JPH0527622U - Instrument pointer - Google Patents

Abstract

(57) [Abstract] [Purpose] The whole can be made thin and a plurality of LEs can be formed.
Providing a pointer for an instrument that can provide sufficient illumination by directly illuminating with D. [Structure] A plurality of die pad portions 12a on which LED chips 11 are mounted, bonding pad portions to which bonding wires are connected, and conductive portions 12 for external connection, respectively.
a lead frame 12 formed by pressing a thin metal plate so as to include b, and the lead frame 12
And a pointer main body 14 that is formed so as to have an external appearance having a pointer shape, and constitutes a pointer 10 for an instrument.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an instrument pointer used for an instrument such as an automobile, which includes a plurality of LEDs as a light source and at least a part of which is illuminated from the inside.

[0002]

[Prior Art]

 Conventionally, as such an instrument pointer, one having a structure as shown in FIGS. 9 and 10, for example, is known. An instrument pointer 1 shown in FIG. 9 has a light guide portion 3 made of a translucent material provided along a longitudinal direction of a pointer main body 2 made of a material such as plastic, and a main body 2 And an LED 4 arranged to face one end of the light guide section 3 near the base of the LED.

According to the instrument pointer 1 thus configured, the light emitted from the LED 4 enters the light guide section 3 from the opposite end faces of the light guide section 3 and is guided along the inside of the light guide section 3. By advancing to the vicinity of the tip of the pointer main body 2 and light is emitted to the outside from the entire surface of the light guide portion 3, it can be observed that the entire light guide portion 3 emits light. As a result, the entire instrument pointer 1 is indirectly illuminated by the LED 4 via the light guide section 3.

Further, the instrument pointer 1 ′ shown in FIG. 10 has a plurality of LED chips 6 arranged along the longitudinal direction on a printed circuit board 5 arranged in the pointer main body 2. Therefore, by making each LED chip 6 emit light, the entire instrument pointer 1 is directly illuminated.

[0005]

[Problems to be solved by the device]

 However, in the instrument pointers 1 and 1 ′ configured as described above, in the instrument pointer 1 of FIG. 9, the instrument pointer 1 emits light from the LED 4 arranged near one end thereof to the pointer main body. Since the light is made incident on the light guide portion 3 arranged along the line 2, and the light is emitted from the entire surface of the light guide portion 3, the instrument pointer 1 is arranged at one end thereof. Since the LED 4 is indirectly illuminated via the light guide portion 3, the illumination efficiency is relatively low, and therefore the instrument pointer 1 cannot be sufficiently illuminated, resulting in poor visibility. It was

Further, regarding the instrument pointer 1 ′ shown in FIG. 10, the instrument pointer 1 ′ has a printed wiring board 5 on which the LED chips 6 are mounted so as to be aligned along the longitudinal direction thereof. Since the printed circuit board 5 has a dead space around it because the circuit pattern is formed by etching, the printed circuit board 5 is relatively wide. Therefore, there is a problem that the entire instrument pointer 1'becomes large.

In view of the above points, the present invention provides a pointer for an instrument, which can be formed thin in its entirety and can be sufficiently illuminated by directly illuminating with a plurality of LEDs. The purpose is to do.

[0008]

[Means for Solving the Problems]

 According to the present invention, the above object is to press a thin metal plate so as to include a plurality of die pad parts on which LED chips are mounted, a bonding pad part to which bonding wires are connected, and a conductive part for external connection. A measuring instrument characterized by comprising a lead frame formed by processing and the like, and a pointer main body formed to accommodate this lead frame inside and to have the appearance of a pointer. Achieved by the guidelines.

[0009]

[Action]

 According to this invention, an LED chip is mounted on each die pad portion of the lead frame, and after the necessary wire bonding is performed between each LED chip and the bonding pad portion, the lead frame is placed inside the pointer body. Since the instrument pointer is configured by housing it, the lead frame is used for mounting the LED chip without using the printed board. Therefore, the lead frame is relatively thin. Since it can be formed, the pointer body for accommodating the lead frame can be correspondingly formed to be relatively thin. Therefore, the entire instrument pointer can be made relatively thin. Further, since the pointer main body is directly illuminated from the inside by the plurality of LED chips on the lead frame housed therein, the indicator pointer for the instrument is sufficiently illuminated, and the instrument main body is sufficiently illuminated. The visibility of the guideline is improved.

[0010]

【Example】

 An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows an embodiment of an instrument pointer according to the present invention. This instrument pointer 10 is pressed from a thin metal plate so as to include a plurality of die pad portions on which LED chips 11 are mounted, bonding pad portions to which bonding wires are connected, and conductive portions for external connection, as will be described later. A lead frame 12 formed by processing, a lamp house 13 integrally formed with the lead frame 12 by insert molding, the lamp house 13 is housed inside, and the appearance is a pointer shape. And a pointer main body 14 formed so as to have.

As shown in FIG. 2, the lead frame 12 has a plurality of metal plates made of phosphor bronze or the like, which are plated with copper, and a plurality of LED chips 11 on the surface thereof are to be bonded. In the case shown, the entire surface including the nine die pad portions 12a is plated with silver, and the entire rear surface including the conductive portion 12b for external connection on the rear surface thereof is plated with tin, and further pressed to a predetermined shape. After die-cutting, the conductive portion 12b is formed by folding back from the back surface to the front surface.

The lamp house 13 is integrally formed with the lead frame 12 formed as described above by insert molding, as shown in FIGS. 3 and 4, and is integrated with the lead frame 12. The lead frame 12 is provided with a wall portion 13a for individually partitioning the die pad portions 12 of the lead frame 12 as a reflection frame for the LED chips 11 mounted on the die pad portions 12a of the lead frame 12. It has a shaft portion 13b which is useful and which extends vertically downward from the vicinity of one end thereof. When the lamp house 13 is housed in the pointer main body 14 as described later, the instrument is It constitutes the rotation axis of the pointer 10.

As shown in FIGS. 5 to 7, the pointer main body 14 is entirely formed of a light-shielding material, and is provided in a through groove 14 a provided on the front surface side along the longitudinal direction thereof. A transparent portion 14b made of a transparent material is attached, and when the lamp house 13 is housed inside, it is mounted on each die pad portion 12a of the lead frame 12 and exposed on the upper surface of the lamp house 13. The LED chips 11 are arranged to face the translucent portions 14b, respectively.

Each LED chip 11 is mounted on each die pad portion 12a of the lead frame 12, and the necessary connection is made by wire bonding to the bonding pad portion arranged around this die pad portion 12a. As a result, the wires are connected as shown in FIG.

The instrument pointer 10 according to the present invention is configured as described above. The lead frame 12 is insert-formed in the lamp house 13, and the LED chip is respectively attached to each die pad portion 12a of the lead frame 12. After mounting 11 and performing wire bonding, each die pad portion 12a surrounded by the reflection frame 13a of the lamp house 13 and the LED chip 11 mounted on the die pad portion 12a are sealed with a resin mold or the like. Then, finally, the lead frame 12 is cut along the chain line in FIG. 2 to complete the assembly of the lamp house 13, and the lamp house 13 is housed in the pointer main body 14, whereby the instrument pointer 10 Is completed.

[0016]

[Effect of the device]

 As described above, according to the present invention, since the lead frame is used for mounting the LED chip without using the printed board, the lead frame can be formed relatively thin. Accordingly, the pointer body for accommodating the lead frame can be correspondingly formed to be relatively thin. Therefore, the whole pointer for the instrument can be made relatively thin, and the pointer main body is directly illuminated from the inside by the plurality of LED chips on the lead frame housed therein. The instrument pointer can be sufficiently illuminated, and the visibility of the instrument finger can be improved. Thus, according to the present invention, there is provided an extremely excellent instrument guide, which is thin in its entirety and is sufficiently illuminated by directly illuminating a plurality of LEDs.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an embodiment of an instrument pointer according to the present invention.

FIG. 2 is a plan view of a lead frame used for the instrument pointer of FIG.

FIG. 3 is a plan view of a lamp house used for the instrument pointer of FIG.

FIG. 4 is a side sectional view of FIG.

FIG. 5 is a plan view of a pointer main body used for the pointer for instrument of FIG.

FIG. 6 is a side view of FIG.

FIG. 7 is a schematic sectional view of FIG.

FIG. 8 is a circuit diagram showing an electrical configuration of the instrument pointer of FIG.

FIG. 9 is a schematic plan view showing an example of a conventional instrument pointer.

FIG. 10 is a schematic plan view showing another example of a conventional instrument pointer.

[Explanation of symbols]

 10 Meter pointer 11 LED chip 12 Lead frame 12a Die pad part 12b Conductive part 13 Lamp house 13a Wall part 13b Shaft part 14 Pointer body 14a Through groove 14b Translucent part

Claims (1)

[Scope of utility model registration request] 1. A lead frame formed from a thin metal plate by pressing or the like so as to include a plurality of die pad portions on which LED chips are mounted, bonding pad portions to which bonding wires are connected, and conductive portions for external connection. And a pointer main body that is formed so as to accommodate the lead frame inside and has an external appearance in the shape of a pointer, and a pointer for an instrument.