JPH05271959A - Ti vapor deposition plated metallic material excellent in corrosion resistance - Google Patents

Abstract

PURPOSE:To impart excellent corrosion resistance to a metallic material by forming an insulated film on the surface of a metal having a natural potential baser than that of Ti and vapor-depositing Ti thereon. CONSTITUTION:On the surface of a metallic material having a natural potential baser than that of Ti such as common steel and stainless steel, an organic or inorganic insulated film is formed into about 0.05 to 500mum thickness. A vapor deposition plated layer of Ti is formed into about 0.005 to 150g/m<2> thickness via the insulated film. The Ti vapor deposition plating can be incorporated with other components for increasing its scratching resistance, wear resistance or the like. Furthermore, as the ones applying color, TiN plating (gold color), TiC plating (silver color) or the like can be given.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Ti-plated metal material used for home electric appliances, sports equipment, building materials and the like, and more particularly to a Ti vapor-deposited metal material excellent in corrosion resistance. The vapor deposition method used here is
In addition to the ordinary vacuum vapor deposition method, the vapor deposition method in a broad sense including various ion plating, sputtering, CVD, etc. is shown.

[0002]

2. Description of the Related Art Due to its excellent corrosion resistance, wear resistance, scratch resistance, etc., Ti has been used not only for aircraft and electronics, but also for home electric appliances, sports equipment, building materials and the like. However, since Ti is an expensive material,
In recent years, by using a cheap material as a base material and performing Ti plating on the surface of the base material, it is considered to manufacture a Ti-plated material that lowers the product price while making the best use of the corrosion resistance, wear resistance, and designability of Ti. It became so. Thus, various materials have been tried to be plated with Ti.

The main methods of Ti plating are vacuum deposition, ion plating, sputtering and CV.
A so-called vapor deposition method such as the D method, in other words, a dry coating method is used. This is because in electroplating in an ordinary aqueous solution, electrolysis of water occurs earlier than electrolysis of Ti, and Ti cannot be substantially plated. In hot dipping, the melting point of Ti is high, so that the base material is dipped. It is difficult to maintain the high temperature of the plating equipment.

[0004]

However, a metal material having a spontaneous potential less base than Ti in the environment in which it is used, such as ordinary steel or stainless steel in seawater, is plated with Ti using the above-described vapor deposition method. When applied, galvanic corrosion occurs due to the difference in spontaneous potential between Ti and the base metal through the pinhole portion existing in the Ti plating layer, and there is a problem that rust easily occurs and the corrosion resistance is poor. .

The present invention has been made in view of the above situation, and its object is to use Ti vapor deposition plating which uses a metal material having a spontaneous potential less base than Ti as a material to be plated and which has excellent corrosion resistance. It is intended to provide a metal material. The spontaneous potential mentioned here means the potential in an environment in which the metal material is placed, and the potential also changes if the usage environment changes.

[0006]

The Ti vapor-deposited metal material of the present invention, which has been able to solve the above problems, has an insulating film formed on the surface of a metal material having a spontaneous potential less base than Ti. It has a gist that a Ti vapor deposition plated layer is formed on it.

[0007]

As a result of various investigations by the present inventors, when a metal material having a spontaneous potential less base than Ti in the use environment is used as the base material, first an insulating film is formed on the surface of the base material and then Ti It has been found that a Ti-plated metal material having excellent corrosion resistance can be obtained by adopting a composite structure of plating. The reason why the corrosion resistance of the Ti-plated metal material is improved by the above composite structure is considered to be as follows.

First, when the Ti plating layer is formed by using the vacuum deposition method or the vapor phase plating method, it is inevitable that some pinholes are present. Further, a plating method such as an ion plating method, which produces relatively few pinholes, has been attempted, but the pinhole has not been completely removed when the plating layer is thin. Therefore, when a metal material having a spontaneous electric potential lower than Ti is used as the base material,
The base material exposed to the external environment at the pinhole portion becomes the anode side due to so-called metal contact with the Ti plating layer, causing galvanic corrosion, and as a result, rust occurs mainly in the pinhole.

Therefore, in order to suppress the galvanic corrosion of the pinhole portion, it is necessary to cut off the metal contact between Ti and the base metal to eliminate the exchange of electrons, that is, insulation. Therefore, if Ti plating is applied to the surface of the metal material via an insulating film, the above-mentioned galvanic corrosion can be prevented,
Therefore, it is considered that the corrosion resistance can be improved. The metal material having a spontaneous potential less base than Ti is not particularly limited in type, but when used in ordinary seawater, for example, ordinary steel, Al, Zn, Mg, and alloys thereof, Pb, Sn, or SUS410. , Stainless steel such as SUS304 corresponds to this. Further, the shape thereof may be plate material, corrugated plate material, pipe material, bar material, or the like.

The insulating film is not particularly limited as long as it is a film excellent in electric insulation and is not particularly limited.
For example, phenol type, polyester type, polyamide type,
Examples thereof include epoxy-based and polyurethane-based resins, rubbers, oil-based varnishes, organic films containing components such as vegetable fibers, ceramics, inorganic films such as phosphates, and oxide films. Considering the ease of forming the insulating film, the adhesion to the base metal and the Ti vapor deposition plated layer, and the presence or absence of defects such as pinholes in the insulating film, the organic film and the oxide film are preferable, and the organic film is particularly preferable. Is particularly preferable. Further, the method for forming the insulating film is not particularly limited, but the following methods are mentioned as general methods.

For example, in the case of an organic film, a method of coating in the form of a paint by means such as a roll coating method or a spray coating method, and in the case of an oxide film, a method of promoting the oxidation of the base metal itself by heat treatment, or There is a method of applying an oxide plating layer using a vacuum deposition method or an ion plating method. In the case of a phosphate coating, there are spraying method, dipping method, brush coating method and the like.

The thickness of the insulating film depends on the type of base metal, Ti
It may be appropriately determined in consideration of the method of vapor deposition plating and the required degree of insulation, but in the case of an organic film, for example, the range of 0.05 to 500 μm is preferable. This is because if the insulating film is too thin, the effect of insulation will not be obtained, and if it is too thick, the adhesion to the base metal or the Ti plating layer will be reduced and the economy will be poor.

The above-mentioned insulating film may be used alone, but it is of course possible to use two or more kinds together if necessary. The Ti vapor deposition plating may of course contain a component other than Ti in order to enhance scratch resistance, abrasion resistance, etc. Further, as a colored product, TiN plating (golden color) or TiC plating ( Silver) and the like. The Ti vapor deposition method is also not particularly limited, but for example, as described above, the vacuum vapor deposition method, the ion plating method, the sputtering method, the CV method.
D method etc. are mentioned. The plating conditions may be appropriately determined according to the type and shape of the base metal and the insulating film.

The thickness of the Ti plating layer may be appropriately determined in consideration of the required plating performance and the like, but a range of 0.005 to 150 g / m ² is preferable. This is T
This is because if the i-plated layer is too thin, the plating performance such as scratch resistance, abrasion resistance, and designability cannot be sufficiently exhibited, and if it is too thick, the plating adhesion and the like are reduced and the economy is poor. Hereinafter, the present invention will be described in more detail with reference to examples, but the following examples do not limit the present invention.
All modifications and implementations within the scope of the above and the following description are included in the technical scope of the present invention.

[0015]

[Example] As a base metal, a 0.7 mm thick ultra-low carbon Al-killed steel plate having a spontaneous electric potential lower than Ti in seawater, and a thickness
0.5 mm Al plate, 0.7 mm thick stainless steel plate (SUS
410 and SUS 304) subjected to alkaline electrolytic degreasing were used. An organic film or an oxide film was used as the insulating film. The organic film was obtained by double-coating a base metal with a commercially available coating material for high processing under the following conditions.

Undercoat -Polyester paint ("Flex Coat 600 Primer" manufactured by Nippon Paint Co., Ltd.)-Dry film thickness ... 5 μm-Baking conditions ... 488 K x 40 sec Top coat -Polyester paint ("Flex paint manufactured by Nippon Paint Co., Ltd." Coat 1000HQ ”) ・ Dry film thickness… 17μm ・ Baking conditions… 503 K × 60sec

The oxide film was obtained by heating a test piece having a width of 100 mm and a length of 100 mm in the atmosphere at 773 K for 3600 seconds. The thickness of the obtained oxide film was about 0.05 μm. Ti plating is 100 mm wide x 100 m long with the above-mentioned insulating film applied to the base metal.
It was performed using a vacuum deposition method as a plating base material of m. Using a batch-type vacuum vapor deposition device, in a vacuum at a pressure of 5 × 10 ⁻³ Pa,
The temperature of the plated substrate was raised in advance to the temperature shown in Table 1 by infrared heating, and the Ti raw material contained in the crucible was irradiated with an electron beam to evaporate Ti and deposit it on the plated substrate. When an organic film is applied as the insulating film, the temperature of the plate before plating is relatively low and the Ti plating is applied because the organic film is decomposed if the temperature is too high. The amount of plating adhered was controlled by providing a film thickness sensor using a crystal oscillator in the adjacent portion of the plating substrate and monitoring the plating amount.

The obtained Ti vapor-deposited plated material was JIS Z23.
A salt spray test was conducted according to No. 71, and the corrosion resistance was evaluated by the 2% rusting time. As a comparative example, a sample material was manufactured and corrosion resistance was evaluated in the same manner as in the example except that the insulating film was not formed. Table 1 collectively shows the test materials and the results of the corrosion resistance test.

[0019]

[Table 1]

As is clear from Table 1, in Examples (Nos. 1 to 6) satisfying the specified requirements of the present invention, the corrosion resistance of any Ti vapor-deposited plated material was remarkably improved. On the other hand, the comparative examples (Nos. 7 to 11) in which the insulating film was not provided were inferior in corrosion resistance. Further, in the comparative example, it was found that the corrosion resistance was poor even when the coating amount was considerably increased (No. 8).

[0021]

The present invention is configured as described above,
It has become possible to provide a Ti vapor-deposited metal material having a very excellent corrosion resistance by using a metal material that is baser than Ti as a base material.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Atsushi Kihara 1-3-18 Wakihamacho, Chuo-ku, Kobe City Kobe Steel, Ltd. Kobe Head Office (72) Inventor Kuniyasu Araga 1-3, Wakihamacho, Chuo-ku, Kobe No. 18 Kobe Steel, Ltd. Kobe Head Office

Claims (1)

[Claims] 1. A Ti vapor-deposited metal material having excellent corrosion resistance, characterized in that a Ti vapor-deposited plated layer is formed on the surface of a metal material having a spontaneous potential lower than Ti by an insulating film.