JPH0523973A - Abrasive tape and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide the above excellent abrasive tape which reduces the controversial problems on any damage and contamination due to swarf in addition to the scattering of this swarf and environmental pollution or the like, in an abrasive tape available in a job for precision finish polishing. CONSTITUTION:At least one side of a film base material 2 is formed into a layer structure made up of laminating a sticker layer 3 and an abrasive layer 4 in order, and the abrasive layer 4 is partially installed so as to have a surface of the sticker layer 2 partially exposed. In addition, the abrasive layer 4 is constituted of hardened ionizing radiation hardened type resin containing an abrasive material. First the sticker layer 3 is coated on one side of the film base material 2. Then, in order to form the abrasive layer into a separate type, a roll intaglio provided with a plate recess is used. While the base material 2 canes into contact with the recess plate, the ionizing radiation is irradiated, hardening the resin. In this case, formation of the abrasive layer may be done by applying a printing means in place of a forming means used with the roll intaglio.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing tape used for precision finish polishing and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years,
Floppy disk, magnetic head, optical fiber end face,
2. Description of the Related Art As a polishing tape used for polishing the surface of a precision electronic component or the like with a high degree of precision, there is a polishing tape in which a coating material comprising an abrasive and a binder component is applied onto a substrate and then simply formed into a film. However, although this polishing tape is easy to configure and manufacture, polishing scraps generated from the object to be polished easily enter between the polishing tape (coating) and the object to be polished, and if polishing is continued in this state, polishing will continue. There are inconveniences such as the surface of the object to be polished is scratched by the waste, and the polishing waste adheres to the surface of the film to cause a clogging, which significantly reduces the polishing ability. In addition, as a type of polishing tape with grooves in the polishing layer, when forming the polishing layer,
The unevenness of the Bernard cell caused by the "convection cell phenomenon" that occurs in the coating layer when a coating material containing a large amount of inorganic components is applied to the coating agent and the solvent is dried was used as the groove shape of the polishing layer. Those have been proposed (see Japanese Patent Laid-Open No. 62-255069). However, in the case of this polishing tape, due to the manufacturing method, the groove recesses formed are limited to those having a substantially hexagonal planar shape, and it is difficult to always form recesses having the same pattern, It was difficult to obtain stable quality. Further, in order to uniformly stabilize the pattern of the groove recesses to be formed, it is difficult to control the solvent composition, coating amount, drying conditions, etc. of the coating for forming the polishing layer in the production, and the production work becomes very complicated. there were. Therefore, in order to overcome the above problems, the present applicant provides a good polishing tape that can reduce the problem of scratching the object to be polished by polishing dust and the deterioration of the polishing ability by providing a large number of specific recesses in the polishing layer. , And proposed a method for producing a polishing tape in which the polishing layer having the specific shape can be stably and easily formed by using a patterning film (Japanese Patent Laid-Open No. 2-83172). However, even in the two types of polishing tapes described below in which grooves or recesses are provided in the polishing layer, there is some inconvenience that the polishing dust enters between the polishing tape and the object to be polished and scratches the surface of the object to be polished. In addition, there is a problem in that polishing dust is scattered during polishing to contaminate the polishing tape itself and the surrounding environment. It is an object of the present invention to provide a new polishing tape that can solve the above-mentioned drawbacks of the prior art and a method of manufacturing the polishing tape.

[0003]

The polishing tape of the present invention comprises:
A pressure-sensitive adhesive layer and a polishing layer are sequentially laminated on at least one side of a film substrate, and the polishing layer is partially provided so that the pressure-sensitive adhesive layer surface is partially exposed. The polishing layer is made of a cured ionizing radiation curable resin containing an abrasive. Further, the production method of the present invention uses a roll intaglio having a step of applying an adhesive on one surface of a film substrate and a plate indentation formed of a pattern shape for imprinting a polishing layer. Ionizing radiation curable resin containing an abrasive is filled only in the plate recesses, and the film base material is contacted so that the adhesive coated surfaces face each other, and ionizing radiation is applied while the base material is in contact with the intaglio plate. After irradiating to cure the above resin interposed between the base material and the intaglio plate, a step of peeling the base material from the intaglio plate is sequentially performed. Further, the production method of the present invention comprises a step of coating an adhesive on one surface of a film base material, and a thermosetting or ionizing radiation curable ink containing an abrasive on the adhesive coated surface of the base material of the polishing layer. After printing the pattern, the steps of heat treatment or irradiation of ionizing radiation are sequentially performed.

[0004]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing an embodiment of the polishing tape of the present invention. The polishing tape 1 of the present invention comprises a film substrate 2, an adhesive layer 3 provided on at least one side of the substrate 2, and the adhesive layer. The polishing layer 4 is partially provided in a predetermined pattern so that part of the surface 3 is exposed. FIG. 2 is an enlarged plan view of the polishing tape showing a pattern example of the polishing layer.

As the film base material 2, any material conventionally used for polishing tapes can be used. For example, polyester film, polyethylene film,
Polypropylene film, polyvinyl chloride film, polyvinylidene chloride film, polycarbonate film, polyamide (nylon) film, polystyrene film, ethylene-vinyl acetate copolymer film, etc. can be used, especially when considering processability, strength, cost, etc. , Especially polyester film is desirable. A base material 2 used in a manufacturing method using a roll intaglio described later.
As the material, it is desirable that the material has appropriate flexibility so that it can smoothly pass through each roll or the like in the manufacturing process. If necessary, the film surface on which the pressure-sensitive adhesive layer is formed may be subjected to treatment for easy adhesion such as corona discharge treatment, plasma treatment, primer coating treatment, and degreasing treatment. In addition to the above-mentioned base material, paper, cloth, non-woven fabric, etc., which have been subjected to a sealing treatment if necessary, can also be used. The thickness of the base material 2 is 12 to 100.
μm is preferred.

As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 3, generally known conventional pressure-sensitive adhesives can be basically used, and specifically, various pressure-sensitive adhesives such as acrylic type, rubber type and silicone type can be mentioned. . The pressure-sensitive adhesive may be of any type such as a solvent type or an emulsion type, and may have an ionizing radiation curable resin as a base material. This pressure-sensitive adhesive layer is usually provided on the entire surface of the base material 2, but the thickness thereof is 5 to 100 μm.
A degree is preferable.

The polishing layer 4 is not particularly limited as long as it has a pattern shape in which at least a part of the surface of the pressure-sensitive adhesive layer 3 is exposed. For example, as shown in FIG. 2, polishing layer constitutional units 4a each having a quadrilateral plane are provided in a regularly scattered (arranged) pattern, and the surface 3a of the pressure-sensitive adhesive layer is provided between the polishing layers 3 (constitutional units). Can be exposed. According to the polishing tape of the present invention, when polishing is performed, polishing debris is stored in the recesses between the constituent units of the polishing layer 4 and, at the same time, is adhesively held on the exposed surface 3a of the adhesive layer. Become. The planar property of the polishing layer is appropriately selected according to conditions such as polishing ability, but may be a hexagon, a circle, an ellipse or the like in addition to the quadrangle. Further, the vertical cross-sectional shape of the polishing layer (each structural unit) may be an inverted triangle, a semicircle, a trapezoid, etc. in addition to the quadrangle illustrated in FIG. The rate of exposing the surface of the pressure-sensitive adhesive layer 3 is preferably about 5 to 50% with respect to the total area of the surface of the polishing tape. In addition, the recess formed by the polishing layer (in other words, the portion that exposes the pressure-sensitive adhesive layer surface), from the viewpoint of enabling efficient storage of polishing dust,
The opening width is 0.1 to 200 μm, and the depth is 0.1 to 10
0 μm, its pitch (distance between the central portions of adjacent recesses)
Is preferably 10 to 500 μm.

The polishing layer 4 is composed of an abrasive and a binder component. The polishing agent may be any one as long as it can perform precise polishing, and the material thereof is appropriately selected according to the polishing application. For example, when polishing a material such as a cemented carbide tool made of a high hardness material, green silicon carbide, diamond or the like is a suitable abrasive, and similarly, a material to be polished such as hard steel special steel or high speed copper. In the case of (1), white fused alumina, in the case of a material to be polished made of chrome, chromium oxide, and in the case of the final polishing of the magnetic head, iron oxide is a suitable polishing agent. The particle size of these abrasives is preferably about 0.1 to 20 μm, and the abrasive is preferably contained in 100 to 400 parts by weight with respect to 100 parts by weight of the binder component. The binder component is also not particularly limited, but a thermosetting or ionizing radiation curable resin is preferable among them. Examples of thermosetting resins include epoxy, melamine, polyurethane, unsaturated polyester, and polysiloxane resins. Ionizing radiation curable resin has a high crosslink density of the cured product, so it has abrasion resistance,
It has the advantages of excellent physical properties such as heat resistance and good productivity because of high acceleration of the acceleration. As the ionizing radiation curable resin, a known ultraviolet ray or electron beam curable resin can be used,
Among them, if a solvent-free type is used, problems such as volume shrinkage due to curing, shape deformation, and bubble generation do not occur, and a preliminary drying step of the resin is unnecessary, and in a manufacturing method using a roll intaglio plate. It becomes easier to surely obtain a polishing layer with better reproducibility. When the polishing layer 4 is required to have high flexibility and shrinkage resistance, the curable resin may be prepared by adding an appropriate amount of a thermoplastic resin such as a non-reactive acrylic resin or various waxes. Can meet the demands of. Further, an antistatic agent or the like may be added to the polishing layer if necessary.

Next, the manufacturing method of the present invention for manufacturing the polishing tape having the above structure will be described. FIG. 3 is a process explanatory view showing one embodiment of the manufacturing method of the present invention, 5 is a coating device, 6 is a drying device, 7 is a roll intaglio plate, 8
Is a plate recess, 9 is an ionizing radiation curable resin containing an abrasive, 10 is a doctor blade, 11 is an ionizing radiation irradiation device,
Reference numeral 12 represents a pressing roll, and 13 represents a feed roll.

First, a pressure sensitive adhesive is applied to one surface of the film substrate 2 by the coating device 5 to form the pressure sensitive adhesive layer 3.
As a coating method, a reverse coating method, a comma coating method or the like is usually applied, but the coating method is not limited to this. After coating,
Subsequently, the pressure-sensitive adhesive coated surface 3b is passed through the drying device 6 to be dried. The drying device may be a general heat drying type, and the drying is performed at a heating temperature of about 100 ° C. for about 2 minutes.
Do it for a second. When the one using an ionizing radiation-curable resin as a base material as the pressure-sensitive adhesive is used, the above-mentioned drying step is unnecessary, and if the ionizing radiation-curable resin is applied to the binder component of the polishing layer, the pressure-sensitive adhesive layer and the polishing layer Can be simultaneously formed.

Next, a roll intaglio 7 is prepared in which a plate indentation 8 having a shape for imprinting the pattern shape of the polishing layer to be formed is prepared and used, for example, installed as shown in the figure. The plate recess 8 in the roll intaglio plate 7 can be formed by means of electronic engraving, etching, mill pressing, electroforming or the like. A film base material 2 coated with an adhesive is supplied to the roll intaglio 7 by a transfer means so as to come into contact with the intaglio surface. At the same time, the ionizing radiation curable resin 9 containing an abrasive is supplied by an appropriate means so as to fill only the plate concave portion 8 of the intaglio plate 7. The resin 9 can be supplied and filled by directly supplying the resin to the intaglio roll by a roll coating method as in the present embodiment, or may be supplied from a die such as a T die. Excess resin 9 adhering to the plate surface other than the plate recesses 8 is removed by scraping it off with, for example, a doctor blade 10.

Then, while the base material 2 is in contact with the intaglio plate 7, the ionizing radiation is applied by the ionizing radiation irradiation device 11 to cure the resin interposed between the base material 2 and the intaglio plate 7, and at the same time, the adhesive is applied. It adheres to the base material side through the agent layer. Finally,
The base material 2 is peeled off from the intaglio plate 7. Ultraviolet rays can be used as the ionizing radiation for irradiation when the substrate 2 is transparent, but it is necessary to use electron beams when the substrate 2 is opaque. Further, if the roll intaglio plate is made of an ionizing radiation transparent material, irradiation from an irradiation device installed inside the intaglio plate becomes possible. When an electron beam is used, its irradiation dose is usually 0.5- though it depends on the thickness and material of the sheet base material.
About 30 Mrad is preferable.

By peeling off the base material 2, the polishing tape 1 as illustrated in FIG. 1 is obtained in which the polishing layer 4 having the pattern shape imprinted by the roll intaglio 7 is formed on the base material 2. In this method of the present invention, since the polishing layer 4 is formed by the manufacturing means as described above, a polishing layer having an extremely sharp pattern shape faithfully reproducing the shape stamped on the roll intaglio can be obtained. Even if the pattern shape of the polishing layer is complicated and fine, it can be easily and surely obtained.

In the above-mentioned manufacturing method, the film substrate 2 having the pressure-sensitive adhesive layer 3 and the polishing layer 4 provided on one side is supplied again so that the surface not having the polishing layer abuts the roll intaglio 7, and the same as above. The same polishing layer 4 can be formed on both surfaces of the base material by passing through the manufacturing process. When the polishing layers are provided on both sides of the base material, the second roll intaglio plate is installed at the rear side, and the base material 2 after being peeled off from the first roll intaglio plate is directly supplied to the second roll intaglio plate side to continue. Efficient manufacturing is possible.

Further, in the manufacturing method of the present invention, after the coating process of the pressure-sensitive adhesive by the coating device 5 and the drying device 6 is completed, a printing means is applied instead of the polishing layer forming means using the roll intaglio 7. To form a polishing layer. That is, a printing ink containing an abrasive is printed on the pressure-sensitive adhesive coated surface 3b of the film substrate 2 in a pattern of the abrasive layer so as to be formed by an appropriate printing method. The printing ink is preferably a thermosetting resin or an ionizing radiation curable resin as a vehicle. The most preferable printing method is the silk screen printing method, but other printing methods may be used. After the above printing is completed, if the ink is of a thermosetting type, a known heat treatment is carried out to cure the printing layer, and if the ink is of an ionizing radiation curing type, the ionizing radiation irradiation device as described above. To irradiate ionizing radiation to cure the printed layer. As a result, the polishing tape illustrated in FIG. 1 is obtained.

Next, the present invention will be described in more detail with reference to specific examples. Example 1 Polyester film (manufactured by Toray: T-60, 50 μm thick)
An electron beam-curable pressure-sensitive adhesive was applied to one surface of the above using a comma coater and dried, and then a pressure-sensitive adhesive layer having a thickness of 25 μm / dry was formed. This film was applied to the manufacturing method shown in FIG. 3 to form a polishing layer on the coated surface with the following constituent materials and conditions to prepare a polishing tape.・ Intaglio: Recess width 10 μm, plate depth (recess depth) 15 μ
m, the pitch of the recesses was 30 μm, and a roll intaglio plate was used in which plate recesses having a hexagonal plan shape and a rectangular cross section were formed. Ionizing radiation curable resin: A polyester acrylate electron curable coating material containing 100% by weight of white fused alumina is used.・ Irradiation conditions: 1 with a curtain beam type electron beam irradiation device
Irradiate with 0 × 10 ⁶ rad electron beam. The obtained polishing tape was provided with a polishing layer in which a desired pattern shape according to the plate was sharply and reproducibly formed, and the pressure-sensitive adhesive layer surface was exposed from the bottom of the recessed portion of the polishing layer. there were. Center line with this polishing tape
Polishing of 0.5 μm stainless steel (SUS-45C) resulted in a polishing finish with a central average roughness of 0.1 μm. Further, the polishing debris at that time adheres to and is held on the adhesive layer surface that is simultaneously exposed and is accommodated in the recess, and as a result, scratches on the surface of the object to be polished due to the polishing debris are not generated, and in comparison with conventional products. Scattering of polishing dust and contamination of the stainless steel plate with polishing dust were extremely small.

Example 2 Example 2 was repeated except that the polishing layer was replaced with an intaglio plate and a polyester acrylate-based electro-curable ink containing 100% by weight of white fused alumina was used for silk screen printing. An abrasive tape was produced using the same materials and production conditions as in 1. The obtained polishing tape had an appearance similar to that of Example 1, and had the same good polishing action and ability as those of Example 1.

[0018]

As described above, in the polishing tape of the present invention, as described above, the pressure-sensitive adhesive layer is provided below the polishing layer, and the polishing layer is partially exposed so that the surface of the pressure-sensitive adhesive layer is partially exposed. Since it is provided, polishing debris generated from the material to be polished during polishing is accommodated in the recess formed by the polishing layer exposing the pressure-sensitive adhesive layer surface, and at the same time, by the pressure-sensitive adhesive layer surface of the recess. As a result, it will be securely adhered and held, and as a result, scratches and contamination on the surface of the material to be polished due to polishing debris,
Further, the scattering of polishing dust and the resulting environmental pollution can be significantly reduced as compared with conventional products. Further, by constituting the polishing layer with a cured ionizing radiation curable resin containing an abrasive, it has excellent physical properties such as abrasion resistance and heat resistance, and polishing with the abrasive is ensured, and it is possible to Highly accurate and precise polishing that does not cause polishing scratches is possible. Further, in the production method of the present invention, since the polishing layer is formed by curing and shaping the ionizing radiation-curable resin containing the abrasive in the roll intaglio plate as described above, it is always faithful to the plate recess of the intaglio plate. It is possible to manufacture a polishing tape having a polishing layer having a pattern shape that is extremely clearly modeled and reproduced. Further, as described above, since the shape of the polishing layer is always uniformly and finely formed, the initial polishing ability of the obtained polishing tape is stable. Further, in the production method of the present invention, even if a printing means is applied instead of the method of forming the polishing layer using the roll intaglio plate, the excellent polishing tape as described above can be easily obtained. In particular, according to the method of the present invention using a roll intaglio,
For example, as compared with a means for forming the polishing layer by using a hot embossing method or a film for shaping, it is easy to surely obtain the one in which the shape of the obtained polishing layer is actually clear and reproduced as desired,
The manufacturing process itself is also simple and simple, and as a result, efficient mass production with stable quality is possible.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of the polishing tape of the present invention.

FIG. 2 is an enlarged plan view of a polishing tape showing a pattern example of a polishing layer.

FIG. 3 is a process explanatory view showing an embodiment of the manufacturing method of the present invention.

[Explanation of symbols]

1 polishing tape 2 Film substrate 3 Adhesive layer 4 Polishing layer 5 coating equipment 7 roll intaglio 8 plate recess Ionizing radiation curable resin containing 9 abrasives

Claims (4)

[Claims] 1. A pressure-sensitive adhesive layer and a polishing layer are sequentially laminated on at least one surface of a film substrate, and the polishing layer is partially provided so that the pressure-sensitive adhesive layer surface is partially exposed. Polishing tape to do. 2. The polishing tape according to claim 1, wherein the polishing layer comprises a cured ionizing radiation curable resin containing an abrasive. 3. A process of applying an adhesive to one surface of a film substrate, and a roll intaglio having a plate indentation having a pattern shape for imprinting a polishing layer is used, and only the plate indentation of the roll intaglio is used. And ionizing radiation-curable resin containing an abrasive are contacted with the film substrate so that the adhesive coated surfaces face each other, and the substrate is irradiated with ionizing radiation while the substrate is in contact with the intaglio plate. A method of manufacturing an abrasive tape, comprising the steps of sequentially curing the resin interposed between a base material and an intaglio plate, and then peeling the base material from the intaglio plate. 4. A step of applying an adhesive to one surface of a film substrate, and a thermosetting or ionizing radiation curable ink containing an abrasive on the adhesive coated surface of the substrate to form a pattern of an abrasive layer. A method of manufacturing an abrasive tape, which comprises sequentially performing a heat treatment or an ionizing radiation irradiation after printing.