JPH05259199A - Manufacture of semiconductor - Google Patents

Abstract

PURPOSE:To reduce a defective ratio and to improve a facility efficiency by clarifying an apparatus in which a malfunction occurs if a malfunction occurs in a wire-bonded lead frame in an apparatus for manufacturing a semiconductor by using a die bonder, a baking furnace and a wire bonder by coupling. CONSTITUTION:Wire bonders 6a, 6b of an apparatus for manufacturing a semiconductor in which a die bonder 3, a baking furnace 5 and the bonders 6a, 6b are coupled each has a bonding rail 7, a rail 8 for conveying a lead frame between apparatuses, a transfer unit 9 for transferring a lead frame from the rail 8 to the rail 7, and a container 10 which can contain the wire-bonded lead frame. If any of the bonders 6a, 6b is defective, it can be easily specified since they respectively have the containers.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus,
In particular, it relates to a semiconductor manufacturing apparatus in which a die bonder, a base furnace, and a wire bonder are connected.

[0002]

2. Description of the Related Art A conventional wire bonder, when used alone as a wire bonder 6 as shown in the plan view of FIG. 3, includes a lead frame supply section 11 for supplying a lead frame 2, a bonding rail 7, and It is composed of an accommodating portion 10 for individually accommodating the wire-bonded lead frames. Also, as shown in the plan view of FIG. 4, the die bonder 3, the base furnace 5, and the wire bonders 6a and 6b.
Wire bonders 6a and 6b for connecting and using
Is a bonding rail 7, an inter-device lead frame carrying rail 8, a transfer section 9a for transferring the die-bonded lead frame from the inter-device lead frame carrying rail 8 to the bonding rail 7, and a wire-bonded lead. The frame has a transfer section 9b for transferring the frame from the bonding rail 7 to the inter-apparatus lead frame transfer rail 8. The wire bonded lead frame is a die bonder 3, a base furnace 5, and a wire bonder 6.
Storage unit 1 connected to the end of the device composed of a and 6b
It was stored in 0.

[0003]

In the conventional wire bonder, in order to reduce the product stagnation time between each process, the wire bonder is used alone, but the die bonder, the baking furnace, and the wire bonder are used in combination. The method of doing is adopted.

The conventional wire bonder carrying and accommodating section has a bonding rail, an inter-apparatus lead frame carrying rail, and a transfer section, but each wire bonder has its own accommodating section. No,
The wire-bonded lead frame was stored in a storage unit connected to the end of the device including a die bonder, a baking furnace, and a wire bonder.

For this reason, when an abnormality is found in the wire-bonded lead frame, it is difficult to find out which wire bonder caused the abnormality, and when one unit is repaired, other connected devices are stopped. As a result, the failure rate increases and the number of products produced decreases.

[0006]

A semiconductor manufacturing apparatus of the present invention is an apparatus constituted by connecting a die bonder, a baking furnace and a wire bonder, and is an inter-apparatus lead frame carrying rail for carrying a lead frame. A bonding rail, a transfer unit for transferring the die-bonded lead frame from the inter-device lead frame transfer rail to the bonding rail, and a storage unit for storing the wire-bonded lead frame.

[0007]

The present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a first embodiment of the present invention.
A die bonder 3 for mounting the semiconductor element 1 supplied from the semiconductor element supply stage 12 on the lead frame 2 by the die bond head 13, and a baking oven 5 for drying and solidifying the adhesive 4 for fixing the semiconductor element 1 to the lead frame 2. , Wire bonders 6a, 6b for stretching a metal wire between the circuit of the semiconductor element 1 and the lead of the lead frame 2
The wire bonders 6a and 6b are respectively composed of a bonding rail 7, an inter-apparatus lead frame carrying rail 8 and an inter-apparatus lead frame carrying rail 8 respectively.
It further has a transfer section 9 for transferring the die-bonded lead frame to the bonding rail 7, and a storage section 10 for setting a lead frame cassette for individually storing the wire-bonded lead frames.

Next, the operation will be described. The wire bonder 6 a draws the die-bonded lead frame from the inter-apparatus lead frame carrying rail 8 to the bonding rail 7 via the transfer unit 9, wire-bonds it with the wire bonding head 14, and then stores it in the housing unit 10. The wire bonder 6b also performs the same operation.

Therefore, the one bonded by the wire bonder 6a and the one bonded by the wire bonder 6b can be distinguished from each other. Further, when the wire bonder 6a is processed, the adjustment sample is used to be stored in the storage portion of the wire bonder 6a, so that it does not mix with the product bonded by the wire bonder 6b.

FIG. 2 is a plan view of the second embodiment of the present invention.
A die bonder 3 for mounting the semiconductor element 1 on the lead frame 2, a baking oven 5 for drying and solidifying an adhesive 4 for fixing the semiconductor element 1 to the lead frame 2, and a circuit between the semiconductor element 1 and the leads of the lead frame 2. It is composed of wire bonders 6a and 6b for stretching a metal wire on each of them. The wire bonders 6a and 6b are used for bonding rails 7, inter-apparatus lead frame carrying rails 8, and inter-apparatus lead frame carrying rails 8 for bonding. A transfer part 9a for transferring the die-bonded lead frame to the rail 7, a transfer part 9b for transferring the wire-bonded lead frame from the bonding rail 7 to the inter-device lead frame transfer rail 8, and a side part of the transfer part 9b. The lead frame that has been wire bonded is stored individually. And a housing portion 10 capable of setting a lead frame cassette.

Next, the operation will be described. The wire bonder 6a draws the die-bonded lead frame from the inter-apparatus lead frame transport rail 8 to the bonding rail 7 via the transfer section 9a, wire-bonds it with the wire bonding head 14, and then transfers the wire-bonded lead frame to the transfer section 9a. send. When all the wires are bonded by the wire bonder 6a, the lead frame to which all the wires have been bonded is housed in the housing portion 10. If there is an unwired portion of the bonding wires, the inter-apparatus lead frame carrying rail is again provided. Return the unwired lead frame to No. 8 and move to the next bonder 6b
Then, the unwired lead frame is pulled into the bonding rail from the inter-device lead frame transport rail through the transfer section, and the bonded lead frame is stored in the storage section by the previous wire bonder 6a.

For this reason, it is possible to perform wire bonding of different materials in a semiconductor manufacturing apparatus in which the die bonder 3 bake furnace and the wire bonder are connected to perform the respective operations in a consistent manner.

[0014]

As described above, according to the present invention, each wire bonder is provided with a storage portion. Therefore, when an abnormality is found in the bonded lead frame, which wire bonder has caused the abnormality immediately. Obviously, when performing one process, there is an effect that the failure rate can be reduced and the number of products produced can be increased without stopping other connected devices.

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment of the present invention.

FIG. 2 is a plan view of a second embodiment of the present invention.

FIG. 3 is a plan view of a conventional wire bonder.

FIG. 4 is a plan view of a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 1 Semiconductor Element 2 Lead Frame 3 Die Bonder 4 Adhesive 5 Baking Furnace 6a, 6b Wire Bonder 7 Bonding Rail 8 Inter-device Lead Frame Conveying Rail 9a, 9b Transfer Section 10 Storage Section 11 Lead Frame Supply Section 12 Semiconductor Element Supply Stage 13 Die bond head 14 Wire bonding head

Claims (1)

[Claims] 1. A die bonder for mounting a semiconductor element on a lead frame, a base furnace for drying and solidifying an adhesive for fixing the semiconductor element to the lead frame, and a plurality of metal wires stretched between the circuit of the semiconductor element and the leads of the lead frame. In a semiconductor manufacturing apparatus that connects a wire bonder of a stand and performs each operation consistently, a bonding rail, an inter-device lead frame transfer rail, and an inter-device lead frame transfer rail in each of the wire bonders. A semiconductor manufacturing apparatus comprising: a transfer unit that transfers a lead frame to a bonding rail further; and a storage unit that can individually store wire-bonded lead frames.