GB2339318A - Lateral type backlight using light emitting diodes - Google Patents
Lateral type backlight using light emitting diodes Download PDFInfo
- Publication number
- GB2339318A GB2339318A GB9814632A GB9814632A GB2339318A GB 2339318 A GB2339318 A GB 2339318A GB 9814632 A GB9814632 A GB 9814632A GB 9814632 A GB9814632 A GB 9814632A GB 2339318 A GB2339318 A GB 2339318A
- Authority
- GB
- United Kingdom
- Prior art keywords
- light
- leds
- pcb
- back light
- light guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- 238000000465 moulding Methods 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- SEWHDNLIHDBVDZ-UHFFFAOYSA-N 1,2,3-trichloro-4-(2-chlorophenyl)benzene Chemical compound ClC1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1Cl SEWHDNLIHDBVDZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/002—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces
- G02B6/0021—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide, e.g. with collimating, focussing or diverging surfaces for housing at least a part of the light source, e.g. by forming holes or recesses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Description
0 2339318 LATERAL-TYPE BACK-LIGHT USING LIGHT EMITTING DIODE
Field of the present invention:
The present invention relates generally to a lateral back-light using light emitting diode (LED), more particularly, to a lateral back-light using LED which can reduce the cost and thickness of unlit, and has enhanced reliability and brightness.
Background of the present invention
Back light is usually used to provide light source for liquid crystal display means such as menu window or notebook computer, and can enhance visual io effect in dark place. The conventional back light comprises a light guide and a plurality of LEDs.
Ile light guide is generally arranged upon a mounting stage on the circuit board, which has a plurality of LEDs as figlit source. The surface of the light guide is generally subjected to a carving process to form a misted surface, and the LEDs are generaBy placed below the light guide.
Fig. I shows one conventional COB-type (chip on board type) lateral back light using LEDs. The LED chip la is directly mounted to the printed circuit board (PCB) I b. After the wire-bonding process of the chip I a, silicone glue is dipped manually to the back light 'Me back light is then assembled to the lateral side of the PCB, that is mounted dice.
In above-mentioned COB-type back fight, the manufacturing process is difficult due to the narrow shape of the PCB. T11e molding process of PCB, for above-mentioned COB-type back light is a push back type molding, which is more expensive than the punch molding. Moreover, the COB-type arrangement is difficult to automatic production and has poor reliability due to the ruggedness thereof.
Figs. 2 and 3 show another conventional SMID-type lateral back light Two SMD-type LEDs 2a (3a) function as light sources and are arranged on the PCB 2b (3b) through soldering. The resulting structure is then bounded to the lateral side of the light guide by silicone glue.
The above-mentioned SMDLtype lateral back light can solve the problem of automatic production, chip mounting, and wire bonding met by the COB type back light, However, the SMD-type back light needs a further SMT process, therefore, the thickness of unit is excessively large and the cost Is increased.
Another conventional lateral back light using LEDs is leadirame-type back light (not shown). That contains white reflector, and it is assembled to the lateral side of the light guide by glue. However, the soldering work becomes cumbersome if the number of light sources is increased.
Me above three kinds of lateral back light which we discussed have the io problem of excessively high thickness. For example, the thickness of the PCB t:ype and the leadframe-type back light are 1.8mrn and 1.3nini, respectively Because the back lights are generally dipped by silicone glue, they are liable to be damaged if being touched directly to the sur-face thereof This increases the processing difficulty. Even thought an EL back light with thickness below 0.6mm can also be used as light source. However, the EL back light has the problem of poor brightness. Tberefore, a high voltage/current driving is required.
The object of the present invention is to provide a lateral-type LED back light, the thickness thereof is only 0.4mm-0.6mm, similar to that of EL back light. T'herefore, the material consumption is only one third of unit made by conventional punching process. Moreover, it is no need to reserve additional area for PCB or leadframe.
Ile lateral-type LED back light according to the present invention comprises a light guide, at least one PCB, and a plurality of LEDs, and is assembled in following manner. First, the LEDs are mounted on the PCB panel and then subjected to a wire-bonding process. Afterward, plastic material is formed on the top of the LEDs by epoxy filling or molding, The PCB panel with LEDs is then punched or cut into a plurality of strip-shaped circuit boards.
Finally, the strip-shaped circuit board with LEDs is assembled to one lateral side of the light guide, thus forming the lateral LED back light of the present invention. Alternatively, the strip-shaped circuit board and the light guide can be formed integrally by mold injection or molding.
Me plastic material arranged on the top of the LEDs can be of rectangular, round, or ellipse shape such that the light propagating, within the light guide can emit from front side uniformly and then enhance brightness.
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:
Brief description of drawings:
Fig. I is a perspective view showing a conventional COB-type back lo light; Fig. 2 is a perspective view showing a conventional SMD-type back light; Fig. 3 is a perspective view showing another conventional SMD-type back light; Fig. 4 is a perspective view showing the back light before cutting process according to the present invention; Fig. 5 is another perspective view showing the back light before cutting process according to the present invention; Fig. 6 is a perspective view showing another back light before cutting process according to the present invention; Fig. 7 is the exploded view of the preferred embodiment according to the present invention; Fig. 8 is a perspective view showing the preferred embodiment according to the present invention in a combined state; and Fig. 9 is the perspective view of another preferred embodiment according to the present inventiom Numeral I a LED chip lb PCB 2a 3a LED light source 2b 3b PCB 41 LED 43 PCB panel 45 strip-shaped circuit board 51 LED 5 55 PCB strip 61 LED 63 PCB panel 65 strip-shaped circuit board 71 LED io 75 PCB strip 79 light guide 81 LED 85 PCB strip 89 light guide Detailed description of the preferred embodixnent
Fig. 4 is a perspective view showing the back light according to the present invention and the state thereof before cutting process. The PCB panel 43 can adopt ceramic base, aluminum base, flexible PCB etc. First, the PCB panel 43 is pressed to be a rectangular shape, a square shape or a V shape and formed holes thereon. A plurality of LEDs, arranged altematively, are then mounted to the PCB panel 43, this arrangement is suitable for pressing and to cutting process. Then the wire bonding processed is carried on.
Then, molding process is carried out to form a plastic material on the top of the LED 41. The plastic material can be rectangular shape, round shape or elliptic shape. Ilen the PCB panel 43 is cut into a plurality of stripshaped circuit board 45. The strip-shaped circuit board 45 can be formed various shape to match the light guide to be assembled.
Fig. 5 is a perspective view showing the back light according to the present invention and the state thereof before cutting process. The PCB panel 53 can adopt ceramic base, aluminum base, flexible PCB etc. First, the PCB panel 53 is pressed to a rectangular shape, a square shape or a V shape and formed hole thereon. A plurality of LEDs 5 1, arranged continuously, are then mounted to the PCB panel 53, this arrangement is suitable for cutting process. Ilen the wire bonding processed is carried on.
Then, molding process is carried out to form a plastic material on the top of the LED 5 1. The plastic material can be rectangular shape, round shape or elliptic shape. Then the PCB panel 53 is cut into a plurality of PCB strip 55. The PCB strip 55 can be formed various shape to match the light guide to be assembled.
Fig. 6 is a perspective view showing another back light before ciatting io process according to the present invention. The shape of plastic material can be the same shape of various STMD LED. The PCB panel 63 can adopt ceramic base, aluminum base, flexible PCB etc. Fir% the PCB panel 63 is pressed to a rectangular shape, a square shape or a V shape and formed hole thereon. A plurality of LEDs 61 are then mounted to the PCB panel 53. Then the wire bonding processed is carried on.
Afterward, molding process is carried out to form a plastic material on the top of the LED 61. The plastic material can be rectangular shape, round shape or elliptic shape. Ilen the PCB panel 63 is cut into a plurality of stripshaped circuit board 65. Tlie strip-shaped circuit board 65 can be formed various shape to match the light guide to be assembled.
The plastic material is used to guide the light of LEDs into the light guide, and can be made of silicon, silicon rubber, silicon compound, epoxy, resin, acrylic resin etc. Ile plastic material arranged on the top of the LEDs can be of rectangular, round, or ellipse shape such that the light propagating within the light guide can emit from front side uniforrnly with enhanced brightness.
Fig. 7 is the exploded view of the preferred embodiment according to the present invention, and fig. 9 is a perspective view showing the preferred embodiment in a combined state. The lateral-type LED back light according to the present invention comprises a light guide 79, at least one PCB strip 75, and a plurality of LEDs 71.
The PCB strip 75 with LEDs 71 is manufactured 'in above process, then arranged on one lateral side of the light guide 79. Therefore, the LEDs 71 are also arranged on one lateral side of the light guide 79. The lateral LED back light is brighter than that of conventional COB-type by 30% and is similar to that of SMD type. Moreover, the thickness is reduced in comparison to SMD type- Fig, 9 is the perspective view of another preferred embodiment according to the present invention. By mold injection or molding, the PCB strip 85 equipped with LEDs 71 can be formed integrally with the light guide 89.
io With above integral arrangement, there is no air gap between the LEDs and the light guide, thus increasing brightness. The brightness of the back light according to the present invention is higher than that of SMD type and has reduced thickness 0.4mm-0-6mrn.
The cost of the back light according to the present invention is reduced because the space between circuit boards is saved, and the process of push back mold and mold are omitted. Moreover, the electrodes of back light can be directly soldered to the circuit board, therefore, the SMD process is dispensed.
To sum up, the back light according to the present invention can be manufactured by a simplified process with high reliability and the brightness is enhanced with compact size.
Although the present invention has been described with reference to the preferred embodiments thereof it will be understood that the invention is not limited to the details thereof Various substitutions. and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Chu'ms:
1. A lateral-type LED back light compnses a light guide, at least one strip shaped circuit board, and a plurality of LEDs; wherein the LETX are mounted on a PCB panel and have rectangular plastic material formed by epoxy filling or molding thereon; the PCB panel with LEDs is then punched or cut into a plurality of strip-shaped circuit boards which is subsequently assembled to one lateral side of the light guide.
2. Ile lateral-type LED back light as in claim 1, wherein said strip shaped circuit board and said light guide are formed integrally 3. A lateral-type LED back light comprises a light guide, at least one strip shaped circuit boards, and a plurality of LEDs; wherein the LEDs are mounted on a PCB panel and have round plastic material formed by epoxy filling or molding thereon; the PCB panel with LEDs is then punched or cut into a plurality of strip-shaped circuit boards which is subsequently mounted on one lateral side of the light guide.
4. The lateral-type LED back light as in claim 3, wherein said stripshaped circuit board and said light guide are 'ormed integrally.
5. A lateral-type LED back light comprises a light guide, at least one strip shaped circuit boards, and a plurality of LEDs; wherein the LEDs are mounted on a PCB panel and have eUipse plastic material formed by epoxy filling or molding thereon; the PCB panel with LEDs is then punched or cut into a plurality of strip-shaped circuit boards, which is subsequently assembled to one lateral side of the light guide.
6. The lateral-type LED back light as in claim 5, wherein said stripshaped circuit board and said light guide are formed integrally.
7. A lateral-type LED back light substantially as described herein with reference to and as illustrated in figures 4 to 9 of the accompanying drawings.
0
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9814632A GB2339318A (en) | 1998-07-06 | 1998-07-06 | Lateral type backlight using light emitting diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9814632A GB2339318A (en) | 1998-07-06 | 1998-07-06 | Lateral type backlight using light emitting diodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9814632D0 GB9814632D0 (en) | 1998-09-02 |
| GB2339318A true GB2339318A (en) | 2000-01-19 |
Family
ID=10835030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9814632A Withdrawn GB2339318A (en) | 1998-07-06 | 1998-07-06 | Lateral type backlight using light emitting diodes |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2339318A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008031249A1 (en) * | 2006-08-14 | 2008-03-20 | Topson Optoelectronics Semi-Conductor Co., Ltd | Backlight module with oval lenses |
| WO2009109974A3 (en) * | 2008-03-05 | 2010-01-28 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus and methods of forming the same |
| US7826698B1 (en) | 2007-12-19 | 2010-11-02 | Oree, Inc. | Elimination of stitch artifacts in a planar illumination area |
| US7929816B2 (en) | 2007-12-19 | 2011-04-19 | Oree, Inc. | Waveguide sheet containing in-coupling, propagation, and out-coupling regions |
| EP1670069A4 (en) * | 2003-09-29 | 2011-09-21 | Panasonic Corp | LINEAR LIGHT SOURCE AND METHOD FOR PRODUCING SUCH LIGHT SOURCE AND SURFACE EMISSION DEVICE |
| US8128272B2 (en) | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
| US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
| US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
| US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
| US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
| DE102015016688A1 (en) * | 2015-12-22 | 2017-06-22 | Kai Graf | Luminous module for the lateral illumination of illuminated areas |
| US9857519B2 (en) | 2012-07-03 | 2018-01-02 | Oree Advanced Illumination Solutions Ltd. | Planar remote phosphor illumination apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5166815A (en) * | 1991-02-28 | 1992-11-24 | Novatel Communications, Ltd. | Liquid crystal display and reflective diffuser therefor including a reflection cavity section and an illumination cavity section |
| GB2264002A (en) * | 1992-02-06 | 1993-08-11 | Rohm Co Ltd | Light emitting element array and apparatus using the same |
| GB2276751A (en) * | 1993-04-01 | 1994-10-05 | Karvan Technology Ltd | Illuminating displays |
| US5375043A (en) * | 1992-07-27 | 1994-12-20 | Inoue Denki Co., Inc. | Lighting unit |
-
1998
- 1998-07-06 GB GB9814632A patent/GB2339318A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5166815A (en) * | 1991-02-28 | 1992-11-24 | Novatel Communications, Ltd. | Liquid crystal display and reflective diffuser therefor including a reflection cavity section and an illumination cavity section |
| GB2264002A (en) * | 1992-02-06 | 1993-08-11 | Rohm Co Ltd | Light emitting element array and apparatus using the same |
| US5375043A (en) * | 1992-07-27 | 1994-12-20 | Inoue Denki Co., Inc. | Lighting unit |
| GB2276751A (en) * | 1993-04-01 | 1994-10-05 | Karvan Technology Ltd | Illuminating displays |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1670069A4 (en) * | 2003-09-29 | 2011-09-21 | Panasonic Corp | LINEAR LIGHT SOURCE AND METHOD FOR PRODUCING SUCH LIGHT SOURCE AND SURFACE EMISSION DEVICE |
| US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| US8414174B2 (en) | 2005-06-07 | 2013-04-09 | Oree, Inc. | Illumination apparatus |
| US8579466B2 (en) | 2005-06-07 | 2013-11-12 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| US8641254B2 (en) | 2005-06-07 | 2014-02-04 | Oree, Inc. | Illumination apparatus |
| US8128272B2 (en) | 2005-06-07 | 2012-03-06 | Oree, Inc. | Illumination apparatus |
| WO2008031249A1 (en) * | 2006-08-14 | 2008-03-20 | Topson Optoelectronics Semi-Conductor Co., Ltd | Backlight module with oval lenses |
| US8182128B2 (en) | 2007-12-19 | 2012-05-22 | Oree, Inc. | Planar white illumination apparatus |
| US7826698B1 (en) | 2007-12-19 | 2010-11-02 | Oree, Inc. | Elimination of stitch artifacts in a planar illumination area |
| US8172447B2 (en) | 2007-12-19 | 2012-05-08 | Oree, Inc. | Discrete lighting elements and planar assembly thereof |
| US8550684B2 (en) | 2007-12-19 | 2013-10-08 | Oree, Inc. | Waveguide-based packaging structures and methods for discrete lighting elements |
| US8064743B2 (en) | 2007-12-19 | 2011-11-22 | Oree, Inc. | Discrete light guide-based planar illumination area |
| US8238703B2 (en) | 2007-12-19 | 2012-08-07 | Oree Inc. | Waveguide sheet containing in-coupling, propagation, and out-coupling regions |
| US7929816B2 (en) | 2007-12-19 | 2011-04-19 | Oree, Inc. | Waveguide sheet containing in-coupling, propagation, and out-coupling regions |
| US8459856B2 (en) | 2007-12-19 | 2013-06-11 | Oree, Inc. | Planar white illumination apparatus |
| US8231237B2 (en) | 2008-03-05 | 2012-07-31 | Oree, Inc. | Sub-assembly and methods for forming the same |
| WO2009109974A3 (en) * | 2008-03-05 | 2010-01-28 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus and methods of forming the same |
| US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| US9164218B2 (en) | 2008-07-10 | 2015-10-20 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
| US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
| US8727597B2 (en) | 2009-06-24 | 2014-05-20 | Oree, Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
| US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
| US8840276B2 (en) | 2011-11-16 | 2014-09-23 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
| US9039244B2 (en) | 2011-11-16 | 2015-05-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
| US9857519B2 (en) | 2012-07-03 | 2018-01-02 | Oree Advanced Illumination Solutions Ltd. | Planar remote phosphor illumination apparatus |
| DE102015016688A1 (en) * | 2015-12-22 | 2017-06-22 | Kai Graf | Luminous module for the lateral illumination of illuminated areas |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9814632D0 (en) | 1998-09-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |