JPH05261336A - Resin coating method - Google Patents

Resin coating method

Info

Publication number
JPH05261336A
JPH05261336A JP4062635A JP6263592A JPH05261336A JP H05261336 A JPH05261336 A JP H05261336A JP 4062635 A JP4062635 A JP 4062635A JP 6263592 A JP6263592 A JP 6263592A JP H05261336 A JPH05261336 A JP H05261336A
Authority
JP
Japan
Prior art keywords
resin
recess
rotating disk
resin layer
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4062635A
Other languages
Japanese (ja)
Inventor
Toshio Nakajima
敏夫 中島
Takeshi Kamo
武志 加茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4062635A priority Critical patent/JPH05261336A/en
Publication of JPH05261336A publication Critical patent/JPH05261336A/en
Withdrawn legal-status Critical Current

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  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE:To achieve the quantification and stable control of the coating amount of a flowable resin at the time of the coating with the resin. CONSTITUTION:Recessed parts 12 are formed on the upper surface of a rotary disc 11 and a flowable resin 1 is placed on the upper surface of the rotary disk 11 and the recessed parts 12 are filled with a part of the resin 1 by the scraper 3 fixed so as to come into contact with the upper surface of the rotary disc 11 and the resin coated surface of a desired part 5 is brought into contact with the upper surface of the rotary disc 11 to cover the resin coated surface with the resin 1 received in the recessed parts. Further, the amount of the resin applied to the resin coated surface is controlled by changing the pitch or depth of the recessed parts 12.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は所望部品の所定面に一定
量の樹脂を塗布せしめる方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying a predetermined amount of resin to a predetermined surface of a desired part.

【0002】[0002]

【従来の技術】図4は所望部品の下面に樹脂を塗布する
従来方法の説明図、図5は従来方法によって回転円盤に
塗布した樹脂層と所望部品の樹脂塗布面に塗布された樹
脂層との関係を説明するための図である。
2. Description of the Related Art FIG. 4 is an explanatory view of a conventional method for applying a resin to a lower surface of a desired part, and FIG. 5 shows a resin layer applied to a rotating disk and a resin layer applied to a resin applied surface of a desired part by a conventional method. FIG. 3 is a diagram for explaining the relationship between FIG.

【0003】図4において従来の樹脂塗布装置は、適量
の流動性樹脂1を載せた回転円盤2が回転すると、回転
円盤2の上面に対し適当な間隔で固定したスクレーパ3
によって、回転円盤2の上面には一定厚さの樹脂層4が
形成される。
In FIG. 4, in the conventional resin coating device, when the rotary disk 2 on which an appropriate amount of the fluid resin 1 is placed rotates, the scraper 3 fixed to the upper surface of the rotary disk 2 at an appropriate interval.
Thus, the resin layer 4 having a constant thickness is formed on the upper surface of the rotating disk 2.

【0004】そこで、キャップ(所望部品)5を吸着し
上下動可能なピックアッパー6を降下せしめ、キャップ
5の下面(樹脂塗布面)を樹脂層4に浸漬し、次いで、
ピックアッパー6を上昇させると、キャップ5の下面に
は樹脂層4の一部が塗布され樹脂層7(図5参照)が形
成される。
Therefore, the cap (desired part) 5 is sucked and the vertically movable pick upper 6 is lowered, the lower surface (resin-coated surface) of the cap 5 is dipped in the resin layer 4, and then,
When the pick upper 6 is raised, a part of the resin layer 4 is applied to the lower surface of the cap 5 to form the resin layer 7 (see FIG. 5).

【0005】かかる塗布方法において、キャップ5の下
面に樹脂の塗布されない部分があってはならないため、
樹脂層4に浸漬するようになるが、ピックアッパー6の
固定位置の誤差および樹脂の粘度等によって樹脂層4の
厚さがばらつき、キャップ5の寸法のばらつき等よって
樹脂層4に対するキャップ5の浸漬量がばらつくことに
なる。そのため、樹脂層7の厚さは、一般に20〜100 μ
m にばらつくという欠点があった。
In such a coating method, there must be no resin-uncoated portion on the lower surface of the cap 5,
Although the resin layer 4 is immersed in the resin layer 4, the thickness of the resin layer 4 varies due to an error in the fixed position of the pick upper 6 and the viscosity of the resin, and the cap 5 is immersed in the resin layer 4 due to variations in the dimensions of the cap 5. The amount will vary. Therefore, the thickness of the resin layer 7 is generally 20-100 μm.
It had the drawback of varying in m.

【0006】図5において、樹脂層に浸漬したときキャ
ップ5の下面と円盤2の上面との間隔t(図4参照)を
横軸とし、キャップ5の下面に被着した樹脂の厚さTを
縦軸としたとき、樹脂膜7の厚さTは間隔tに比例して
厚くなる。
In FIG. 5, the distance t (see FIG. 4) between the lower surface of the cap 5 and the upper surface of the disk 2 when immersed in the resin layer is taken as the horizontal axis, and the thickness T of the resin adhered to the lower surface of the cap 5 is represented by On the vertical axis, the thickness T of the resin film 7 increases in proportion to the interval t.

【0007】[0007]

【発明が解決しようとする課題】樹脂層7の前記ばらつ
きに対し従来は、例えばキャップ5が電子素子を気密封
止するパッケージに用いるものであり、樹脂1が接着剤
であり樹脂層7の厚さを50μm 程度としたいときには、
キャップ5に塗布した樹脂膜7の厚さが50μm 以上 (例
えば 100μm 程度) となるようにし、余分の樹脂を取り
除くという工程上の無駄と煩わしさがあり、尚かつ、余
分の樹脂を取り除いた後における樹脂量のばらつきが避
けられないという問題点があった。
Conventionally, for example, the cap 5 is used in a package for hermetically sealing an electronic element, the resin 1 is an adhesive, and the thickness of the resin layer 7 is large. If you want to make the size about 50 μm,
The resin film 7 applied to the cap 5 has a thickness of 50 μm or more (for example, about 100 μm) to remove excess resin, which is a waste and a trouble in the process, and after removing the excess resin. There is a problem in that the variation in the amount of resin in the above is unavoidable.

【0008】[0008]

【課題を解決するための手段】所望部品 (キャップ)5
の所定面(下面)に塗布する樹脂量を安定化すると共に
調整可能とすることを目的とした本発明方法は、その実
施例を示す図1によれば、回転する回転円盤11の上面に
凹所12を形成し、回転円盤11の上面に流動性樹脂1を載
せ、回転円盤11の上面に当接するように固定したスクレ
ーパ3によって凹所12に樹脂1の一部を充填し、キャッ
プ5の下面を回転円盤11の上面に当接し、キャップ5の
下面に凹所内充填樹脂1′の一部を被着させ、該下面に
樹脂層13を塗布形成させるものである。
[Means for Solving the Problem] Desired part (cap) 5
The method of the present invention aimed at stabilizing and adjusting the amount of resin applied to a predetermined surface (lower surface) of the above-mentioned method, according to the embodiment shown in FIG. The place 12 is formed, the fluid resin 1 is placed on the upper surface of the rotating disk 11, and the recess 12 is partially filled with the scraper 3 fixed so as to abut on the upper surface of the rotating disk 11. The lower surface is brought into contact with the upper surface of the rotary disk 11, a part of the recess filling resin 1'is applied to the lower surface of the cap 5, and the resin layer 13 is applied and formed on the lower surface.

【0009】[0009]

【作用】上記手段によれば、回転円盤11の上面の凹所12
に流動性樹脂1を充填し、回転円盤11の上面にキャップ
5の下面を当接することによって、凹所内樹脂1′がキ
ャップ5下面に転写され、該下面には流動性樹脂層13が
形成される。
According to the above means, the recess 12 on the upper surface of the rotating disk 11
The resin 1'in the recess is transferred to the lower surface of the cap 5 by filling the lower surface of the cap 5 with the upper surface of the rotary disk 11 by filling the lower surface of the cap 5 with the liquid resin 1, and the lower surface of the liquid resin layer 13 is formed. It

【0010】従って、キャップ5下面の樹脂層13の樹脂
量は定量化し、帯状凹所12のピッチまたは深さを変える
ことによって該樹脂量の調整が可能となり、余分の樹脂
を取り除く従来工程が不要になる。
Therefore, the amount of resin in the resin layer 13 on the lower surface of the cap 5 can be quantified, and the amount of resin can be adjusted by changing the pitch or depth of the band-shaped recesses 12, thus eliminating the conventional step of removing excess resin. become.

【0011】[0011]

【実施例】図1は本発明方法の実施例の説明図、図2は
本発明方法によって回転円盤に形成した凹所を示す平面
図(その1)、図3は本発明方法によって回転円盤に形
成した凹所を示す平面図(その2)である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an explanatory view of an embodiment of the method of the present invention, FIG. 2 is a plan view showing a recess formed in a rotary disk by the method of the present invention (No. 1), and FIG. It is a top view (the 2) showing a formed crevice.

【0012】図1(イ) において、本発明方法による樹脂
塗布装置は、回転円盤11の上面に断面V字形の多数の凹
所12を形成し、スクレーパ3は先端が回転円盤11の上面
に当接した状態で固定する。上面に樹脂1を止め置く回
転円盤11は、回転円盤11と共に回転する軸15が中心部
に, 側壁16が外周部より突出する。
In FIG. 1 (a), the resin coating apparatus according to the method of the present invention forms a large number of recesses 12 having a V-shaped cross section on the upper surface of a rotary disk 11, and the scraper 3 has its tip abutting on the upper surface of the rotary disk 11. Fix in contact. In the rotating disk 11 for holding the resin 1 on the upper surface, the shaft 15 rotating with the rotating disk 11 is centered and the side wall 16 is projected from the outer peripheral part.

【0013】そこで、回転円盤11の上面に適量の流動性
樹脂1をのせ、回転円盤11を回転させると、その回転方
向にスクレーパ3より先方の各凹所12には、樹脂1の一
部1′が充填され、ピックアッパー6に吸着したキャッ
プ5の下面を回転円盤11の上面に当接させたのち、キャ
ップ5を引き上げると図1(ロ) に示す如く、キャップ5
の下面には、凹所12に充填された樹脂1′が転写され樹
脂層13が被着生成される。
Therefore, when an appropriate amount of the fluid resin 1 is placed on the upper surface of the rotating disk 11 and the rotating disk 11 is rotated, a part 1 of the resin 1 is placed in each recess 12 ahead of the scraper 3 in the rotating direction. ′ Is filled and the lower surface of the cap 5 adsorbed to the pick upper 6 is brought into contact with the upper surface of the rotating disk 11, and then the cap 5 is pulled up, as shown in FIG.
The resin 1 ′ filled in the recess 12 is transferred to the lower surface of the resin layer 13 to deposit and form the resin layer 13.

【0014】このような樹脂層13は、その厚さ (量) が
凹所12の形状とその形成密度によって一定化し、例えば
50〜60μm の厚さとすることができた。図2(イ) におい
て、回転円盤11-1は上面に、回転円盤11-1と同心円の断
面V字形凹所12-1を、回転円盤11-1の半径方向に連続形
成したものであり、凹所12-1は例えば60度のV字断面と
し深さを 150μm 程度とする。
The thickness (quantity) of such a resin layer 13 is made constant by the shape of the recesses 12 and the formation density thereof.
The thickness could be 50-60 μm. 2 (b), the rotary disk 11 -1 top, the rotation disk 11 -1 concentric V-shaped section recess 12 -1, and in the radial direction of the rotary disk 11 -1 a continuum formed, The recess 12 -1 has, for example, a V-shaped cross section of 60 degrees and a depth of about 150 μm.

【0015】図2(ロ) において、回転円盤11-2は上面
に、回転円盤11-2と同心円の断面V字形凹所12-2と12-3
を、回転円盤11-2の半径方向に例えば60度のV字断面に
連続形成したものである。
In FIG. 2B, the rotary disk 11 -2 has a V-shaped recess 12 -2 and 12 -3 on its upper surface, which is concentric with the rotary disk 11 -2.
Are continuously formed in a V-shaped cross section of 60 degrees in the radial direction of the rotating disk 11 -2 .

【0016】ただし、凹所12-2に対し凹所12-3は浅くし
てあり、従って、凹所12-2に充填した樹脂量は凹所12-3
に充填した樹脂量より多くなるため、凹所12-2に当接し
た樹脂塗布面の樹脂層(13)は、凹所12-3に当接した樹脂
塗布面の樹脂層(13)より厚くなる。
[0016] However, the recess 12-2 relative to recess 12 -3 Yes made shallow, therefore, the recess 12 amount of resin filled into -2 recess 12 -3
The resin layer (13) on the resin-coated surface in contact with the recess 12 -2 is thicker than the resin layer (13) on the resin-coated surface in contact with the recess 12 -3. Become.

【0017】図3において、回転円盤11-3は上面に、パ
ターンが六角形となるように断面V字形凹所12-4と12-5
を形成したものであり、凹所12-4が回転円盤11-3の半径
方向に連続するのに対し、凹所12-4より浅い凹所12
-5は、回転円盤11-3の半径方向に一定の隙間で開いてい
る。従って、凹所12-4に当接した樹脂塗布面の樹脂層(1
3)は、凹所12-5に当接した樹脂塗布面の樹脂層(13)より
厚くなる。
In FIG. 3, the rotary disk 11 -3 has V-shaped recesses 12 -4 and 12 -5 on its upper surface so that the pattern has a hexagonal shape.
While the recess 12 -4 is continuous in the radial direction of the rotating disk 11 -3 , the recess 12 -4 is shallower than the recess 12 -4.
-5 is opened in the radial direction of the rotating disk 11 -3 with a constant gap. Thus, the recess 12 abutting the resin coated surface of the resin layer 4 (1
3) is thicker than the resin layer (13) on the resin-coated surface which is in contact with the recess 12 -5 .

【0018】[0018]

【発明の効果】以上説明したように本発明方法によれ
ば、所望部品に塗布する樹脂量が安定化するのみなら
ず、塗布された樹脂量の調整が容易かつ確実になる。そ
のため、本発明方法をパッケージの気密封止に適用した
とき、生産性と気密封止の確実性を向上せしめた効果が
顕著である。
As described above, according to the method of the present invention, not only the amount of resin applied to a desired component is stabilized, but also the amount of applied resin can be adjusted easily and reliably. Therefore, when the method of the present invention is applied to hermetically sealing a package, the effect of improving productivity and reliability of hermetic sealing is remarkable.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明方法の実施例の説明図である。FIG. 1 is an explanatory view of an embodiment of the method of the present invention.

【図2】 本発明方法によって回転円盤に形成した凹所
の説明図(その1)である。
FIG. 2 is an explanatory view (No. 1) of the recess formed in the rotating disk by the method of the present invention.

【図3】 本発明方法によって回転円盤に形成した凹所
の説明図(その2)である。
FIG. 3 is an explanatory view (No. 2) of the recess formed in the rotating disk by the method of the present invention.

【図4】 所望部品の下面に樹脂を塗布する従来方法の
説明図である。
FIG. 4 is an explanatory diagram of a conventional method of applying a resin to the lower surface of a desired component.

【図5】 従来方法によって回転円盤に塗布した樹脂層
と所望部品の所定面に塗布された樹脂層との関係(塗布
樹脂層厚さのばらつき)の説明図である。
FIG. 5 is an explanatory diagram of a relationship (variation in applied resin layer thickness) between a resin layer applied to a rotary disk and a resin layer applied to a predetermined surface of a desired component by a conventional method.

【符号の説明】[Explanation of symbols]

1は流動性樹脂 3は回転円盤の凹所に樹脂を充填させるスクレーパ 1′は凹所に充填された樹脂 5はキャップ(所望部品) 11, 11-1, 11-2, 11-3は回転円盤 12, 12-1, 12-2, 12-3, 12-4, 12-5は回転円盤の上面に
形成した凹所 13はキャップの下面 (樹脂塗布面) に塗布された樹脂層
1 is a fluid resin 3 is a scraper for filling the resin in the recess of the rotating disk 1'is the resin filled in the recess 5 is the cap (desired part) 11, 11 -1 , 11 -2 , 11 -3 is the rotation Disks 12, 12 -1 , 12 -2 , 12 -3 , 12 -4 , 12 -5 are recesses formed on the upper surface of the rotating disk 13 are resin layers applied on the lower surface (resin application surface) of the cap

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 回転する回転円盤(11,11-1, 11-2, 1
1-3) の上面に凹所(12,12-1, 12-2, 12-3, 12-4, 12-5)
を形成し、該回転円盤(11,11-1, 11-2, 11-3)の上面に
流動性樹脂(1) を載せ、該回転円盤(11,11-1, 11-2, 11
-3) の上面に当接するように固定したスクレーパ(3) に
よって該凹所(12,12-1, 12-2, 12-3, 12 -4, 12-5) に該
樹脂(1) の一部を充填し、所望部品(5) の樹脂塗布面を
該回転円盤(11,11-1, 11-2, 11-3) の上面に当接し、該
樹脂塗布面に該凹所内の充填樹脂(1′) を被着させるこ
と特徴とする樹脂塗布方法。
1. A rotating rotating disk (11,11)-1, 11-2, 1
1-3) On top of the recess (12,12-1, 12-2, 12-3, 12-Four, 12-Five)
 To form the rotating disk (11,11-1, 11-2, 11-3) On the upper surface
Place the fluid resin (1) on the rotating disk (11,11-1, 11-2, 11
-3) To the scraper (3) that is fixed so that
Therefore, the recess (12,12-1, 12-2, 12-3, 12 -Four, 12-Five) To
Fill a part of the resin (1) with the resin coated surface of the desired component (5).
The rotating disk (11,11-1, 11-2, 11-3) Contact the upper surface of
Make sure to coat the resin coating surface with the filling resin (1 ') in the recess.
And a resin coating method.
【請求項2】 前記回転円盤 (11-2, 11-3) の上面を複
数領域に分割し、それらの分割領域に並行する複数本の
帯状の前記凹所 (12-2, 12-3または12-4, 12 -5) のピッ
チまたは深さを変え、該分割領域の何れに前記樹脂塗布
面を当接させるかによって、該樹脂塗布面に被着する樹
脂量が異なるようにすることを特徴とする請求項1記載
の樹脂塗布方法。
2. The rotating disk (11-2, 11-3)
Divide into several areas and use multiple
The strip-shaped recess (12-2, 12-3Or 12-Four, 12 -Five)
The resin is applied to any of the divided areas by changing the depth or depth.
Depending on whether the surfaces are brought into contact with each other, the resin applied to the resin-coated surface
The amount of fat is made different, The claim 1 characterized by the above-mentioned.
Resin coating method.
JP4062635A 1992-03-18 1992-03-18 Resin coating method Withdrawn JPH05261336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4062635A JPH05261336A (en) 1992-03-18 1992-03-18 Resin coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4062635A JPH05261336A (en) 1992-03-18 1992-03-18 Resin coating method

Publications (1)

Publication Number Publication Date
JPH05261336A true JPH05261336A (en) 1993-10-12

Family

ID=13205986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4062635A Withdrawn JPH05261336A (en) 1992-03-18 1992-03-18 Resin coating method

Country Status (1)

Country Link
JP (1) JPH05261336A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0798764A2 (en) 1996-03-28 1997-10-01 Nec Corporation Hollow package manufacturing method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0798764A2 (en) 1996-03-28 1997-10-01 Nec Corporation Hollow package manufacturing method and apparatus
EP0798764B1 (en) * 1996-03-28 2004-10-20 NEC Compound Semiconductor Devices, Ltd. Hollow package manufacturing apparatus

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Legal Events

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Effective date: 19990518