JPH05254561A - Wire binding device and noise removal device for wiring - Google Patents

Abstract

PURPOSE:To prevent lead wires of electronic equipment from absorbing and radiating noise by a method wherein a wire binding device is molded of a flexible polymer material. CONSTITUTION:A wire binding device 11 is molded into a ring shape of a flexible synthetic resin dispersed with ferrite powder and consists of a lead wire insert space 11a, a first stopper piece 11b having a number of tooth outside, a first tongue flap 11c which branches from the base of the first stopper piece 11b and extends parallel with the first stopper piece 11b, a second stopper piece 11d having a number of tooth inside, and a second tongue flap 11e which branches from the base of the second stopper piece 11d and extends parallel with the second stopper piece 11d. And, the first and second tongue flaps 11c and 11e face each other. Since the flexible resin used is dispersed with ferrite powder, it has a specified magnetic permeability and the magnetic flux produced around the lead wires 7-9 forms a closed magnetic circuit with the wire binding device 11. As a result, the EMI filter effect arises to prevent noise.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring tie and a wiring noise eliminator.

[0002]

2. Description of the Related Art A lead wire of an electronic device is a portion that easily emits and absorbs particularly high frequency noise. Further, an AC adapter and a power cord for obtaining a DC power source from an AC power source are also portions that easily generate noise.

When noise enters the lead wire from the outside,
This is inconvenient because the original signal to be transmitted is modulated.
Further, if noise is emitted from the lead wire and enters the electronic device, it may cause a malfunction.

As a countermeasure against such noise, generally, FIG.
As shown in, a ring formed by sintering ferrite powder
The core 51 is attached around the lead wire 52 to prevent noise emission and absorption. In this case, the ring core 51 is not attachable to and detachable from the lead wire 52, but only fixed to the periphery thereof.

The ring core 51 is manufactured by sintering ferrite powder, but the sintered body of ferrite is brittle, and the dimensional accuracy cannot be sufficiently obtained due to shrinkage during molding.
Moreover, because of its brittleness, the ferrite sintered body has insufficient mechanical strength against external pressure and its shape cannot be changed.

On the other hand, although a binding band has been conventionally used for bundling the lead wires, the binding band merely binds the lead wires and is not used for any further purpose. Therefore, even if the lead wires are bundled with the binding band, there is a problem in that the lead wires pick up noise from each other.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is a noise removing tool for wiring which can prevent the radiation and absorption of noise with respect to wiring such as a lead wire and the like. The purpose of the present invention is to provide a wiring tie that can be conveniently used.

[0008]

The first aspect of the present invention relates to a wiring binder made of a flexible polymer material molded body containing a magnetic material.

A second invention relates to a noise eliminator for wiring, which is made of a polymer material molded body containing a magnetic material.

[0010]

EXAMPLES Examples of the first invention will be described below.

First, FIG. 7 shows a personal computer to which the present invention is applicable and its peripheral equipment separated from each other. The personal computer comprises an input keyboard 1, a computer main body 2, a floppy disk drive 3, a display 4 and a printer 5, which are electrically connected by lead wires 6, 7, 8 and 9.

Since the lead wires 7, 8 and 9 may actually have a sufficient length with a considerable allowance, simply connecting the devices simply causes them to hang down from the desk or to remain on the desk. I am bent.

Therefore, as shown in FIG.
11, a plurality of lead wires 7, 8 and 9 are bundled together, or one lead wire is bent at a plurality of positions as shown in FIG. 2 and bundled.

FIG. 1 shows the procedure of such lead wire bundling. FIG. 1 (a) shows the state immediately before bundling, FIG. 1 (b) shows the state before bundling, and FIG. 1 (c) shows the bundling completed. Each state is shown.

The binding tool 11 is made of a flexible synthetic resin molding in which ferrite powder is dispersed, has a substantially ring shape, and has a lead wire insertion space 11a and a first toothed outer surface. Locking piece 11b, a first tongue piece 11c branched from the root of the first locking piece 11b and extending substantially parallel to the locking piece 11b, and a second locking piece having a large number of teeth formed inside. 11d and the second tongue piece 11e which branches from the root of the second locking piece 11d and extends substantially parallel to the locking piece 11d. The first and second locking pieces 11b and 11d and the second tongue pieces 11c and 11e are provided so as to face each other.

The lead wire bundling is performed as follows in the case of FIG. 1 (this also applies to the case of FIG. 2). First, as shown in FIG. 1 (a), the lead wires 7, 8 and 9 are inserted into the lead wire insertion space 11a, and then, as shown in FIG. 1 (b), the second locking piece 11d is first inserted. It is inserted between the locking piece 11b and the first tongue piece 11c.

At this time, the binding itself is elastically deformed, and the first tongue piece 11c is inserted while being sandwiched between the second locking piece 11d and the second tongue piece 11e, and at the same time, the first tongue piece 11c is inserted. , The teeth of the second locking pieces 11b and 11d mesh with each other, and the state shown in FIG. 1 (b) is reached, and then the binding state shown in FIG. 1 (c) is obtained. That is, in this bound state, the lead wires 7, 8 and 9 are tightly bound and sufficiently fixed in position.

The above is the same as the above from the binding state in FIG. 1 (c).
After the state of (b), the bundling can be released as shown in (a) of the figure, so that the lead wires can be re-bundled at another desired position, if necessary. Since the binding tool is entirely made of synthetic resin, the above-described binding operation, unbinding operation, and rebinding operation can be repeated.

As shown in FIG. 3, which is an enlarged sectional view taken along line III-III in FIG. 1 (c), the binding tool 11 has a structure in which ferrite powder particles 13 are dispersed in a flexible synthetic resin matrix 12. Since it is made of a molded body, it has a constant magnetic permeability (eg μr = 20).
Indicates.

Due to the dispersion of the ferrite particles, a magnetic flux 14 generated around the lead wire is generated as schematically shown in FIG.
Has a relatively low magnetic resistance (less than air)
A closed magnetic circuit is formed in 11. Therefore, this binding tool not only has the function of binding the lead wires, but also the EMI (Electro Mag
Since it also has a netic interference) filter effect, noise from the outside is not absorbed by the closed magnetic circuit 14 and does not enter the lead wires 7, 8 and 9. Further, the noise transmitted through the lead wire will be absorbed by the closed magnetic circuit 14. Therefore, the signal supplied by the lead wire is a pure signal without noise and the noise is not dissipated.

FIG. 5 is an equivalent circuit diagram of FIG. 4, in which a choke coil is formed by surrounding the lead wire with a binding tool, and noise is absorbed.

In the binding tool 11 of this embodiment, the base material
The synthetic resin constituting 12 is polypropylene, polyamide, polyphenylene sulfide, polyethylene, polystyrene, ethylene-vinyl acetate copolymer, ethylene ethyl acrylate, 6-nylon, 6,6-nylon,
It is preferable to use a thermoplastic resin such as 6,10-nylon, 11-nylon, 12-nylon, polyethylene terephthalate, polybutylene terephthalate or a thermosetting resin such as a phenol resin, an epoxy resin or a diallyl phthalate resin. The ferrite powder particles 13 to be dispersed or kneaded therein are preferably particles such as Mn-Zn ferrite, Mn-Ni ferrite or Mg-Zn ferrite having an average particle size of 110 ± 40 μm.

The weight ratio of the synthetic resin to the ferrite powder is preferably (50:50) to (90:10), for example, 70:30 is selected. If the amount of the synthetic resin is too large, the flexibility is sufficient, but the amount of dispersion of the ferrite powder is relatively small and it tends to be insufficient as a noise countermeasure, and if the amount of the ferrite powder is too large, Since the amount is relatively small, the flexibility is insufficient and it becomes difficult to use.

The method for producing the above-mentioned molded product will be described with reference to a specific example. First, a raw material composition containing iron oxide as a main component is crushed by a ball mill, and an additive (a binder, a defoaming agent, a lubricant) is added thereto. , Plasticizer) to adjust the slurry concentration to prepare a slurry composition. The respective compositions of the raw material composition and the additives are shown below.

Raw material composition Fe ₂ O ₃ 49.72mol% ZnO 31.70mol% NiO 9.11mol% CuO 9.47mol% Additive binder (polyvinyl alcohol) 120 liter antifoaming agent 1 liter lubricant 8.5kg plasticizer 1.0kg slurry concentration ( Raw material composition%) 55%

The slurry composition thus prepared is spray-dried to give an almost spherical granulated powder. Then, this granulated powder is fired while being stirred at a temperature of about 1050-1100 ° C. to form a substantially spherical Ni-Zn ferrite powder (particle system = several μm).
~ Tens of μm) is obtained.

In addition, a core molded body using the following Mg-Zn series or Mn-Zn series ferrite powder can be produced. Mg-Zn system: Fe ₂ O ₃ 48.0mol% MgO 20.5mol% CuO 7.5mol% ZnO 24.0mol% Mg-Zn system: Fe ₂ O ₃ 53.0mol% MnCO ₃ 34.0mol% ZnO 13.0mol%

The tying member 11 can be easily molded by conventional injection molding. FIG. 6 is a sectional view of a main part of the molding die.
A cavity 17 is formed by combining the lower die 15 and the upper die 16, and the cavity 17 is filled with a resin material 60 in which ferrite powder is kneaded through the runner 19 and the gate 18. The mold temperature during molding may be 200 to 300 ° C. In addition to the above injection molding, press molding or hot press molding can be used.

As described above, since the binding tool 11 can be manufactured by molding the ferrite-containing powder resin, the molding does not require the sintering step as in the manufacturing of the core ring of the prior art, and the finishing is almost completed. It is unnecessary, easy to manufacture, and can be manufactured at low cost. Moreover, the binding tool 11 has sufficient strength,
Molded with high dimensional accuracy. Further, the binding tool is flexible in terms of size and number of lead wires to be bound, and detachable, which is convenient for use.

As described above, the binding device of this embodiment
No. 11 is an extremely high value-added product that not only binds to the lead wires, but also has noise absorption and radiation prevention effects (noise countermeasures). Moreover, since it can be manufactured by molding, it is very advantageous in terms of strength, dimensional accuracy, cost and the like.

FIG. 8 shows a tying member (tying band) according to another example of the present invention.

The structure of the binding tool 21 of FIG. 8 is similar to that of the binding tool 11 according to the above-mentioned example, and has a structure in which powder particles of ferrite are uniformly dispersed in the base material of the flexible resin. Such a tissue is the same as the binding tool 31 of FIG. 9 described later.

As shown in FIG. 8 (a), the binding band 21 is
The base portion 22 has a through hole 22a, and an elongated elastically deformable flexible band portion 23 extending from the base portion 22.
The band portion 23 is provided with a large number of fine ridges 23a in the width direction.

The lead wires are bound together as shown in FIG. 8 (b). That is, after applying the lead wires 7, 8 and 9 to the band portion 23, the band portion 23 is inserted into the through hole 22a of the base portion 22 and the band portion 23 is further pulled as it is to bundle the lead wires in the loop. Bind tightly. In this state, the band
The protrusion 23a of 23 engages with the edge of the base 22 facing the through hole 22a (or the recess formed so as to face the through hole 22a) and fixes the position. There is nothing to loosen.

If the protruding portion of the band portion 23 protruding from the base portion 22 after binding is too long and becomes an obstacle, it may be cut.

The binding band 21 according to the present embodiment is the binding device described above.
In the same way as described in 11, it is an effective means for noise, and at the same time, it can easily bind lead wires of any number and size, and its shape is almost the same as that of a normal binding band, so that it is easy to manufacture.

FIG. 9 shows a tying member (tying band) according to still another example of the present invention.

As shown in FIG. 9 (a), the binding band 31 of this example is formed by spirally forming a band-like body, and its structure is the same as in the above-mentioned example, in which ferrite powder is dispersed in a flexible resin. It was made.

As shown in FIG. 9 (b), the lead wires 7, 8 and 9 are bundled together, and a spiral binding band 31 is spirally wound around the lead wires to firmly bind them. This binding is strong due to the elastic force (spring force) of the binding band 31.

In addition to the effect of each of the above-mentioned examples, the binding band 31 can be wound and covered substantially over a wide area in the length direction of the lead wire, so that the binding band 31 can shield noise. It also has a magnetic shield effect, and can block the influence of external magnetism.

Next, an embodiment of the second invention will be described.

FIG. 10 schematically shows a data processing system to which the present invention is applicable, in which data can be stored from one personal computer as a master to another personal computer as a slave. ..

In the figure, 42A is the main body of the base unit, 43A is the same keyboard, 44A is the same display, 45A is the same power cord, 42B is the main unit of the handset, 43B is the same keyboard, 44B is the same display, and 45B is the same. It is the same power cord. Both bodies 42
A and 42B are connected by a lead wire 46, and the operator operates the keyboard 43A of the base unit, so that the base unit main body
The same data as the data stored in 42A is the main unit
It is stored in 42B at the same time.

The line connecting cord 46 in which the conductor 62 is covered with the insulator 63 and the power cords 45A and 45B are attached to the noise removing tool 41.
Is installed. The noise eliminator 41 is attached so as to surround the lead wire 46 or the power cords 45A and 45B, respectively.
As shown in the enlarged view, it is composed of a molded body in which ferrite powder particles 13 are uniformly dispersed in a synthetic resin matrix 12.

The noise removing tool 41 removes noise by a closed magnetic path, as in the binding tool 11 of the above-mentioned first invention (see FIGS. 4 and 5). Therefore, a signal containing no noise is sent to the child device main body 42B, and the predetermined data is accurately stored. In addition, noise to or from the power source 61 can be blocked.

The noise eliminator 41 may be fixed to the lead wire 46 and the power cords 45A and 45B with an adhesive, but may be slid at a desired position without using the adhesive. The noise eliminator 41 is also easily manufactured by conventional injection molding, as in the above example.

FIG. 12 is a schematic view showing an example in which the noise removing tool 41 is attached between the AC adapter 48 and the electronic equipment.

Plug of AC adapter 48 into outlet 49
When the plug 48a is inserted, the AC power supplied from the outlet 49 is converted into DC by the AC adapter 48, and the converted DC power is supplied to a predetermined device (not shown) through the power cord 47.

Also in this example, the DC power supply is in the process of passing through the power supply cord 47, and the noise removing tool 41 attached thereto is attached.
Effectively removes noise.

The noise eliminator 41 can be attached to a lead wire or a power cord as shown in FIG.

That is, the lead wire 46 or the power cords 45A, 45
A wide annular groove 50 is provided in the insulating coating layers 63 of B and 47, and an annular noise removing tool 41 is fitted in the annular groove 50.

In this example, in addition to the effects of the examples of FIGS. 10, 11 and 12, the noise eliminator may travel outside the lead wire or power cord when the noise eliminator 41 is attached. There is an advantage that the surface is flat and does not get in the way. Further, since the noise eliminator 41 itself is flexible, it can be elastically deformed or bent together with the lead wire 46 and has sufficient strength.

Although the embodiments of the present invention have been described above, various modifications can be made to the above embodiments based on the technical idea of the present invention.

For example, the above-mentioned binding tool and noise removing tool are
The same effect can be obtained by applying it to various electronic devices other than the personal computer, and the shape and size thereof can be appropriately selected according to the purpose.

Further, the synthetic resin constituting them may be an appropriate synthetic resin other than the above, and instead of these synthetic resins, an appropriate polymer material other than the synthetic resin may be used.
The magnetic material may be an appropriate magnetic material such as sendust, permalloy, carbonyl iron other than ferrite, and may be in the form of flakes, fibers or the like other than powder. Note that the noise removing tool based on the second invention does not require flexibility as a polymer material.

[0056]

Since the wiring tie and the noise eliminator for wiring based on the present invention are made of a polymer material containing a magnetic substance, the magnetic substance imparts a function as a choke coil, thereby radiating noise. , Absorption is prevented. As a result, a signal or current containing no noise is supplied to the electronic device, and normal operation is always guaranteed.

Further, since it is made of a polymeric material, it is possible to manufacture a high-strength one with high dimensional accuracy and low cost by a simple molding method.

Furthermore, the wiring tie according to the first aspect of the present invention has not only the function of absorbing noise and preventing radiation, but also the action of the tie at the same time, and therefore has a great added value. Further, since the polymer material is made flexible, it can be detachably attached or elastically deformable or bent, and can be conveniently used.

[Brief description of drawings]

FIG. 1 is a perspective view of a tying member according to an embodiment of the first invention,
The figure (a) shows the state just before binding, and the figure (b) shows the state during binding.
(c) shows the binding state.

FIG. 2 is a perspective view showing another binding state by the binding tool.

FIG. 3 is an enlarged sectional view taken along the line III-III in FIG. 1 (c).

FIG. 4 is an enlarged sectional view taken along line IV-IV of FIG. 1 (c) for explaining the electromagnetic action of the binding tool according to the embodiment of the first invention.

5 is a schematic circuit diagram showing an equivalent circuit of FIG. 4. FIG.

FIG. 6 is an enlarged cross-sectional view of a main part of a binding tool molding die.

FIG. 7 is a perspective view showing the components of a personal computer separately.

FIG. 8 is a perspective view of a binding band according to another embodiment of the first invention, wherein FIG. 8 (a) shows an unused state and FIG. 8 (b) shows a binding state.

9 is a perspective view showing a binding state of a binding band according to still another embodiment of the first invention, FIG. 9 (a) showing an unused state, and FIG. 9 (b) showing a binding state.

FIG. 10 is a schematic perspective view of a data processing system according to an embodiment of the second invention.

11 is an enlarged cross-sectional view of a main part including the noise removing tool of FIG. 10.

FIG. 12 is a front view of an AC adapter and its periphery according to another embodiment of the second invention.

FIG. 13 is an enlarged cross-sectional view of a lead wire and a noise eliminator according to another embodiment of the second invention.

FIG. 14 is a perspective view showing a usage state of a conventional ring core.

[Explanation of symbols]

 2, 42A, 42B Personal computer main body 7, 8, 9, 46 Lead wire 11, 21, 31 Binding tool 12 Synthetic resin base material 13 Ferrite powder particles 14 Closed magnetic circuit (or magnetic flux) 15 Mold lower mold 16 Mold Upper mold 17 Mold cavity 41 Noise eliminator 45A, 45B Power cord 47 DC power cord 48 AC adapter

Claims (2)

[Claims] 1. A wiring binder comprising a flexible polymer material molded body containing a magnetic material. 2. A noise eliminator for wiring, which is made of a polymer material molded body containing a magnetic material.