JPH05278043A - Method and device for removing burr - Google Patents

Method and device for removing burr

Info

Publication number
JPH05278043A
JPH05278043A JP7742092A JP7742092A JPH05278043A JP H05278043 A JPH05278043 A JP H05278043A JP 7742092 A JP7742092 A JP 7742092A JP 7742092 A JP7742092 A JP 7742092A JP H05278043 A JPH05278043 A JP H05278043A
Authority
JP
Japan
Prior art keywords
pin
hole
burr
center hole
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7742092A
Other languages
Japanese (ja)
Other versions
JPH0775851B2 (en
Inventor
Takeshi KOMIYAMA
毅 小宮山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMI Records Japan Inc
Original Assignee
Toshiba Emi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Emi Ltd filed Critical Toshiba Emi Ltd
Priority to JP4077420A priority Critical patent/JPH0775851B2/en
Publication of JPH05278043A publication Critical patent/JPH05278043A/en
Publication of JPH0775851B2 publication Critical patent/JPH0775851B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To prevent a burr which has been produced on a peripheral edge of a hole of a hot melt resin product on one surface thereof during the production process from adhering and remaining on the surface of the resin product. CONSTITUTION:In a pin 10 having a conical tip end, a slant face 11 is coated with an adhesion preventive layer 12 to a resin. The slant face of the pin 10 heated by a heating wire 13 and controlled to a predetermined temperature by a temperature sensor 14 is inserted to a hole 1 formed in a hot melt resin product. In this manner, a burr 2 which has been produced on the edge of the hole on one surface of the product is thermally melted to be fused to the inner peripheral edge of the hole 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば、コンパクトデ
ィスク、ビデオディスク等の光学的に情報を記録した光
ディスクの中心孔の穿設に際し、その中心孔周縁の一面
に発生したバリを除去するためのバリ除去方法とその装
置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is for removing burrs formed on one surface of the peripheral edge of a center hole of an optical disk, such as a compact disk or a video disk, on which information is optically recorded. Burr removal method and apparatus therefor.

【0002】[0002]

【従来の技術】従来から、この種の光ディスクAは、射
出成型されるものであるが、そのスプルーランナBは、
光ディスクの中心、すなわち、中心孔1の部分に設けら
れ、このスプルーランナBの部分を、図3に示すよう
に、ポンチCで打ち抜くものであるが、この打ち抜きに
際し図4に示すようにバリ2が発生してしまう。
2. Description of the Related Art Conventionally, an optical disc A of this type has been injection-molded, but its sprue runner B has
The sprue runner B, which is provided at the center of the optical disk, that is, the central hole 1, is punched out by a punch C as shown in FIG. Will occur.

【0003】このバリ2が発生した状態で、原盤の信号
記録面に対して、次の工程として反射膜の形成を行う
と、その工程以前の運搬中に、あるいは、工程中にバリ
2が脱落して、図5に示すように信号記録面に付着した
状態となることがあり、この状態で反射膜を形成する
と、図6に示すようにバリ2の部分がピンホール3とな
って、この部分で記録した信号が正確に再生されなくな
ってしまう。
When the reflective film is formed on the signal recording surface of the master in the state where the burr 2 is generated, the burr 2 is detached during transportation before the process or during the process. Then, as shown in FIG. 5, it may be attached to the signal recording surface. When the reflection film is formed in this state, the burr 2 portion becomes a pinhole 3 as shown in FIG. The signal recorded in the part will not be reproduced correctly.

【0004】そのために、従来はこの中心孔1の穿設後
に、図7に示すようにバキュームキャップDで中心孔1
周縁の吸引を行いバリ2を吸引して、その除去を行った
り、あるいは、図8に示すように、円錐形の刃物Eで切
削を行っていた。
For this reason, conventionally, after the center hole 1 is formed, the center hole 1 is formed by the vacuum cap D as shown in FIG.
The peripheral edge is sucked to suck the burr 2 and the burr 2 is removed, or, as shown in FIG. 8, cutting is performed with a conical tool E.

【0005】[0005]

【発明が解決しようとする課題】しかし、プレス加工で
形成されたバリ2は、中心孔1と繋がった状態で残って
いることが多く、バキュームによる吸引だけではこれを
除去することは困難であり、次の工程への運搬中、ある
いは、次の工程でのセット中に脱落して光ディスクAに
付着してしまい、反射膜の形成工程でピンホール3とな
ってしまう。
However, the burr 2 formed by pressing often remains in a state of being connected to the central hole 1, and it is difficult to remove it only by vacuum suction. During the transportation to the next process or during the setting in the next process, it falls off and adheres to the optical disc A, and becomes a pinhole 3 in the process of forming the reflective film.

【0006】また、刃物Eによる切削加工を行う場合
も、図8に示すように切り粉4が飛散して、この飛散し
た切り粉4が光ディスクAとの間の静電気による吸着等
で光ディスクA上に残り、反射膜の形成に際しピンホー
ル3となって、エラーを発生することが多かった。
Also, when cutting with the blade E, the cutting powder 4 scatters as shown in FIG. 8, and the scattered cutting powder 4 is attracted to the optical disk A by static electricity, etc. However, when forming the reflective film, the pinhole 3 often occurs and an error occurs.

【0007】本発明は従来の熱溶融する樹脂における孔
のバリ除去上での前述の問題点を解決するためのもの
で、この孔の一面の周縁に発生しているバリを熱溶着す
ることで、孔周縁に一体的に溶け込ませて、そのバリを
熱溶融する樹脂の面に付着、残存させないバリ除去方
法、およびその装置を提供することを目的とする。
The present invention is intended to solve the above-mentioned problems in removing burrs from holes in a conventional heat-melting resin, and heat-welding burrs generated on the peripheral edge of one surface of the holes. SUMMARY OF THE INVENTION It is an object of the present invention to provide a burr removal method and a device for melting the burr integrally with the periphery of a hole so that the burr does not adhere to and remain on the surface of a resin that is melted by heat.

【0008】[0008]

【課題を解決するための手段】本発明は前述の目的を達
成するためのバリ除去方法に関し、その方法は、熱溶融
する樹脂の孔をプレス等の穿設加工を行って発生するバ
リを、先端が円錐形状の斜面を有するピンの表面に溶融
樹脂の付着防止層が形成され、かつ、所定温度に制御さ
れる前記ピンの斜面を、前記中心孔に差し込み、中心孔
の一面の周囲に形成されているバリを熱で柔軟化して、
前記中心孔の内縁部に溶着したことを特徴とする方法で
ある。
SUMMARY OF THE INVENTION The present invention relates to a method for removing burrs for achieving the above-mentioned object. The method is to remove burrs generated by punching a hole of resin to be melted by heat. A pin for preventing adhesion of molten resin is formed on the surface of the pin whose tip has a conical slope, and the slope of the pin, which is controlled to a predetermined temperature, is inserted into the center hole and formed around the one surface of the center hole. The burr that is being made is softened by heat,
The method is characterized by being welded to the inner edge portion of the center hole.

【0009】そして、前記の方法を行うための装置とし
て、熱溶融する樹脂の孔の周縁に圧接するべく、先端が
円錐形状の斜面に形成され、かつ、その表面に溶融樹脂
の付着防止層が形成されたピンと、該ピンに取付けられ
た電熱線と、前記ピンの温度を検出して前記電熱線を一
定温度に制御するための温度センサとを具備したことを
特徴とするものである。
As an apparatus for carrying out the above method, the tip is formed into a conical slant surface so as to be pressed against the peripheral edge of the hole of the resin to be melted by heat, and a layer for preventing adhesion of the molten resin is formed on the surface. It is characterized by comprising a formed pin, a heating wire attached to the pin, and a temperature sensor for detecting the temperature of the pin and controlling the heating wire to a constant temperature.

【0010】[0010]

【作用】本発明のバリ除去方法およびその装置は、熱溶
融する樹脂の孔の一面周縁に発生しているバリを、ピン
の加熱されている円錐面を押し当てることで、このバリ
を溶融し中心孔の一面周縁に溶け込ませて一体化するこ
とにより、このバリを除去するものである。
According to the method and apparatus for removing burrs of the present invention, the burrs generated on the peripheral edge of the hole of the resin to be melted by heat are pressed against the heated conical surface of the pin to melt the burrs. This burr is removed by being melted and integrated with the peripheral edge of one surface of the central hole.

【0011】[0011]

【実施例】次に、本発明を光ディスクの中心孔に発生す
るバリを除去する方法を実施するための一例を図1、図
2について以下に説明する。このバリ除去装置として使
用されるピン10は、図1に示すように先端が円錐形状
の斜面11に形成されると共に、この斜面11にはフッ
素樹脂等の溶融樹脂の付着防止層12がコーティングさ
れ、この斜面11に溶融された光ディスクAの熱可塑性
樹脂が付着しないようになっている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example for carrying out the method of the present invention for removing burrs generated in the center hole of an optical disk will be described below with reference to FIGS. As shown in FIG. 1, the pin 10 used as the deburring device is formed with a conical sloped surface 11 at the tip thereof, and the sloped surface 11 is coated with an adhesion preventing layer 12 of molten resin such as fluororesin. The melted thermoplastic resin of the optical disk A is prevented from adhering to the slope 11.

【0012】そして、前記の斜面11の直下部分には、
電熱線13が巻き付けられ、この電熱線13に電流を流
すことによってピン10は加熱され、さらに、このピン
10の内部中心には温度センサ14が内蔵され、この温
度センサ14の感知した温度によってピン10は一定温
度を保持するように温度制御されている。
Then, in the portion directly below the slope 11,
The heating wire 13 is wound, and the pin 10 is heated by passing an electric current through the heating wire 13. Further, a temperature sensor 14 is built in the center of the pin 10, and the temperature sensor 14 senses the temperature of the pin. The temperature of 10 is controlled so as to maintain a constant temperature.

【0013】而して、一定温度に保たれるピン10の斜
面11が光ディスクAの中心孔1のバリ2の発生してい
る面に押し付けられるが、このピン10の温度でバリ2
と共に光ディスクAの中心孔1の内縁部の一部も溶融さ
れ、図2に示すようなテーパ面15に形成されてバリ2
は除去される。
Then, the slope 11 of the pin 10 which is kept at a constant temperature is pressed against the surface of the center hole 1 of the optical disc A where the burr 2 is generated.
At the same time, a part of the inner edge portion of the center hole 1 of the optical disc A is melted and formed on the tapered surface 15 as shown in FIG.
Are removed.

【0014】この斜面11によるディスクAの熱可塑性
樹脂の溶融によって、溶融された熱可塑性樹脂が斜面1
1に付着して引き伸ばされ糸状となるのは、斜面11に
コーティングされた付着防止層12によって、その付着
が防止され糸状となることはない。
When the thermoplastic resin of the disk A is melted by the slope 11, the molten thermoplastic resin is converted into the slope 1.
What is attached to No. 1 to be stretched to form a thread is that the adhesion prevention layer 12 coated on the slope 11 prevents the adhesion and does not form a thread.

【0015】このピン10の光ディスクAへの圧接する
圧力や時間は、熱可塑性樹脂の種類や、ピン10の温度
によって変化させる必要があるが、ピン10の温度設定
を、その樹脂のガラス転移温度Tgよりも20°C高く
設定した場合には、低い圧力で圧着が可能である。
The pressure and time for the pin 10 to be pressed against the optical disk A must be changed depending on the type of thermoplastic resin and the temperature of the pin 10. The temperature setting of the pin 10 is set to the glass transition temperature of the resin. When the temperature is set to 20 ° C. higher than Tg, the pressure bonding can be performed with a low pressure.

【0016】光ディスクAの材料として、アクリル樹脂
が用いられている際には、ヒータ10の温度は、Tg=
120°Cであるので、120°C+20°C=140
°Cに設定し、光ディスクAの自重、すなわち、100
g前後の圧力でピン10の斜面11上に圧接させれば、
0.1 〜1.0 sec でバリ2の溶着と、中心孔1の内縁部の
整形は完了する。
When acrylic resin is used as the material of the optical disk A, the temperature of the heater 10 is Tg =
Since it is 120 ° C, 120 ° C + 20 ° C = 140
Set to ° C, the weight of the optical disc A, that is, 100
If pressure is applied to the slope 11 of the pin 10 with a pressure of about g,
The welding of the burr 2 and the shaping of the inner edge of the central hole 1 are completed in 0.1 to 1.0 sec.

【0017】従って、このバリ除去に際して、切り粉の
飛散、吸引の不完全性に基づく光ディスクAの表面への
バリ2の付着は略完全に除去され、バリ2の表面への付
着に伴うピンホールの発生がなくなり、光ディスクAの
信号欠落を防止できるものである。
Therefore, when removing the burrs, the burrs 2 are almost completely removed from the surface of the optical disc A due to the scattering of chips and the imperfect suction, and the pinholes are attached to the surfaces of the burrs 2. Therefore, the signal loss of the optical disc A can be prevented.

【0018】なお、前記した実施例は光ディスクの中心
孔のバリを除去する方法および装置について説明した
が、光ディスクに限定されるものではなく、熱溶融する
樹脂製品に形成した孔のバリを除去する場合にも応用で
きるものである。
Although the above-described embodiments have explained the method and apparatus for removing the burr in the center hole of the optical disk, the invention is not limited to the optical disk, and the burr in the hole formed in the heat-melting resin product is removed. It can also be applied in cases.

【0019】[0019]

【発明の効果】本発明は叙上のように、加熱されたピン
の円錐形状の斜面をバリの残存する熱溶融する樹脂の孔
の内縁部に圧接することで、バリを孔の内縁部を斜面と
しながら溶着してバリ除去が行えるので、例えば、光デ
ィスクに応用した場合に信号記録面の反射膜のピンホー
ルでの信号の欠落がなくなり、忠実なる再生が行えると
共に、中心孔の内縁部の成形状態はテーパ面に綺麗に成
形でき、従って、美観を損ねることがない等の効果を有
するものである。
As described above, according to the present invention, the conical slope of the heated pin is pressed against the inner edge of the hole of the heat-melting resin in which the burr remains so that the burr is removed from the inner edge of the hole. Since burrs can be removed by welding while forming an inclined surface, for example, when applied to an optical disc, there is no loss of signal in the pinhole of the reflection film of the signal recording surface, faithful reproduction can be performed, and the inner edge of the center hole In the molding state, the taper surface can be neatly molded, and therefore, the appearance is not spoiled.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例におけるヒータのバリ除去工程
の断面図である。
FIG. 1 is a cross-sectional view of a deburring process of a heater according to an embodiment of the present invention.

【図2】同上による加工を行った光ディスクの中心孔内
周縁部の断面図である。
FIG. 2 is a cross-sectional view of the inner peripheral edge portion of the center hole of the optical disc processed by the above.

【図3】射出成形状態のポンチ打ち抜き前の断面図であ
る。
FIG. 3 is a cross-sectional view before punch punching in an injection molding state.

【図4】同上のポンチ打ち抜き工程の断面図である。FIG. 4 is a sectional view of the punch punching process of the same.

【図5】反射膜形成工程前の斜面図である。FIG. 5 is a perspective view before a reflection film forming step.

【図6】反射膜形成時の斜面図である。FIG. 6 is a perspective view when a reflective film is formed.

【図7】バリ除去のためのバキューム吸引時の斜面図で
ある。
FIG. 7 is a perspective view at the time of vacuum suction for removing burrs.

【図8】バリ除去のための切削工程時の斜面図である。FIG. 8 is a perspective view during a cutting process for removing burrs.

【符号の説明】[Explanation of symbols]

A 光ディスク 1 中心孔 2 バリ 10 ピン 11 斜面 12 付着防止層 13 電熱線 14 温度センサ A optical disk 1 center hole 2 burr 10 pin 11 slope 12 adhesion prevention layer 13 heating wire 14 temperature sensor

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 熱溶融する樹脂の孔をプレス等の穿設加
工を行って発生するバリを、先端が円錐形状の斜面を有
するピンの表面に溶融樹脂の付着防止層が形成され、か
つ、所定温度に制御される前記ピンの斜面を、前記中心
孔に差し込み、中心孔の一面の周囲に形成されているバ
リを熱で柔軟化して、前記中心孔の内縁部に溶着したこ
とを特徴とするバリ除去方法。
1. A burrs generated by punching a hole of a heat-melting resin, such as a press, has a molten resin adhesion preventing layer formed on the surface of a pin having a conical sloped tip. The slant surface of the pin controlled to a predetermined temperature is inserted into the center hole, and a burr formed around one surface of the center hole is softened by heat and is welded to the inner edge portion of the center hole. Deburring method.
【請求項2】 熱溶融する樹脂の孔の周縁に圧接するべ
く、先端が円錐形状の斜面に形成され、かつ、その表面
に溶融樹脂の付着防止層が形成されたピンと、該ピンに
取付けられた電熱線と、前記ピンの温度を検出して前記
電熱線を一定温度に制御するための温度センサとを具備
したことを特徴とするバリ除去装置。
2. A pin having a conical sloped tip and a molten resin adhesion-preventing layer formed on the surface thereof so as to be pressed against the peripheral edge of a hole of heat-melting resin, and the pin is attached to the pin. A deburring device, comprising: a heating wire; and a temperature sensor for detecting the temperature of the pin to control the heating wire at a constant temperature.
JP4077420A 1992-03-31 1992-03-31 Deburring method and apparatus Expired - Lifetime JPH0775851B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4077420A JPH0775851B2 (en) 1992-03-31 1992-03-31 Deburring method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4077420A JPH0775851B2 (en) 1992-03-31 1992-03-31 Deburring method and apparatus

Publications (2)

Publication Number Publication Date
JPH05278043A true JPH05278043A (en) 1993-10-26
JPH0775851B2 JPH0775851B2 (en) 1995-08-16

Family

ID=13633472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4077420A Expired - Lifetime JPH0775851B2 (en) 1992-03-31 1992-03-31 Deburring method and apparatus

Country Status (1)

Country Link
JP (1) JPH0775851B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049027A1 (en) * 2000-12-15 2002-06-20 Sony Corporation Disk substrate, molding apparatus for injection-molding it, and disk substrate pick-up robot
KR100405704B1 (en) * 2001-04-30 2003-11-14 현대자동차주식회사 Grinding device for burr of piercing hole
KR20040047245A (en) * 2002-11-29 2004-06-05 주식회사 대연 Magnetic attaching article and method for manufacturing the article
CN109352882A (en) * 2018-10-25 2019-02-19 南通皋鑫电子股份有限公司 Remove high-voltage diode pin resin burr technique

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246983U (en) * 1988-09-26 1990-03-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246983U (en) * 1988-09-26 1990-03-30

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002049027A1 (en) * 2000-12-15 2002-06-20 Sony Corporation Disk substrate, molding apparatus for injection-molding it, and disk substrate pick-up robot
JP2002240101A (en) * 2000-12-15 2002-08-28 Sony Corp Disk board and mold apparatus for injection molding the same, robot for fetching disk board
US7229275B2 (en) 2000-12-15 2007-06-12 Sony Corporation Disk substrate, mold apparatus for injection molding the same, and disk substrate taking-out robot
KR100405704B1 (en) * 2001-04-30 2003-11-14 현대자동차주식회사 Grinding device for burr of piercing hole
KR20040047245A (en) * 2002-11-29 2004-06-05 주식회사 대연 Magnetic attaching article and method for manufacturing the article
CN109352882A (en) * 2018-10-25 2019-02-19 南通皋鑫电子股份有限公司 Remove high-voltage diode pin resin burr technique

Also Published As

Publication number Publication date
JPH0775851B2 (en) 1995-08-16

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