JPH05274950A - Structure of disconnecting switch contact portion - Google Patents
Structure of disconnecting switch contact portionInfo
- Publication number
- JPH05274950A JPH05274950A JP10012292A JP10012292A JPH05274950A JP H05274950 A JPH05274950 A JP H05274950A JP 10012292 A JP10012292 A JP 10012292A JP 10012292 A JP10012292 A JP 10012292A JP H05274950 A JPH05274950 A JP H05274950A
- Authority
- JP
- Japan
- Prior art keywords
- shape memory
- memory alloy
- contact piece
- fixed
- fixed contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 23
- 150000001875 compounds Chemical class 0.000 abstract description 12
- 230000005611 electricity Effects 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 238000005498 polishing Methods 0.000 abstract description 2
- 238000004873 anchoring Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 230000006870 function Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
Landscapes
- Contacts (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は断路器の開閉接触部(以
下接触部とする)に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an opening / closing contact portion (hereinafter referred to as a contact portion) of a disconnector.
【0002】[0002]
【従来の技術】従来の接触部は閉状態では、ブレードと
フィンガーが接したままで接触面は動くことのない構造
である。2. Description of the Related Art A conventional contact portion has a structure in which a blade and a finger are in contact with each other and a contact surface does not move in a closed state.
【0003】[0003]
【発明が解決しようとする課題】従来の接触部は長期間
の閉状態において、接触面は長期間動くことがないの
で、時間の経過に伴い、大気中の塩素またはその化合物
あるいは硫黄またはその化合物と、接触面の金属が反応
して接触面の金属と塩素あるいは硫黄との化合物(以下
化合物とする)を生成する。化合物は電気抵抗が大きい
ため、接触部の接触面で、電気的に閉状態となる。ある
いは通電による発熱で、接触面の金属が溶解する。こう
いったことを防止するために定期的に接触面を研磨して
化合物を除く。 このために通電の停止及び研磨のため
の時間、手間がかかるという欠点がある。Since the conventional contact portion is in a closed state for a long period of time and the contact surface does not move for a long period of time, over time, chlorine or a compound thereof in the air or sulfur or a compound thereof is present in the atmosphere. Then, the metal on the contact surface reacts with each other to form a compound (hereinafter referred to as a compound) of the metal on the contact surface and chlorine or sulfur. Since the compound has a high electric resistance, it is electrically closed at the contact surface of the contact portion. Alternatively, the metal on the contact surface is melted by heat generated by energization. To prevent this, the contact surface is regularly polished to remove the compound. For this reason, there is a drawback that it takes time and labor for stopping the energization and for polishing.
【0004】本発明は上記のような従来技術の欠点を解
消するために創案されたものであり、通電電流の変化、
例えば昼間と夜間のような通電電流の変化(以下この例
について記す)により接触面を移動させ、接触面の化合
物を除去することを目的とする。The present invention was devised in order to eliminate the above-mentioned drawbacks of the prior art.
The purpose is to remove the compound on the contact surface by moving the contact surface by a change in the energizing current during the daytime and at night (hereinafter described in this example).
【0005】[0005]
【課題を解決するための手段】上記の目的を達成するた
めに、接触部の固定接触片を形状記憶合金を介して固定
部ベースに固定し、通電電流は形状記憶合金を全部また
は一部が流れる回路とし、昼間と夜間の通電電流の増減
により形状記憶合金の温度変化に伴い、形状が記憶状
態、非記憶状態の交互変化により接触面が移動する構成
とする。In order to achieve the above object, a fixed contact piece of a contact portion is fixed to a fixed portion base via a shape memory alloy, and a current is supplied to the shape memory alloy in whole or in part. The circuit is a flowing circuit, and the contact surface is moved by the change in the memory state and the non-memory state of the shape with the temperature change of the shape memory alloy due to the increase and decrease of the energization current in the daytime and the nighttime.
【0006】[0006]
【作用】通電量の少い夜間では通電回路の一部をなす形
状記憶合金は形状記憶温度より低く、形状は非記憶状態
であるが、通電量の多い昼間となると、形状記憶合金は
形状記憶温度以上となり、記憶した形状である伸張状態
となりバイアススプリングの力に勝って、固定接触片を
一方向へ回転させ、接触面は可動接触片縁部を摺動す
る。通電量の少い夜間になると形状記憶合金は形状記憶
温度以下となり、バイアススプリングの力に負けて非形
状記憶の圧縮した形状となり、固定接触片は逆方向に回
転する。この時も接触面は摺動する。このように通電電
流の変化が前記のように昼夜であれば、昼夜一回ずつ接
触面は摺動研磨し、化合物を除去する。[Function] At night when the amount of electricity is small, the shape memory alloy forming a part of the electricity supply circuit is lower than the shape memory temperature and the shape is in a non-memory state. When the temperature becomes equal to or higher than the temperature, the memorized shape is brought into an expanded state, the force of the bias spring is overcome, the fixed contact piece is rotated in one direction, and the contact surface slides on the edge of the movable contact piece. At night when the energization amount is low, the shape memory alloy falls below the shape memory temperature, loses the force of the bias spring and becomes a non-shape memory compressed shape, and the fixed contact piece rotates in the opposite direction. At this time as well, the contact surface slides. In this way, when the change in the applied current is day or night as described above, the contact surface is slid and polished once a day to remove the compound.
【0007】[0007]
【実施例】図1に示すように、固定接触片1はフィンガ
ー1aと固定接触片ベース1bより成る。固定接触片ベ
ース1bは固定ボルト7を貫通して動かし得る大きさの
固定接触片ボルト穴11がある。固定金具9は固定ボル
ト7を貫通し得る固定金具ボルト穴10がある。固定金
具9は可撓導体5を挾んで固定部ベース6に固定してあ
る。固定接触片べース1bは形状記憶合金コイル3およ
びバイアススプリング4を介して固定ボルト7で固定金
具9に固定してある。固定ボルト7は可動接触子中心O
より固定接触片ボルト穴11までの距離を半径Rとする
円弧をなしている。可動接触片縁部12は可動接触片中
心Oを中心とする円弧をなしている。通電路における固
定接触片1と固定部ベース6の間は記憶合金コイル3と
可撓導体5とで並列回路をなしている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT As shown in FIG. 1, a fixed contact piece 1 comprises a finger 1a and a fixed contact piece base 1b. The fixed contact piece base 1b has a fixed contact piece bolt hole 11 which is sized to move through the fixed bolt 7. The fixing fitting 9 has a fixing fitting bolt hole 10 through which the fixing bolt 7 can pass. The fixing metal fitting 9 is fixed to the fixing portion base 6 by sandwiching the flexible conductor 5. The fixed contact piece base 1b is fixed to a fixing fitting 9 with a fixing bolt 7 via a shape memory alloy coil 3 and a bias spring 4. The fixed bolt 7 is the center O of the movable contact.
It has an arc with a radius R that is the distance to the fixed contact piece bolt hole 11. The movable contact piece edge portion 12 forms an arc centered on the movable contact piece center O. The memory alloy coil 3 and the flexible conductor 5 form a parallel circuit between the fixed contact piece 1 and the fixed portion base 6 in the energization path.
【0008】図1(a)は形状記憶合金コイル3が形状
記憶温度以下で非形状記憶形状すなわち圧縮した状態で
ある。通電量が増し、形状記憶合金コイル3を流れる電
流も増して形状記憶合金コイルが形状記憶温度以上にな
ると図1(b)に示すように形状記憶合金コイル3はそ
の記憶した形状すなわち伸張した形状に変形し、バイア
ススプリング4の力に勝って固定接触片1を左へ回転す
る。FIG. 1 (a) shows the shape memory alloy coil 3 in a non-shape memory shape, that is, in a compressed state at a shape memory temperature or lower. When the amount of energization increases and the current flowing through the shape memory alloy coil 3 also increases and the shape memory alloy coil becomes the shape memory temperature or higher, the shape memory alloy coil 3 has its memorized shape, that is, an expanded shape, as shown in FIG. Then, the fixed contact piece 1 is rotated to the left by overcoming the force of the bias spring 4.
【0009】通電量が減って形状記憶合金コイル3が形
状記憶温度以下になると形状記憶合金コイル3はバイア
ススプリング4の力に負けて圧縮状態となり、固定接触
片1は右へ回転し図1(a)に示す状態になる。通電量
の増減に基ずく固定接触片1の左右への回転により接触
面8は可動接触片縁部12を摺動し、フインガー1a及
び可動接触片2の接触面8を形成する部分を研磨し化合
物を取り除く。When the amount of energization is reduced and the shape memory alloy coil 3 falls below the shape memory temperature, the shape memory alloy coil 3 loses the force of the bias spring 4 and becomes in a compressed state, and the fixed contact piece 1 rotates to the right, as shown in FIG. The state shown in a) is obtained. The contact surface 8 slides on the edge 12 of the movable contact piece 12 when the fixed contact piece 1 is rotated to the left or right based on the increase or decrease in the amount of energization, and the portions forming the contact surface 8 of the finger 1a and the movable contact piece 2 are polished. Remove the compound.
【0010】[0010]
【発明の効果】本発明によって、断路器の接触面に生じ
る化合物を通電量の変化により除去し化合物を原因とす
る接触部の閉回路の発生、あるいは発熱溶損を防止する
ことができる。According to the present invention, the compound generated on the contact surface of the disconnector can be removed by changing the amount of electric current to prevent the generation of a closed circuit at the contact portion due to the compound or the heat generation and melting loss.
【図1】(a)は通電量が少く、形状記憶合金コイルが
形状記憶温度より低く、形状記憶合金コイルは非形状記
憶の形状である圧縮状態にあり、固定接触部が右に回転
した状態を示す。(b)は通電量が多く、形状記憶合金
コイルは形状記憶温度より高温となり、記憶した形状で
ある伸張した形状に変形してバイアススプリングの力に
勝ってこれを圧縮させ、固定接触部が左に回転した状態
を示す。FIG. 1 (a) is a state in which the energization amount is small, the shape memory alloy coil is lower than the shape memory temperature, the shape memory alloy coil is in a non-shape memory shape compressed state, and the fixed contact portion is rotated to the right. Indicates. (B) has a large amount of electricity, and the shape memory alloy coil has a temperature higher than the shape memory temperature and is deformed into an expanded shape which is the memorized shape and overcomes the force of the bias spring to compress it. Shows the state of rotating.
1 固定接触片 1a フィンガー 1b 固定接触片ベース 2 可動接触片 3 形状記憶合金コイル 4 バイアススプリング 5 可撓導体 6 固定部ベース 7 固定ボルト 8 接触面 9 固定金具 10 固定金具ボルト穴 11 固定接触片ボルト穴 12 可動接触片縁部 1 Fixed Contact Piece 1a Finger 1b Fixed Contact Piece Base 2 Movable Contact Piece 3 Shape Memory Alloy Coil 4 Bias Spring 5 Flexible Conductor 6 Fixed Part Base 7 Fixing Bolt 8 Contact Surface 9 Fixing Bracket 10 Fixing Bracket Bolt 11 Fixed Contact Piece Bolt Hole 12 Movable contact edge
Claims (1)
状記憶合金を介して固定部ベースに固定させ、形状記憶
合金の記憶した形状への変形により固定接触変が一方向
へ回転し、元の非形状記憶の形状への復帰により固定接
触片が逆方向に回転し、断路器開閉接触部の閉状態での
フィンガーと可動接触片の接触部の接触面(以下接触面
と記す)が、可動接触片縁部を往復移動することによ
り、接触面を摺動研磨する断路器開閉接触部の構造。1. A fixed contact piece is fixed to a fixed portion base via a shape memory alloy at a disconnecting switch opening / closing contact portion, and the fixed contact deformation is rotated in one direction by deformation of the shape memory alloy into a memorized shape. The fixed contact piece rotates in the opposite direction due to the return to the non-shape memory shape, and the contact surface (hereinafter referred to as the contact surface) between the contact portion of the finger and the movable contact piece in the closed state of the disconnector opening / closing contact portion, The structure of the disconnecting switch opening / closing contact part that slides and polishes the contact surface by reciprocating the movable contact edge.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10012292A JPH05274950A (en) | 1992-03-27 | 1992-03-27 | Structure of disconnecting switch contact portion |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10012292A JPH05274950A (en) | 1992-03-27 | 1992-03-27 | Structure of disconnecting switch contact portion |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05274950A true JPH05274950A (en) | 1993-10-22 |
Family
ID=14265537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10012292A Pending JPH05274950A (en) | 1992-03-27 | 1992-03-27 | Structure of disconnecting switch contact portion |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05274950A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105225879A (en) * | 2015-04-29 | 2016-01-06 | 苏州西脉记忆合金有限公司 | A kind of isolating switch intelligence contact |
-
1992
- 1992-03-27 JP JP10012292A patent/JPH05274950A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105225879A (en) * | 2015-04-29 | 2016-01-06 | 苏州西脉记忆合金有限公司 | A kind of isolating switch intelligence contact |
CN105225879B (en) * | 2015-04-29 | 2017-08-15 | 苏州国嘉记忆合金有限公司 | A kind of intelligent contact of disconnecting switch |
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