JPH05279078A - Near infrared ray absorption material - Google Patents

Near infrared ray absorption material

Info

Publication number
JPH05279078A
JPH05279078A JP11547192A JP11547192A JPH05279078A JP H05279078 A JPH05279078 A JP H05279078A JP 11547192 A JP11547192 A JP 11547192A JP 11547192 A JP11547192 A JP 11547192A JP H05279078 A JPH05279078 A JP H05279078A
Authority
JP
Japan
Prior art keywords
phosphoric acid
powder
copper
cuo
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11547192A
Other languages
Japanese (ja)
Inventor
Tsuneo Manabe
恒夫 真鍋
Hiroshi Usui
寛 臼井
Yasuko Osaki
康子 大崎
Takuo Osuga
卓生 大須賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of JPH05279078A publication Critical patent/JPH05279078A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To enable to easily recognize a material by allowing the material to contain a specified amount of phosphate compd. containing copper. CONSTITUTION:CuO and P2O5 are blended so as to provide a blended material in which molar ratio of CuO/P2O5 becomes 0.05-4 when copper is in terms of CuO and phosphoric acid is expressed in terms of P2O5. Then, after the blended material is dried at about 150 deg.C in an alumina crucible, etc., and calcined at about 800 deg.C, the material is powdered in a ball mill to provide a phosphoric acid compd. powder having <=100mum average particle diameter. Next, the powder is mixed with a dispersing medium, such as resin material, so that the powder content becomes >=10wt.% to produce a near infrared ray absorption material.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は近赤外線吸収材料に関す
る。
FIELD OF THE INVENTION The present invention relates to a near infrared ray absorbing material.

【0002】[0002]

【従来の技術】従来、物体や画像は肉眼で認識していた
ため、認識しやすい材料とは可視光領域での光を吸収あ
るいは散乱する材料であった。しかし、最近、自動的に
物体や画像を認識する技術が、急速に進歩している。そ
して、この画像を認識、読みとるための光源としては、
半導体レーザーが主流になるといわれている。この半導
体レーザーとしては、700〜1600nmの波長領域
のものが、実用化されているが、この波長は近赤外線の
領域であり、肉眼では認識できない。可視光を良好に吸
収あるいは散乱する物体や画像でも、必ずしも近赤外光
を良好に吸収、散乱するとは限らない。従来の材料では
物体や画像がこの近赤外線領域で認識し難いという課題
があった。
2. Description of the Related Art Conventionally, since an object or an image has been recognized with the naked eye, a material that is easily recognized is a material that absorbs or scatters light in the visible light region. However, recently, a technique for automatically recognizing an object or an image has rapidly advanced. And as a light source for recognizing and reading this image,
It is said that semiconductor lasers will become the mainstream. As this semiconductor laser, one having a wavelength range of 700 to 1600 nm has been put into practical use, but this wavelength is in the near infrared region and cannot be visually recognized. Even an object or image that absorbs or scatters visible light well does not always absorb and scatter near infrared light well. The conventional material has a problem that it is difficult to recognize an object or an image in this near infrared region.

【0003】[0003]

【発明が解決しようとする課題】本発明は、従来技術の
有する前述の課題を解消するためになされたものであ
り、近赤外線で認識が容易な近赤外線吸収材料を提供す
ることを目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and an object thereof is to provide a near-infrared absorbing material which can be easily recognized by near-infrared rays. .

【0004】[0004]

【課題を解決するための手段】本発明は、銅を含有する
リン酸化合物を10重量%以上含有する近赤外線吸収材
料を提供するものである。
The present invention provides a near infrared ray absorbing material containing 10% by weight or more of a phosphoric acid compound containing copper.

【0005】本発明の近赤外線吸収材料において銅を含
有するリン酸化合物の含有量が10重量%未満の場合
は、近赤外線吸収能力が不充分である。銅を含有するリ
ン酸化合物の含有量は多いほど近赤外線吸収能力は大き
くなり好ましい。一方、その含有量の上限に特に制限は
ないが、この化合物を結合する媒体の量が相対的に少な
くなり本材料の強度が低下してくるため、用途によって
は、含有量の上限が制限される。
When the content of the copper-containing phosphoric acid compound in the near-infrared absorbing material of the present invention is less than 10% by weight, the near-infrared absorbing ability is insufficient. The larger the content of the phosphoric acid compound containing copper, the larger the near-infrared absorption capacity, which is preferable. On the other hand, the upper limit of the content is not particularly limited, but since the amount of the medium that binds this compound becomes relatively small and the strength of the material decreases, the upper limit of the content is limited depending on the application. It

【0006】銅を含有するリン酸化合物において、銅は
一般に銅化合物として存在する。銅化合物は一般には、
黒色や褐色等各種の色を呈し、化合物によってそれぞれ
特徴ある光吸収特性を示すが、リン酸化合物中で特に近
赤外線を良好に吸収することが判明した。リン酸化合物
中の銅濃度を示す指標としては、銅をCuO、リン酸を
P2 O5 に換算してCuO/P2 O5 のモル比で示すの
が適しており、このモル比が0.05未満の場合は近赤
外線吸収能力が充分でなく好ましくない。また、銅の濃
度が高いほど近赤外線吸収能力が高くなり好ましいが、
CuO/P2 O5 のモル比が4を超えるとリン酸化合物
が不安定になり好ましくない。
In the phosphoric acid compound containing copper, copper is generally present as a copper compound. Copper compounds are generally
Although various colors such as black and brown are exhibited and each compound has a characteristic light absorption property, it has been found that particularly near-infrared rays are well absorbed in the phosphoric acid compound. As an index showing the copper concentration in the phosphoric acid compound, it is suitable to convert copper into CuO and phosphoric acid into P2 O5 and show it as a CuO / P2 O5 molar ratio, which is less than 0.05. In this case, the near-infrared absorbing ability is not sufficient, which is not preferable. Also, the higher the concentration of copper, the higher the near infrared absorption capacity, which is preferable,
If the molar ratio of CuO / P2 O5 exceeds 4, the phosphate compound becomes unstable, which is not preferable.

【0007】銅を含有するリン酸化合物としては、特に
制限はないが、近赤外線吸収能力の高い材料としては、
リン酸銅としてメタリン酸銅、ピロリン酸銅、オルトリ
ン酸銅、銅アパタイト等がある。また銅と銅以外の元素
との各種複合リン酸塩も用いられ、銅以外の元素と複合
塩化することにより、本材料の近赤外線吸収率、色調、
屈折率、化学的特性を制御することも可能である。これ
らリン酸塩は、結晶水を含むものも知られており、一般
的に結晶水を含む化合物は化学的耐久性等の面でやや好
ましくないが、用途によれば使用できる。また、リン酸
化合物としては、結晶性化合物に制限されずガラス等の
非晶質状態でも問題なく使用できる。
The phosphoric acid compound containing copper is not particularly limited, but as a material having a high near-infrared absorbing ability,
Examples of copper phosphates include copper metaphosphate, copper pyrophosphate, copper orthophosphate, copper apatite, and the like. In addition, various complex phosphates of copper and elements other than copper are also used, and by complex chlorination with elements other than copper, the near infrared absorptivity of this material, color tone,
It is also possible to control the refractive index and chemical properties. It is also known that these phosphates contain water of crystallization, and a compound containing water of crystallization is generally somewhat unfavorable in terms of chemical durability, but can be used depending on the application. Further, the phosphoric acid compound is not limited to a crystalline compound and can be used without problems even in an amorphous state such as glass.

【0008】このガラスとしては、銅をCuO換算で
2.0〜15重量%含有するリン酸ガラスが好ましい。
ガラス中の銅濃度がCuO換算で2.0重量%未満の場
合は近赤外線吸収能力が不充分であるので好ましくな
い。銅濃度が高いほど近赤外線吸収能力が高くなり好ま
しいが、ガラス中の濃度がCuO換算で15重量%を超
えるとガラスが不安定になり好ましくない。
As this glass, a phosphate glass containing 2.0 to 15% by weight of copper in terms of CuO is preferable.
When the copper concentration in the glass is less than 2.0% by weight in terms of CuO, the near-infrared absorbing ability is insufficient, which is not preferable. The higher the copper concentration is, the higher the near-infrared absorbing capacity is, which is preferable, but when the concentration in the glass exceeds 15% by weight in terms of CuO, the glass becomes unstable, which is not preferable.

【0009】このガラスの組成としては、特に制限はな
いが、近赤外線吸収能力の高い組成としては、リン酸を
P2 O5 換算で10〜80重量%、フッ素を0〜30重
量%含有するリン酸塩ガラスまたはフツリン酸塩ガラス
が好ましい。リン酸濃度がP2 O5 換算で10重量%未
満の場合は、近赤外線吸収成分である銅を充分ガラス中
に溶かし込むことが難しく、80重量%超の場合はガラ
スが吸湿性となり、近赤外線吸収能力が経時的に劣化す
るおそれがあるのでいずれも好ましくない。さらに、フ
ッ素は、含有させることにより近赤外線吸収能力を向上
させることができる。この場合、ガラス中のフッ素含有
量が30重量%を超えるとガラスが不安定になるため好
ましくない。
The composition of this glass is not particularly limited, but as a composition having a high near-infrared absorbing ability, phosphoric acid containing 10 to 80% by weight of P2O5 and fluorine of 0 to 30% by weight in terms of P2O5. Salt glass or fluorophosphate glass is preferred. When the phosphoric acid concentration is less than 10% by weight in terms of P2O5, it is difficult to sufficiently dissolve the near-infrared absorbing component copper into the glass, and when it exceeds 80% by weight, the glass becomes hygroscopic and absorbs near-infrared rays. All of them are not preferable because the performance may deteriorate with time. Further, by containing fluorine, the near infrared absorbing ability can be improved. In this case, if the fluorine content in the glass exceeds 30% by weight, the glass becomes unstable, which is not preferable.

【0010】このリン酸化合物の製造方法としては、特
に制限はなく、リン酸化合物の一般的製法が適宜用いら
れ、銅を含む物質をリン酸化合物と混合し加熱し、固相
反応させる方法、リン酸を含む溶液中に銅を含む物質を
溶解させた後、加熱乾燥させる方法、銅とリン酸を含む
物質を600〜2000℃で溶融し、リン酸化合物化す
る方法等を用いることができる。この場合、銅はリン酸
化合物中に1価と2価という2種のイオン状態で存在す
るが、近赤外吸収には2価の銅イオンが寄与するため、
リン酸化合物作製中に酸化作用を有する酸化剤を添加し
たり、酸化性雰囲気中でリン酸化合物を合成することも
リン酸化合物の近赤外吸収能力を高めるのに有効であ
る。
The method for producing the phosphoric acid compound is not particularly limited, and a general method for producing a phosphoric acid compound is appropriately used. A method of mixing a substance containing copper with a phosphoric acid compound and heating the mixture to carry out a solid phase reaction, A method in which a substance containing copper is dissolved in a solution containing phosphoric acid and then dried by heating, a method of melting a substance containing copper and phosphoric acid at 600 to 2000 ° C. to form a phosphoric acid compound, and the like can be used. .. In this case, copper exists in the phosphoric acid compound in two kinds of ionic states of monovalent and divalent, but since divalent copper ions contribute to near infrared absorption,
It is also effective to add an oxidizing agent having an oxidizing action during the production of the phosphoric acid compound or to synthesize the phosphoric acid compound in an oxidizing atmosphere to enhance the near-infrared absorption ability of the phosphoric acid compound.

【0011】このリン酸化合物を粉末とした場合の粒径
にも特に制限はないが、用途に応じて適切な粒径があり
うる。微細な形状やパターンを認識させたい場合には、
リン酸化合物粉末の粒径は細かい方がよい。一般的に平
均粒径として100μm以下が好ましい。リン酸化合物
を粉末にする方法にも制限はないが、ボールミルによる
粉砕等粉末リン酸化合物の作製法として一般的な方法が
用いられる。
There are no particular restrictions on the particle size of this phosphoric acid compound when made into a powder, but there may be an appropriate particle size depending on the application. If you want to recognize fine shapes and patterns,
The phosphoric acid compound powder preferably has a small particle size. Generally, the average particle size is preferably 100 μm or less. There is no limitation on the method for powdering the phosphoric acid compound, but a general method is used as a method for producing a powdered phosphoric acid compound such as pulverization by a ball mill.

【0012】リン酸化合物粉末を分散する媒体にも特に
制限はなく、このリン酸化合物粉末が適切に分散され、
リン酸化合物の近赤外吸収能力が発現されるような近赤
外線に比較的透明な材料が好ましい。用途によっては、
リン酸化合物と可視光の屈折率が一致した材料が、可視
光に対して透明な材料となるので好ましい場合がある。
常温で使用する場合は、この媒体として樹脂系材料が一
般的に使用できる。
The medium for dispersing the phosphoric acid compound powder is not particularly limited, and the phosphoric acid compound powder is appropriately dispersed,
A material that is relatively transparent to near-infrared rays so that the near-infrared absorbing ability of the phosphoric acid compound is exhibited is preferable. Depending on the application,
A material in which the refractive index of the phosphoric acid compound matches that of visible light is preferable because it becomes a material transparent to visible light.
When used at room temperature, a resin material can be generally used as this medium.

【0013】リン酸化合物粉末を分散する方法にも制限
はなく、樹脂系材料に分散する場合には、樹脂溶液に分
散した後に溶媒を蒸発させる方法、樹脂低分子量体中に
分散した後に樹脂を重合する方法、樹脂粉末をリン酸化
合物粉末に混合した後に加熱焼結する方法等が適宜使用
できる。
There is no limitation on the method of dispersing the phosphoric acid compound powder. When dispersing the powder of the phosphoric acid compound, in the case of dispersing in the resin material, the method of evaporating the solvent after dispersing in the resin solution, or the method of dispersing the resin in the low molecular weight resin and then dispersing the resin A method of polymerizing, a method of mixing resin powder with a phosphoric acid compound powder and then heating and sintering, and the like can be appropriately used.

【0014】リン酸化合物粉末を分散した近赤外線吸収
材料の形態にも特に制限はなく、用途に応じて適宜選択
できる。この材料自体の成形体として用いることも可能
であるが、認識したい物品の表面に塗布して使用するこ
とでも目的は達成できる。この場合、本発明の近赤外線
吸収材料は可視光に対しほぼ無色透明であるので、基材
の肉眼による外観を損なうことなく近赤外光のみを有効
に吸収させることが可能となる。また、本材料を基材上
にパターンを付与して塗布あるいは印刷することによ
り、近赤外光で有効に判読できる印刷も可能となる。
The form of the near-infrared absorbing material in which the phosphoric acid compound powder is dispersed is not particularly limited and can be appropriately selected depending on the application. The material can be used as a molded body of the material itself, but the object can also be achieved by applying the material on the surface of an article to be recognized. In this case, since the near-infrared absorbing material of the present invention is substantially colorless and transparent to visible light, it is possible to effectively absorb only near-infrared light without impairing the appearance of the base material with the naked eye. Further, by applying or printing this material on a base material in a pattern, it becomes possible to perform printing which can be effectively read by near infrared light.

【0015】[0015]

【実施例】【Example】

[実施例1]85%リン酸100重量部を水で3倍に希
釈した溶液を加熱した後、酸化銅(CuO)69重量部
を加えた。この量は、銅をCuO、リン酸をP2 O5 に
換算してCuO/P2 O5 のモル比が2に相当する。充
分撹拌した後、アルミナるつぼに移し、150℃で乾燥
後、800℃で焼成した。焼成物をボールミルで粉砕
し、粉末を得た。粉末の平均粒径は、2.8μmであっ
た。この粉末40重量部に対し、20重量%のエチルセ
ルロースを溶解したα−テルピネオール溶液を60重量
部の割合で加えて混練し、3本ロールミルにより均質分
散を行い、所望の粘度に調整し、ペースト状のインク組
成物を得た。
Example 1 A solution prepared by diluting 100 parts by weight of 85% phosphoric acid with water three times was heated, and then 69 parts by weight of copper oxide (CuO) was added. This amount corresponds to a molar ratio of CuO / P2 O5 of 2 when copper is converted to CuO and phosphoric acid is converted to P2 O5. After sufficiently stirring, the mixture was transferred to an alumina crucible, dried at 150 ° C., and calcined at 800 ° C. The fired product was crushed with a ball mill to obtain a powder. The average particle size of the powder was 2.8 μm. To 40 parts by weight of this powder, an α-terpineol solution in which 20% by weight of ethyl cellulose was dissolved was added at a ratio of 60 parts by weight, kneaded, and homogenously dispersed by a three-roll mill, adjusted to a desired viscosity, and formed into a paste form. An ink composition of

【0016】このインクを4インチ角のアルミナ板上の
約半面にスクリーン印刷し、乾燥した。乾燥後の印刷膜
厚は約15μmであった。印刷部分は、やや淡緑色を呈
していた。この板による半導体レーザー(波長:810
nm)に対する反射率を測定した結果、印刷部分の反射
率はアルミナ基板の反射率の約18%であった。
This ink was screen-printed on a half surface of a 4-inch square alumina plate and dried. The printed film thickness after drying was about 15 μm. The printed part was slightly light green. Semiconductor laser with this plate (wavelength: 810
The reflectance of the printed portion was about 18% of the reflectance of the alumina substrate.

【0017】[実施例2]85%リン酸100重量部を
水で3倍に希釈した溶液を加熱した後、酸化銅(Cu
O)34.5重量部および酸化亜鉛(ZnO)35.3
重量部を加えた。この量は、銅をCuO、リン酸をP2
O5 に換算してCuO/P2 O5 のモル比が1に相当す
る。以下実施例1と同様にして粉末を得た。粉末の平均
粒径は、2.4μmであった。この粉末を実施例1と同
様な操作で、ペースト状のインク組成物を得た。
Example 2 A solution prepared by diluting 100 parts by weight of 85% phosphoric acid by 3 times with water was heated, and then copper oxide (Cu
O) 34.5 parts by weight and zinc oxide (ZnO) 35.3
Parts by weight were added. This amount is CuO for copper and P2 for phosphoric acid.
The CuO / P2 O5 molar ratio corresponds to 1 in terms of O5. A powder was obtained in the same manner as in Example 1 below. The average particle size of the powder was 2.4 μm. This powder was treated in the same manner as in Example 1 to obtain a paste-like ink composition.

【0018】このインクを4インチ角のアルミナ板上の
約半面にスクリーン印刷し、乾燥した。乾燥後の印刷膜
厚は約25μmであった。印刷部分は、ほぼ白色を呈し
ており、基板のアルミナとは外観上はほぼ相違はなかっ
た。この板による半導体レーザー(波長:810nm)
に対する反射率を測定した結果、印刷部分の反射率はア
ルミナ基板の反射率の約22%であった。
This ink was screen-printed on a half-inch surface of a 4-inch square alumina plate and dried. The printed film thickness after drying was about 25 μm. The printed portion was almost white, and there was almost no difference in appearance from the alumina of the substrate. Semiconductor laser with this plate (wavelength: 810 nm)
The reflectance of the printed portion was about 22% of the reflectance of the alumina substrate.

【0019】[実施例3]リン酸2水素アンモニウム
(NH4 H2 PO4 )粉末100重量部と酸化銅(Cu
O)粉末103.7重量部を混合し混合粉末を得た。こ
の量は、銅をCuO、リン酸をP2 O5 に換算してCu
O/P2 O5 のモル比が3に相当する。この混合粉末を
アルミナるつぼに移し、900℃で焼成した。焼成物
を、ボールミルで粉砕し、粉末を得た。粉末の平均粒径
は、2.3μmであった。この粉末を実施例1と同様な
操作で、ペースト状のインク組成物を得た。
[Example 3] 100 parts by weight of ammonium dihydrogen phosphate (NH4 H2 PO4) powder and copper oxide (Cu)
O) Powder 103.7 parts by weight was mixed to obtain a mixed powder. This amount is equivalent to Cu when Cu is converted to CuO and phosphoric acid is converted to P2 O5.
The molar ratio O / P2 O5 corresponds to 3. This mixed powder was transferred to an alumina crucible and fired at 900 ° C. The fired product was crushed with a ball mill to obtain a powder. The average particle size of the powder was 2.3 μm. This powder was treated in the same manner as in Example 1 to obtain a paste-like ink composition.

【0020】このインクを4インチ角のアルミナ板上の
約半面にスクリーン印刷し、乾燥した。乾燥後の印刷膜
厚は約20μmであった。印刷部分は、淡緑色を呈して
いた。この板による半導体レーザー(波長:810n
m)に対する反射率を測定した結果、印刷部分の反射率
はアルミナ基板の反射率の約8%であった。
This ink was screen-printed on a half surface of a 4-inch square alumina plate and dried. The printed film thickness after drying was about 20 μm. The printed part had a light green color. Semiconductor laser with this plate (wavelength: 810n
As a result of measuring the reflectance for m), the reflectance of the printed portion was about 8% of the reflectance of the alumina substrate.

【0021】[実施例4]表1の組成および粒度特性を
有するリン酸ガラス粉末(銅をCuO、リン酸をP2 O
5 に換算してCuO/P2 O5 のモル比が0.067に
相当)を80重量部に対し、10重量%のエチルセルロ
ースを溶解したα−テルピネオール溶液を30重量部の
割合で加えて混練し、3本ロールミルにより均質分散を
行い、所望のペースト粘度に調整し、ペースト状のセラ
ミックカラー組成物を得た。
Example 4 Phosphate glass powder having the composition and particle size characteristics shown in Table 1 (CuO for copper and P2 O for phosphoric acid)
(The molar ratio of CuO / P2O5 converted to 5 corresponds to 0.067) is added to 80 parts by weight of an α-terpineol solution in which 10% by weight of ethylcellulose is dissolved, and the mixture is kneaded. Homogeneous dispersion was performed with a three-roll mill to adjust the paste viscosity to a desired value, and a paste-like ceramic color composition was obtained.

【0022】[0022]

【表1】 [Table 1]

【0023】このペーストを、4インチ角のアルミナ板
上の約半面にスクリーン印刷し、乾燥した。乾燥後の印
刷膜厚は約40μmであった。印刷部分は、やや淡青色
は呈しているものの、基板のアルミナとは外観上はほぼ
相違はなかった。この板による半導体レーザー(波長:
810nm)に対する反射率を測定した結果、印刷部分
の反射率はアルミナ基板の反射率の約10%であった。
This paste was screen-printed on a half surface of a 4-inch square alumina plate and dried. The printed film thickness after drying was about 40 μm. The printed part was slightly blue in color, but there was almost no difference in appearance from the alumina of the substrate. Semiconductor laser (wavelength:
As a result of measuring the reflectance with respect to 810 nm), the reflectance of the printed portion was about 10% of the reflectance of the alumina substrate.

【0024】[実施例5]表2の組成および平均粒径を
有するリン酸ガラス粉末15重量部に対し、85重量部
のアクリル樹脂粉末を加熱混練した後、4cm角、3m
m厚の板に成形した。また、平均粒径約1.5μmの石
英粉末でも同様にして、板を作製した。
Example 5 To 15 parts by weight of a phosphate glass powder having the composition and average particle size shown in Table 2, 85 parts by weight of acrylic resin powder was heat kneaded, and then 4 cm square, 3 m
It was formed into a m-thick plate. Further, a plate was prepared in the same manner using quartz powder having an average particle size of about 1.5 μm.

【0025】[0025]

【表2】 [Table 2]

【0026】石英粉末を用いた板は無色、リン酸ガラス
粉末を用いた板はやや緑青色を呈していたが、どちらの
板も若干濁っているが透明であった。これらの板による
半導体レーザー(波長:810nm)に対する反射率を
測定した結果、リン酸ガラス粉末を用いた板の反射率は
石英粉末を用いた板の反射率の約22%であった。
The plate using quartz powder was colorless, and the plate using phosphate glass powder was slightly greenish blue, but both plates were slightly cloudy but transparent. As a result of measuring the reflectance of these plates with respect to the semiconductor laser (wavelength: 810 nm), the reflectance of the plate using the phosphoric acid glass powder was about 22% of the reflectance of the plate using the quartz powder.

【0027】[比較例]実施例5と同じリン酸ガラス粉
末(銅をCuO、リン酸をP2 O5 に換算してCuO/
P2 O5 のモル比が1に相当)を7重量部に対し、93
重量部のアクリル樹脂粉末を加熱混練したのち、4cm
角、3mm厚の板に成形した。また、実施例4と同様に
石英粉末でも同様にして、板を製作した。
[Comparative Example] The same phosphoric acid glass powder as in Example 5 (CuO / CuO in terms of CuO / P2O5).
The molar ratio of P2 O5 corresponds to 1) to 93 parts by weight of 93
After heating and kneading parts by weight of acrylic resin powder, 4 cm
It was formed into a plate having a square shape and a thickness of 3 mm. Further, a plate was manufactured in the same manner with quartz powder as in Example 4.

【0028】石英粉末を用いた板は無色、リン酸ガラス
粉末を用いた板はやや緑青色を呈しており、どちらも若
干濁っているが透明であった。これらの板による半導体
レーザー(波長:810nm)に対する反射率を測定し
た結果、リン酸ガラス粉末を用いた板の反射率は石英粉
末を用いた板の反射率の約62%であり、半導体レーザ
ーの吸収は不充分であった。
The plate using quartz powder was colorless, and the plate using phosphate glass powder was slightly greenish blue, and both were slightly cloudy but transparent. As a result of measuring the reflectance of these plates with respect to the semiconductor laser (wavelength: 810 nm), the reflectance of the plate using the phosphoric acid glass powder is about 62% of the reflectance of the plate using quartz powder. Absorption was inadequate.

【0029】[0029]

【発明の効果】本発明の近赤外線吸収材料は、近赤外域
での半導体レーザーを良好に吸収するため、この光源を
用いたシステムにより物体、画像として良好に認識でき
る。
The near-infrared absorbing material of the present invention satisfactorily absorbs a semiconductor laser in the near-infrared region, so that a system using this light source can satisfactorily recognize it as an object or an image.

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成4年10月23日[Submission date] October 23, 1992

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】請求項2[Name of item to be corrected] Claim 2

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【手続補正2】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0006[Correction target item name] 0006

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0006】銅を含有するリン酸化合物において、銅は
一般に銅化合物として存在する。銅化合物は一般には、
黒色や褐色等各種の色を呈し、化合物によってそれぞれ
特徴ある光吸収特性を示すが、リン酸化合物中で特に近
赤外線を良好に吸収することが判明した。リン酸化合物
中の銅濃度を示す指標としては、銅をCuO、リン酸を
25 に換算してCuO/P25 のモル比で示すの
が適しており、このモル比が0.05未満の場合は近赤
外線吸収能力が充分でなく好ましくない。また、銅の濃
度が高いほど近赤外線吸収能力が高くなり好ましいが、
CuO/P25 のモル比が4を超えるとリン酸化合物
が不安定になり好ましくない。
In the phosphoric acid compound containing copper, copper is generally present as a copper compound. Copper compounds are generally
Although various colors such as black and brown are exhibited and each compound has a characteristic light absorption property, it has been found that particularly near-infrared rays are well absorbed in the phosphoric acid compound. As an index showing the copper concentration in the phosphoric acid compound, it is suitable to convert copper into CuO and phosphoric acid into P 2 O 5 and show the molar ratio of CuO / P 2 O 5 , and this molar ratio is 0. If it is less than 0.05, the near-infrared absorbing ability is not sufficient, which is not preferable. Also, the higher the concentration of copper, the higher the near infrared absorption capacity, which is preferable,
When the molar ratio of CuO / P 2 O 5 exceeds 4, the phosphoric acid compound becomes unstable, which is not preferable.

【手続補正3】[Procedure 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0009[Correction target item name] 0009

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0009】このガラスの組成としては、特に制限はな
いが、近赤外線吸収能力の高い組成としては、リン酸を
25 換算で10〜80重量%、フッ素を0〜30重
量%含有するリン酸塩ガラスまたはフツリン酸塩ガラス
が好ましい。リン酸濃度がP25 換算で10重量%未
満の場合は、近赤外線吸収成分である銅を充分ガラス中
に溶かし込むことが難しく、80重量%超の場合はガラ
スが吸湿性となり、近赤外線吸収能力が経時的に劣化す
るおそれがあるのでいずれも好ましくない。さらに、フ
ッ素は、含有させることにより近赤外線吸収能力を向上
させることができる。この場合、ガラス中のフッ素含有
量が30重量%を超えるとガラスが不安定になるため好
ましくない。
The composition of this glass is not particularly limited, but as the composition having a high near-infrared absorbing ability, phosphoric acid is contained in an amount of 10 to 80% by weight and fluorine is included in an amount of 0 to 30% by weight in terms of P 2 O 5. Phosphate glass or fluorophosphate glass is preferred. When the phosphoric acid concentration is less than 10% by weight in terms of P 2 O 5 , it is difficult to sufficiently dissolve the near infrared ray absorbing component copper into the glass, and when it exceeds 80% by weight, the glass becomes hygroscopic. Both are not preferable because the infrared absorption capacity may deteriorate with time. Further, the incorporation of fluorine can improve the near infrared absorbing ability. In this case, if the fluorine content in the glass exceeds 30% by weight, the glass becomes unstable, which is not preferable.

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0015[Correction target item name] 0015

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0015】[0015]

【実施例】 [実施例1]85%リン酸100重量部を水で3倍に希
釈した溶液を加熱した後、酸化銅(CuO)69重量部
を加えた。この量は、銅をCuO、リン酸をP25
換算してCuO/P25 のモル比が2に相当する。充
分撹拌した後、アルミナるつぼに移し、150℃で乾燥
後、800℃で焼成した。焼成物をボールミルで粉砕
し、粉末を得た。粉末の平均粒径は、2.8μmであっ
た。この粉末40重量部に対し、20重量%のエチルセ
ルロースを溶解したα−テルピネオール溶液を60重量
部の割合で加えて混練し、3本ロールミルにより均質分
散を行い、所望の粘度に調整し、ペースト状のインク組
成物を得た。
Example 1 After heating a solution prepared by diluting 100 parts by weight of 85% phosphoric acid with water three times, 69 parts by weight of copper oxide (CuO) was added. This amount, copper CuO, the molar ratio of CuO / P 2 O 5 in terms of the phosphoric acid P 2 O 5 is equivalent to 2. After sufficiently stirring, the mixture was transferred to an alumina crucible, dried at 150 ° C., and calcined at 800 ° C. The fired product was crushed with a ball mill to obtain a powder. The average particle size of the powder was 2.8 μm. To 40 parts by weight of this powder, an α-terpineol solution in which 20% by weight of ethyl cellulose was dissolved was added at a ratio of 60 parts by weight, kneaded, and homogenously dispersed by a three-roll mill, adjusted to a desired viscosity, and formed into a paste form. An ink composition of

【手続補正5】[Procedure Amendment 5]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0017[Correction target item name] 0017

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0017】[実施例2]85%リン酸100重量部を
水で3倍に希釈した溶液を加熱した後、酸化銅(Cu
O)34.5重量部および酸化亜鉛(ZnO)35.3
重量部を加えた。この量は、銅をCuO、リン酸をP2
5 に換算してCuO/P25 のモル比が1に相当す
る。以下実施例1と同様にして粉末を得た。粉末の平均
粒径は、2.4μmであった。この粉末を実施例1と同
様な操作で、ペースト状のインク組成物を得た。
Example 2 A solution prepared by diluting 100 parts by weight of 85% phosphoric acid by 3 times with water was heated, and then copper oxide (Cu
O) 34.5 parts by weight and zinc oxide (ZnO) 35.3
Parts by weight were added. This amount is CuO for copper and P 2 for phosphoric acid.
In terms of O 5 molar ratio of CuO / P 2 O 5 is equivalent to 1. A powder was obtained in the same manner as in Example 1 below. The average particle size of the powder was 2.4 μm. This powder was treated in the same manner as in Example 1 to obtain a paste-like ink composition.

【手続補正6】[Procedure Amendment 6]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0019[Name of item to be corrected] 0019

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0019】[実施例3]リン酸2水素アンモニウム
(NH42 PO4 )粉末100重量部と酸化銅(Cu
O)粉末103.7重量部を混合し混合粉末を得た。こ
の量は、銅をCuO、リン酸をP25 に換算してCu
O/P25 のモル比が3に相当する。この混合粉末を
アルミナるつぼに移し、900℃で焼成した。焼成物
を、ボールミルで粉砕し、粉末を得た。粉末の平均粒径
は、2.3μmであった。この粉末を実施例1と同様な
操作で、ペースト状のインク組成物を得た。
Example 3 100 parts by weight of ammonium dihydrogen phosphate (NH 4 H 2 PO 4 ) powder and copper oxide (Cu)
O) Powder 103.7 parts by weight was mixed to obtain a mixed powder. This amount is equivalent to Cu when copper is converted to CuO and phosphoric acid is converted to P 2 O 5.
The molar ratio O / P 2 O 5 corresponds to 3. This mixed powder was transferred to an alumina crucible and fired at 900 ° C. The fired product was crushed with a ball mill to obtain a powder. The average particle size of the powder was 2.3 μm. This powder was treated in the same manner as in Example 1 to obtain a paste-like ink composition.

【手続補正7】[Procedure Amendment 7]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0021[Correction target item name] 0021

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0021】[実施例4]表1の組成および粒度特性を
有するリン酸ガラス粉末(銅をCuO、リン酸をP2
5 に換算してCuO/P25 のモル比が0.067に
相当)を80重量部に対し、10重量%のエチルセルロ
ースを溶解したα−テルピネオール溶液を30重量部の
割合で加えて混練し、3本ロールミルにより均質分散を
行い、所望のペースト粘度に調整し、ペースト状のセラ
ミックカラー組成物を得た。
Example 4 Phosphate glass powder having the composition and particle size characteristics shown in Table 1 (CuO for copper and P 2 O for phosphoric acid)
5 molar ratio in terms of CuO / P 2 O 5 is to 80 parts by weight or equivalent) to 0.067, the addition of α- terpineol solution of 10 wt% ethylcellulose in a proportion of 30 parts by kneading Then, uniform dispersion was performed with a three-roll mill to adjust to a desired paste viscosity, and a paste-like ceramic color composition was obtained.

【手続補正8】[Procedure Amendment 8]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0022[Name of item to be corrected] 0022

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0022】[0022]

【表1】 [Table 1]

【手続補正9】[Procedure Amendment 9]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0025[Name of item to be corrected] 0025

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0025】[0025]

【表2】 [Table 2]

【手続補正10】[Procedure Amendment 10]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0027[Name of item to be corrected] 0027

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【0027】[比較例]実施例5と同じリン酸ガラス粉
末(銅をCuO、リン酸をP25 に換算してCuO/
25 のモル比が1に相当)を7重量部に対し、93
重量部のアクリル樹脂粉末を加熱混練したのち、4cm
角、3mm厚の板に成形した。また、実施例4と同様に
石英粉末でも同様にして、板を製作した。
[0027] [Comparative Example] Example 5 and CuO same phosphate glass powder (copper, CuO in terms of phosphoric acid P 2 O 5 /
The molar ratio of P 2 O 5 is equivalent to 1) and the amount of
After heating and kneading parts by weight of acrylic resin powder, 4 cm
It was formed into a plate having a corner of 3 mm. Further, a plate was manufactured in the same manner with quartz powder as in Example 4.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 大須賀 卓生 東京都千代田区丸の内二丁目1番2号 旭 硝子株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takuo Osuga 2-1-2 Marunouchi, Chiyoda-ku, Tokyo Asahi Glass Co., Ltd.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】銅を含有するリン酸化合物を10重量%以
上含有する近赤外線吸収材料。
1. A near infrared absorbing material containing 10% by weight or more of a phosphoric acid compound containing copper.
【請求項2】リン酸化合物は、銅をCuO、リン酸をP
2 O5 に換算してCuO/P2 O5のモル比が0.05
〜4である請求項1の近赤外線吸収材料。
2. A phosphoric acid compound is CuO for copper and P for phosphoric acid.
The molar ratio of CuO / P2 O5 is 0.05 when converted to 2 O5.
The near infrared ray absorbing material according to claim 1, wherein
【請求項3】リン酸化合物は、亜鉛をZnOに換算して
0.5重量%以上含有する請求項2の近赤外線吸収材
料。
3. The near infrared absorbing material according to claim 2, wherein the phosphoric acid compound contains zinc in an amount of 0.5% by weight or more in terms of ZnO.
JP11547192A 1992-02-07 1992-04-08 Near infrared ray absorption material Pending JPH05279078A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5677392 1992-02-07
JP4-56773 1992-02-07

Publications (1)

Publication Number Publication Date
JPH05279078A true JPH05279078A (en) 1993-10-26

Family

ID=13036786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11547192A Pending JPH05279078A (en) 1992-02-07 1992-04-08 Near infrared ray absorption material

Country Status (1)

Country Link
JP (1) JPH05279078A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009517490A (en) * 2005-11-25 2009-04-30 シクパ・ホールディング・ソシエテ・アノニム Infrared absorbing intaglio ink
KR20150032369A (en) 2013-09-16 2015-03-26 한국조폐공사 Infrared absorptive intaglio inks

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009517490A (en) * 2005-11-25 2009-04-30 シクパ・ホールディング・ソシエテ・アノニム Infrared absorbing intaglio ink
US8080307B2 (en) 2005-11-25 2011-12-20 Sicpa Holding Sa IR-absorbing Intaglio ink
EP1790701B2 (en) 2005-11-25 2012-02-01 Sicpa Holding Sa IR-absorbing intaglio ink
US8362130B2 (en) 2005-11-25 2013-01-29 Sicpa Holding Sa IR-absorbing Intaglio ink
KR20150032369A (en) 2013-09-16 2015-03-26 한국조폐공사 Infrared absorptive intaglio inks

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