JPH0524037A - Cutting method for electronic part ceramic base and its device - Google Patents

Abstract

PURPOSE:To prevent the generation of defects such as crack, break and the like when an electronic part ceramic base is cut into chips. CONSTITUTION:Boundaries on both sides of a section 4 to be cut of an electronic part ceramic base 100 are cut simultaneously by using a plurality of disc-shaped rotating whetstones 60 mounted on a spindle 52 and rotationally driven thereon.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for cutting a ceramic substrate for electronic parts, which is capable of cutting the ceramic substrate for electronic parts with high accuracy and without causing cracks or chips.

[0002]

2. Description of the Related Art Conventionally, the problems to be solved by the invention
In Japanese Patent Laid-Open No. 63-172401, etc., an electronic component element is formed in each section of the rod-shaped portion of a ceramic substrate formed by integrally forming a plurality of rod-shaped portions by forming slit holes. It has been proposed that the chip component be manufactured by cutting and separating.

FIG. 13 shows an example of a ceramic substrate having slit holes. Reference numeral 1 denotes a ceramic substrate, and region E surrounded by a two-dot chain line is a portion where a large number of rod-shaped portions 3 are formed by a large number of parallel slit holes 2. is there. Each bar 3 has a number of compartments 4
And electronic component elements such as a chip resistance element and a chip capacitance element are formed in each section 4. It is necessary to cut the boundary H of each partition 4 after forming the electronic component element in each partition 4, but in the past, the cutting operation was performed with one disk-shaped rotary grindstone.

The cutting operation by one disc-shaped rotary grindstone and its defects will be described with reference to FIGS. 14 and 15. 14
Inside, 1 is a ceramic substrate, and an adhesive vinyl tape 10 is attached to the back surface thereof. Then, the disc-shaped rotary grindstone 11 is pressed against the ceramic substrate 1 on the adhesive vinyl tape to cut the boundary of each cutting section in which the electronic component element is formed. The force in the escape direction acts on the section on the way. For this reason,
Before the rotary grindstone 11 completely reached the lower surface of the substrate, the cutting section was separated as the chip component 15 as shown in FIG.
For this reason, the chip component 15 obtained after cutting had many cracks and chips.

FIGS. 16 to 30 show examples of generation of defective products by the conventional cutting operation. FIGS. 16 to 18 show a step a of 60 to 70 μm on one cut surface of the chip component 15 and a corner portion. It shows a state where a chip b is generated. 19 to 21 show a state in which a step is formed on both cut surfaces of the chip component 15. 22 to 24 show a state in which a step is generated on both cut surfaces of the chip component 15 and a cutting striation (reciprocating) c is generated. 25 to 27 show how the warp d and the fracture surface e occur on the cut surface of the chip component 15. 28 to 30 show how a warp f and a step g occur on the cut surface of the chip component 15.

When cutting the ceramic substrate 1 for electronic parts with one rotating grindstone 11, it is highly accurate if there is a deviation in the parallelism between the boundaries of the sections 4 to be cut and the cutting direction of the rotating grindstone 11. Can't be cut off. In particular, when the shape and size of each section 4 in which the electronic component element is formed becomes small, the deviation of the parallelism cannot be ignored, and some measure is required also in this respect.

In view of the above points, the present invention provides a method and apparatus for cutting a ceramic substrate for an electronic component, which can cut the ceramic substrate for an electronic component with high accuracy and prevent the occurrence of defects such as cracks and chips. With the goal.

[0008]

In order to achieve the above object, a method of cutting a ceramic substrate for electronic parts according to the present invention comprises:
A plurality of disc-shaped rotary grindstones parallel to each other are used to simultaneously cut the boundaries on both sides of the section to be cut of the ceramic substrate for electronic parts.

Further, in the cutting device for a ceramic substrate for electronic parts of the present invention, the spindle in which a plurality of disk-shaped rotary grindstones are mounted in parallel with each other and the positional relationship between the ceramic substrate for electronic parts and the spindle are XY-. The moving means for changing in the Z-θ direction and a plurality of markers on the substrate arranged on a straight line parallel to the boundary of the section to be cut in the ceramic substrate for electronic parts are imaged to pick up the boundary and the rotary grindstone. The image processing means for detecting the deviation of the parallelism from the cutting direction, and the control means for operating the moving means so as to correct the deviation of the parallelism by receiving the detection output of the image processing means. There is.

[0010]

In the present invention, since the boundaries on both sides of the section to be cut of the ceramic substrate for electronic parts are cut at the same time by using a plurality of disk-shaped rotary grindstones, no escape occurs in the section being cut and the disk-shaped section is cut. The cutting section does not separate until the rotary grindstone reaches the lower surface of the ceramic substrate for electronic parts. Therefore, cracks and chips are unlikely to occur in the chip component obtained by cutting the ceramic substrate for electronic components. Further, since the cutting is performed with a plurality of rotary grindstones, the ceramic substrate for electronic parts can be cut efficiently, which is also advantageous in reducing the manufacturing cost. Furthermore, if a plurality of markers arranged on a straight line parallel to the boundary of the section to be cut are provided on the ceramic substrate for electronic parts, and a configuration is adopted in which these markers are imaged, the cutting direction of the rotary grindstone and the It is possible to detect the deviation of the parallelism with the boundary and execute the cutting operation after correcting the deviation of the parallelism, and to make the ceramic substrate for electronic parts into a chip part having a minute dimension (about 1.0 × 0.5 mm). High accuracy (± 10
It can be cut with an error of less than μm.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method and apparatus for cutting a ceramic substrate for electronic parts according to the present invention will be described below with reference to the drawings.

FIG. 1 and FIG. 5 are main components of a cutting device for a ceramic substrate for electronic parts, which is an embodiment of the present invention, and FIG.
4 to 4 show the overall configuration, and FIG. 6 shows the control system of the embodiment.

First, the overall structure will be described with reference to FIGS. In these figures, 20 is a device frame,
A supply / removal section 21 is arranged on the right side surface of the apparatus frame 20. The supply / removal unit 21 is the device frame 2
A magazine movable base 22 slidably attached to the right side surface of 0 in the Y-axis direction (perpendicular to the X-axis and perpendicular to the paper surface of FIG. 2), and a supply side fixed on the magazine movable base 22. It has a substrate storage magazine 23A and a take-out side substrate storage magazine 23B. Each board storage magazine 23A,
Two 23Bs are arranged at the front and rear, as shown in FIG.
Each of the substrate storage magazines 23A and 23B is provided with a mechanism for pushing up the stored electronic component ceramic substrate (having an adhesive vinyl tape attached to the bottom surface) to a predetermined height position.

An X-axis direction moving head 31 is supported by a support mechanism 32 so as to be reciprocally movable along the X-axis direction of the apparatus frame 20.
The ceramic board for electronic parts is supported on the device frame 20 by the suction board 33A capable of sucking and holding the ceramic board for electronic parts in the supply side board housing magazine 23A by vacuum suction and the ceramic board for electronic parts in the takeout side board housing magazine 23B. Suction discs 33B capable of suction-holding and transferring are attached to the X-axis direction moving heads 31, respectively. The upper part of the moving range of the X-axis direction moving head 31 is covered with a cover 34. This is so that the grinding liquid used in the cutting step of the ceramic substrate for electronic parts described later does not reach the ceramic substrate for electronic parts being transferred by the X-axis direction moving head 31. It should be noted that by moving the magazine moving table 22 in the Y-axis direction, each of the two substrate storage magazines 23A shown in FIG.
It is possible to select either the front or the back of 23B to face the suction plates 33A and 33B for taking out and storing the ceramic substrate for electronic parts.

As shown in FIG. 3, the apparatus frame 20 is provided with an X table 40 movable in the X-axis direction.
A θ table 41 is installed on the table 40. The θ table 41 has a central axis of rotation that is parallel to the Z axis perpendicular to the XY plane (horizontal plane) and is rotatable at a required angle. The θ table 41 has a ceramic substrate for electronic parts to be cut. It is designed to be placed and fixed.

A Y-slider 50 slidable in the Y-axis direction is supported on the device frame 20, and the Y-slider 50 is supported.
A Z slider 51 is supported on the front surface of the slider so as to be slidable in the Z-axis direction. The tip of a spindle 52, which rotates at a high speed, projects below the Z slider 51. As shown in FIGS. 1 and 5, a plurality of disk-shaped rotary grindstones 60 are alternately stacked in parallel at regular intervals via spacers 61 to form flanges 53.
And is fixed by a nut 55 via a grindstone retainer 54, and a flange 53 to which a disk-shaped rotary grindstone 60 is attached is fitted on a spindle 52 and fixed by a nut 56. The upper part of the location where the disk-shaped rotary grindstone 60 is arranged is covered with an openable cover 57 with a transparent window.

A control system of the cutting device for a ceramic substrate for electronic parts will be described with reference to FIG. The control system of FIG. 6 includes an image processing circuit 70, a television camera 71 for capturing an image of a ceramic substrate for electronic parts, a monitor television 72 for displaying the image processing output of the image processing circuit 70, a microprocessor 73, an X-axis motor driver 74. , Y-axis motor driver 75, Z-axis motor driver 76, θ-axis motor driver 77, take-out supply motor driver 78, spindle motor driver 79, each sensor 81 attached to the apparatus, each motor driver 7
4 to 79, an interface 82 for connecting each sensor 81 and the microprocessor 73, and an operation switch panel 83.

Here, the TV camera 71 is fixed to the Y slider 50 via a mounting arm 85, and the monitor TV 72 and the operation switch panel 83 are arranged on the front surface of a control housing 90 in which a control system is stored. There is. The X-axis motor driver 74 drives and controls a motor that moves the X table 40 in the X-axis direction, and the Y-axis motor driver 75 drives and controls a motor that moves the Y slider 50 in the Y-axis direction. The Z-axis motor driver 76 drives and controls the motor that moves the Z slider 51 in the Z-axis direction, and the θ-axis motor driver 77 drives and controls the motor that rotates and moves the θ-table 41. The driver 78 drives and controls the motor that moves the X-axis direction moving head 31 for transferring the ceramic substrate for electronic parts, and the spindle motor driver 79 drives and controls the motor that rotates the spindle 52. These motor drivers 74
79 to 79 are controlled by the microprocessor 73 via the interface 82.

Next, the step of cutting the ceramic substrate for electronic parts and the steps before and after it will be described with reference to FIG. 7 and other figures. The electronic component ceramic substrate 100 on which electronic component elements such as chip resistance elements and capacitance elements have been formed in a large number of sections is first transferred to the supply-side magazine 102 of the tape sticking machine 101, as shown in FIG. Supply magazine 10
The ceramic substrate 100 for electronic parts of 2 is sucked by the suction plate 103 and transferred onto the tape sticking table 104 (in the state of being turned upside down), and is held on the back surface of the ceramic substrate 100 for electronic parts by the elevating member 105 for a predetermined length. The adhesive vinyl tape 106 is attached by the lowering operation of the elevating member 105, and is further pressed by the pressure roller 107. Then, the ceramic substrate for electronic parts (hereinafter, abbreviated as a ceramic substrate for electronic parts with tape) 100 to which the adhesive vinyl tape 106 is attached on the back surface is the tape applying machine 1.
No. 01 is ejected to the take-out magazine 108.

Ceramic substrate 10 for electronic parts with tape
Before the cutting process of 0, the cutting device 110 for a ceramic substrate for electronic parts, whose overall configuration has been described with reference to FIGS. 2 to 4, performs a step of cutting a test substrate. That is, the test board 111 of FIG. 8 is positioned and placed on the θ table 41, and the spindle 52 is rotated at the known position of the Y slider 50.
The X table 40 is moved to cut the test substrate 111, and a plurality of disc-shaped rotary grindstones 60 attached to the test substrate are cut.
The cutting trace T is imaged by the television camera 71, the image processing circuit 70 performs image processing to recognize the position (Y coordinate) of the cutting trace T, and the microprocessor 73 stores it. This allows
It is possible to accurately know the known positional relationship between the Y slider 50 and the disk-shaped rotary grindstone 60. After that, the test board 111 is removed from the θ table 41.

By the way, the ceramic substrate 100 for electronic parts with tape produced by the tape applying machine 101 is transferred from the take-out side magazine 108 of the tape applying machine 101 to the supply side substrate storing magazine 23A of the cutting device 110 for electronic part ceramic substrate. To be done. Then, the ceramic board 100 for electronic components with tape in the supply side substrate storage magazine 23A is sucked and held by the suction board 33A by the lifting operation of the suction board 33A, and the movement of the X-axis direction moving head 31 and the lowering operation of the suction board 33A. Is transferred onto the θ table 41 located directly below the television camera 71, and is positioned and fixed to the θ table 41 by the clamp means.

As shown in FIGS. 9 to 11, the electronic component ceramic substrate 100 has a region E in which a large number of rod-shaped portions 3 are formed by a large number of parallel slit holes 2, and each rod-shaped portion 3 has a large number of portions. Each section 4 has a chip resistance element,
Electronic component elements such as chip capacitance elements are formed respectively. The array interval of the disk-shaped rotary grindstones 60 attached to the spindle 52 is set in advance so as to match the array interval of the partitions 4 to be cut as chip parts (array interval of boundaries of each partition). In addition, two markers, that is, a first rectangular marker 120A and a second rectangular marker 12 are arranged along a straight line parallel to the boundary of the section 4 to be cut.
0B is formed on the ceramic substrate 100 for electronic parts. The markers 120A and 120B may be holes or colored substrate surfaces as long as they can be imaged by a camera.

Now, each rectangular marker 120A of the ceramic substrate 100 for electronic parts on the θ table 41,
120B are sequentially captured by the television camera 71, and the image processing circuit 70 performs image processing to detect the Y-coordinates of the two rectangular markers 120A and 120B and the deviation ΔY between the Y-coordinates of the two markers as shown in FIG. Processor 7
The rotation amount of the θ table 41 required in 3 is calculated and the θ table 41 is corrected and rotated. That is, steps # 1 to # 3 of the flowchart of FIG. 12 are executed. After the correction rotation of the θ table 41, the television camera 71 takes an image of the first rectangular marker 120A again to confirm whether or not the Y coordinates of both markers 120A and 120B match, as shown in FIG. 10, that is, step # 4. , # 5 is executed. Then, step # 6 is executed by matching the position P of the disk-shaped rotary grindstone 60 closest to the base of the spindle 52 to the Y coordinate Q of the upper edges of the first and second rectangular markers 120A and 120B in FIG. Further, the spindle 52 (Y slider 50) is separated by the distance Ystep in the Y-axis direction between the Y coordinate Q of the upper edge of the marker and the Y coordinate R of the boundary H of the section 4 to be cut that is closest to the marker.
To execute step # 7. afterwards,
The Z slider 51 is operated to lower the spindle 52 to a height at which the entire thickness of the electronic component ceramic substrate 100 can be cut. In this state, the X table 40 is moved to the left in FIGS. The ceramic substrate 100 for cutting is cut by the rotary grindstone 60. That is, step # 8
To execute.

In this case, as shown in FIG. 1, both boundaries of each section 4 to be cut are simultaneously cut by the disk-shaped rotary grindstone 60 having the same arrangement interval as the boundaries.
It is possible to smoothly cut each section 4 without any relief of the section in the middle of cutting that occurs when cutting with one disk-shaped rotary grindstone (in the experiment, cut to a plate thickness of 0.1 mm to 5.0 mm). Possible). Further, the positions of the two markers 120A and 120B are detected, and the correction rotation of the θ table 41 and the Y slider 5 are performed.
By performing the movement of a predetermined amount of 0, the boundary of the section 4 of the ceramic substrate 100 for electronic parts to be cut and the cutting direction of the disk-shaped rotary grindstone 60 can be matched with high accuracy.

As shown in FIG. 7, the ceramic substrate 100A for electronic parts with tape after cutting is moved to the lower position of the television camera 71 by the movement of the X table 40 to the right, and further sucked and held by the lowering of the suction plate 33B. , X
It is moved to the upper side of the take-out side substrate storage magazine 23B by the movement of the axial moving head 31, and is stored in the take-out side substrate storage magazine 23B by the suction release of the suction plate 33B.

A series of operations of the ceramic substrate cutting device 110 for electronic parts can be automatically executed according to the program of the microprocessor 73.

Ceramic substrate 100 for electronic parts after cutting
In A, the adhesive vinyl tape 106 on the back side holds the chip components obtained by cutting each section 4 as they are. Therefore, the electronic component ceramic substrate 100A of the take-out side substrate storage magazine 23B of the electronic component ceramic substrate cutting device 110 is transferred to the supply side substrate storage magazine 131 of the work peeling machine 130, and further irradiated with ultraviolet rays by the suction plate 132. Transferred to section 133. The ultraviolet irradiation unit 133 has a mercury lamp 134 that emits ultraviolet rays and a mask 135, and irradiates only the area where the chip parts are located (corresponding to the area E in FIG. 11) with ultraviolet rays to lose the adhesiveness of the vinyl tape 106. I am trying. Then, the ceramic board 100A for electronic parts is transferred onto the belt conveyor 136 by the suction board 132, and the roll brush 137 such as nylon bristles is used.
Sent to the rotating area of. As a result, the chip component 15 obtained by cutting is separated from the electronic component ceramic substrate 100A and dropped into the box 141. The pressing belt 142 prevents the electronic component ceramic substrate 100A from dropping from the belt conveyor 136 when the chip component 15 is scraped off by the roll brush 137.
The remaining portion 100B of the electronic component ceramic substrate after the chip components are taken out is discharged to the discharge box 143.

When the television camera 71 takes an image of the ceramic substrate 100 for electronic parts, the markers 120A, 1A
In order to accurately capture the image of 20B or the like, it is advisable to increase the reflectance of the substrate surface by the tilted illumination means. In addition, a step of blowing compressed air may be performed before the cut ceramic substrate 100A for electronic parts is taken out of the cover 57 in order to blow away the grinding liquid and shavings after cutting.

[0029]

As described above, according to the present invention,
Since a plurality of disc-shaped rotary grindstones are used to simultaneously cut the boundaries on both sides of the section to be cut of the ceramic substrate for electronic components, the following effects can be obtained. (1) Cracks and chips are unlikely to occur in the chip parts obtained by cutting, and the manufacturing yield is good. (2) Since a large number of chip parts are cut at the same time, efficiency is improved and manufacturing cost can be reduced. (3) The disk-shaped rotary grindstone and the boundary of the object to be cut can be set parallel to each other by image processing so as not to cause misalignment, and the size is small (for example, about 1.0 × 0.5 mm) and highly accurate (error 10 μm The cutting operation can be performed at (within).

[Brief description of drawings]

FIG. 1 is a side sectional view of an essential part of an embodiment of a method and an apparatus for cutting a ceramic substrate for electronic parts according to the present invention during cutting of a ceramic substrate for electronic parts.

FIG. 2 is a front view showing the overall configuration of a cutting device for a ceramic substrate for electronic parts according to an embodiment.

FIG. 3 is a plan view of the same.

FIG. 4 is a side view of the same.

FIG. 5 is a cross-sectional view of the main part showing the configuration of the main part of the embodiment.

FIG. 6 is a block diagram showing a control system of the embodiment.

FIG. 7 is an explanatory view showing a cutting process and processes before and after the cutting process according to the embodiment.

FIG. 8 is a main-portion cross-sectional view illustrating a step of cutting a test substrate.

FIG. 9 is a plan view showing a state where the Y-coordinates of the first and second rectangular markers of the ceramic substrate for electronic parts used in the examples are deviated.

FIG. 10 is a plan view showing a state where the Y-coordinates of the first and second rectangular markers of the ceramic substrate for electronic parts are matched.

FIG. 11 is an enlarged plan view of an essential part of a ceramic substrate for electronic parts.

FIG. 12 is a flow chart for explaining the operation of the cutting device for a ceramic substrate for electronic parts of the embodiment.

FIG. 13 is an enlarged plan view of an essential part showing an example of a conventional ceramic substrate for electronic parts.

FIG. 14 is an explanatory view for explaining a cutting operation by a conventional one disk-shaped rotary grindstone.

FIG. 15 is an explanatory diagram showing the reason why cracking or chipping occurs along with cutting with a conventional single disk-shaped rotary grindstone.

FIG. 16 is a perspective view showing a first example of a chip component obtained by cutting with a conventional single disk-shaped rotary grindstone and showing one cut surface.

FIG. 17 is a perspective view showing the other cross section of the first example.

FIG. 18 is a transverse sectional view of the first example.

FIG. 19 is a perspective view showing one cut surface of a second example of a chip component obtained by cutting with a conventional single disk-shaped rotary grindstone.

FIG. 20 is a perspective view showing the other cross section of the second example.

FIG. 21 is a transverse sectional view of the same as the second example.

FIG. 22 is a perspective view showing one cutting surface of a third example of a chip component obtained by cutting with a conventional one disk-shaped rotary grindstone.

FIG. 23 is a perspective view showing the other cross section of the third example.

FIG. 24 is a transverse sectional view of the same as the third example.

FIG. 25 is a perspective view showing one cut surface of a fourth example of a chip component obtained by cutting with a conventional one disk-shaped rotary grindstone.

FIG. 26 is a perspective view showing the other cross section of the fourth example.

FIG. 27 is likewise a transverse sectional view of the fourth example.

FIG. 28 is a perspective view showing one cutting surface of a fifth example of a chip component obtained by cutting with a conventional one disk-shaped rotary grindstone.

FIG. 29 is a perspective view showing the other cross section of the fifth example.

FIG. 30 is a transverse sectional view of the fifth example.

[Explanation of symbols]

Ceramic substrate for electronic parts 2 slit holes 3 bar 4 divisions 15 Chip parts 20 equipment frame 21 Supply / Detach 22 Magazine transfer stand 23A, 23B substrate storage magazine 31 X-axis direction moving head 33A, 33B suction plate 40 X table 41 θ table 50 Y slider 51 Z slider 52 spindle 60 disk-shaped rotary whetstone 70 Image processing circuit 71 TV camera 73 microprocessors 106 Adhesive vinyl tape

Claims (3)

[Claims] 1. A method for cutting a ceramic substrate for electronic parts, which comprises simultaneously cutting the boundaries on both sides of a section to be cut in the ceramic substrate for electronic parts by using a plurality of disk-shaped rotary grindstones parallel to each other. 2. A plurality of markers are provided on the ceramic substrate for electronic parts so as to be arranged on a straight line parallel to the boundary of the section to be cut, and the cutting direction of the rotary grindstone is determined by imaging the markers. The method of cutting a ceramic substrate for an electronic component according to claim 1, wherein a deviation in parallelism with the boundary is detected, and the cutting operation is executed after correcting the deviation in parallelism. 3. A spindle having a plurality of disk-shaped rotary grindstones mounted in parallel to each other, a moving means for changing the positional relationship between the ceramic substrate for electronic parts and the spindle in the XYZ-θ directions, and the electronic device. Image of imaging a plurality of markers on the substrate arranged on a straight line parallel to the boundary of the section to be cut of the ceramic substrate for parts to detect a deviation in parallelism between the boundary and the cutting direction of the rotary grindstone A cutting device for a ceramic substrate for electronic parts, comprising: a processing means; and a control means for receiving the detection output of the image processing means and operating the moving means so as to correct the deviation of the parallelism.