JP H05283543A JP 4074694 A JP4074694 A JP 4074694A JP 7469492 A JP7469492 A JP 7469492A JP H05283543 A JPH05283543 A JP H05283543A
- Authority
- JP
- Japan
- Prior art keywords
- reflecting mirror
- laser beam
- light source
- work
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はレーザ捺印装置に関する
のであり、詳細には、TABリード型半導体装置等のワ
ークの表裏両面に品番、規格、ロット番号等をインライ
ン方式でレーザ捺印する装置を提供するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser marking device, and more particularly, to a device for laser marking a product number, a standard, a lot number, etc. on the front and back surfaces of a work such as a TAB lead type semiconductor device by an in-line method. To do.
【0002】[0002]
【従来の技術】例えば、TABリード型半導体装置
(1)の製造に際しては、図3に示すように絶縁フィル
ム(5)に設けられたインナリード(4)の先端を半導体
ペレット(2)のバンプ電極(3)に熱圧着することによ
って中間構体を製作する。この後、上記絶縁フィルム
(5)の窓部(5A)内に位置決め固定された半導体ペレ
ット(2)の表面に上記インナリード(4)の先端部分と
バンプ電極(3)を覆う樹脂(8)を塗着固化させ、ま
た、半導体ペレット(2)の裏面に樹脂膜又はAuメッ
キ膜(8A)を被着形成することによってTABリード型
半導体装置(1)を完成させている。2. Description of the Related Art For example, when manufacturing a TAB lead type semiconductor device (1), the tip of an inner lead (4) provided on an insulating film (5) is bumped onto a semiconductor pellet (2) as shown in FIG. An intermediate structure is produced by thermocompression bonding to the electrode (3). Then, a resin (8) covering the tip portion of the inner lead (4) and the bump electrode (3) on the surface of the semiconductor pellet (2) positioned and fixed in the window portion (5A) of the insulating film (5). The TAB lead-type semiconductor device (1) is completed by coating and solidifying and forming a resin film or an Au plating film (8A) on the back surface of the semiconductor pellet (2).
【0003】ところで、上記TABリード型半導体装置
(1)の表面側にある樹脂(8)の表面及びその裏面側に
ある樹脂膜又はAuメッキ膜(8A)の表面には、ユーザ
側でTABリード型半導体装置(1)を実装するときの
識別を容易にする目的で、品名、規格、製造ロット番号
等を捺印する。By the way, on the surface of the resin (8) on the front surface side of the TAB lead type semiconductor device (1) and on the surface of the resin film or Au plating film (8A) on the rear surface side thereof, the TAB lead on the user side is provided. The product name, standard, manufacturing lot number, etc. are stamped for the purpose of facilitating identification when mounting the semiconductor device (1).
【0004】従来の捺印装置としては、図3に示すレー
ザ捺印装置が使用されている。As a conventional marking device, a laser marking device shown in FIG. 3 is used.
【0005】従来のレーザ捺印装置は、図3(A)に示
すように、先ずガイドレール(6)上に位置決め固定さ
れたTABリード型半導体装置(1)の上方から第1の
光源(7A)からレーザ光線を投射し、樹脂(8)の表面
に品名や規格等を捺印した後、同一ポジション或いは別
ポジションで図3(B)に示すようにTABリード型半
導体装置(1)の下方から第2の光源(7B)からレーザ
光線を投射し、樹脂膜又はAuメッキ膜(8A)の表面に
残余の必要事項、例えばロット番号等を捺印するように
している。In the conventional laser marking device, as shown in FIG. 3A, first, a first light source (7A) is placed from above a TAB lead type semiconductor device (1) which is positioned and fixed on a guide rail (6). After projecting a laser beam from the resin (8) and marking the product name, standard, etc. on the surface of the resin (8), at the same position or at another position, as shown in FIG. A laser beam is projected from the second light source (7B) to imprint remaining necessary items such as lot numbers on the surface of the resin film or Au plating film (8A).
【0006】[0006]
【発明が解決しようとする課題】図3に示す従来装置を
使用した場合、インライン方式では、TABリード型半
導体装置(1)の上面側と下面側に二つの光源(7A)(7
B)を設置する必要があり、光源の数が増える分だけ設
備費が高騰する。一方、一台の光源だけでTABリード
型半導体装置(1)の表裏両面にレーザ捺印を行なおう
とすると、TABリード型半導体装置(1)を上下反転
させる機構を設け、TABリード型半導体装置(1)の
表面側の捺印が終了した後、その反転機構を利用してT
ABリード型半導体装置(1)を上下反転させて裏面側
の捺印を行なうことになり、反転機構の設置により設備
が複雑化するという問題が発生する。When the conventional device shown in FIG. 3 is used, in the in-line system, two light sources (7A) (7A) (7A) (7A)
It is necessary to install B), and the equipment cost rises as the number of light sources increases. On the other hand, when laser marking is performed on both front and back surfaces of the TAB lead-type semiconductor device (1) with only one light source, a mechanism for vertically turning up the TAB lead-type semiconductor device (1) is provided. After the marking on the front side of 1) is completed, T
Since the AB lead type semiconductor device (1) is turned upside down and the back side is imprinted, installation of the reversing mechanism complicates the equipment.
【0007】[0007]
【課題を解決するための手段】上記課題の解決手段とし
て本発明は、搬送路上で位置決めされたワークの表裏両
面にレーザ光線の照射により所定の情報を捺印するもの
において、上記搬送路のワーク表面側に一対の固定反射
鏡を八の字状に対向配置すると共に搬送路のワーク裏面
側に一対の固定反射鏡を逆八の字状に対向配置し、光源
からのレーザ光線を上記固定反射鏡へ選択的に入射させ
る可動反射鏡を搬送路の側方に配設したことを特徴とす
る。Means for Solving the Problems As a means for solving the above problems, the present invention is a method for imprinting predetermined information by irradiating a laser beam on both front and back surfaces of a work positioned on a transport path, wherein the work surface of the transport path is Side, a pair of fixed reflecting mirrors are arranged opposite to each other in the shape of a figure, and a pair of fixed reflecting mirrors are arranged opposite to each other in the shape of a reverse figure in the back side of the work in the conveying path. It is characterized in that a movable reflecting mirror that selectively makes light incident on is disposed on the side of the transport path.
【0008】上記可動反射鏡としては、上記光源からの
レーザ光線の投光経路に対して回転する単一の反射面を
有するものや、光源からのレーザ光線の投光経路対して
直交する方向に直線移動する一対の反射面を有するもの
が望ましい。The movable reflecting mirror has a single reflecting surface that rotates with respect to the projection path of the laser beam from the light source, or in the direction orthogonal to the projection path of the laser beam from the light source. It is desirable to have a pair of reflecting surfaces that move linearly.
【0009】[0009]
【作用】光源からのレーザ光線を可動反射鏡を介して一
方の固定反射鏡に導き、その固定反射鏡から投射された
レーザ光線を利用してワークの表裏面の一方に情報を捺
印する。その後、上記可動反射鏡を作動させることによ
ってレーザ光線の投光経路を切替え、レーザ光線を可動
反射鏡を介して他方の固定反射鏡に導き、その固定反射
鏡から投射されたレーザ光線を利用してワークの表裏面
の他方に情報を捺印する。The laser beam from the light source is guided to one of the fixed reflecting mirrors via the movable reflecting mirror, and the laser beam projected from the fixed reflecting mirror is used to mark information on one of the front and back surfaces of the work. After that, the projecting path of the laser beam is switched by operating the movable reflecting mirror, the laser beam is guided to the other fixed reflecting mirror through the movable reflecting mirror, and the laser beam projected from the fixed reflecting mirror is used. The information is stamped on the other side of the front and back of the work.
【0010】[0010]
【実施例】図1を参照しながらTABリード型半導体装
置(1)の表面と裏面に捺印する本発明の実施例を説明
する。尚、以下の記述において、従来技術を説明する図
3と同一の構成部材は同一の参照番号で表示し、重複す
る事項に関しては説明を省略する。EXAMPLE An example of the present invention for imprinting the front and back surfaces of a TAB lead type semiconductor device (1) will be described with reference to FIG. In the following description, the same components as those in FIG. 3 for explaining the conventional technique are denoted by the same reference numerals, and the description of the overlapping matters will be omitted.
【0011】レーザ捺印装置(10)は、ガイドレール
(6)によって形成された搬送路の上方に、第1の固定
反射鏡(11)と第2の固定反射鏡(12)を八の字状に対
向配置すると共に、上記ワーク搬送路の下方に、第3の
固定反射鏡(14)と第4の固定反射鏡(13)を逆八の字
状に対向配置し、これらの固定反射鏡(11)〜(14)へ
のレーザ光線の入射手段として、上記搬送路の側方に、
可動反射鏡(15A)と光源(7)を配設している。The laser marking device (10) is provided with a first fixed reflecting mirror (11) and a second fixed reflecting mirror (12) in a figure-eight shape above a conveying path formed by a guide rail (6). And a third fixed reflecting mirror (14) and a fourth fixed reflecting mirror (13) are arranged below the work transfer path so as to face each other in an inverted eight shape. As means for injecting the laser beam to 11) to (14), on the side of the transport path,
A movable reflecting mirror (15A) and a light source (7) are arranged.
【0012】この実施例における可動反射鏡(15A)
は、光源(7)からの投光経路上で、その側端に取付け
られたピボット(16)を中心として水平回転する回転式
の反射鏡から構成されている。The movable reflecting mirror (15A) in this embodiment
Is composed of a rotary reflecting mirror that horizontally rotates on a light projection path from the light source (7) around a pivot (16) attached to its side end.
【0013】図1に実線で表示するように、ピボット
(16)を回転中心として可動反射鏡(15A)を水平回転
させ、その反射面を斜め上向きにする。この状態で光源
(7)からレーザ光線を投射する。投射されたレーザ光
線は、実線で示すように可動反射鏡(15A)、第1の固
定反射鏡(11)及び第2の固定反射鏡(12)を経てワー
ク、例えばTABリード型半導体装置(1)の上面に導
かれ、そこに品名、規格等を示す所定の情報を捺印す
る。As indicated by the solid line in FIG. 1, the movable reflecting mirror (15A) is horizontally rotated with the pivot (16) as the center of rotation, and its reflecting surface is directed obliquely upward. In this state, a laser beam is projected from the light source (7). The projected laser beam passes through a movable reflecting mirror (15A), a first fixed reflecting mirror (11) and a second fixed reflecting mirror (12) as shown by a solid line, and a work, for example, a TAB lead type semiconductor device (1). ), And stamps predetermined information indicating the product name, standard, etc.
【0014】その後、図1に二点鎖線で表示するように
ピボット(16)を回転中心として可動反射鏡(15A)を
水平回転させ、その反射面を斜め下向きにする。この状
態で光源(7)からレーザ光線を投射する。投射れたレ
ーザ光線は、二点鎖線で示すように可動反射鏡(15
A)、第3の固定反射鏡(14)及び第4の固定反射鏡(1
3)を経てTABリード型半導体装置(1)の下面に導か
れ、そこにロット番号等を示す所定の情報を捺印する。Thereafter, the movable reflecting mirror (15A) is horizontally rotated with the pivot (16) as the center of rotation, as indicated by the chain double-dashed line in FIG. 1, and its reflecting surface is directed obliquely downward. In this state, a laser beam is projected from the light source (7). The projected laser beam is moved by the movable reflecting mirror (15
A), the third fixed reflecting mirror (14) and the fourth fixed reflecting mirror (1
It is guided to the lower surface of the TAB lead type semiconductor device (1) via 3), and predetermined information indicating the lot number and the like is imprinted there.
【0015】この実施例では、レーザ光源(7)からの
入射光に対し可動反射鏡(15A)のピボット(16)を直
交配置して可動反射鏡(15A)を回転させるようにした
が、反射鏡の鏡面を図1状態に保ち入射光軸とピボット
とを同心配置して可動反射鏡を回転させてもよい。In this embodiment, the pivot (16) of the movable reflecting mirror (15A) is arranged orthogonal to the incident light from the laser light source (7) to rotate the movable reflecting mirror (15A). The movable reflecting mirror may be rotated by keeping the mirror surface of the mirror in the state shown in FIG. 1 and concentrically arranging the incident optical axis and the pivot.
【0016】次に、他の実施例を図2に示す。この実施
例における可動反射鏡(15B)は、同図の実線と二点鎖
線で示すように光源(7)からの投光経路上で図示しな
いガイド部材によって支持され、TABリード型半導体
装置(1)の厚み方向に沿って直線的にスライドする三
角形の反射鏡から構成されている。TABリード型半導
体装置(1)と上面側と下面側へのレーザ光線の投射経
路の切替え要領は実施例1と同様であるため説明は省略
する。Next, another embodiment is shown in FIG. The movable reflecting mirror (15B) in this embodiment is supported by a guide member (not shown) on the light projecting path from the light source (7) as indicated by the solid line and the chain double-dashed line in FIG. ) Is composed of a triangular reflecting mirror that linearly slides along the thickness direction. The procedure for switching the TAB lead type semiconductor device (1) and the projection path of the laser beam to the upper surface side and the lower surface side is the same as that in the first embodiment, and the description thereof will be omitted.
【0017】[0017]
【発明の効果】本発明によれば、ワーク、例えばTAB
リード型半導体装置の表裏両面に、一台の光源だけで簡
単な設備により上記TABリード型半導体装置を反転さ
せることなく所定の情報を捺印することが可能となり、
設備投資の節減が図れて製品コストの低減化が実現でき
その実用的価値は大である。According to the present invention, a work, for example, TAB, is used.
It becomes possible to imprint predetermined information on both front and back surfaces of the lead-type semiconductor device with a simple light source using a simple light source without inverting the TAB lead-type semiconductor device.
It is possible to reduce the capital investment and realize the product cost reduction, and its practical value is great.
【図1】本発明の第1の実施例を示す概略正面図FIG. 1 is a schematic front view showing a first embodiment of the present invention.
【図2】本発明の第2の実施例を示す概略正面図FIG. 2 is a schematic front view showing a second embodiment of the present invention.
【図3】レーザ捺印装置の従来例を示す概略正面図FIG. 3 is a schematic front view showing a conventional example of a laser marking device.
1 ワーク〔TABリード型半導体装置〕 6 搬送路〔ガイドレール〕 7 光源 10 レーザ捺印装置 11、12、13、14 第1の固定反射鏡 15A、15B 可動反射鏡 1 Work [TAB lead type semiconductor device] 6 Transport path [Guide rail] 7 Light source 10 Laser marking device 11, 12, 13, 14 First fixed reflecting mirror 15A, 15B Movable reflecting mirror
Claims (3)
両面にレーザ光線の照射により所定の情報を捺印するも
のにおいて、 上記搬送路のワーク表面側に一対の固定反射鏡を八の字
状に対向配置すると共に搬送路のワーク裏面側に一対の
固定反射鏡を逆八の字状に対向配置し、光源からのレー
ザ光線を上記固定反射鏡へ選択的に入射させる可動反射
鏡を搬送路の側方に配設したことを特徴とするレーザ捺
印装置。1. A method of imprinting predetermined information by irradiating a laser beam on both front and back surfaces of a work positioned on a transport path, wherein a pair of fixed reflecting mirrors face each other in a figure eight shape on the work surface side of the transport path. A pair of fixed reflecting mirrors are arranged opposite to each other in the shape of an inverted figure on the back side of the work in the conveying path, and a movable reflecting mirror that selectively makes a laser beam from a light source incident on the fixed reflecting mirror is located on the conveying path side. A laser marking device, characterized in that it is arranged on one side.
からのレーザ光線の投光経路に対して回転する単一の反
射面を有することを特徴とするレーザ捺印装置。2. The laser marking device according to claim 1, wherein the movable reflecting mirror has a single reflecting surface that rotates with respect to a projection path of a laser beam from the light source.
からのレーザ光線の投光経路対して直交する方向に直線
移動する一対の反射面を有することを特徴とするレーザ
捺印装置。3. The laser marking device according to claim 1, wherein the movable reflecting mirror has a pair of reflecting surfaces that linearly moves in a direction orthogonal to a projection path of a laser beam from the light source.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4074694A JPH05283543A (en) | 1992-03-30 | 1992-03-30 | Laser stamp device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4074694A JPH05283543A (en) | 1992-03-30 | 1992-03-30 | Laser stamp device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05283543A true JPH05283543A (en) | 1993-10-29 |
Family
ID=13554597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4074694A Pending JPH05283543A (en) | 1992-03-30 | 1992-03-30 | Laser stamp device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05283543A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009231295A (en) * | 2008-03-19 | 2009-10-08 | Powertech Technology Inc | Semiconductor device, and manufacturing method thereof |
-
1992
- 1992-03-30 JP JP4074694A patent/JPH05283543A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009231295A (en) * | 2008-03-19 | 2009-10-08 | Powertech Technology Inc | Semiconductor device, and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE2540431C2 (en) | Method for aligning a semiconductor die | |
CN101677061B (en) | Laser irradiation method and laser irradiation apparatus | |
CA2249549A1 (en) | Card transport mechanism and method of operation | |
FR2652317B1 (en) | LIGHTING DEVICE FOR VEHICLES, PARTICULARLY FOR ALLOWING AN EXTENDED VISION AREA IN A GROWING POSITION. | |
JPS61268052A (en) | Laser trimming method in semiconductor wafer | |
ATE175367T1 (en) | TUBE BENDING MACHINE | |
JPH05283543A (en) | Laser stamp device | |
DE60003063D1 (en) | PRINTING MODULE FOR TWO PRINTING CARRIERS AND AUTOMATS EQUIPPED WITH SUCH MODULES | |
JP2790469B2 (en) | Film exposure equipment | |
FR2793189B1 (en) | DEVICE FOR PRINTING BY SERIGRAPHY, IN PARTICULAR FOR PRINTING ON GLASS ARTICLES | |
JPH07122624A (en) | Prealignment equipment for wafer | |
AU641910B2 (en) | A mechanism for inverting a carrier | |
JPH11338001A (en) | Diaphragm mechanism of camera | |
JP2834834B2 (en) | Original plate opening and closing device in exposure equipment | |
JPH1032294A (en) | Semiconductor package outer lead bending method and device | |
JP3130590B2 (en) | Line chart switching device | |
KR910013502A (en) | Tool holding mechanism for bonder | |
JPH0629342A (en) | Bonding mechanism for bonding surfaces not flush with each other | |
JPS56158330A (en) | Printing device | |
JPH05107653A (en) | Optical device for copying machine | |
JPH06310395A (en) | Aligner | |
JPH10335256A (en) | Laser annealing apparatus of liquid crystal substrate | |
JPH0767992B2 (en) | Two-position locking device for rotating arm | |
JPS60136895U (en) | Welding jig for long products | |
JPS61158663U (en) |