JPH0524162A - Double-layered film for printed wiring board - Google Patents
Double-layered film for printed wiring boardInfo
- Publication number
- JPH0524162A JPH0524162A JP18475191A JP18475191A JPH0524162A JP H0524162 A JPH0524162 A JP H0524162A JP 18475191 A JP18475191 A JP 18475191A JP 18475191 A JP18475191 A JP 18475191A JP H0524162 A JPH0524162 A JP H0524162A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- film
- printed wiring
- wiring board
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、耐ハローイング性に優
れた印刷配線板用複層フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer film for printed wiring boards, which has excellent haloing resistance.
【０００２】[0002]
【従来の技術】従来、内層回路板と銅箔とを接着剤層を
介して積層化することで多層プリント配線板としてい
る。そして、この場合、積層間の密着性を高めるため
に、内層回路を形成したプリント配線板の銅箔に亜塩素
酸ソーダ又は過硫酸カリ等で黒化処理（酸化処理）を施
こし、銅箔表面に針状突起を形成せしめている。しかし
ながら、この処理によって生成した銅箔表面の酸化銅
（CuO又はCu2O)は酸に対して易溶であるために、多層プ
リント配線板の形成後のスルーホール加工後において、
スルーホールのメッキ工程中のメッキ前処理液の酸性に
よりスルーホール周辺の内層銅の溶出、すなわち“ハロ
ーイング" が生じるという問題があった。このハローイ
ングは多層プリント配線板の細線化、高密度化に対し重
大な悪影響を及ぼしてしまう。2. Description of the Related Art Conventionally, a multilayer printed wiring board has been formed by laminating an inner layer circuit board and a copper foil via an adhesive layer. In this case, in order to improve the adhesion between the laminated layers, the copper foil of the printed wiring board on which the inner layer circuit is formed is subjected to blackening treatment (oxidation treatment) with sodium chlorite or potassium persulfate, etc. Needles are formed on the surface. However, copper oxide on the surface of the copper foil produced by this treatment (CuO or Cu 2 O) is easily soluble in acid, so after the through hole processing after the formation of the multilayer printed wiring board,
There was a problem that the inner layer copper around the through hole was eluted, that is, "haloing", due to the acidity of the plating pretreatment liquid during the through hole plating process. This haloing has a serious adverse effect on the thinning and high density of the multilayer printed wiring board.
【０００３】このハローイングの発生防止のためには種
々の方法が提案されてきた。例えば、内層銅酸化処理
後に表面形状を保ったまま酸に強い金属銅に内層表面を
還元する方法（特開平１−２２３７９９号公報）、内
層銅を酸化処理することなく電気エッチングによって処
理する方法（特開平２−２３９６９３号公報）、電気
分解により内層銅表面に微細銅粗面を形成させる方法
（特開平２−２６６５９４号公報）、などがある。しか
し、いずれもハローイングの発生防止には十分でなく、
また新しく製造プロセスを設けることとなり、さらに処
理液又は電解液等の管理も必要となるので煩雑である。
他の方法としては、内層銅の酸化処理は従来通り行うけ
れどもスルーホール部の外周縁部にエポキシ樹脂層を形
成し、スルーホール部の密着性を向上させハローイング
を防ぐ方法（特開平１−２６５５９４号公報）がある。
しかし、これは樹脂と内層銅との密着だけに頼った方法
であるので完全とはいえない。Various methods have been proposed to prevent the occurrence of this haloing. For example, a method of reducing the inner layer surface to metallic copper resistant to acid while maintaining the surface shape after the inner layer copper oxidation treatment (Japanese Patent Laid-Open No. 1-223799), a method of treating the inner layer copper by electroetching without oxidizing treatment ( JP-A-2-236993), a method of forming a fine copper rough surface on the inner layer copper surface by electrolysis (JP-A-2-266594), and the like. However, neither is sufficient to prevent the occurrence of haloing,
In addition, since a new manufacturing process is provided and it is necessary to control the treatment liquid or the electrolytic solution, it is complicated.
As another method, a method of forming an epoxy resin layer on the outer peripheral portion of the through hole portion to improve the adhesion of the through hole portion and prevent haloing, though the oxidation treatment of the inner layer copper is performed as in the conventional method (JP-A-1- 265594).
However, this method cannot be said to be perfect because it depends only on the adhesion between the resin and the inner layer copper.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、プリント配
線板の複数個を積層させて多層プリント配線板とする際
に各プリント配線板間に介在させて用いる複層フィルム
であって、従来通りの酸化処理内層銅を使用して積層す
る場合でも耐ハローイング性を向上させることができる
印刷配線板用複層フィルムを提供することを目的とす
る。DISCLOSURE OF THE INVENTION The present invention relates to a multilayer film which is used by interposing between printed wiring boards when a plurality of printed wiring boards are laminated to form a multilayer printed wiring board. It is an object of the present invention to provide a multilayer film for a printed wiring board, which can improve the haloing resistance even when the copper is laminated using the oxidation-treated inner layer copper.
【０００５】[0005]
【課題を解決するための手段】本発明の印刷配線板用複
層フィルムは、接着剤フィルムと電気絶縁性樹脂フィル
ムとを積層させてなり、前記接着剤フィルムがエポキシ
樹脂および／又は変性エポキシ樹脂と表面疎水化処理さ
れたアルカリ金属炭酸塩および／又は表面疎水化処理さ
れたアルカリ土類金属炭酸塩とエポキシ樹脂硬化剤を含
有すると共に、前記電気絶縁性樹脂フィルムがエポキシ
樹脂および／又は変性エポキシ樹脂とエポキシ樹脂硬化
剤を含有することを特徴とする。The multilayer film for a printed wiring board of the present invention comprises an adhesive film and an electrically insulating resin film laminated together, and the adhesive film is an epoxy resin and / or a modified epoxy resin. And a surface-hydrophobized alkali metal carbonate and / or a surface-hydrophobized alkaline earth metal carbonate and an epoxy resin curing agent, and the electrically insulating resin film is an epoxy resin and / or a modified epoxy. It is characterized by containing a resin and an epoxy resin curing agent.
【０００６】以下、本発明の構成につき詳しく説明す
る。
（Ａ）接着剤フィルム。
エポキシ樹脂および／又は変性エポキシ樹脂と表面疎水
化処理されたアルカリ金属炭酸塩および／又は表面疎水
化処理されたアルカリ土類金属炭酸塩とエポキシ樹脂硬
化剤とを含有する樹脂組成物を、常法によりフィルム状
としたものである。The structure of the present invention will be described in detail below. (A) Adhesive film. A resin composition containing an epoxy resin and / or a modified epoxy resin, a surface-hydrophobized alkali metal carbonate and / or a surface-hydrophobized alkaline earth metal carbonate, and an epoxy resin curing agent is prepared by a conventional method. It is made into a film by.
【０００７】(ａ) エポキシ樹脂、変性エポキシ樹脂。
エポキシ樹脂としては、例えば、エピクロールヒドリン
・ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ
型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、ノ
ボラック型エポキシ樹脂、脂環式エポキシ樹脂、難燃性
を付与したブロム化エポキシ樹脂等が用いられる。これ
らの混合物でもよい。(A) Epoxy resin and modified epoxy resin. As the epoxy resin, for example, epichlorhydrin / bisphenol A type epoxy resin, bisphenol F
Type epoxy resin, bisphenol S type epoxy resin, novolac type epoxy resin, alicyclic epoxy resin, brominated epoxy resin imparted with flame retardancy and the like are used. A mixture of these may be used.
【０００８】変性エポキシ樹脂としては、例えば、ＣＴ
ＢＮ変性エポキシ樹脂、ウレタン変性エポキシ樹脂、液
状ゴム変性エポキシ樹脂等が用いられる。これらの混合
物でもよい。
（ｂ）炭酸塩。
表面疎水化処理されたアルカリ金属炭酸塩および／又は
表面疎水化処理されたアルカリ土類金属炭酸塩が用いら
れる。これらの炭酸塩としては、例えば、炭酸リチウム
（Li2CO3) 、炭酸ナトリウム（Na2CO3) 、炭酸カルシウ
ム（CaCO3) 、炭酸マグネシウム（MgCO3) 、炭酸バリウ
ム（BaCO3) 等が挙げられる。これらの炭酸塩はいずれ
も塩基性であり、酸に対し中和作用がある。この中和作
用によって、酸化処理された内層銅を酸から守ることが
できるので、耐ハローイング性の向上が可能となる。こ
れら炭酸塩の粒径は、１０μｍ以下、好ましくは１μｍ
以下がよい。１０μｍ超では熱硬化性樹脂と炭酸塩との
分散が粗くなりすぎ、耐ハローイング性の低下を招いて
しまうからである。Examples of the modified epoxy resin include CT
BN-modified epoxy resin, urethane-modified epoxy resin, liquid rubber-modified epoxy resin, etc. are used. A mixture of these may be used. (B) Carbonate. The surface-hydrophobicized alkali metal carbonate and / or the surface-hydrophobicized alkaline earth metal carbonate is used. Examples of these carbonates include lithium carbonate (Li 2 CO 3 ), sodium carbonate (Na 2 CO 3 ), calcium carbonate (CaCO 3 ), magnesium carbonate (MgCO 3 ), barium carbonate (BaCO 3 ), and the like. To be All of these carbonates are basic and have a neutralizing effect on acids. By this neutralizing action, the inner copper layer subjected to the oxidation treatment can be protected from the acid, so that the haloing resistance can be improved. The particle size of these carbonates is 10 μm or less, preferably 1 μm
The following is good. This is because if it exceeds 10 μm, the dispersion of the thermosetting resin and the carbonate becomes too coarse, and the haloing resistance is deteriorated.
【０００９】ここで、表面疎水化処理とは、例えば、脂
肪酸、樹脂酸等による処理をいう。この処理により炭酸
塩の表面は疎水化され、同時にエポキシ樹脂又は変性エ
ポキシ樹脂との親和性が向上するので、高温高湿下での
電気絶縁信頼性が向上する。炭酸塩の配合量としては、
熱硬化性樹脂（エポキシ樹脂および／又は変性エポキシ
樹脂）１００重量部に対し、炭酸塩２０重量部以上、具
体的には２０重量部〜１５０重量部であることが耐ハロ
ーイング性の点から好ましい。Here, the surface hydrophobization treatment means, for example, treatment with fatty acid, resin acid or the like. By this treatment, the surface of the carbonate is hydrophobized, and at the same time, the affinity with the epoxy resin or the modified epoxy resin is improved, so that the electrical insulation reliability under high temperature and high humidity is improved. The amount of carbonate to be added is
From 100 parts by weight of the thermosetting resin (epoxy resin and / or modified epoxy resin), 20 parts by weight or more of carbonate, specifically 20 parts by weight to 150 parts by weight is preferable from the viewpoint of haloing resistance. .
【００１０】（ｃ）エポキシ樹脂硬化剤。
エポキシ樹脂の硬化剤としては、貯蔵安定性の点から潜
在硬化性を有するものを用いるのが好ましい。具体例を
挙げれば、ジシアンジアミドや或る種のイミダゾール化
合物 (例えば、２−フェニル−４−メチル−５−ヒドロ
キシメチルイミダゾールなどの) のように常温でエポキ
シ樹脂と相溶性のない硬化剤、三フッ化ホウ素アミン錯
体で代表されるルイス酸塩、さらには硬化剤をモレキュ
ラーシーブなど多孔質体に吸着させたもの、マイクロカ
プセルで硬化剤を包んだものなどである。特に、ジシア
ンジアミドやイミダゾール等はガラスエポキシプリプレ
グによく使用されており、いずれも有効な硬化剤であ
る。これら硬化剤の配合量は、貯蔵安定性と硬化物の特
性とのかね合いによりその都度選択されればよい。(C) Epoxy resin curing agent. As the curing agent for the epoxy resin, it is preferable to use one having latent curability from the viewpoint of storage stability. Specific examples include a curing agent that is not compatible with the epoxy resin at room temperature, such as dicyandiamide or some imidazole compound (for example, 2-phenyl-4-methyl-5-hydroxymethylimidazole), trifluoride. Examples thereof include Lewis acid salts represented by borohydride amine complexes, and those in which a curing agent is adsorbed on a porous body such as molecular sieve, and those in which the curing agent is wrapped in microcapsules. In particular, dicyandiamide, imidazole and the like are often used in glass epoxy prepregs, and all of them are effective curing agents. The blending amount of these curing agents may be selected each time depending on the balance between the storage stability and the properties of the cured product.
【００１１】(ｄ) 他の配合剤。
成膜剤としてフィルム形成付与機能を有する各種高分子
量体を配合するとよい。この場合、熱硬化性樹脂との相
溶性が重要であり、その点から選ばれるものは、例えば
アクリロニトリル・ブタジエン共重合体ゴム (ＮＢＲ)
、カルボキシ化ＮＢＲ、エポキシ化ＮＢＲ、エポキシ
化天然ゴム、ポリビニルアセタール樹脂、ポリビニルブ
チラール樹脂、ポリエーテルスルホン樹脂、ポリエステ
ル樹脂などである。必要に応じてこれらの少なくともひ
とつを用いるとよい。その量は熱硬化性樹脂１００重量
部に対し１重量部以上が好ましい。１重量部より少ない
とフィルム形成性が低下する。(D) Other compounding agents. As the film-forming agent, various high molecular weight substances having a film-forming imparting function may be blended. In this case, compatibility with the thermosetting resin is important, and the one selected from that point is, for example, acrylonitrile-butadiene copolymer rubber (NBR).
, Carboxylated NBR, epoxidized NBR, epoxidized natural rubber, polyvinyl acetal resin, polyvinyl butyral resin, polyether sulfone resin, polyester resin and the like. At least one of these may be used if necessary. The amount is preferably 1 part by weight or more based on 100 parts by weight of the thermosetting resin. If the amount is less than 1 part by weight, the film formability is deteriorated.
【００１２】(Ｂ) 電気絶縁性樹脂フィルム。
エポキシ樹脂および／又は変性エポキシ樹脂とエポキシ
樹脂硬化剤とを含有する樹脂組成物を常法によりフィル
ム状としたものである。ここで用いるエポキシ樹脂、変
性エポキシ樹脂、エポキシ樹脂硬化剤は、それぞれ、前
述したと同様のものである。前述したと同様の他の配合
剤もまた、適宜配合してもよい。(B) Electrically insulating resin film. A resin composition containing an epoxy resin and / or a modified epoxy resin and an epoxy resin curing agent is formed into a film by a conventional method. The epoxy resin, modified epoxy resin, and epoxy resin curing agent used here are the same as those described above. Other compounding agents similar to those described above may also be appropriately compounded.
【００１３】(Ｃ) 金属箔。
上記電気絶縁性樹脂フィルムに、必要に応じて、積層さ
れる。この金属箔としては、例えば、銅箔、アルミニウ
ム箔を挙げることができる。一般的に印刷配線板では銅
箔が用いられ、その中でもリジッドの４層板の外層銅箔
としては１８mm厚の電解銅箔が主流である。(C) Metal foil. If necessary, it is laminated on the electrically insulating resin film. Examples of this metal foil include copper foil and aluminum foil. Generally, a copper foil is used in a printed wiring board, and among them, an electrolytic copper foil having a thickness of 18 mm is mainly used as an outer layer copper foil of a rigid four-layer board.
【００１４】[0014]
【実施例】表１に示す配合内容 (重量部) の組成物をＭ
ＥＫ（メチルエチルケトン）に溶解させワニスを調製し
た。このワニスを用いて次のように複層フィルムを作製
した。
本発明複層フィルム１
ワニス１、ワニス３をそれぞれ別個に、乾燥後の膜厚が
５０μｍになるように離型処理ポリエチレンテレフタレ
ート (ＰＥＴ) フィルム上にコートし、乾燥を行い。そ
れぞれフィルム１、フィルム３とした。これらをロール
温度４０℃で貼り合せ、複層フィルムとした。EXAMPLE A composition having the content (parts by weight) shown in Table 1 was mixed with M
A varnish was prepared by dissolving it in EK (methyl ethyl ketone). Using this varnish, a multilayer film was produced as follows. Multilayer film 1 of the present invention Varnish 1 and varnish 3 were separately coated on a release-treated polyethylene terephthalate (PET) film so that the film thickness after drying was 50 μm, and dried. These are film 1 and film 3, respectively. These were laminated at a roll temperature of 40 ° C. to form a multilayer film.
【００１５】 本発明複層フィルム２
ワニス１を乾燥後の膜厚が５０μｍになるように離型処
理ＰＥＴフィルム上にコートし、乾燥を行った。これを
フィルム１とした。ワニス３を電解銅箔 (厚さ１８μ
ｍ) の粗化面に乾燥後の膜厚が５０μｍとなるようにコ
ートし、乾燥を行った。これを銅箔つきフィルム３とし
た。これらをロール温度４０℃で貼り合せ、複層フィル
ムとした。Multilayer film 2 of the present invention A varnish 1 was coated on a release-treated PET film so that the film thickness after drying was 50 μm, and dried. This was designated as film 1. Varnish 3 with electrolytic copper foil (thickness 18μ
The roughened surface of m) was coated so that the film thickness after drying would be 50 μm, and dried. This was designated as film 3 with copper foil. These were laminated at a roll temperature of 40 ° C. to form a multilayer film.
【００１６】 本発明複層フィルム３
ワニス２、ワニス３をそれぞれ別個に乾燥後の膜厚が５
０μｍになるように離型処理ＰＥＴフィルム上にコート
し、乾燥を行った。それぞれフィルム２、フィルム３と
した。これらをロール温度４０℃で貼り合せ複層フィル
ムとした。
比較複層フィルム１
ワニス３を乾燥後の膜厚が５０μｍになるように電解銅
箔 (厚さ１８μｍ) の粗化面にコートし、乾燥を行っ
た。これを銅箔つきフィルム３とした。The multilayer film 3 of the present invention has a film thickness of 5 after the varnish 2 and the varnish 3 are separately dried.
The release-treated PET film was coated so as to have a thickness of 0 μm, and dried. These are film 2 and film 3, respectively. These were laminated at a roll temperature of 40 ° C. to form a multilayer film. Comparative multilayer film 1 Varnish 3 was coated on the roughened surface of an electrolytic copper foil (thickness 18 μm) so that the film thickness after drying was 50 μm, and dried. This was designated as film 3 with copper foil.
【００１７】 比較複層フィルム２
ワニス４、ワニス３をそれぞれ別個に乾燥後の膜厚が５
０μｍになるように離型処理ＰＥＴフィルム上にコート
し、乾燥を行った。それぞれフィルム４、フィルム３と
した。これらをロール温度４０℃で貼り合せ、複層フィ
ルムとした。
比較複層フィルム３
ワニス５、ワニス３をそれぞれ別個に乾燥後の膜厚が５
０μｍになるように離型処理ＰＥＴフィルム上にコート
し、乾燥を行った。それぞれフィルム５、フィルム３と
した。これらをロール温度４０℃で貼り合せ、複層フィ
ルムとした。Comparative multilayer film 2 Varnish 4 and varnish 3 each having a thickness of 5 after being dried separately.
The release-treated PET film was coated so as to have a thickness of 0 μm, and dried. These are film 4 and film 3, respectively. These were laminated at a roll temperature of 40 ° C. to form a multilayer film. Comparative multilayer film 3 Varnish 5 and varnish 3 each having a thickness of 5 after being dried separately
The release-treated PET film was coated so as to have a thickness of 0 μm, and dried. These are film 5 and film 3, respectively. These were laminated at a roll temperature of 40 ° C. to form a multilayer film.
【００１８】これらの複層フィルムを用いて下記により
耐ハローイング性、銅箔引き剥し強さ、はんだ耐熱性、
電気絶縁性を評価した。この結果を表２に示す。耐ハローイング性評価法
：両面酸化 (ＢＯ) 処理銅箔
（３５μｍ）付ガラスエポキシ基板（1.６mm厚）へ、本
発明複層フィルム１、２、３および比較複層フィルム
２、３はフィルム１、２、４、５の面を、また、比較複
層フィルム１はフィルム３の面を、ラミネーターにより
基板の両面へ１２０℃で貼り合せた。ついで、銅箔のつ
いていない本発明複層フィルム１、３および比較複層フ
ィルム２、３のフィルムのそれぞれフィルム３の面に、
ラミネーターより電解銅箔 (１８μｍ) の粗化面を１２
０℃で貼り合せた。つぎに、全てのサンプルをオートク
レーブで減圧 (５トール) 下、５kg／cm2 で加圧しなが
ら１７０℃、１時間硬化させ、４層板を得た。これに、
ドリル径0.８mm、回転数１２００rpm で穴開け加工を行
い、１８％ HCl水溶液中に３０分間浸漬して、内層銅の
ドリル孔周辺のハローイングを観察し、測定を行った。Using these multilayer films, the following haloing resistance, copper foil peeling strength, solder heat resistance,
The electrical insulation was evaluated. The results are shown in Table 2. Evaluation method of haloing resistance : Double-sided films 1, 2 and 3 of the present invention and comparative double-layered films 2 and 3 are films on glass epoxy substrates (1.6 mm thick) with double-sided oxidation (BO) treated copper foil (35 μm) The surfaces 1, 2, 4, 5 and the surface of the comparative multilayer film 1 of the film 3 were bonded to both surfaces of the substrate by a laminator at 120 ° C. Then, on the surface of the film 3 of each of the multi-layer films 1 and 3 of the present invention and the comparative multi-layer films 2 and 3 having no copper foil,
From the laminator, remove the roughened surface of electrolytic copper foil (18 μm)
It stuck together at 0 degreeC. Next, all samples were cured in an autoclave under reduced pressure (5 torr) at 5 kg / cm 2 while being cured at 170 ° C. for 1 hour to obtain a 4-layer plate. to this,
Drilling was performed at a drill diameter of 0.8 mm and a rotation speed of 1200 rpm, and the hole was immersed in an 18% HCl aqueous solution for 30 minutes to observe and measure the haloing of the inner layer copper around the drill hole.
【００１９】銅箔引き剥し強さ評価法：上記で作製した
４層板を用い、カッターナイフにより１０±0.１mmの幅
で、銅箔にカットを入れ、ＪIＳ Ｃ6481. 5.7.3 の(1)
により測定した。はんだ耐熱性の評価法
：上記で作製した４層板から２５
±１mm角に試験片を切り取り、予め２６０℃に温度調節
したはんだ浴に、試験片の銅箔面がはんだに浸るように
浮かべ、６０秒間浸漬し、その後取り出し、室温まで冷
却した後、銅箔面のふくれ、剥がれなどを目視により観
察した。電気絶縁性の評価法
：予め作製したクシ歯型パターン回
路基板（ライン／スペース＝0.２mm／0.２mm）を用い、
硬化工程まで前記の耐ハローイング性評価法と同様にし
て行った。硬化後、銅箔を全面エッチングによって取り
除き、得られたサンプルについて線間絶縁抵抗 (ＤＣ５
００Ｖ、１分印加後の抵抗値) を測定した。これを常態
値とし、続いてサンプルを８５℃、８５％ＲＨの条件下
でＤＣ５０Ｖ印加を５００時間行い、同様に線間絶縁抵
抗を測定した。 Copper foil peeling strength evaluation method : Using the 4-layer plate prepared above, a copper knife was cut into a width of 10 ± 0.1 mm with a cutter knife, and the copper foil was cut according to JIS C6481. 5.7.3 (1). )
It was measured by. Evaluation method of solder heat resistance : 25 from the four-layer board produced above
Cut the test piece into squares of ± 1 mm, float in a solder bath whose temperature is adjusted to 260 ° C so that the copper foil surface of the test piece is immersed in the solder, soak it for 60 seconds, then take it out and cool it to room temperature, then copper foil The swelling and peeling of the surface were visually observed. Evaluation method of electrical insulation : Using a comb-shaped pattern circuit board (line / space = 0.2 mm / 0.2 mm) that was prepared in advance,
The procedure up to the curing step was carried out in the same manner as in the above haloing resistance evaluation method. After curing, the copper foil was removed by etching the entire surface, and the sample obtained was subjected to line insulation resistance (DC5
The resistance value after applying 00 V for 1 minute) was measured. This was taken as a normal value, and subsequently, DC50V was applied for 500 hours under the conditions of 85 ° C. and 85% RH, and the line insulation resistance was measured in the same manner.
【００２０】 [0020]
【００２１】
表１、表２から本発明複層フィルム１〜３は耐ハローイ
ング性、銅箔との引き剥し強さ、はんだ耐熱性、電気絶
縁性に優れていることがわかる。比較複層フィルム１で
は耐ハローイング性が著しく劣っている。比較複層フィ
ルム２では炭酸カルシウムの粒径が大きく、耐ハローイ
ング性が若干芳しくなく、また炭酸塩が表面疎水化処理
されていないため電気絶縁性の温熱劣化が見うけられ
る。比較複層フィルム３では耐ハローイング性は良好だ
が、炭酸塩が表面疎水化処理されていないため、やはり
電気絶縁性の温熱劣化が生じている。[0021] It can be seen from Tables 1 and 2 that the multilayer films 1 to 3 of the present invention are excellent in haloing resistance, peel strength from a copper foil, solder heat resistance, and electrical insulation. The comparative multilayer film 1 is significantly inferior in haloing resistance. In the comparative multilayer film 2, the particle size of calcium carbonate is large, the haloing resistance is slightly poor, and the thermal insulation deterioration of the electric insulation can be seen because the carbonate is not surface-hydrophobicized. The comparative multilayer film 3 has good haloing resistance, but since the carbonate is not surface-hydrophobicized, the thermal insulation deterioration of the electrical insulation still occurs.
【００２２】[0022]
【発明の効果】以上説明したように本発明の印刷配線板
用複層フィルムは、従来通りの酸化処理内層銅の耐ハロ
ーイング性を著しく向上させることができる。さらに、
多層プリント配線板の電気絶縁性を高めることができ、
複層フィルムであるために多層プリント配線板の製造時
の作業性をも向上させることが可能となる。As described above, the multilayer film for a printed wiring board of the present invention can remarkably improve the haloing resistance of the conventional oxidation-treated inner layer copper. further,
The electric insulation of the multilayer printed wiring board can be improved,
Since it is a multi-layer film, it is possible to improve workability in manufacturing a multilayer printed wiring board.
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/03 Ｊ 7011−4Ｅ Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 1/03 J 7011-4E
Claims (2)
ムとを積層させてなり、前記接着剤フィルムがエポキシ
樹脂および／又は変性エポキシ樹脂と表面疎水化処理さ
れたアルカリ金属炭酸塩および／又は表面疎水化処理さ
れたアルカリ土類金属炭酸塩とエポキシ樹脂硬化剤を含
有すると共に、前記電気絶縁性樹脂フィルムがエポキシ
樹脂および／又は変性エポキシ樹脂とエポキシ樹脂硬化
剤を含有する印刷配線板用複層フィルム。1. An adhesive film and an electrically insulating resin film are laminated, the adhesive film being an epoxy resin and / or a modified epoxy resin and a surface-hydrophobicized alkali metal carbonate and / or surface hydrophobic. Multi-layer film for printed wiring board, which contains a modified alkaline earth metal carbonate and an epoxy resin curing agent, and in which the electrically insulating resin film contains an epoxy resin and / or a modified epoxy resin and an epoxy resin curing agent. .
ムとを積層させ、さらに前記電気絶縁性樹脂フィルムに
金属箔を積層させてなる請求項１の印刷配線板用積層フ
ィルム。2. The laminated film for a printed wiring board according to claim 1, wherein an adhesive film and an electrically insulating resin film are laminated, and a metal foil is further laminated on the electrically insulating resin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18475191A JPH0524162A (en) | 1991-07-24 | 1991-07-24 | Double-layered film for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18475191A JPH0524162A (en) | 1991-07-24 | 1991-07-24 | Double-layered film for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0524162A true JPH0524162A (en) | 1993-02-02 |
Family
ID=16158709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18475191A Pending JPH0524162A (en) | 1991-07-24 | 1991-07-24 | Double-layered film for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0524162A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008522392A (en) * | 2004-11-29 | 2008-06-26 | テサ・アクチエンゲゼルシヤフト | Adhesive strip, thermally activated and based on nitrile rubber and polyvinyl butyral, for bonding electronic components and strip-shaped conductors together |
-
1991
- 1991-07-24 JP JP18475191A patent/JPH0524162A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008522392A (en) * | 2004-11-29 | 2008-06-26 | テサ・アクチエンゲゼルシヤフト | Adhesive strip, thermally activated and based on nitrile rubber and polyvinyl butyral, for bonding electronic components and strip-shaped conductors together |
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