JPH05277781A - Laser beam machine - Google Patents
Laser beam machineInfo
- Publication number
- JPH05277781A JPH05277781A JP4106115A JP10611592A JPH05277781A JP H05277781 A JPH05277781 A JP H05277781A JP 4106115 A JP4106115 A JP 4106115A JP 10611592 A JP10611592 A JP 10611592A JP H05277781 A JPH05277781 A JP H05277781A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- laser
- gas
- laser processing
- auxiliary gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Laser Beam Processing (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はレーザ光を集光して加工
対象物に照射し、加工対象物の切断,溶接,表面改質等
のレーザ加工を行うレーザ加工機に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing machine for converging a laser beam and irradiating the object to be processed to perform laser processing such as cutting, welding and surface modification of the object.
【0002】[0002]
【従来の技術】通常、レーザ加工機により、加工対象物
のレーザ加工を行った場合、加工対象物に付着した油等
のため、レーザ加工時に大量の煙が発生する。この発生
した煙がレーザ加工機のレーザ光を集光案内するレンズ
や凹面鏡等の光学系に付着すれば、光学系でのレーザ光
の透過効率の低下の原因となると共に、その際光学系で
吸収されたレーザ光の発熱作用によって光学系の損傷を
招くおそれもある。2. Description of the Related Art Normally, when a laser processing machine performs laser processing on an object to be processed, a large amount of smoke is generated during the laser processing due to oil or the like attached to the object to be processed. If the generated smoke adheres to the optical system such as a lens or a concave mirror that guides the laser light of the laser processing machine, it causes a reduction in the transmission efficiency of the laser light in the optical system. The heat generated by the absorbed laser light may damage the optical system.
【0003】また、レーザ加工時における熱によって、
加工地点付近にプラズマが発生し、これによってレーザ
光がさえぎられて良好な加工ができなくなるため、アル
ゴン等の加工補助ガスを加工トーチ内に供給し、加工ト
ーチの先端部開口より噴出させて加工地点付近に吹き付
け、プラズマを除去するガス供給機構が一般に、レーザ
加工機に備えられている。Further, due to heat generated during laser processing,
Plasma is generated in the vicinity of the machining point, which interrupts the laser light and prevents good machining.Therefore, a machining auxiliary gas such as argon is supplied into the machining torch and jetted from the tip opening of the machining torch. Generally, a laser processing machine is equipped with a gas supply mechanism that blows near a point to remove plasma.
【0004】そして、このガス供給機構による加工補助
ガスの吹き付けによって、前記レーザ加工時に発生する
煙も吹き飛ばし除去され、光学系の汚染防止を図ってい
た。By blowing the processing auxiliary gas by the gas supply mechanism, the smoke generated during the laser processing is also blown off and removed, and the optical system is prevented from being contaminated.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、従来の
レーザ加工機においては、レーザ光の照射を停止して、
レーザ加工を停止すれば、加工補助ガスも停止する構造
とされているため、レーザ加工終了後に残った煙がレー
ザ加工地点近くに位置する加工トーチの先端部開口より
内部に侵入して光学系を汚染するという欠点があった。However, in the conventional laser processing machine, the irradiation of laser light is stopped,
When the laser processing is stopped, the processing auxiliary gas is also stopped.Therefore, the smoke remaining after the laser processing is completed enters the inside of the tip opening of the processing torch near the laser processing point, and the optical system is removed. It had the drawback of being contaminated.
【0006】そこで、本発明は上記問題点に鑑み、レー
ザ加工終了後に残った煙も良好に除去して光学系の汚染
防止を図ったレーザ加工機を提供することを目的とす
る。In view of the above problems, it is an object of the present invention to provide a laser processing machine in which smoke remaining after the laser processing is properly removed to prevent contamination of the optical system.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
の第1の技術的手段は、レーザ光を光学系によって集光
させながら加工トーチ内を通過させ、加工トーチの先端
部開口から加工対象物に照射してレーザ加工を行うと共
に、該レーザ加工時にレーザ加工地点付近に指向して加
工補助ガスを噴出させるガス供給機構を備えてなるレー
ザ加工機において、前記レーザ光の照射終了後も継続し
て一定時間、前記加工補助ガスを噴出させるガス供給機
構制御部を備えてなる点にある。A first technical means for achieving the above object is to allow a laser beam to pass through a processing torch while being condensed by an optical system and to be processed from an opening of a tip of the processing torch. In a laser processing machine equipped with a gas supply mechanism that irradiates an object to perform laser processing, and at the time of laser processing, directs a processing auxiliary gas toward the vicinity of the laser processing point, and continues even after the irradiation of the laser beam is completed. In addition, a gas supply mechanism control unit for ejecting the processing auxiliary gas for a certain period of time is provided.
【0008】また第2の技術的手段は、レーザ光を光学
系によって集光させながら加工トーチ内を通過させ、加
工トーチの先端部開口から加工対象物に照射してレーザ
加工を行うと共に、該レーザ加工時にレーザ加工地点付
近に指向して加工補助ガスを噴出させるガス供給機構を
備えてなるレーザ加工機において、前記レーザ光の照射
終了後に前記加工補助ガスを乾燥空気等の汚染防止ガス
に切替えて噴出させるガス供給機構制御部を備えてなる
点にある。A second technical means is that the laser beam is passed through the processing torch while being condensed by an optical system, and the object to be processed is irradiated from the opening of the tip end of the processing torch to perform the laser processing. In a laser processing machine provided with a gas supply mechanism that directs a processing auxiliary gas toward the vicinity of a laser processing point during laser processing, switches the processing auxiliary gas to a pollution prevention gas such as dry air after the irradiation of the laser beam is completed. It is provided with a gas supply mechanism control unit for ejecting the gas.
【0009】さらに第3の技術的手段は、レーザ光を光
学系によって集光させながら加工トーチ内を通過させ、
加工トーチの先端部開口から加工対象物に照射してレー
ザ加工を行うと共に、該レーザ加工時にレーザ加工地点
付近に指向して加工補助ガスを噴出させるガス供給機構
を備えてなるレーザ加工機において、前記ガス供給機構
を通じて、定常的に乾燥空気等の汚染防止ガスを流出さ
せ、前記レーザ加工時に、汚染防止ガスに前記加工補助
ガスを混入させた状態で噴出させるガス供給機構制御部
を備えてなる点にある。A third technical means is to pass the laser light through the processing torch while condensing the laser light by an optical system,
While performing laser processing by irradiating the object to be processed from the tip end opening of the processing torch, in a laser processing machine comprising a gas supply mechanism for directing a processing auxiliary gas toward the vicinity of the laser processing point during the laser processing, A gas supply mechanism controller is provided which constantly causes a pollution prevention gas such as dry air to flow out through the gas supply mechanism, and ejects the contamination prevention gas with the processing auxiliary gas mixed during the laser processing. There is a point.
【0010】[0010]
【作用】第1発明によれば、ガス供給機構制御部によっ
て、レーザ光の照射終了後も継続して一定時間、加工補
助ガスがレーザ加工地点付近に指向して噴出するよう制
御されているため、レーザ加工終了後に残った煙も良好
に吹き飛ばし除去され、加工トーチ内への煙の侵入を防
止でき、光学系の汚染が防止される。According to the first aspect of the invention, the gas supply mechanism control unit controls the processing auxiliary gas so that the processing auxiliary gas is jetted toward the vicinity of the laser processing point for a certain period of time even after the laser light irradiation is completed. Also, the smoke remaining after the laser processing is properly blown off and removed, the smoke can be prevented from entering the processing torch, and the optical system can be prevented from being contaminated.
【0011】第2発明によれば、ガス供給機構制御部に
よって、レーザ光の照射終了後、加工補助ガスを乾燥空
気等の汚染防止ガスに切替えて、レーザ加工地点付近に
指向して噴射させるよう制御されているため、レーザ加
工終了後に残った煙も良好に吹き飛ばし除去され、加工
トーチ内への煙の侵入を防止でき、光学系の汚染が防止
される。According to the second aspect of the present invention, the gas supply mechanism control unit switches the processing auxiliary gas to a pollution preventing gas such as dry air after the irradiation of the laser light is finished, and directs the injection toward the vicinity of the laser processing point. Since it is controlled, the smoke remaining after the laser processing is well blown off and removed, the smoke can be prevented from entering the processing torch, and the optical system can be prevented from being contaminated.
【0012】第3発明によれば、ガス供給機構制御部に
よって、定常的に乾燥空気等の汚染防止ガスをレーザ加
工地点付近に指向して流出させるよう制御されているた
め、レーザ加工終了後に残った煙の加工トーチ内への侵
入が有効に防止され、光学系の汚染が防止される。According to the third aspect of the present invention, the gas supply mechanism control unit constantly controls so that the pollution preventing gas such as dry air is directed toward the vicinity of the laser processing point and flows out. The smoke is effectively prevented from entering the processing torch and the optical system is prevented from being contaminated.
【0013】[0013]
【実施例】以下、第1発明の第1実施例を図面に基づい
て説明すると、図1において、1はレーザ加工機で、レ
ーザ加工機構部2やガス供給機構3やレーザ加工制御装
置4等を備えている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the first invention will now be described with reference to the drawings. In FIG. 1, reference numeral 1 denotes a laser processing machine, a laser processing mechanism section 2, a gas supply mechanism 3, a laser processing control device 4, etc. Is equipped with.
【0014】前記レーザ加工機構部2にはレーザ発振器
10が搭載されており、レーザ発振器10から放射され
たレーザ光11は集光レンズや凹面鏡等の光学系12で
絞られて加工トーチ13に沿って集光され、加工トーチ
13の先端部13a開口から加工対象物としてのワーク
14に照射されるよう構成されている。A laser oscillator 10 is mounted on the laser processing mechanism portion 2, and a laser beam 11 emitted from the laser oscillator 10 is focused by an optical system 12 such as a condenser lens or a concave mirror and is guided along a processing torch 13. It is configured such that the light is focused and condensed, and the work 14 as the object to be processed is irradiated from the opening of the tip portion 13a of the processing torch 13.
【0015】ガス供給機構3は、アルゴン等の加工補助
ガスが収容された補助ガスボンベ20と、補助ガスボン
ベ20から加工トーチ13内部に加工補助ガスを供給す
る補助ガス供給路21とを備え、補助ガス供給路21途
中には減圧弁22および補助ガス電磁弁23が順次介在
されている。The gas supply mechanism 3 includes an auxiliary gas cylinder 20 containing a processing auxiliary gas such as argon, and an auxiliary gas supply passage 21 for supplying the auxiliary processing gas from the auxiliary gas cylinder 20 into the processing torch 13. A pressure reducing valve 22 and an auxiliary gas electromagnetic valve 23 are sequentially interposed in the supply path 21.
【0016】レーザ加工制御装置4はレーザ発振器10
を作動させるレーザ発振器ON信号24や補助ガス電磁
弁23を励磁させる補助ガスON信号25を出力・停止
するよう構成されており、またレーザ発振器ON信号2
4と補助ガスON信号25とが同時に出力されると共
に、レーザ発振器ON信号24の出力が停止した後、一
定時間経過後に補助ガスON信号25の出力が停止する
よう制御されている。The laser processing controller 4 includes a laser oscillator 10
Is configured to output and stop the laser oscillator ON signal 24 for activating the auxiliary gas and the auxiliary gas ON signal 25 for exciting the auxiliary gas electromagnetic valve 23, and the laser oscillator ON signal 2
4 and the auxiliary gas ON signal 25 are simultaneously output, and after the output of the laser oscillator ON signal 24 is stopped, the output of the auxiliary gas ON signal 25 is stopped after a predetermined time has elapsed.
【0017】従って図1に示される如く、ワーク14の
突合せ溶接を行う場合には、レーザ加工が開始される
と、レーザ加工制御装置4からレーザ発振器ON信号2
4と補助ガスON信号25とが同時に出力される。Therefore, as shown in FIG. 1, when the butt welding of the work 14 is performed, when the laser processing is started, the laser processing control device 4 outputs the laser oscillator ON signal 2
4 and the auxiliary gas ON signal 25 are simultaneously output.
【0018】レーザ発振器10にレーザ発振器ON信号
24が入力されると、レーザ発振器10が作動してレー
ザ光11を放射する。このレーザ光11は光学系12で
絞られて加工トーチ13に沿って集光され、先端部13
a開口からワーク14に照射され、ワーク14上で焦点
を結び、ここに溶接が実行される。When the laser oscillator ON signal 24 is input to the laser oscillator 10, the laser oscillator 10 operates and emits the laser beam 11. This laser light 11 is focused by an optical system 12 and is condensed along a processing torch 13, and a tip portion 13
The work 14 is irradiated from the opening a, is focused on the work 14, and welding is performed there.
【0019】一方、補助ガス電磁弁23に補助ガスON
信号25が入力されると、補助ガス電磁弁23が励磁さ
れて開作動し、ここに補助ガスボンベ20から減圧弁2
2を通じて所定圧力に調整された加工補助ガスが補助ガ
ス供給路21を通じて加工トーチ13内に供給される。On the other hand, the auxiliary gas solenoid valve 23 is turned on.
When the signal 25 is input, the auxiliary gas electromagnetic valve 23 is excited and opens, and the pressure reducing valve 2 is connected to the auxiliary gas cylinder 20.
The processing auxiliary gas adjusted to a predetermined pressure through 2 is supplied into the processing torch 13 through the auxiliary gas supply passage 21.
【0020】この供給された加工補助ガスは加工トーチ
13の先端部13a開口からレーザ加工地点付近に向け
て噴出される。そしてレーザ加工中に発生するプラズマ
を除去すると共に煙を吹き飛ばし除去する。The supplied processing auxiliary gas is jetted from the opening of the tip portion 13a of the processing torch 13 toward the vicinity of the laser processing point. Then, plasma generated during laser processing is removed and smoke is blown away.
【0021】またレーザ加工中は図示省略の駆動機構お
よび駆動機構制御装置によってレーザ加工機構部2は溶
接すべき軌跡に沿って移動制御され、溶接線に沿って溶
接が実行される。During the laser processing, the laser processing mechanism section 2 is controlled to move along the locus to be welded by a drive mechanism and a drive mechanism controller (not shown), and welding is performed along the welding line.
【0022】所定の溶接が終了すると、レーザ加工制御
装置4はレーザ発振器ON信号24の出力を停止し、こ
こにレーザ発振器10の作動が停止する。一方、補助ガ
スON信号25は継続して出力されており、加工補助ガ
スは継続して加工トーチ13の先端部13a開口からレ
ーザ加工地点付近に指向して噴出されている。When the predetermined welding is completed, the laser processing controller 4 stops the output of the laser oscillator ON signal 24, and the operation of the laser oscillator 10 stops there. On the other hand, the auxiliary gas ON signal 25 is continuously output, and the processing auxiliary gas is continuously ejected from the opening of the tip portion 13a of the processing torch 13 toward the vicinity of the laser processing point.
【0023】従って、レーザ加工終了後に残っている煙
は継続して噴出される加工補助ガスによって吹き飛ばし
除去されると共に、加工トーチ13内への煙の侵入が噴
出する加工補助ガスによって有効に阻止され、ここにレ
ーザ加工時に発生する煙による光学系の汚染が防止でき
る。Therefore, the smoke remaining after the completion of the laser processing is blown away and removed by the machining auxiliary gas continuously ejected, and the invasion of smoke into the machining torch 13 is effectively blocked by the ejected machining auxiliary gas. Here, contamination of the optical system due to smoke generated during laser processing can be prevented.
【0024】その後、一定時間経過後に、レーザ加工制
御装置4は補助ガスON信号25の出力も停止し、ここ
に補助ガス電磁弁23が消磁されて閉作動し、加工トー
チ13に対する加工補助ガスの供給が停止する。Then, after a lapse of a certain time, the laser processing controller 4 also stops the output of the auxiliary gas ON signal 25, the auxiliary gas solenoid valve 23 is demagnetized and closed, and the auxiliary processing gas for the processing torch 13 is supplied. Supply is stopped.
【0025】ここに、レーザ加工制御装置4はガス供給
機構3を制御して、レーザ加工終了後も継続して一定時
間、加工補助ガスを噴出させる制御部を構成する。Here, the laser processing control device 4 constitutes a control unit for controlling the gas supply mechanism 3 to continuously eject the processing auxiliary gas for a certain period of time after the laser processing is completed.
【0026】なお、レーザ発振器ON信号24の出力停
止後、補助ガスON信号が継続して出力される時間は、
対象ワーク14や加工の種別に応じて最適な時間を適宜
設定すればよい。After the output of the laser oscillator ON signal 24 is stopped, the time during which the auxiliary gas ON signal is continuously output is
The optimum time may be set appropriately according to the target work 14 and the type of processing.
【0027】図2は第1発明の第2実施例を示してお
り、図中第1実施例と同様構成のものは同一符号を付
し、その説明を省略する。FIG. 2 shows a second embodiment of the first invention. In the figure, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.
【0028】ガス供給機構3はメインガス供給路21a
とサブガス供給路21bとが並列状に分岐配置された補
助ガス供給路21を備え、メインガス供給路21aおよ
びサブガス供給路21bのそれぞれに減圧弁22a,2
2bおよび補助ガス電磁弁23a,23bが備えられて
いる。The gas supply mechanism 3 is a main gas supply passage 21a.
And a sub gas supply passage 21b are provided in parallel with each other, and an auxiliary gas supply passage 21 is provided, and pressure reducing valves 22a, 2 are provided in the main gas supply passage 21a and the sub gas supply passage 21b, respectively.
2b and auxiliary gas solenoid valves 23a, 23b are provided.
【0029】そしてレーザ加工制御装置4はレーザ発振
器10を作動させるレーザ発振器ON信号24や各補助
ガス電磁弁23a,23bを励磁させる補助ガスON信
号25a,25bを出力・停止するよう構成されてい
る。またレーザ発振器ON信号24とメインガス供給路
21aへの補助ガスON信号25aとは同時に出力・停
止され、レーザ発振器ON信号24と補助ガスON信号
25aの出力が停止されると同時に、サブガス供給路2
1bへの補助ガスON信号25bが出力され、一定時間
経過後に補助ガスON信号25bの出力が停止するよう
制御されている。The laser processing controller 4 is configured to output / stop the laser oscillator ON signal 24 for operating the laser oscillator 10 and the auxiliary gas ON signals 25a, 25b for exciting the auxiliary gas solenoid valves 23a, 23b. .. Further, the laser oscillator ON signal 24 and the auxiliary gas ON signal 25a to the main gas supply path 21a are output / stopped at the same time, and the output of the laser oscillator ON signal 24 and the auxiliary gas ON signal 25a are stopped, and at the same time, the sub gas supply path Two
The auxiliary gas ON signal 25b to 1b is output, and the output of the auxiliary gas ON signal 25b is controlled to stop after a certain period of time has elapsed.
【0030】従って第1実施例同様、レーザ加工が開始
されると、レーザ加工制御装置4からレーザ発振器ON
信号24と補助ガスON信号25aとが同時に出力さ
れ、レーザ光により溶接が実行されると共に、補助ガス
供給路21のメインガス供給路21a を通じて加工トーチ
13内に加工補助ガスが供給され、レーザ加工中に発生
するプラズマを除去すると共に煙を吹き飛ばし除去す
る。Therefore, as in the first embodiment, when the laser processing is started, the laser processing controller 4 turns on the laser oscillator.
The signal 24 and the auxiliary gas ON signal 25a are simultaneously output, the welding is executed by the laser light, and the processing auxiliary gas is supplied into the processing torch 13 through the main gas supply path 21a of the auxiliary gas supply path 21 for laser processing. The plasma generated inside is removed and the smoke is blown away.
【0031】所定の溶接が終了すると、レーザ加工制御
装置4はレーザ発振器ON信号24および補助ガスON
信号25aの出力を停止すると共に、補助ガスON信号
25bを出力する。When the predetermined welding is completed, the laser processing control device 4 causes the laser oscillator ON signal 24 and the auxiliary gas ON.
The output of the signal 25a is stopped and the auxiliary gas ON signal 25b is output.
【0032】この補助ガスON信号25bによってサブ
ガス供給路21bの補助ガス電磁弁23bが励磁して開
作動し、ここにサブガス供給路21bを通じて、適当に
圧力調整された加工補助ガスは加工トーチ13内に継続
して供給され、加工トーチ13の先端部13a開口から
レーザ加工地点付近に指向して噴出される。This auxiliary gas ON signal 25b excites the auxiliary gas electromagnetic valve 23b of the sub gas supply path 21b to open it, and the processing auxiliary gas whose pressure is adjusted appropriately through the sub gas supply path 21b is stored in the processing torch 13. Is continuously supplied to the laser beam and is ejected from the opening of the tip portion 13a of the processing torch 13 toward the vicinity of the laser processing point.
【0033】従って、レーザ加工終了後に残っている煙
は継続して噴出される加工補助ガスによって吹き飛ばし
除去されると共に、加工トーチ13内への煙の侵入が噴
出する加工補助ガスによって有効に阻止され、ここにレ
ーザ加工時に発生する煙による光学系の汚染が防止でき
る。Therefore, the smoke remaining after the completion of the laser processing is blown away and removed by the machining auxiliary gas continuously ejected, and the invasion of smoke into the machining torch 13 is effectively blocked by the ejected machining auxiliary gas. Here, contamination of the optical system due to smoke generated during laser processing can be prevented.
【0034】その後、一定時間経過後に、レーザ加工制
御装置4は補助ガスON信号25bの出力を停止し、こ
こに補助ガス電磁弁23bが消磁されて閉作動し、加工
トーチ13に対する加工補助ガスの供給が停止する。Then, after a lapse of a certain period of time, the laser processing control device 4 stops the output of the auxiliary gas ON signal 25b, and the auxiliary gas solenoid valve 23b is demagnetized and closed to operate the auxiliary gas for the processing torch 13. Supply is stopped.
【0035】図3は第2発明の実施例を示しており、図
中第1発明の実施例と同様構成のものは同一符号を付
し、その説明を省略する。FIG. 3 shows an embodiment of the second invention. In the drawing, the same components as those of the embodiment of the first invention are designated by the same reference numerals and the description thereof will be omitted.
【0036】ガス供給機構3には、乾燥空気や窒素等の
汚染防止ガスを供給するための汚染防止ガス源30が備
えられており、一端側が汚染防止ガス源30に接続さ
れ、減圧弁31および汚染防止ガス電磁弁32を介在し
た汚染防止ガス供給路33の他端側が、補助ガス電磁弁
23と加工トーチ13間に位置する補助ガス供給路21
に接続されている。The gas supply mechanism 3 is provided with a pollution control gas source 30 for supplying a pollution control gas such as dry air or nitrogen. One end of the gas supply mechanism 3 is connected to the pollution control gas source 30 and a pressure reducing valve 31 and The auxiliary gas supply passage 21 is located between the auxiliary gas solenoid valve 23 and the processing torch 13 at the other end of the pollution prevention gas supply passage 33 with the pollution prevention gas solenoid valve 32 interposed.
It is connected to the.
【0037】そしてレーザ加工制御装置4はレーザ発振
器10を作動させるレーザ発振器ON信号24や補助ガ
ス電磁弁23,汚染防止ガス電磁弁32を励磁させる補
助ガスON信号25、汚染防止ガスON信号35を出力
・停止するよう構成されている。またレーザ発振器ON
信号24と補助ガスON信号25とは同時に出力・停止
され、レーザ発振器ON信号24と補助ガスON信号2
5の出力が停止されると同時に、汚染防止ガスON信号
35が出力され、一定時間経過後に汚染防止ガスON信
号35の出力が停止するよう制御されている。Then, the laser processing controller 4 sends the laser oscillator ON signal 24 for operating the laser oscillator 10, the auxiliary gas solenoid valve 23, the auxiliary gas ON signal 25 for exciting the pollution prevention gas solenoid valve 32, and the pollution prevention gas ON signal 35. It is configured to output / stop. The laser oscillator is turned on.
The signal 24 and the auxiliary gas ON signal 25 are simultaneously output and stopped, and the laser oscillator ON signal 24 and the auxiliary gas ON signal 2 are output.
At the same time that the output of No. 5 is stopped, the pollution prevention gas ON signal 35 is output, and the output of the pollution prevention gas ON signal 35 is controlled to stop after a certain period of time.
【0038】従って第1発明の第1実施例同様、レーザ
加工が開始されると、レーザ加工制御装置4からレーザ
発振器ON信号24と補助ガスON信号25とが同時に
出力され、レーザ光により溶接が実行されると共に、補
助ガス供給路21を通じて加工トーチ13内に加工補助
ガスが供給され、レーザ加工中に発生するプラズマを除
去すると共に煙を吹き飛ばし除去する。Therefore, like the first embodiment of the first invention, when the laser processing is started, the laser processing control device 4 outputs the laser oscillator ON signal 24 and the auxiliary gas ON signal 25 at the same time, and the welding is performed by the laser light. While being executed, the processing auxiliary gas is supplied into the processing torch 13 through the auxiliary gas supply passage 21 to remove plasma generated during laser processing and blow off smoke.
【0039】所定の溶接が終了すると、レーザ加工制御
装置4はレーザ発振器ON信号24および補助ガスON
信号25の出力を停止すると共に、汚染防止ガスON信
号35を出力する。When the predetermined welding is completed, the laser processing controller 4 turns on the laser oscillator ON signal 24 and the auxiliary gas ON.
The output of the signal 25 is stopped and the pollution prevention gas ON signal 35 is output.
【0040】この汚染防止ガスON信号35によって汚
染防止ガス供給路33の汚染防止ガス電磁弁32が励磁
して開作動し、ここに汚染防止ガス供給路33を通じて
補助ガス供給路21から加工トーチ13内に適当に圧力
調整された汚染防止ガスが供給される。即ち、補助ガス
供給路21を通じて供給されていた加工補助ガスが停止
されると同時に汚染防止ガスが供給される方式であり、
ここに加工トーチ13の先端部13a開口からレーザ加
工地点付近に指向して噴出されていた加工補助ガスが汚
染防止ガスに切替えられ、継続して噴出される。The pollution prevention gas ON signal 35 excites the pollution prevention gas solenoid valve 32 in the pollution prevention gas supply passage 33 to open, and the auxiliary gas supply passage 21 through the processing gas torch 13 passes through the pollution prevention gas supply passage 33. An anti-pollution gas, whose pressure is adjusted appropriately, is supplied therein. That is, this is a system in which the processing auxiliary gas that has been supplied through the auxiliary gas supply path 21 is stopped and at the same time the pollution prevention gas is supplied.
The machining auxiliary gas that has been ejected from the opening of the tip portion 13a of the machining torch 13 toward the vicinity of the laser machining point is switched to the pollution prevention gas, and is continuously ejected.
【0041】従って、レーザ加工終了後に残っている煙
は継続して噴出される汚染防止ガスによって吹き飛ばし
除去されると共に、加工トーチ13内への煙の侵入が噴
出する汚染防止ガスによって有効に阻止され、ここにレ
ーザ加工時に発生する煙による光学系の汚染が防止でき
る。Therefore, the smoke remaining after the laser processing is blown off and removed by the pollution preventing gas continuously ejected, and the invasion of smoke into the processing torch 13 is effectively blocked by the ejecting pollution preventing gas. Here, contamination of the optical system due to smoke generated during laser processing can be prevented.
【0042】その後、一定時間経過後に、レーザ加工制
御装置4は汚染防止ガスON信号35の出力を停止し、
ここに汚染防止ガス電磁弁32が消磁されて閉作動し、
加工トーチ13に対する汚染防止ガスの供給が停止す
る。Then, after a lapse of a certain time, the laser processing control device 4 stops outputting the pollution prevention gas ON signal 35,
Here, the pollution prevention gas solenoid valve 32 is demagnetized and closed,
The supply of the pollution prevention gas to the processing torch 13 is stopped.
【0043】図4は第3発明の実施例を示しており、図
中第1発明の第1実施例と同様構成のものは同一符号を
付し、その説明を省略する。FIG. 4 shows an embodiment of the third invention. In the drawing, the same components as those of the first embodiment of the first invention are designated by the same reference numerals and the description thereof will be omitted.
【0044】ガス供給機構3には、乾燥空気や窒素等の
汚染防止ガスを供給するための汚染防止ガス源30が備
えられており、汚染防止ガス供給路33の一端側が汚染
防止ガス源30に接続されると共に他端側が、補助ガス
電磁弁23と加工トーチ13間に位置する補助ガス供給
路21に接続されている。また汚染防止ガス供給路33
途中には圧力調整用の減圧弁31が介在されている。The gas supply mechanism 3 is provided with a pollution prevention gas source 30 for supplying a pollution prevention gas such as dry air or nitrogen. One end of the pollution prevention gas supply passage 33 serves as the pollution prevention gas source 30. While being connected, the other end is connected to an auxiliary gas supply passage 21 located between the auxiliary gas solenoid valve 23 and the processing torch 13. In addition, the pollution prevention gas supply passage 33
A pressure reducing valve 31 for pressure adjustment is interposed in the middle.
【0045】従って、汚染防止ガス源30から減圧弁3
1により圧力調整された汚染防止ガスが、汚染防止ガス
供給路33および補助ガス供給路21を通じて加工トー
チ13内に常時供給されており、補助ガス電磁弁23が
開作動された際には、汚染防止ガスに加工補助ガスが混
入した状態の混合ガスが加工トーチ13内に供給され
る。Therefore, from the pollution prevention gas source 30 to the pressure reducing valve 3
The pollution prevention gas whose pressure is adjusted by 1 is constantly supplied into the processing torch 13 through the pollution prevention gas supply path 33 and the auxiliary gas supply path 21, and when the auxiliary gas solenoid valve 23 is opened, the pollution prevention gas is polluted. A mixed gas in which the processing auxiliary gas is mixed with the prevention gas is supplied into the processing torch 13.
【0046】そしてレーザ加工制御装置4はレーザ発振
器10を作動させるレーザ発振器ON信号24や補助ガ
ス電磁弁23を励磁させる補助ガスON信号25を同時
に出力・停止するよう制御されている。The laser processing controller 4 is controlled so as to simultaneously output and stop the laser oscillator ON signal 24 for operating the laser oscillator 10 and the auxiliary gas ON signal 25 for exciting the auxiliary gas electromagnetic valve 23.
【0047】従って第1発明の第1実施例同様、レーザ
加工が開始されると、レーザ加工制御装置4からレーザ
発振器ON信号24と補助ガスON信号25とが同時に
出力され、レーザ光により溶接が実行されると共に、補
助ガス供給路21および汚染防止ガス供給路33を通じ
て加工トーチ13内に加工補助ガスと汚染防止ガスとの
混合ガスが供給され、レーザ加工中に発生するプラズマ
を除去すると共に煙を吹き飛ばし除去する。Therefore, like the first embodiment of the first invention, when the laser processing is started, the laser processing control device 4 outputs the laser oscillator ON signal 24 and the auxiliary gas ON signal 25 at the same time, and the welding is performed by the laser light. While being executed, the mixed gas of the processing auxiliary gas and the pollution prevention gas is supplied into the processing torch 13 through the auxiliary gas supply path 21 and the pollution prevention gas supply path 33 to remove the plasma generated during the laser processing and smoke. Blow away and remove.
【0048】所定の溶接が終了すると、レーザ加工制御
装置4はレーザ発振器ON信号24および補助ガスON
信号25の出力を停止する。ここに加工補助ガスの供給
が停止される。When the predetermined welding is completed, the laser processing control device 4 causes the laser oscillator ON signal 24 and the auxiliary gas ON.
The output of the signal 25 is stopped. The supply of the processing auxiliary gas is stopped here.
【0049】この際、汚染防止ガス供給路33を通じて
汚染防止ガスは定常的に供給されているため、加工トー
チ13の先端部13a開口からレーザ加工地点付近に指
向して汚染防止ガスが継続して噴出される。At this time, since the pollution prevention gas is constantly supplied through the pollution prevention gas supply passage 33, the pollution prevention gas continues from the opening 13a of the processing torch 13 toward the vicinity of the laser processing point. Erupted.
【0050】従って、レーザ加工終了後に残っている煙
は継続して噴出される汚染防止ガスによって吹き飛ばし
除去されると共に、加工トーチ13内への煙の侵入が噴
出する汚染防止ガスによって有効に阻止され、ここにレ
ーザ加工時に発生する煙による光学系の汚染が防止でき
る。Therefore, the smoke remaining after the laser processing is blown away and removed by the pollution preventing gas continuously ejected, and the invasion of smoke into the processing torch 13 is effectively blocked by the ejecting pollution preventing gas. Here, contamination of the optical system due to smoke generated during laser processing can be prevented.
【0051】なお、上記各発明の実施例において、溶接
を行う場合を示しているが、切断や表面改質等の加工内
容であってもよい。また、レーザ加工地点付近に指向し
て噴出させる加工補助ガスや汚染防止ガスを加工トーチ
13内に供給する構造を示しているが、加工トーチ13
の外周部近傍に汚染防止ガス供給路33等の噴出口を配
置する構造としてもよい。さらに補助ガス供給路21と
汚染防止ガス供給路33とを別の供給路として構成し、
それぞれ別個に加工トーチ13に接続する構造であって
もよい。In the above-mentioned embodiments of the invention, the case where welding is performed is shown, but the details of processing such as cutting and surface modification may be used. Further, a structure is shown in which a processing auxiliary gas and a pollution prevention gas to be jetted toward the vicinity of the laser processing point are supplied into the processing torch 13.
It is also possible to adopt a structure in which the ejection ports such as the pollution prevention gas supply passage 33 are arranged near the outer peripheral portion of Further, the auxiliary gas supply path 21 and the pollution prevention gas supply path 33 are configured as separate supply paths,
The structure may be such that they are separately connected to the processing torch 13.
【0052】[0052]
【発明の効果】以上のように、第1発明のレーザ加工機
によれば、レーザ光の照射終了後も継続して一定時間加
工補助ガスを噴出させるため、レーザ加工終了後に残っ
た煙も良好に吹き飛ばし除去でき、レーザ加工時におい
て発生する煙による光学系の汚染が有効に防止できる。As described above, according to the laser processing machine of the first invention, since the processing auxiliary gas is continuously ejected for a certain period of time after the end of the laser beam irradiation, the smoke remaining after the end of the laser processing is also good. It can be blown away and removed, and contamination of the optical system due to smoke generated during laser processing can be effectively prevented.
【0053】また第2発明のレーザ加工機によれば、レ
ーザ光の照射終了後に加工補助ガスに替えて、継続して
汚染防止ガスが噴出されるため、前述同様にレーザ加工
時において発生する煙による光学系の汚染が有効に防止
できる。Further, according to the laser processing machine of the second invention, since the pollution preventing gas is continuously ejected in place of the processing auxiliary gas after the irradiation of the laser light is finished, the smoke generated during the laser processing is similarly generated as described above. It is possible to effectively prevent the optical system from being contaminated.
【0054】さらに第3発明のレーザ加工機によれば、
定常的に汚染防止ガスがレーザ加工地点付近に指向して
流出されているため、レーザ加工終了後に残った煙の加
工トーチ内への侵入が有効に防止でき、レーザ加工時に
おいて発生する煙による光学系の汚染が有効に防止でき
る。Further, according to the laser processing machine of the third invention,
Since the pollution prevention gas is constantly directed toward the laser processing point and flows out, it is possible to effectively prevent the smoke remaining after the laser processing from entering the processing torch, and the smoke generated during the laser processing is used as an optical source. System pollution can be effectively prevented.
【図1】第1発明の第1実施例を示す概略説明図であ
る。FIG. 1 is a schematic explanatory view showing a first embodiment of the first invention.
【図2】第1発明の第2実施例を示す概略説明図であ
る。FIG. 2 is a schematic explanatory view showing a second embodiment of the first invention.
【図3】第2発明の実施例を示す概略説明図である。FIG. 3 is a schematic explanatory view showing an embodiment of the second invention.
【図4】第3発明の実施例を示す概略説明図である。FIG. 4 is a schematic explanatory view showing an embodiment of the third invention.
1 レーザ加工機 3 ガス供給機構 4 レーザ加工制御装置 10 レーザ発振器 11 レーザ光 12 光学系 13 加工トーチ 14 ワーク 20 補助ガスボンベ 21 補助ガス供給路 24 レーザ発振器ON信号 25 補助ガスON信号 30 汚染防止ガス源 33 汚染防止ガス供給路 35 汚染防止ガスON信号 1 Laser Processing Machine 3 Gas Supply Mechanism 4 Laser Processing Control Device 10 Laser Oscillator 11 Laser Light 12 Optical System 13 Processing Torch 14 Work 20 Auxiliary Gas Cylinder 21 Auxiliary Gas Supply Channel 24 Laser Oscillator ON Signal 25 Auxiliary Gas ON Signal 30 Contamination Prevention Gas Source 33 Contamination prevention gas supply path 35 Pollution prevention gas ON signal
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小林 正和 兵庫県西宮市田近野町6番107号 新明和 工業株式会社開発技術本部内 (72)発明者 黒田 俊英 兵庫県西宮市田近野町6番107号 新明和 工業株式会社開発技術本部内 (72)発明者 桃崎 潤子 兵庫県西宮市田近野町6番107号 新明和 工業株式会社開発技術本部内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Masakazu Kobayashi, 6-10 Takino-cho, Nishinomiya-shi, Hyogo Prefecture Shinmeiwa Industrial Co., Ltd. Development Technology Headquarters (72) Toshihide Kuroda 6-Takino-cho, Nishinomiya-shi, Hyogo No. 107 Shin-Maywa Industrial Co., Ltd. Development Technology Headquarters (72) Inventor Junko Momozaki 6-7 Takino-cho, Nishinomiya-shi, Hyogo No. 107 Shin-Maywa Industrial Co., Ltd. Development Technology Headquarters
Claims (3)
ら加工トーチ内を通過させ、加工トーチの先端部開口か
ら加工対象物に照射してレーザ加工を行うと共に、該レ
ーザ加工時にレーザ加工地点付近に指向して加工補助ガ
スを噴出させるガス供給機構を備えてなるレーザ加工機
において、 前記レーザ光の照射終了後も継続して一定時間、前記加
工補助ガスを噴出させるガス供給機構制御部を備えてな
ることを特徴とするレーザ加工機。1. A laser beam is passed through a processing torch while being condensed by an optical system, and an object to be processed is irradiated with laser light from an opening of a tip end of the processing torch to perform laser processing. In a laser processing machine provided with a gas supply mechanism for ejecting a processing auxiliary gas toward a direction, a gas supply mechanism control unit for continuously ejecting the processing auxiliary gas for a certain period of time after the end of the irradiation of the laser beam is provided. A laser processing machine characterized by the following.
ら加工トーチ内を通過させ、加工トーチの先端部開口か
ら加工対象物に照射してレーザ加工を行うと共に、該レ
ーザ加工時にレーザ加工地点付近に指向して加工補助ガ
スを噴出させるガス供給機構を備えてなるレーザ加工機
において、 前記レーザ光の照射終了後に前記加工補助ガスを乾燥空
気等の汚染防止ガスに切替えて噴出させるガス供給機構
制御部を備えてなることを特徴とするレーザ加工機。2. A laser beam is passed through a processing torch while being condensed by an optical system, and an object to be processed is irradiated from an opening of a tip end of the processing torch to perform laser processing, and at the time of the laser processing, a vicinity of a laser processing point. In a laser processing machine provided with a gas supply mechanism for ejecting a processing auxiliary gas directed toward, a gas supply mechanism control for switching the processing auxiliary gas to a pollution prevention gas such as dry air and ejecting it after the irradiation of the laser beam is completed. A laser processing machine characterized by comprising a section.
ら加工トーチ内を通過させ、加工トーチの先端部開口か
ら加工対象物に照射してレーザ加工を行うと共に、該レ
ーザ加工時にレーザ加工地点付近に指向して加工補助ガ
スを噴出させるガス供給機構を備えてなるレーザ加工機
において、 前記ガス供給機構を通じて、定常的に乾燥空気等の汚染
防止ガスを流出させ、前記レーザ加工時に、汚染防止ガ
スに前記加工補助ガスを混入させた状態で噴出させるガ
ス供給機構制御部を備えてなることを特徴とするレーザ
加工機。3. A laser beam is passed through a processing torch while being condensed by an optical system, and an object to be processed is irradiated with laser light from an opening of a tip end of the processing torch to perform laser processing. In a laser processing machine provided with a gas supply mechanism for ejecting a processing auxiliary gas toward a direction, a pollution prevention gas such as dry air is constantly flown out through the gas supply mechanism, and the pollution prevention gas is supplied during the laser processing. A laser processing machine, comprising: a gas supply mechanism control unit for ejecting the processing auxiliary gas in a mixed state.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4106115A JPH05277781A (en) | 1992-03-30 | 1992-03-30 | Laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4106115A JPH05277781A (en) | 1992-03-30 | 1992-03-30 | Laser beam machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05277781A true JPH05277781A (en) | 1993-10-26 |
Family
ID=14425463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4106115A Pending JPH05277781A (en) | 1992-03-30 | 1992-03-30 | Laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05277781A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1743727A1 (en) * | 2005-07-12 | 2007-01-17 | Fanuc Ltd | Laser processing machine with a processing head having a nozzle hole closing means |
WO2012053297A1 (en) * | 2010-10-19 | 2012-04-26 | 三菱電機株式会社 | Laser processing machine control device and laser processing machine control method |
JP2013187519A (en) * | 2012-03-12 | 2013-09-19 | Panasonic Corp | Laser oscillator and laser material processing machine |
-
1992
- 1992-03-30 JP JP4106115A patent/JPH05277781A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1743727A1 (en) * | 2005-07-12 | 2007-01-17 | Fanuc Ltd | Laser processing machine with a processing head having a nozzle hole closing means |
WO2012053297A1 (en) * | 2010-10-19 | 2012-04-26 | 三菱電機株式会社 | Laser processing machine control device and laser processing machine control method |
CN103167928A (en) * | 2010-10-19 | 2013-06-19 | 三菱电机株式会社 | Laser processing machine control device and laser processing machine control method |
JP5301039B2 (en) * | 2010-10-19 | 2013-09-25 | 三菱電機株式会社 | Laser machine control device and laser machine control method |
US9492884B2 (en) | 2010-10-19 | 2016-11-15 | Mitsubishi Electric Corporation | Control device and control method for laser processing machine |
JP2013187519A (en) * | 2012-03-12 | 2013-09-19 | Panasonic Corp | Laser oscillator and laser material processing machine |
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