JPH05251201A - Resistor and manufacturing method thereof - Google Patents

Abstract

PURPOSE:To provide a space-saving thin type ultralow resistor with high terminal precision avoiding the tendency to falling down and distortion thereof. CONSTITUTION:A space-saving thin type ultralow resistor comprises a wavy shape processed resistance wire 3, an L-type terminal 2, a junction part 4 of the resistance wire 3 with the L-type terminal 2, an insulating ceramic case 6 and an insulating cement material 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor used in various consumer equipments and industrial equipments, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, set makers have been promoting high-density automatic mounting of electronic circuit components.

Accordingly, there has been a demand for a space-saving thin type, which can cope with the ultra-low resistor which is often used for current detection in a circuit or as an emitter resistor in a power amplifier output stage. Moreover, in order to reduce mounting mistakes during mounting, a terminal with high terminal accuracy is required, and it has the property of not easily falling or twisting when some stress is applied after mounting the circuit board. Things are required.

An embodiment of the prior art will be described below with reference to the drawings. FIG. 9 is a perspective view of an embodiment of the prior art. As shown in the figure, a conventional space-saving thin type ultra-low resistor includes a resistor body 1 and a kink-processed lead terminal 10. FIG. 10 is a partial sectional view of an embodiment according to the prior art. The conventional ultra-low resistor is composed of a wave-processed resistance wire 3, a kink-processed lead terminal 10, a connection portion 4 between the resistance wire and the lead terminal, an insulating ceramic case 6, and an insulating cement material 7. Next, from FIG.
An example of the conventional manufacturing method will be described with reference to FIG. As shown in FIG. 11A, first, an arbitrary portion 4 in which a lead terminal 10 is flattened with a resistance wire 3 that is corrugated to obtain various characteristics and an arbitrary resistance value is obtained. 11B using a method such as welding and cutting and removing the unnecessary portion 5 of the resistance wire.
The completed element is shown in. Next, as shown in FIG. 11C, the completed element is inserted into the insulating ceramic case 6. Then, as shown in FIG. 11 (d), the insulating cement material 7 is enclosed, and it is hardened by drying, baking, or the like. After this, the process is completed through steps such as kink processing, resistance value selection, and marking. It should be noted that the order of insertion of completed element, encapsulation of insulating cement material, kink processing, resistance value selection, and marking process does not matter.

[0005]

However, in such a space-saving thin type ultra-low resistor and its manufacturing method, vibration or some stress is applied to the lead terminal during the process movement or work after the cement encapsulation. At that time, it easily tilts, resulting in defective pitch. This is because the lead terminals are supported by the wave-processed resistance wire, and the resistance wire of the support base is easily deformed.

Further, since the compatible condition of the automatic mounting machine is determined by the terminal wire diameter, even if the maximum diameter is designed within the restriction range, the product mounting is particularly effective in such a self-supporting floating type. It is difficult to obtain sufficient performance with the subsequent terminal collapse and twist strength.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and an object thereof is to provide a space-saving thin type ultra-low resistor which has high terminal accuracy and does not easily fall or twist.

[0008]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is to connect a terminal having a substantially L-shaped cross section to both side surfaces of a resistor.

[0009]

With the above-described structure, the present invention is a space-saving thin type ultra-low resistor with improved terminal accuracy, tilting and twisting strength.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a perspective view of an embodiment of the present invention.
As shown in the figure, the space-saving thin type ultra-low resistor of the present invention comprises a resistor body 1 and an L-shaped terminal 2.

FIG. 1 is a partial sectional view of an embodiment of the present invention. As shown in the figure, the space-saving thin type ultra-low resistor of the present invention is formed by corrugated (wave) processed resistance wire 3, L
It is composed of a V-shaped terminal 2, a connecting portion 4 between the resistance wire 3 and the L-shaped terminal 2, an insulating ceramic case 6, and an insulating cement material 7.

Next, the structure of the present invention will be described with reference to FIGS. First, the resistance wire 3 that has been wave-processed to obtain predetermined characteristics and an arbitrary resistance value is connected to an arbitrary portion 4 of the L-shaped terminal 2 by using a method such as welding, and an unnecessary portion of the resistance wire is formed. 5 is cut and removed to obtain the completed element shown in FIG. Next, FIG. 3 (c)
Insulated ceramic case 6
To insert. Then, as shown in the perspective view of FIG. 3 (d), the insulating cement material 7 is enclosed, and it is cured by drying, baking, or the like. After this, the process is completed through steps such as kink processing, resistance value selection, and marking. It should be noted that the order of insertion of completed element, encapsulation of insulating cement material, kink processing, resistance value selection, and marking process does not matter.

An example of the manufacturing method of the present invention will be described with reference to FIGS. As shown in FIG. 4, first, the resistance wire 3 which is corrugated (wave) to obtain predetermined characteristics and an arbitrary resistance value is formed on the lead frame material 8.
Is connected to the arbitrary portion 4 of the same using a joining method such as welding.
Next, a portion of the lead frame material 8 indicated by a dotted line is valley-folded. As a result, the cross-sectional shape of the terminals connected to both side surfaces of the resistor is substantially L-shaped. Then, the unnecessary portion 5 of the resistance wire is cut and removed, and then the portion b indicated by the dotted line is cut in order to divide the lead frame material 8 into two parts.
A completed element is manufactured through the above steps and is shown in FIG. Next in FIG.
As shown in, the insulating ceramic case 6 is arranged in the insulating ceramic case alignment jig 9 and the completed element is inserted. Then, as shown in the perspective view of FIG. 7, the insulating cement material 7 is enclosed, and it is cured by drying, baking, or the like. Next, in order to separate the mechanical transporting role portion of the lead frame material 8 from the product terminal role portion, a portion c indicated by a dotted line is cut. The morphology after separation is shown in FIG. After that, the process is completed through steps such as resistance value selection and marking. It should be noted that the order of insertion of completed element, encapsulation of insulating cement material, selection of resistance value, and marking process does not matter.

In the above embodiment, a concrete example is shown of an ultra-low resistor using an insulating ceramic case and an insulating cement material. However, the insulation covering the resistor may be molded or painted. There is no end.

With this manufacturing method, it is possible to provide a space-saving thin type ultra-low resistor which has a high terminal accuracy and does not easily fall or twist.

[0017]

As is apparent from the above embodiments, the space-saving thin type ultra-low resistor according to the present invention has high terminal accuracy and reduces mounting mistakes during automatic mounting. In addition, since the terminal has a substantially L-shaped cross-section, the accuracy of the terminal is increased for structural reasons, and therefore, when some stress is applied after mounting the circuit board, the terminal does not easily fall or twist. The effect can be obtained. Then, the manufacturing method excellent in mass productivity according to the present invention can provide the effect of inexpensively providing it to the user.

[Brief description of drawings]

FIG. 1 is a partial sectional view of an embodiment of the present invention.

FIG. 2 is a perspective view of an ultra-low resistor according to an embodiment of the present invention.

FIG. 3 (a) is a front view showing a part of a manufacturing process in one embodiment of the present invention (b) is a front view of a completed element in the manufacturing process in one embodiment of the present invention (c) is the present invention FIG. 3D is a perspective view showing a part of a manufacturing process according to one embodiment of the present invention.

FIG. 4 is a front view showing a part of a manufacturing process according to an embodiment of the present invention.

FIG. 5 is a perspective view showing a part of a manufacturing process according to an embodiment of the present invention.

FIG. 6 is a perspective view showing a part of a manufacturing process according to an embodiment of the present invention.

FIG. 7 is a perspective view showing a part of a manufacturing process according to an embodiment of the present invention.

FIG. 8 is a perspective view showing a part of a manufacturing process according to an embodiment of the present invention.

FIG. 9 is a perspective view of a conventional ultra-low resistor.

FIG. 10 is a partial sectional view according to a conventional technique.

FIG. 11 (a) is a front view showing a part of a conventional manufacturing process, (b) is a front view of a completed element in the conventional manufacturing process, and FIG. 11 (c) is an example of a conventional manufacturing process. (D) is a perspective view showing a part of the manufacturing process by the conventional technique.

[Explanation of symbols]

 1 Resistor main body 2 L-shaped terminal 3 Waveform processed resistance wire 4 Connection between resistance wire and lead terminal 5 Unnecessary part of resistance wire 6 Insulation ceramic case 7 Insulation cement material 8 Lead frame material

Claims (2)

[Claims] 1. A resistor in which terminals each having a substantially L-shaped cross section are connected to both sides of the resistor. 2. A resistor is connected to a lead frame, the lead frame terminal portion is processed into a substantially L shape, the resistor is covered with an insulating material, and then the resistor body is cut from the lead frame material. The method of manufacturing a resistor according to claim 1.