JPH05256785A - Observing apparatus of ic using microminiature proximity imaging device - Google Patents

Abstract

PURPOSE:To execute inspection of soldering of IC efficiently by monitoring a soldered part of the IC by rotating an opticalaxis reflecting mirror, a periphery reflecting mirror and a ring lens for correction of an illuminating optical path by a rotary ring. CONSTITUTION:A ring lens 8 for correction of an illuminating optical path which corresponds to a ring lens for illumination on the imaging device 1 side and a periphery reflecting mirror 9 which reflects a soldered part of IC obliquely from above and projects an image thereof onto an optical-axis reflecting mirror 7 are fixed around the optical-axis reflecting mirror 7. The imaging device 1 to which an observing device is fitted is disposed immediately above the IC 10 and a rotary ring 4 is rotated by finger tips in the direction of an arrow (a), for instance. Then the periphery reflecting mirror 9 and the optical-axis reflecting mirror 7 rotate around the IC 10, the soldered part 11 is illuminated by an illuminating light corrected by the ring mirror 8 for correction of the illuminating optical path and a reflected image thereof is formed in the imaging device 1. By observing this formed image by a monitor, an observer inspects the quality of soldering.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for observing (inspecting) the soldering state of terminals in an IC (integrated circuit).

[0002]

2. Description of the Related Art In the case of an IC, a large number of terminals for circuit connection are attached around the substrate by soldering. Conventionally, this soldering is performed by enlarging the soldering portion using an ultra-small close-up imaging device and displaying the enlarged image on a monitor for observation.

[0003]

However, when observing with the above-mentioned ultra-small close-up photography device, the soldered portion is I
Since it exists around C, it is inconvenient that the soldering portion of the entire IC cannot be observed unless the user holds the microminiature close-up imaging device in one hand, picks the IC with the other hand, and rotates the IC. Therefore, it takes a lot of time to observe one chip.

An object of the present invention is to make it possible to efficiently observe an IC soldered portion using a microminiature close-up photographing device.

[0005]

The apparatus for observing an IC soldered portion according to the present invention is as follows.

A rotating ring rotatably attached to the microminiature close-up photographing device, an optical axis reflecting mirror which is rotated together with the rotating ring and is placed on the optical axis, and the optical axis reflecting mirror. The IC can be reflected obliquely from above, and the reflected image can be projected toward the optical axis reflecting mirror. The rotating ring allows the IC to be projected together with the optical axis reflecting mirror.
An IC for a microminiature close-up image pickup device, which includes an orbiting reflection mirror that rotates around the Observation device.

[0007]

When the IC is placed horizontally and the microminiature close-up device is placed in the center of the upper part of the IC, the illumination light sent from the light source to the soldering portion around the IC via the optical fiber is corrected from the ring lens. The soldered part is irradiated through the ring lens for use. The image of the soldered part brightened by this illumination enters the microminiature close-up imaging device from the orbiting reflection mirror via the optical axis reflection mirror, is enlarged and forms an image on the CCD, and this image is transmitted via the TV camera. It is displayed on the monitor. The observer observes the state of soldering on this monitor. Then, when the rotating ring is rotated, the orbiting reflection mirror, the center mirror, and the illumination optical path correcting ring mirror are rotated together, and the soldered portion is sequentially displayed on the monitor while the IC makes one round. As a result, it is possible to quickly observe the soldered portion of the entire IC simply by fixing the IC as it is and rotating the rotating ring once with a fingertip.

[0008]

EXAMPLE FIG. 1 shows an example of the present invention. Reference numeral 1 denotes an ultra-small close-up imaging device (hereinafter referred to as “imaging device”), and 2 denotes a fixing ring for the imaging device 1, which is fixed by a screw 3. Reference numeral 4 denotes a rotary ring which is rotatably attached to the fixed ring 2 on the outer side of the fixed ring 2.
Is a rotating handling, 6 is a reflecting mirror holding ring which rotates together with the rotating ring 4, and an optical axis reflecting mirror 7 is attached to the center of the holding ring 6 so as to be located on the optical axis and Around the axis reflection mirror 7, the illumination optical path correction ring lens 8 corresponding to the illumination ring lens (not shown) on the photographing device 1 side and the soldered portion of the IC are projected obliquely from above, and this image is reflected by the optical axis. The orbiting reflection mirror 9 for projecting on the mirror 7 is fixed. The illumination optical path correcting ring lens 8 may not be rotated.

FIG. 2 is an explanatory view of an observation example performed by using the above-described observation apparatus, 10 is an IC, 11 is a soldering portion, and the photographing apparatus 1 to which the observation apparatus of the present invention is attached is IC10.
When the rotary ring 4 is arranged immediately above the optical disk, and the rotary ring 4 is rotated with the fingertip in the direction of arrow a, the orbiting reflection mirror 9 and the optical axis reflection mirror 7 rotate around the IC 10, and the illumination corrected by the illumination optical path correction ring mirror 8 The soldered portion 11 is reflected by the light, and this reflected image is formed in the photographing device 1. The observer inspects this image formation on the monitor to inspect whether the soldering is good or bad.

[0010]

As described above, according to the present invention, the soldering state of the entire IC can be observed only by placing the IC horizontally and rotating the reflection mirror on the IC by the rotating ring. Work can be done efficiently.

[Brief description of drawings]

FIG. 1 is a sectional view of an observation device according to the present invention.

FIG. 2 is an explanatory view of IC observation work.

[Explanation of symbols]

 1 Ultra-compact close-up imaging device 2 Fixed ring 3 Screw 4 Rotation ring 5 Rotation handling 6 Reflection mirror holding ring 7 Optical axis reflection mirror 8 Illumination optical path correction ring lens 9 Circular reflection mirror 10 IC 11 Soldering part

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location // H01L 23/50 N 9272-4M

Claims (1)

[Claims] 1. A rotating ring rotatably attached to an ultra-small close-up image pickup device, an optical axis reflecting mirror that rotates together with the rotating ring and is placed on an optical axis, and the optical axis reflecting mirror. With respect to the IC, the IC can be reflected obliquely from above and the reflected image can be projected toward the optical axis reflecting mirror.
In a microminiature close-up photography device, which comprises an orbiting reflection mirror that rotates around C and an illumination optical path correction ring lens that is located in front of the illumination ring lens on the side of the microminiature close-up photography device and corrects the illumination optical path. IC observation device.