JPH0526938A - Testing method for electronic circuit device with planar antenna - Google Patents

Abstract

PURPOSE:To enable manufacturing yield to be improved and manufacturing cost to be reduced in a card-type electronic circuit device with a planar antenna. CONSTITUTION:In a testing method for an electronic circuit device with a planar antenna, a circuit pattern 13 including a pattern 12 for connection with the antenna is formed, at the same time a printed-circuit board 11 where electronic parts 15-20 are mounted is coated by resin and is formed in a card shape, and then an antenna pattern is formed on the resin surface. Before coating the printed-circuit board 11 with resin, a test is executed by connecting the pattern 12 for connection and an antenna 22 of a tester 21, and then resin is coated, thus forming an antenna pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card type electronic circuit device having a plane antenna. 2. Description of the Related Art In recent years, IC cards have been used to pay fees at railway ticket gates and toll gates on expressways. However, a general IC card requires physical contact with a host device (for example, a charge management device) in order to input and output data such as a charge, and this requires time.

Therefore, a card type electronic circuit device having a communication function has been attracting attention. This device is equipped with an antenna and can input / output data by radio waves, that is, in a contactless manner, and is expected to be used in large quantities in the future.

[0003]

2. Description of the Related Art FIG. 5 is a perspective view of a card type electronic circuit device having a planar antenna, and FIG. 6 is a sectional view taken along line AA of FIG. In the figure, reference numeral 1 denotes a printed circuit board. The printed circuit board 1 has a circuit pattern 2 including a coupling pattern with an antenna after conductor foils are formed on both surfaces of the printed circuit board 1 and a required portion of the conductive foil is removed. Are formed and configured. The conductor foil on the other surface becomes the earth pattern (ground conductor) 3 as it is.

On the printed circuit board 1, a circuit component 4 functioning as a memory, a gate array, a microprocessor and the like, a component 5 such as a chip resistor, a capacitor, a microwave detector and a battery are mounted. In this state, by loading the printed circuit board 1 in the female mold and pouring the resin,
A resin layer 6 is formed on the component mounting surface of the printed board 1 and molded into a card. Next, a rectangular antenna pattern 7 is formed on the surface of the resin layer 6, and a decorative sheet is attached to the entire surface of the antenna pattern 7 to complete the product.

At this stage, a functional test such as a memory input / output test and a communication distance test is carried out by actually communicating with the tester, and if it passes, the product is shipped as a product.

[0006]

According to the above-mentioned structure, there is an advantage that the size and cost of the device can be reduced. Conventionally, the function test is performed after the device is completed. Therefore, if the test fails here, it is extremely difficult to repair it and the device as a whole is defective. Therefore, there is a problem that the yield (ratio of non-defective products out of all products) is low and the manufacturing cost as a whole is high.

The present invention has been made in view of the above points, and an object of the present invention is to improve yield.
It is to reduce the manufacturing cost as a whole.

[0008]

A printed circuit board on which a circuit pattern including a pattern for coupling with an antenna is formed, and an electronic component is mounted is coated with resin to form a card, and then the resin is formed. The following method is provided as a method for testing an electronic circuit device with a planar antenna, which has an antenna pattern formed on the surface thereof.

That is, before coating the printed circuit board with resin, the coupling pattern and the antenna of the tester are coupled to perform a test, and then the resin coating and antenna pattern formation are performed.

[0010]

According to the present invention, the antenna of the tester is mounted on the coupling pattern formed on the printed circuit board to be coupled with the antenna pattern formed after mounting the necessary components on the printed circuit board and before covering with the resin. And perform a basic operation confirmation test of the device.

In this test, items that cannot obtain sufficient characteristics without an antenna pattern such as sensitivity and directivity of the device cannot be tested, but circuit patterns are broken, solder bridges, connection failures between circuit patterns and components, and component defects. Etc. can almost be found. At this stage, correction of soldering and replacement of defective parts can be easily performed, and therefore repairs are performed so that the products are non-defective. After that, resin coating,
After forming the antenna pattern, conduct the tests of the items that cannot be tested without the above-mentioned antenna pattern, and confirm the necessary characteristics.

As a result, the yield can be improved and the manufacturing cost as a whole can be reduced as compared with the conventional case.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are explanatory views of an embodiment of the present invention, FIG. 1 is a diagram showing a configuration at the time of performing an intermediate test, and FIG. 2 is a diagram showing a configuration at the time of performing a final test.

First, referring to FIG. In the figure, 1
Reference numeral 1 denotes a printed circuit board. After the conductive foil is formed on both surfaces of the printed circuit board 11, the conductive foil of a required portion on one surface is removed to form a circuit pattern 13 including a coupling pattern 12 with the antenna. Consists of The conductor foil on the other surface becomes a ground pattern (ground conductor) 14.

On the printed circuit board 11, components such as a circuit component 15 functioning as a memory, a gate array and a microprocessor, a microwave detector 16, a terminating resistor 17, start-up time constant capacitors 18 and 19, a battery 20 and the like are provided. To be implemented.

When the mounting of the necessary parts is completed, the coupling pattern 12 and the antenna 2 of the tester 21 are kept in this state.
Combine with 2 and perform operation test of each circuit and parts,
Check for broken circuit patterns, solder bridges, defective connections between circuit patterns and components, and defective components.
If a defect such as a component is found by this test, the soldering is corrected and the defective component is replaced as appropriate.

Next, referring to FIG. If no abnormality is found in the intermediate test, or if the correction is completed, the printed circuit board 11 is loaded into the female mold and resin is poured into the female mold to form the resin layer 23 on the component mounting surface of the printed circuit board 11. It is formed into a card shape. Then, a rectangular antenna pattern 24 is formed at a position corresponding to the coupling pattern 12 on the surface of the resin layer 23, and a final test is performed in this state. That is, the antenna 22 of the tester 21 is coupled to the antenna pattern 24, a test for the sensitivity and directivity of the device is performed, and if no abnormality is found, the printed circuit board 11, the resin layer 23, the antenna pattern 24. A decorative sheet (not shown) is attached to the whole of the above, and the finished product is tested.

According to the present embodiment, most of the defects are found in the intermediate test, and the resin coating and the antenna formation are performed after the appropriate correction, so that the final test does not determine the defect. The yield is very small and the yield can be improved.

FIGS. 3 and 4 are explanatory views of another embodiment of the present invention, FIG. 3 is a diagram showing a configuration at the time of an intermediate test, and FIG. 4 is a diagram showing a configuration at the time of a final test. This embodiment is an example in which two coupling patterns 31 and 32 for two orthogonal polarizations (horizontal polarization and vertical polarization) are formed on a printed circuit board, and the tester 33 includes two antennas 34. , 35 for connecting the antennas 34, 35 to the coupling patterns 31, 32, respectively.
The intermediate test and the final test are carried out in combination with. If the antenna for the tester has dual orthogonal polarizations, the number of antennas for the tester is naturally one.

Although the above embodiment is for the case of two orthogonal polarized waves, it goes without saying that the same can be applied to the case of circular polarized waves.

[0021]

As described above, according to the method of the present invention,
In the card-type electronic circuit device provided with the planar antenna, the manufacturing yield can be improved, and as a result, the cost of the device can be reduced.

[Brief description of drawings]

FIG. 1 is an explanatory diagram during an intermediate test in an example of the present invention.

FIG. 2 is an explanatory diagram at the final test in the example of the present invention.

FIG. 3 is an explanatory diagram at the time of an intermediate test in another example of the present invention.

FIG. 4 is an explanatory diagram at the final test in another example of the present invention.

FIG. 5 is a perspective view of an electronic circuit device.

FIG. 6 is a cross-sectional view of an electronic circuit device.

[Explanation of symbols]

11 printed circuit boards 12 coupling patterns 21 tester 22 antenna 23 Resin layer 24 antenna pattern

Claims (3)

[Claims] 1. A circuit pattern including a pattern (12) for coupling with an antenna is formed, and an electronic component (15)
~ 20) mounted on the printed circuit board (11) is coated with a resin (23) to form a card, and then an antenna pattern (24) is formed on the surface of the resin (23). In a test method for a circuit device, a test is performed by coupling the coupling pattern (12) and the antenna (22) of the tester (21) before coating the printed board (11) with the resin (23). A test method for an electronic circuit device with a flat antenna, characterized in that the resin coating and antenna pattern formation are then performed. 2. The coupling pattern is used for two orthogonal polarizations.
2. The method for testing an electronic circuit device with a planar antenna according to claim 1, wherein the tester is formed by forming the antenna and the antennas of the tester are coupled to each other. 3. The electron with a planar antenna according to claim 2, wherein the signals transmitted and received by the two coupling patterns are circularly polarized radio waves as a result of combining two orthogonally polarized waves. Circuit device test method.