JPH01122684A - Method and equipment for laser beam welding - Google Patents

Method and equipment for laser beam welding

Info

Publication number
JPH01122684A
JPH01122684A JP62279322A JP27932287A JPH01122684A JP H01122684 A JPH01122684 A JP H01122684A JP 62279322 A JP62279322 A JP 62279322A JP 27932287 A JP27932287 A JP 27932287A JP H01122684 A JPH01122684 A JP H01122684A
Authority
JP
Japan
Prior art keywords
welded
laser beam
inert gas
laser
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62279322A
Other languages
Japanese (ja)
Inventor
Kazuo Mera
和夫 米良
Masayoshi Hashiura
橋浦 雅義
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62279322A priority Critical patent/JPH01122684A/en
Publication of JPH01122684A publication Critical patent/JPH01122684A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To perform welding without an oxide inclusion at the low output even if objects to be welded are thick by boring a fine hole up to the middle of plate thickness on a first object to be welded and performing welding after removing an oxide film of the fine hole part at the time of performing lap welding. CONSTITUTION:After the objects 19 and 20 to be welded are superposed on each other and set up, a solenoid valve 10 is opened and O2 gas 17 is injected from a machining nozzle 7 and then, a laser beam is projected and the fine hole is bored up to the depth of about 1/2 of the plate thickness on the object 19 to be welded. At this time, it is necessary to determine conditions (output, irradiation time, etc.) of the pulse laser beam according to material and the plate thickness of the objects to be welded. At the same time when the O2 gas is stopped, a solenoid valve 8 is opened and the inert gas highspeed flow 15 is injected from the nozzle 7 and then, the laser beam is projected and an oxidizing zone of the interior of the fine hole is molten and sattered. Afterward, at the same time when the highspeed flow 15 is stopped, a solenoid valve 9 is opened and the inner gas low-speed flow 16 is injected from the nozzle 7 and then, the laser beam is projected to weld the objects 19 and 20 to be welded. A series of actions as mentioned above are carried out automatically by setting and inputting conditions in a control panel 18 in advance.

Description

【発明の詳細な説明】 [産業上の利用分野〕 本発明は、レーザ光を用いて重ね合わせ溶接を行う方法
、及びその装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for performing lap welding using laser light, and an apparatus therefor.

〔従来の技術〕[Conventional technology]

従来の重ね合わせスポット溶接においては、−殻内に被
加工物を重ねて、単にレーザ光を照射するというもので
、熱影部が大きく、溶は込み深さが小さい。さらに板厚
が大きくなれば、照射レーザ出力も大きくする必要があ
った。この為、特開58−97489号に記載のように
、溶接前にレーザ光で1枚目の被加工物に小穴を開け、
次にレーザ光を照射し溶接するという手段が発明された
In conventional overlapping spot welding, the workpieces are stacked in a shell and simply irradiated with laser light, resulting in a large heat shadow area and a small weld penetration depth. Furthermore, as the plate thickness increases, the irradiation laser output also needs to increase. For this reason, as described in JP-A No. 58-97489, a small hole is made in the first workpiece using a laser beam before welding.
Next, a method of welding by irradiating laser light was invented.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

前記の公知技術(特開58−97489号)は、第1回
目のレーザ光照射で、1枚目被加工物に貫通穴を開け、
第2回目のレーザ光照射で重ね合わせ溶接を行なうもの
であるが、溶接前に1枚目の被加工物に貫通穴を開ける
ため、第2回目のレーザ光が照射されても、1枚目の被
加工物の溶融部は少なく、2枚目の被加工物との溶は込
みが小さくなる。このため溶接強度が不充分となる。又
、第1回目のレーザ光による小穴加工の際、アシストガ
スとして酸素を使用するため、小穴部には酸化層が発生
する。この酸化層は、第2回目のレーザ光照射による溶
接において、溶接欠陥を生じさせる要因となる。
The above-mentioned known technology (Japanese Patent Laid-Open No. 58-97489) makes a through hole in the first workpiece in the first laser beam irradiation,
Overlap welding is performed with the second laser beam irradiation, but since a through hole is made in the first workpiece before welding, even if the second laser beam is irradiated, the first workpiece The melted portion of the second workpiece is small, and the weld penetration with the second workpiece is small. Therefore, the welding strength becomes insufficient. Furthermore, since oxygen is used as an assist gas during the first small hole machining using a laser beam, an oxide layer is generated in the small hole portion. This oxidized layer becomes a cause of welding defects during welding by the second laser beam irradiation.

本発明の目的は、板厚の大きい被加工物でも低出力で重
ね合わせ溶接が可能で、しかも、酸化物の巻き込みを生
じる虞れの無いレーザ溶接方法、及びレーザ溶接装置を
提供することを目的とする。
It is an object of the present invention to provide a laser welding method and a laser welding device that enable lap welding of workpieces with a large thickness at low output and that are free from the risk of entrainment of oxides. shall be.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的は、第1回目のレーザ光照射による穴加工にお
いて、1枚目の被加工物に貫通穴を開けるのではなく、
照射レーザ光を制御することにより、板厚の約2分の工
程度の深さまで微小径の穴を開け、第2回目のレーザ光
照射による溶接の際の溶融部を残すことにより達成され
る。又、第1回目のレーザ光照射による微小穴加工の際
に生じた酸化層は、本格的な最終工程の溶接前に、不活
性ガスをアシストガスとして高速で前記微小穴に噴出し
なからレーザ光を照射させて除去することにより、次の
工程(最終工程)のレーザ光照射による溶接の際の溶接
欠陥発生を防止することができる。このように、(a)
微小穴加工、(b)酸化層除去、(c)溶接、と、3段
階に分けて、レーザ光照射、アシストガス制御を行なえ
るようにすることにより達成される。
The above purpose is not to drill a through hole in the first workpiece in the first hole machining by laser beam irradiation.
This is accomplished by controlling the irradiated laser beam to drill a minute diameter hole to a depth of about half the thickness of the plate, leaving a molten part during welding by the second laser beam irradiation. In addition, the oxide layer generated during the first laser beam irradiation to process the microhole is ejected into the microhole at high speed using an inert gas as an assist gas before the final welding process. By removing it by irradiating it with light, it is possible to prevent welding defects from occurring during welding by laser light irradiation in the next step (final step). In this way, (a)
This is accomplished by performing laser beam irradiation and assist gas control in three stages: microhole processing, (b) oxide layer removal, and (c) welding.

本発明の方法は、上記(a) 、 (b) 、 (c)
の3行程を、この順序に遂行するものである。
The method of the present invention includes the above (a), (b), and (c).
The three steps are carried out in this order.

また、本発明の装置は上記(a) 、 (b) 、 (
c)の3行程を遂行するに必要な酸素ガス供給と、不活
性ガス高圧送給と、不活性ガス低圧送給とを、レーザ照
射に合わせて実施できるように構成したものである。
Moreover, the apparatus of the present invention has the above-mentioned (a), (b), (
The structure is such that the oxygen gas supply, high-pressure inert gas supply, and low-pressure inert gas supply required to carry out the three steps c) can be performed in synchronization with laser irradiation.

〔作用〕[Effect]

本発明の方法によれば、第1回目のレーザ光照射による
1枚目被加工物の微小穴開けにおいて、溶接用溶融部を
残すことにより、1枚目と2枚目との接合溶融部が大き
くなり、溶接強度が大きくなる。又、第1回目のレーザ
光照射により生じた微小穴部酸化層は、高速不活性ガス
を噴出させ、レーザ光を照射することにより、レーザ光
で溶融した酸化層を不活性ガスで吹き飛ばして除去する
According to the method of the present invention, when making micro holes in the first workpiece by the first laser beam irradiation, by leaving a molten part for welding, the joining molten part between the first and second workpieces is This increases the welding strength. In addition, the oxidized layer in the micro holes created by the first laser beam irradiation is removed by jetting out high-speed inert gas and irradiating the laser beam to blow away the oxidized layer melted by the laser beam with the inert gas. do.

これにより、次のレーザ光照射による溶接においては、
酸化層がないため、高品質な溶接が可能となる。
As a result, in the next welding by laser beam irradiation,
Since there is no oxidized layer, high quality welding is possible.

また、本発明の装置によれば、上記3段階の各工程に必
要な機器を過不足なく配置して、自動制御手段を設けで
あるので前記の発明方法を容易に、かつ確実に、しかも
自動的に行うことが出来る。
Furthermore, according to the apparatus of the present invention, the equipment necessary for each of the three steps mentioned above is arranged in just the right amount, and an automatic control means is provided. It can be done.

〔実施例〕〔Example〕

本発明の装置を用いて本発明の方法を実施した1例を、
第1図及び第2図を参照しつつ説明する。
An example of implementing the method of the present invention using the apparatus of the present invention is as follows:
This will be explained with reference to FIGS. 1 and 2.

第1図は本発明装置の光路・配管・制御系統図である。FIG. 1 is a diagram of the optical path, piping, and control system of the device of the present invention.

この実施例の装置は、レーザ発振器1から照射されるレ
ーザ光2をペンドミラー3等により、加工ヘッド部まで
伝送し、集光レンズ4で集光後、被加工物に照射、加工
するシステムを示す。
The apparatus of this embodiment shows a system in which a laser beam 2 irradiated from a laser oscillator 1 is transmitted to a processing head section through a pendor mirror 3, etc., and after being focused by a condensing lens 4, the workpiece is irradiated and processed. .

レーザ加工用アシストガスは、不活性ガス5(例えば窒
素、アルゴン等)、酸素ガス6を使用する。
As assist gas for laser processing, an inert gas 5 (for example, nitrogen, argon, etc.) and oxygen gas 6 are used.

前記不活性ガス5は、ガス圧力5kg/cnY以上の高
圧力を有し、その系統は、電磁弁8を介して加工ノズル
7へ流れ、高速ガス流15を発生させる高速流系統11
と、高圧力を減圧弁14により低圧力へ低下させ、電磁
弁9を介して加工ノズル7へ流れ、低速ガス流16を発
生させる低速流系統1.2とに分れる。又、前記酸素ガ
ス6は、ガス圧力4kg/cnt以上を有し、その系統
は、電磁弁10を介して加工ノズル7へ流れ、高速ガス
流17を発生させる酸素ガス流系統となっている。
The inert gas 5 has a high pressure of 5 kg/cnY or more, and its system is a high-speed flow system 11 that flows to the processing nozzle 7 via a solenoid valve 8 and generates a high-speed gas flow 15.
and a low-speed flow system 1.2 in which high pressure is reduced to low pressure by a pressure reducing valve 14, flows to the processing nozzle 7 via an electromagnetic valve 9, and generates a low-speed gas flow 16. Further, the oxygen gas 6 has a gas pressure of 4 kg/cnt or more, and its system is an oxygen gas flow system in which it flows to the processing nozzle 7 via the electromagnetic valve 10 and generates a high-speed gas flow 17.

上記レーザ光2を発生させるレーザ発振器1とアシスト
ガスの3系統のガス流の○N−OF Fを制御する電磁
弁8〜10は、制御盤18により、動作時間を制御され
ている。
The operating times of the electromagnetic valves 8 to 10 that control the N-OF of the three systems of gas flow, that is, the laser oscillator 1 that generates the laser beam 2 and the assist gas, are controlled by a control panel 18 .

次に本実施例における一連の動作を第2図で説明する。Next, a series of operations in this embodiment will be explained with reference to FIG.

本図は、照射レーザ光出力とアシストガスどの時間的タ
イミングを示したものと、各時点における加工部の状態
を示したものである。動作工程は大別して■微小穴加工
工程 ■酸化層除去工程 ■溶接工程からなる。
This figure shows the temporal timing of the irradiated laser light output and the assist gas, and the state of the processed part at each point in time. The operating process can be broadly divided into ■ Microhole drilling process ■ Oxide layer removal process ■ Welding process.

■微小穴加工工程は、加工点(レーザ光2の焦点)に被
加工物19.20を重ね合わせて設置した後、電磁弁1
oを開は酸素ガスを加工ノズルから噴出させ、次にレー
ザ光を照射させ、1枚目の被加工物19に、その板厚の
約2分の1の深さまで微小穴を開ける。この時、被加工
物の材質、板厚により、パルスレーザ■の条件(出力、
照射時間等)を決め、加工を行なう必要がある。
■The micro hole machining process is carried out by placing the workpieces 19 and 20 on top of each other at the machining point (the focal point of the laser beam 2), and then placing the solenoid valve 1
When opening o, oxygen gas is ejected from the processing nozzle, and then a laser beam is irradiated to make a minute hole in the first workpiece 19 to a depth of approximately one-half the thickness of the workpiece. At this time, depending on the material and thickness of the workpiece, the pulse laser ■ conditions (output,
It is necessary to determine the irradiation time, etc., and perform processing.

■酸化層除去工程は、前述の工程■終了時、酸素ガス停
止と同時に、電磁弁8を開け、不活性ガス高速流15を
加工ノズル7から噴出させ、次にレーザ光を照射させて
、前記小穴の内面の酸化層21を溶融、飛散させる。
(2) In the oxide layer removal step, at the end of the above-mentioned step (2), at the same time as the oxygen gas is stopped, the electromagnetic valve 8 is opened, a high-speed inert gas flow 15 is ejected from the processing nozzle 7, and then a laser beam is irradiated to remove the above-mentioned The oxide layer 21 on the inner surface of the small hole is melted and scattered.

■溶接工程は、工程■終了時、不活性ガス高速流を停止
すると同時に、電磁弁9を開け、不活性ガス低速流16
を加工ノズル7から噴出させ、次にレーザ光を照射させ
、2枚重ねの被加工物19゜20を溶接する。以上の一
連の動作は、あらかじめ、制御盤18に条件を設定、入
力することにより、自動的に動作するものである。
■ At the end of the process ■, the welding process stops the high-speed flow of inert gas, and at the same time opens the solenoid valve 9 to open the low-speed flow of inert gas 16.
is ejected from the processing nozzle 7, and then irradiated with laser light to weld the two stacked workpieces 19° and 20. The above series of operations is automatically performed by setting and inputting conditions to the control panel 18 in advance.

〔発明の効果〕〔Effect of the invention〕

本発明方法を適用してレーザ溶接を行うと、第1工程で
微小径の穴を設けるため第3工程の最終溶接において周
囲への熱影響を軽減して健全な溶接金属が得られ、高強
度の溶接部が形成される。
When laser welding is performed by applying the method of the present invention, since a minute diameter hole is created in the first step, the heat effect on the surroundings is reduced in the third step, the final welding, resulting in a sound weld metal with high strength. A weld is formed.

しかも、第2工程で酸化被膜の除去を行うので溶接金属
内に酸化物が巻き込まれる虞れが無く、溶接欠陥が防止
される。また、従来例に比して同一レーザ出力によって
板厚1.5倍の被溶接物の溶接が可能となる。
Furthermore, since the oxide film is removed in the second step, there is no risk of oxides getting caught up in the weld metal, and welding defects are prevented. Furthermore, compared to the conventional example, it is possible to weld a workpiece that is 1.5 times thicker with the same laser output.

本発明の装置は、上記の発明方法の実施に必要かつ充分
な機器が合理的に設置されているので、前記発明方法を
容易にかつ確実に実施して、その効果を充分に発揮せし
めることが出来る。
Since the apparatus of the present invention is rationally equipped with necessary and sufficient equipment for carrying out the above-mentioned method of the invention, it is possible to carry out the method of the invention easily and reliably and to fully exhibit its effects. I can do it.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係るレーザ溶接装置の1実施例を示し
、光路・配管・制御系統図である。 第2図は本発明に係るレーザ溶接方法の1実施例におけ
るタイミング図表である。 1・・・レーザ発振器、2・・・レーザ光、3・・・ベ
ントミラー、4・・・集光レンズ、5・・・不活性ガス
、6・・・酸素ガス、7・・・加工ノズル、8〜10電
磁弁、11・・・不活性ガス高速流系統、12・・・不
活性ガス低速流系統、13・・・酸素ガス系統、14・
・・減圧弁、15・・・不活性ガス高速流、16・・・
不活性ガス低速流、17・・・酸素ガス高速流、18・
・・制御盤、]9゜20・・・被溶接物、21・・・酸
化層。
FIG. 1 shows one embodiment of the laser welding apparatus according to the present invention, and is a diagram of the optical path, piping, and control system. FIG. 2 is a timing chart in one embodiment of the laser welding method according to the present invention. DESCRIPTION OF SYMBOLS 1... Laser oscillator, 2... Laser light, 3... Bent mirror, 4... Condensing lens, 5... Inert gas, 6... Oxygen gas, 7... Processing nozzle , 8-10 Solenoid valve, 11... Inert gas high speed flow system, 12... Inert gas low speed flow system, 13... Oxygen gas system, 14.
...Pressure reducing valve, 15...Inert gas high speed flow, 16...
Inert gas low speed flow, 17... Oxygen gas high speed flow, 18.
...Control panel,]9゜20...Object to be welded, 21...Oxide layer.

Claims (1)

【特許請求の範囲】 1、1枚の板状の被溶接物を相手側被溶接物に重ね合わ
せ、該1枚の板状被溶接物にレーザ光を照射して双方の
被溶接物を溶接する方法において、 (a)第1回目の照射工程により、前記1枚の板状被溶
接物に、その板厚の途中まで微小径の穴を加工し、 (b)第2回目の照射工程により、前記微小径の穴の内
側面の酸化被膜を除去し、 (c)第3回目の照射工程により、前記双方の被溶接物
を溶融させて溶接することを特徴とするレーザ溶接方法
。 2、前記第2回目の照射工程において、前記微小径の穴
にレーザ光を照射するとともに、不活性ガスを吹きつけ
ることを特徴とする、特許請求の範囲第1項に記載のレ
ーザ溶接方法。 3、1枚の板状の被溶接物を相手側被溶接物に重ね合わ
せ、該1枚の板状被溶接物にレーザ光を照射して双方の
被溶接物を溶接する装置において、 (a)レーザ照射部位にガスを吹きつける為のノズルと
、 (b)上記ノズルに酸素を送給する手段と、(c)上記
ノズルに不活性ガスを送給する手段と、(d)上記不活
性ガスの送給圧力を調節する手段と、 (e)上記酸素の送給・送給停止、及び上記不活性ガス
の送給・送給停止、並びに上記不活性ガスの圧力を制御
する自動制御手段と、 を設けたことを特徴とするレーザ溶接装置。 4、前記の自動制御手段はレーザ光の出力モードを制御
する機能を兼ねたものであつて、 (イ)パルス状のレーザ出力を発生させつつ酸素を送給
する第1工程状態と、 (ロ)パルス状のレーザ出力を発生させつつ、比較的高
圧の不活性ガスを送給する第2工程状態と、 (ハ)連続的にレーザ出力を発生させつつ比較的低圧の
不活性ガスを送給する第3工程状態とを、上記第1〜第
3の工程順に自動的に進行せとめるように構成されてい
ることを特徴とする、特許請求の範囲第3項に記載のレ
ーザ溶接装置。
[Claims] 1. One plate-shaped object to be welded is superimposed on the other object to be welded, and the one plate-shaped object to be welded is irradiated with laser light to weld both objects to be welded. In the method, (a) in the first irradiation step, a minute diameter hole is formed in the one plate-shaped workpiece to the middle of the thickness of the plate, and (b) in the second irradiation step. , removing the oxide film on the inner surface of the micro-diameter hole, and (c) melting and welding both of the objects to be welded in a third irradiation step. 2. The laser welding method according to claim 1, wherein in the second irradiation step, the micro-diameter hole is irradiated with a laser beam and an inert gas is blown onto the hole. 3. In a device that overlaps one plate-shaped workpiece with the other workpiece and irradiates the single plate-like workpiece with laser light to weld both workpieces, (a ) a nozzle for blowing gas onto the laser irradiation site; (b) means for supplying oxygen to the nozzle; (c) means for supplying an inert gas to the nozzle; and (d) a means for supplying the inert gas to the nozzle. means for adjusting the gas supply pressure; (e) automatic control means for controlling the supply/stop of the oxygen, the supply/stop of the inert gas, and the pressure of the inert gas; A laser welding device characterized by comprising: and. 4. The above-mentioned automatic control means also has the function of controlling the output mode of the laser beam, and has the following functions: (a) a first process state in which oxygen is supplied while generating a pulsed laser output; and (b) ) A second process state in which a relatively high-pressure inert gas is fed while generating a pulsed laser output, and (c) a relatively low-pressure inert gas is fed while continuously generating a laser output. 4. The laser welding apparatus according to claim 3, wherein the laser welding apparatus is configured to automatically stop the third step state from proceeding in the order of the first to third steps.
JP62279322A 1987-11-06 1987-11-06 Method and equipment for laser beam welding Pending JPH01122684A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62279322A JPH01122684A (en) 1987-11-06 1987-11-06 Method and equipment for laser beam welding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62279322A JPH01122684A (en) 1987-11-06 1987-11-06 Method and equipment for laser beam welding

Publications (1)

Publication Number Publication Date
JPH01122684A true JPH01122684A (en) 1989-05-15

Family

ID=17609556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62279322A Pending JPH01122684A (en) 1987-11-06 1987-11-06 Method and equipment for laser beam welding

Country Status (1)

Country Link
JP (1) JPH01122684A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04333386A (en) * 1991-02-28 1992-11-20 Fanuc Ltd Laser beam machine and laser beam welding method
US5767479A (en) * 1994-02-28 1998-06-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus and corresponding method which employs a laser beam to pretreat and machine a workpiece
JP2007014992A (en) * 2005-07-08 2007-01-25 Amada Co Ltd Piercing method, and laser beam machining apparatus
US20150069025A1 (en) * 2013-09-10 2015-03-12 Caterpillar, Inc. Machine component cladding strategy
CN110890509A (en) * 2018-09-05 2020-03-17 罗伯特·博世有限公司 Method for connecting individual film-shaped films of a stack of battery films
JPWO2021124561A1 (en) * 2019-12-20 2021-06-24
WO2024004111A1 (en) * 2022-06-29 2024-01-04 ファナック株式会社 Laser processing method, processing program, and control device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04333386A (en) * 1991-02-28 1992-11-20 Fanuc Ltd Laser beam machine and laser beam welding method
US5539180A (en) * 1991-02-28 1996-07-23 Fanuc, Ltd. Method of laser beam welding galvanized steel sheets with an auxiliary gas containing oxygen
US5767479A (en) * 1994-02-28 1998-06-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus and corresponding method which employs a laser beam to pretreat and machine a workpiece
US5889253A (en) * 1994-02-28 1999-03-30 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus and method which employs a laser beam to pretreat and machine a workpiece
US6040549A (en) * 1994-02-28 2000-03-21 Mitsubishi Denki Kabushiki Kaisha Laser beam machining apparatus and corresponding method which employs a laser beam to pretreat and machine a workpiece
JP2007014992A (en) * 2005-07-08 2007-01-25 Amada Co Ltd Piercing method, and laser beam machining apparatus
US20150069025A1 (en) * 2013-09-10 2015-03-12 Caterpillar, Inc. Machine component cladding strategy
US9555503B2 (en) * 2013-09-10 2017-01-31 Caterpillar Inc. Machine component cladding strategy
CN110890509A (en) * 2018-09-05 2020-03-17 罗伯特·博世有限公司 Method for connecting individual film-shaped films of a stack of battery films
JPWO2021124561A1 (en) * 2019-12-20 2021-06-24
WO2024004111A1 (en) * 2022-06-29 2024-01-04 ファナック株式会社 Laser processing method, processing program, and control device

Similar Documents

Publication Publication Date Title
JP5276699B2 (en) Laser processing method and laser processing apparatus for piercing
US6316743B1 (en) Laser piercing method, laser processing nozzle, and laser cutting apparatus
EP3924136B1 (en) Laser welding method
JPH07236984A (en) Method and device for laser beam processing
JPH09206975A (en) Laser beam machining method and device therefor
JPH01122684A (en) Method and equipment for laser beam welding
JP2007075878A (en) Laser beam machining method
JPH11267867A (en) Method and device for laser processing
JP3131357B2 (en) Laser processing method
JP2600323B2 (en) Laser processing method
JPH10305387A (en) Method and machine for laser processing
JP5986775B2 (en) Laser processing method and laser processing apparatus
JP2875626B2 (en) Laser piercing method
JPH0639571A (en) Laser beam cutting method and device therefor
JPS60216987A (en) Laser welding method
JP3110504B2 (en) Laser processing method
JP2009190064A (en) Laser beam machining method and laser beam machining mechanism
JPH06246475A (en) Laser welding process
JPS63268585A (en) Cutting method by laser beam
JPH1085975A (en) Laser beam machining method
JPH09220683A (en) Method for working round hole
JP2618730B2 (en) Laser processing method and laser processing apparatus
JPH04284993A (en) Laser beam machine
JP4304808B2 (en) Laser processing method
JP2718224B2 (en) Laser cutting method