JPH05249172A - Electricity inspection method and method for mounting electronic part using the same - Google Patents

Abstract

PURPOSE:To remove a rejected article, to re-install an electronic part without resupplying solder and to conduct an electricity inspection, by overheating cream solder before melting in a specific temperature, by agglomerating and by making electric continuity between electrodes. CONSTITUTION:Cream solder 11 lying between a bump 9 and a land 10 of a circuit substrate 1 of an electronic part 7 after installation is heated in 100 deg.C to 180 deg.C and agglomerated, and electric continuity is made between the bump 9 and the land 10. Pins 13 for an inspection are contacted on lands 10, electricity inspection is conducted by an electric inspection apparatus 12, and whether the part 7 comes up to the standard or not is judged. In a process for removing a rejected electronic part, the rejected electronic part 7 is removed from the substrate 1 by an installation head 6. In this case, the electricity inspection can be conducted, because the solder 11 is heated in 100 deg.C to 180 deg.C, agglomerated and electrically conductible. However, the rejected part 7 can easily be removed from the substrate 1, because it does not melt. The solder 11 applied on the land 10 is not taken off by the bump 9 and keeps a remounting state with invariant weight and there is no necessity for resupplying the solder 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical inspection method in an electronic component mounting process and an electronic component mounting method using this electrical inspection method.

[0002]

2. Description of the Related Art In recent years, mounting of electronic parts on a circuit board has been
High density and narrow pitch are the mainstream. Therefore,
The need for electrical inspection in the mounting process is increasing.

A conventional electrical inspection method in an electronic component mounting step and a conventional example of an electronic component mounting method using this electrical inspection method will be described with reference to FIGS.

In the flow chart of FIG. 8 and FIGS. 9 to 14, in the printing step of step # 1, as shown in FIG. 9, the metal mask 2 is placed on the circuit board 1 and the squeegee 4 is moved in the direction of the arrow. Then, the cream solder 5 is filled in the opening 3 of the metal mask 2 and printed on the circuit board 1, and the process proceeds to step # 2.

In the electronic component mounting process of step # 2, as shown in FIG.
As shown in FIG. 0, the electronic component 7 having the aluminum bumps 8 provided on the aluminum electrodes 8 is held by the mounting head 6, and the gold bumps 9 are attached to the circuit board 1 by the printing process of step # 1.
It is mounted on the cream solder 11 printed on the land 10, and the process proceeds to step # 3.

In the reflow process of step # 3, as shown in FIG. 11, the cream solder is melted to bond the electronic component 7 and the circuit board 1, and the process proceeds to step # 4.

In the electrical inspection process of step # 4, as shown in FIG. 12, the inspection pin 13 is connected to the land 1 of the circuit board 1.
When 0, the electric inspection is performed by the electric inspection machine 12. If the electric inspection is successful, the process ends. If the electric inspection is not successful, the process proceeds to step # 5.

In the step # 5 of removing rejected electronic components, the circuit board 1 is heated to melt the cream solder 11, and the rejected electronic components 7 are removed as shown in FIG.
Go to step # 6.

In the step # 6 of supplying the cream solder,
As shown in FIG. 13 of step # 5, the rejected electronic component 7
14 is supplied to the cream solder 11 that is lost and chipped when the solder is removed, and the cream solder 11 shown in FIG.
And then return to step # 2.

[0010]

However, in the configuration of the above-mentioned conventional example, since the cream solder 11 before melting is not electrically connected after the electronic component mounting process of step # 2, the reflow of step # 3 is performed. After melt-bonding the cream solder in the process, electrical inspection is performed in the electrical inspection process in step # 4. Therefore, if a defective product is found in the electrical inspection process, the circuit board 1 is heated in the reject electronic component removing process of step # 5 to melt the cream solder 11 and remove the reject electronic component 7. At this time, the cream solder 11 on the side of the circuit board 1 is taken by the rejected electronic component 7 side, and the cream solder 11 is chipped as shown in FIG. In the solder supply process,
Although it is necessary to regenerate the cream solder 11, there is a problem that the work is difficult and the productivity is lowered because the hardened cream solder remains partially.

The present invention solves the above-mentioned problems, the rejected electronic component 7 can be easily removed, and the electronic component can be remounted without re-supplying the cream solder 11. Another object of the present invention is to provide an electronic component mounting method using the same.

[0012]

In order to solve the above-mentioned problems, an electrical inspection method according to the first invention of the present application is to apply cream solder between electrodes between 100 ° C and 180 ° C before melting.
It is characterized in that the cream solder is agglomerated by heating to form electrical conduction between the electrodes, and an electrical inspection is performed based on the electrical conduction.

In order to solve the above-mentioned problems, the electronic component mounting method of the second invention of the present application comprises a cream solder applying step of applying cream solder to the land of the circuit board, and a bump previously provided on the electrode of the electronic component. An electronic component mounting step of mounting on the cream solder applied to the land, and heating the cream solder interposed between the bump and the land from 100 ° C to 180 ° C to aggregate the cream solder, And a preliminary heating step for forming electrical conduction between the lands, an electrical inspection step for inspecting electrical connection and / or circuit characteristics between the electronic component and the circuit board, and a circuit board that has passed the electrical inspection step. And a reflow step of.

In order to solve the above problems, the electronic component mounting method according to the third aspect of the present invention applies a cream solder applying step of applying cream solder to bumps provided in advance on the electrodes of the electronic component, and applying cream solder. The electronic component mounting step of mounting the bumps on the electrodes of the circuit board, and the cream solder interposed between the bumps and the lands is heated from 100 ° C to 180 ° C to aggregate the cream solder, And a preliminary heating step for forming electrical conduction between the lands, an electrical inspection step for inspecting electrical connection and / or circuit characteristics between the electronic component and the circuit board, and a circuit board that has passed the electrical inspection step. And a reflow step of.

[0015]

In the electrical inspection method according to the first aspect of the present invention, when the cream solder is supplied between the electrodes and soldering is performed after the electrical inspection, the cream solder before the melting supplied between the electrodes is electrically connected. Since there is no such thing, the electrical inspection cannot be performed as it is.
By heating from ° C to 180 ° C, the cream solder is aggregated to form electrical conduction, and the electrical inspection can be performed based on this electrical conduction.

In the electronic component mounting method of the second and third inventions of the present application, the printing step, the electronic component mounting step, and the reflow step are the same as those of the conventional electronic component mounting method, but the preliminary heating step is performed. 1 paste of cream solder before melting
By heating the cream solder from 00 ° C. to 180 ° C. to condense the cream solder to form electrical conduction, the electrical conduction is utilized in the electrical inspection process after electrical conduction between the electronic component and the circuit board. Junction and / or circuit characteristics can be inspected and only good products can be sent to the next reflow process.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method of mounting an electronic component according to the second invention of the present application using the first invention of the present application will be described with reference to FIGS.

2 and 7, the metal mask 2 is placed on the circuit board 1 and the squeegee 4 is moved in the direction of the arrow in the printing process of step # 1 as shown in FIG. Then, the cream solder 5 is filled in the opening 3 of the metal mask 2 and printed on the circuit board 1, and the process proceeds to step # 2.

In the electronic component mounting process of step # 2, as shown in FIG.
As shown in FIG. 2, the electronic head 7 having the aluminum bumps 8 provided on the aluminum electrodes 8 is held by the mounting head 6 and the gold bumps 9 are placed on the lands 10 of the circuit board 1 in the printing process of step # 1. It is mounted on the cream solder 11 printed on, and the process proceeds to step # 3.

In the preheating step of step # 3, the cream solder 11 interposed between the mounted electronic component 7, the bump 9 of the circuit board 1 and the land shown in FIG. 4 is heated from 100 ° C to 180 ° C. Then, the cream solder 11 is aggregated to establish electrical conduction between the bump 9 and the land 10, and the process proceeds to step # 4.

In the electrical inspection process of step # 4, as shown in FIG. 5, the inspection pin 13 is connected to the land 10 of the circuit board 1.
Then, the electrical inspection is performed by the electrical inspection machine 12, and if it passes, the process proceeds to step # 5, and if it fails, the step # 6.
Proceed to.

In the reflow process of step # 5, as shown in FIG. 6, the cream solder is melted, the electronic component 7 and the circuit board 1 are joined, and the process is completed.

In the reject electronic component removing step of step # 6, the reject electronic component 7 is removed from the circuit board 1 by the mounting head 6 as shown in FIG. 7, and the process returns to step # 2. In this case, the cream solder 11 is from 100 ° C to 1
Although it is heated to 80 ° C. and agglomerated, it has electrical continuity and is capable of electrical inspection, but since it has not melted, the rejected electronic component 7 is easily removed from the circuit board 1 and applied onto the land 10. The applied cream solder 11 is not taken by the bumps 9 and remains in the state of being able to be reattached with the weight when applied, and it is not necessary to re-supply the cream solder 11.

The electronic component mounting method of the third invention of the present application using the first invention of the present application is also the same as the electronic component mounting method of the second invention of the present application, and the description thereof will be omitted.

[0025]

According to the electrical inspection method of the present invention, after the electronic parts are mounted, the cream solder which is interposed between the electrodes and which is not yet melted is applied to 10 times.
By heating from 0 ° C to 180 ° C, the cream solder is aggregated to form electrical conduction between the electrodes,
There is an effect that an electrical inspection can be performed based on this electrical continuity.

In the electronic component mounting method of the present invention, a pre-heating step is provided after the electronic component mounting step, and the cream solder before melting interposed between the electrodes is heated from 100 ° C to 180 ° C. Not only can electrical conduction be configured between the electrodes, and an electrical inspection step can be provided after this preheating step to perform an electrical inspection based on the electrical conduction, in this case, the cream solder is 100 °. It is heated from C to 180 ° C and agglomerated, and it has electrical continuity and electrical inspection is possible, but since it has not melted, rejected electronic components are easily removed from the circuit board 1 and The cream solder 11 of is not taken by the bump 9,
The remountable state is maintained as it is, and the effect that the step of resupplying the cream solder 11 can be omitted is achieved.

[Brief description of drawings]

FIG. 1 is a flow chart of an embodiment of a method of mounting an electronic component using the electrical inspection method of the present invention.

2 is an operation diagram of FIG. 1. FIG.

3 is an operation diagram of FIG. 1. FIG.

FIG. 4 is an operation diagram of FIG. 1.

5 is an operation diagram of FIG. 1. FIG.

6 is an operation diagram of FIG. 1. FIG.

FIG. 7 is an operation diagram of FIG. 1.

FIG. 8 is a flowchart of a method of mounting an electronic component using the conventional electrical inspection method.

9 is an operation diagram of FIG. 8. FIG.

10 is an operation diagram of FIG. 8. FIG.

11 is an operation diagram of FIG. 8. FIG.

12 is an operation diagram of FIG. 8. FIG.

13 is an operation diagram of FIG. 8. FIG.

14 is an operation diagram of FIG. 8. FIG.

[Explanation of symbols]

 # 1 Printing process # 2 Electronic component mounting process # 3 Preheating process # 4 Electrical inspection process # 5 Reflow process 1 Circuit board 2 Metal mask 3 Opening part 4 Squeegee 5 Cream solder 6 Mounting head 7 Electronic component 8 Aluminum electrode 9 Gold Bump 10 Land 11 Cream solder 12 Electrical inspection machine 13 Inspection pin

Claims (3)

[Claims] 1. The cream solder before melting interposed between the electrodes is heated from 100 ° C. to 180 ° C. to agglomerate the cream solder to form electrical conduction between the electrodes. An electrical inspection method comprising performing an electrical inspection based on continuity. 2. A cream solder applying step of applying cream solder to a land of a circuit board, and an electronic component attaching step of attaching a bump previously provided on an electrode of an electronic component onto the cream solder applied to the land, Cream solder between the bump and the land is 100 ° C to 180 ° C
A preheating step of heating the above to agglomerate the cream solder to form electrical conduction between the bump and the land, and an electrical test for inspecting electrical connection between the electronic component and the circuit board and / or circuit characteristics. An electronic component mounting method, comprising: an inspection step; and a reflow step of a passing circuit board in the electrical inspection step. 3. A bump, which is previously provided on an electrode of an electronic component,
The cream solder applying step of applying the cream solder, the electronic component mounting step of mounting the bumps coated with the cream solder on the electrodes of the circuit board, and the cream solder interposed between the bumps and the land from 100 ° C. to 180 ° C. Preheat step of heating to ° C to agglomerate cream solder to form electrical conduction between the bump and the land, and inspect electrical connection and / or circuit characteristic between the electronic component and the circuit board A method of mounting an electronic component, comprising: an electrical inspection step of: and a reflow step of a circuit board that has passed the electrical inspection step.