JPH05230369A - Thermoplastic resin composition - Google Patents
Thermoplastic resin compositionInfo
- Publication number
- JPH05230369A JPH05230369A JP3196792A JP3196792A JPH05230369A JP H05230369 A JPH05230369 A JP H05230369A JP 3196792 A JP3196792 A JP 3196792A JP 3196792 A JP3196792 A JP 3196792A JP H05230369 A JPH05230369 A JP H05230369A
- Authority
- JP
- Japan
- Prior art keywords
- pps
- melt viscosity
- bis
- hydroxyphenyl
- polyphenylene sulfide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 18
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims abstract description 72
- 229920000069 polyphenylene sulfide Polymers 0.000 claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 239000000155 melt Substances 0.000 claims abstract description 18
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 4
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 12
- 239000003381 stabilizer Substances 0.000 claims description 9
- 239000000460 chlorine Substances 0.000 claims description 8
- 229910052801 chlorine Inorganic materials 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000006866 deterioration Effects 0.000 abstract 1
- 239000004417 polycarbonate Substances 0.000 description 38
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 239000012994 photoredox catalyst Substances 0.000 description 9
- -1 arylene sulfide Chemical compound 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- KYPYTERUKNKOLP-UHFFFAOYSA-N Tetrachlorobisphenol A Chemical compound C=1C(Cl)=C(O)C(Cl)=CC=1C(C)(C)C1=CC(Cl)=C(O)C(Cl)=C1 KYPYTERUKNKOLP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- YIYBRXKMQFDHSM-UHFFFAOYSA-N 2,2'-Dihydroxybenzophenone Chemical compound OC1=CC=CC=C1C(=O)C1=CC=CC=C1O YIYBRXKMQFDHSM-UHFFFAOYSA-N 0.000 description 1
- VXHYVVAUHMGCEX-UHFFFAOYSA-N 2-(2-hydroxyphenoxy)phenol Chemical compound OC1=CC=CC=C1OC1=CC=CC=C1O VXHYVVAUHMGCEX-UHFFFAOYSA-N 0.000 description 1
- BLDLRWQLBOJPEB-UHFFFAOYSA-N 2-(2-hydroxyphenyl)sulfanylphenol Chemical compound OC1=CC=CC=C1SC1=CC=CC=C1O BLDLRWQLBOJPEB-UHFFFAOYSA-N 0.000 description 1
- XSVZEASGNTZBRQ-UHFFFAOYSA-N 2-(2-hydroxyphenyl)sulfinylphenol Chemical compound OC1=CC=CC=C1S(=O)C1=CC=CC=C1O XSVZEASGNTZBRQ-UHFFFAOYSA-N 0.000 description 1
- XBQRPFBBTWXIFI-UHFFFAOYSA-N 2-chloro-4-[2-(3-chloro-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(Cl)=CC=1C(C)(C)C1=CC=C(O)C(Cl)=C1 XBQRPFBBTWXIFI-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- BWCAVNWKMVHLFW-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-dimethylphenyl)cyclohexyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C2(CCCCC2)C=2C=C(C)C(O)=C(C)C=2)=C1 BWCAVNWKMVHLFW-UHFFFAOYSA-N 0.000 description 1
- NIRYBKWMEWFDPM-UHFFFAOYSA-N 4-[3-(4-hydroxyphenyl)-3-methylbutyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)CCC1=CC=C(O)C=C1 NIRYBKWMEWFDPM-UHFFFAOYSA-N 0.000 description 1
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004255 Butylated hydroxyanisole Substances 0.000 description 1
- 239000004322 Butylated hydroxytoluene Substances 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- 238000012695 Interfacial polymerization Methods 0.000 description 1
- 239000004420 Iupilon Substances 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HYJODZUSLXOFNC-UHFFFAOYSA-N [S].[Cl] Chemical compound [S].[Cl] HYJODZUSLXOFNC-UHFFFAOYSA-N 0.000 description 1
- 239000012814 acoustic material Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052977 alkali metal sulfide Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229940043253 butylated hydroxyanisole Drugs 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229940095259 butylated hydroxytoluene Drugs 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- PXJJSXABGXMUSU-UHFFFAOYSA-N disulfur dichloride Chemical compound ClSSCl PXJJSXABGXMUSU-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Chemical group 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004255 ion exchange chromatography Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000011968 lewis acid catalyst Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- HYHCSLBZRBJJCH-UHFFFAOYSA-M sodium hydrosulfide Chemical compound [Na+].[SH-] HYHCSLBZRBJJCH-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- XUHUMYVYHLHMCD-UHFFFAOYSA-N tris(2-cyclohexylphenyl) phosphite Chemical compound C1CCCCC1C1=CC=CC=C1OP(OC=1C(=CC=CC=1)C1CCCCC1)OC1=CC=CC=C1C1CCCCC1 XUHUMYVYHLHMCD-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- 239000000326 ultraviolet stabilizing agent Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(57)【要約】
【構成】 溶融粘度が300〜3000ポイズのポリフ
ェニレンスルフィド樹脂(A)と、該ポリフェニレンス
ルフィド樹脂(A)の3倍以上の溶融粘度(300゜C、
200sec−1での溶融粘度、以下同様)を有するポ
リフェニレンスルフィド樹脂(B)と、3000ポイズ
以上の溶融粘度を有するポリカーボネート系樹脂(C)
とを含有してなることを特徴とする熱可塑性樹脂組成
物。
【効果】 耐衝撃性等の機械的特性に優れ、耐熱性の低
下が少ない。(57) [Summary] [Structure] A polyphenylene sulfide resin (A) having a melt viscosity of 300 to 3000 poise, and a melt viscosity three times or more of the polyphenylene sulfide resin (A) (300 ° C,
Polyphenylene sulfide resin (B) having a melt viscosity at 200 sec-1, the same shall apply hereinafter) and polycarbonate resin (C) having a melt viscosity of 3000 poise or more.
A thermoplastic resin composition comprising: [Effect] Excellent mechanical properties such as impact resistance, and less deterioration in heat resistance.
Description
【0001】[0001]
【産業上の利用分野】本発明はポリフェニレンスルフィ
ド樹脂(以下、PPSと略す)とポリカーボネート系樹
脂(以下、PCと略す)から成る機械的性質に優れた樹
脂組成物に関するものである。本組成物は、射出成形
品、押出成形品等に利用され、各種電気・電子部品、機
械部品、精密機械部品、自動車部品、スポーツ用品、雑
貨等の用途に用いられる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition comprising a polyphenylene sulfide resin (hereinafter abbreviated as PPS) and a polycarbonate resin (hereinafter abbreviated as PC) having excellent mechanical properties. The composition is used for injection-molded products, extrusion-molded products and the like, and is used for various electric / electronic parts, machine parts, precision machine parts, automobile parts, sporting goods, sundries and the like.
【0002】[0002]
【従来の技術】PPSは耐熱性、難燃性、高剛性、耐薬
品性、寸法安定性、成形加工性などに優れた結晶性のエ
ンジリアリングプラスチックとして、電気部品、精密機
械部品、自動車部品などの各種分野に利用されている。2. Description of the Related Art PPS is a crystalline engineering plastic excellent in heat resistance, flame retardancy, high rigidity, chemical resistance, dimensional stability, molding processability, etc., and is used for electrical parts, precision machine parts, automobile parts. It is used in various fields such as.
【0003】しかしながら該樹脂は、柔軟性に乏しく、
非常に脆いことから、通常、ガラス繊維で補強強化され
た形で使用されており、材料として用いられる分野が限
定されている。また、耐候性や成形品のバリ特性に難点
が有ることも指摘されている。更に、ガラス転移温度が
80〜90℃と比較的低いために、ガラス転移温度を超
える温度域では、弾性率が急激に低下するという欠点を
有している。However, the resin is poor in flexibility,
Since it is very brittle, it is usually used in a form reinforced with glass fiber, and its field of use as a material is limited. It has also been pointed out that there are drawbacks in weather resistance and burr characteristics of molded products. Furthermore, since the glass transition temperature is relatively low at 80 to 90 ° C., there is a drawback that the elastic modulus sharply decreases in the temperature range exceeding the glass transition temperature.
【0004】PPSとPCをブレンドすることによっ
て、PPSの欠点を改善したり、或は、PPSの持つ優
れた特性をPCに付与させようとする試みは、これまで
に、数多く行なわれてきた。しかしながら、いずれの場
合もPPSとPCとの親和性が不十分であるために、目
的とする効果(特に、耐衝撃性などの機械的性質)が十
分に現われないとか、場合によっては、かえって特性が
低下するなどの問題点があった。Many attempts have been made so far to improve the defects of PPS or to impart the excellent properties of PPS to PC by blending PPS and PC. However, in either case, because the affinity between PPS and PC is insufficient, the desired effects (in particular, mechanical properties such as impact resistance) may not be sufficiently manifested, or in some cases, the characteristics may be rather reversed. There was a problem such as the decrease.
【0005】例えば、特開昭51−100150号公報
ではPCにPPSを配合し、PCの欠点である耐焔性、
加水分解性の改良を行っている。しかし、この場合、こ
れらの目的は達成されるものの、親和性が不十分である
ために、耐衝撃性などの機械的性質が向上しなかった
り、かえって低下するなどの問題があった。また、特開
平2−283763号公報では、カルボン酸無水物によ
り変性されたPPSを用いPCと混合することによって
機械的性質の改良を行っている。しかし、この場合には
カルボン酸無水物の耐熱性がPPSより劣るため成形物
の耐熱性が低下し、耐衝撃性の改良も不満足なものであ
った。一方、特開平2−180962号公報では、粘度
の異なる2種以上のPPSを混合して用いることによっ
てPPSの成形安定性の改良を図る旨が提案されてお
り、また該公報中には該発明の趣旨を逸脱しない範囲で
使用できる樹脂の一例にPCが挙げられている。しか
し、粘度の異なる2種以上のPPSに単にPCを混合し
ても、依然として機械的性質の向上は望めない。For example, in JP-A-51-100150, PPS is blended with PC, and flame resistance, which is a defect of PC,
We are improving the hydrolyzability. However, in this case, although these objects are achieved, there is a problem that mechanical properties such as impact resistance are not improved or rather deteriorated due to insufficient affinity. Further, in JP-A-2-283763, mechanical properties are improved by mixing PPS modified with a carboxylic acid anhydride with PC. However, in this case, the heat resistance of the carboxylic acid anhydride was inferior to that of PPS, so that the heat resistance of the molded product was lowered, and the improvement of impact resistance was also unsatisfactory. On the other hand, JP-A-2-180962 proposes to improve the molding stability of PPS by mixing and using two or more kinds of PPS having different viscosities. PC is mentioned as an example of a resin that can be used within the scope of the invention. However, even if PC is simply mixed with two or more kinds of PPS having different viscosities, improvement in mechanical properties cannot be expected.
【0006】[0006]
【発明が解決しようとする課題】以上のように従来の技
術のいずれにおいてもPPSとPCとの樹脂組成物で
は、機械的性質の改良が不十分であった。As described above, in any of the conventional techniques, the resin composition of PPS and PC was insufficient in improving the mechanical properties.
【0007】本発明の目的は、耐熱性を損なうこと無く
耐衝撃性などの機械的性質が改善されたPPSとPCか
らなる樹脂組成物を提供することにある。An object of the present invention is to provide a resin composition comprising PPS and PC which has improved mechanical properties such as impact resistance without impairing heat resistance.
【0008】[0008]
【課題を解決するための手段】本発明者らは、上記の課
題を解決すべく鋭意研究を重ねた結果、まず我々は他の
エンジニアリングプラスチックと殆ど相溶しないPPS
の中にあって、比較的低分子量のPPSがPCと良好な
親和性を示すことを見い出した。分子量の小さいものは
相溶化に有利であるという高分子化学の一般通則がある
が、本発明者らはPCとの反応性において低分子量PP
Sが活性で反応していると推測する。この時PCはPP
Sとの反応によって分解する傾向にあり、このことはP
PSとの相溶性を高めるが一方では機械的な性質を損な
う原因ともなる。本発明者らは単に相分離したPPSと
PCとの界面の親和力の改善だけでなく、このことと共
に樹脂組成物中におけるPPS、PCそれ自体の脆性改
良も併せて数倍高められれば機械的性質は更に向上する
と考察した。[Means for Solving the Problems] As a result of intensive studies to solve the above-mentioned problems, the inventors of the present invention firstly found that PPS which is hardly compatible with other engineering plastics.
Among them, it was found that PPS having a relatively low molecular weight has a good affinity with PC. Although there is a general rule in polymer chemistry that a compound having a small molecular weight is advantageous for compatibilization, the present inventors have found that a low molecular weight PP in the reactivity with PC.
It is speculated that S is active and reacting. At this time, the PC is PP
It tends to decompose by reaction with S, which means that P
Although it increases the compatibility with PS, it also causes the mechanical properties to be impaired. The present inventors not only improve the affinity of the phase-separated interface between PPS and PC, but also improve the brittleness of PPS and PC themselves in the resin composition together with this, if mechanical properties are improved several times. Was considered to improve further.
【0009】以上の知見を基に更に鋭意検討を進め、親
和性の良い低分子量PPSと脆性の比較的良好な高分子
量PPSとして、PPS(A)と該樹脂(A)の3倍以
上の溶融粘度を持つPPS(B)とを用い、これを比較
的高分子量のPCに混合することによって機械的性質の
高められた樹脂組成物を得ることができることを見い出
し、本発明を完成するに至った。Based on the above findings, further intensive investigations have been carried out to obtain a low molecular weight PPS having a good affinity and a high molecular weight PPS having a relatively good brittleness, and melting the PPS (A) and the resin (A) three times or more. It was found that a resin composition having improved mechanical properties can be obtained by using PPS (B) having viscosity and mixing it with PC having a relatively high molecular weight, and completed the present invention. .
【0010】即ち、本発明はポリフェニレンスルフィド
樹脂(A)と、該ポリフェニレンスルフィド樹脂(A)
の3倍以上の溶融粘度(300゜C、200sec−1で
の溶融粘度、以下同様)を有するポリフェニレンスルフ
ィド樹脂(B)と、3000ポイズ以上の溶融粘度を有
するポリカーボネート系樹脂(C)とを含有してなるこ
とを特徴とする熱可塑性樹脂組成物に関するものであ
る。That is, the present invention relates to a polyphenylene sulfide resin (A) and the polyphenylene sulfide resin (A).
Containing a polyphenylene sulfide resin (B) having a melt viscosity three times or more of the above (melt viscosity at 300 ° C., 200 sec-1; the same applies below) and a polycarbonate resin (C) having a melt viscosity of 3000 poise or more. And a thermoplastic resin composition.
【0011】本発明に用いられるPPSとは、(−φ−
S−)(但し、−φ−はp−フェニレン基であり、以下
も同様に表わす。)で示される構造単位を70モル%、
特に好ましくは90モル%以上を含む重合体である。こ
の(−φ−S−)以外に含まれるアリーレンスルフィド
構造単位は、主に、アリーレン基が下記に示す基を有す
るものである。即ち、m−フェニレン、o−フェニレ
ン、2,6−ナフタレン、4,4′−ビフェニレン等の
2価芳香族残基、或いは、(−φ−O−φ−)、(−φ
−CO−φ−)、(−φ−CH2−φ−) 、(−φ−S
O2−φ−) 、(−φ−C(CH3)2−φ−)等の如き
少なくとも2個の炭素数6の芳香環を含む2価の芳香族
残基であり、更に、各芳香環にはF、Cl、Br、CH
3 、COOH、NH2 、OH、CN、NO2 等の置換基
が導入されてもよい。これらPPSはホモポリマーであ
っても、ランダム共重合体、ブロック共重合体であって
もよい。The PPS used in the present invention is (-φ-
S-) (provided that -φ- is a p-phenylene group and the same shall apply hereinafter), 70 mol% of a structural unit represented by
Particularly preferred is a polymer containing 90 mol% or more. The arylene sulfide structural unit contained in addition to (-φ-S-) is mainly an arylene group having a group shown below. That is, a divalent aromatic residue such as m-phenylene, o-phenylene, 2,6-naphthalene, 4,4'-biphenylene, or (-φ-O-φ-), (-φ
-CO-φ-), (-φ-CH 2 -φ-), (-φ-S
O 2 -φ-), (-φ-C (CH 3 ) 2 -φ-) and the like, which is a divalent aromatic residue containing at least two aromatic rings having 6 carbon atoms, and each aromatic group. F, Cl, Br, CH in the ring
Substituents such as 3 , COOH, NH 2 , OH, CN and NO 2 may be introduced. These PPS may be a homopolymer, a random copolymer or a block copolymer.
【0012】かかるPPSの一般的な製法は、例えば
(1)ハロゲン置換芳香族化合物と硫化アルカリ金属と
の反応(米国特許第2513188号明細書、特公昭4
4−27671号公報および特公昭45−3368号公
報参照)、(2)チオフェノール類のアルカリ触媒また
は銅塩等の共存下における縮合反応(米国特許第327
4165号、英国特許第1160660号参照)、
(3)芳香族化合物と塩化硫黄とのルイス酸触媒共存下
における縮合反応(特公昭46−27255号公報、ベ
ルギー特許第29437号参照)等により合成されるも
のであり、目的に応じ任意に選択し得る。A general method for producing such PPS is, for example, (1) a reaction between a halogen-substituted aromatic compound and an alkali metal sulfide (US Pat. No. 2,513,188, JP-B 4).
No. 4-27671 and Japanese Patent Publication No. 45-3368), (2) Condensation reaction of thiophenols in the coexistence of an alkali catalyst or a copper salt (US Pat.
4165, British Patent No. 1160660),
(3) It is synthesized by a condensation reaction of an aromatic compound and sulfur chloride in the presence of a Lewis acid catalyst (see Japanese Patent Publication No. 46-27255 and Belgian Patent No. 29437), and is arbitrarily selected according to the purpose. You can
【0013】PPS(A)の粘度が比較的低くてもPP
S(B)の粘度がPPS(A)の3倍未満となる場合で
は、PPSとPCとが良好な分散性を示すものの、樹脂
組成物としての機械的性質は極めて不十分なものとな
る。また、PPS(A)の粘度が比較的高くてもPPS
(B)の粘度がPPS(A)の3倍未満では界面の親和
性が不十分であるためか、やはり機械的性質の改良効果
は少ない。Even if the viscosity of PPS (A) is relatively low, PP
When the viscosity of S (B) is less than 3 times that of PPS (A), PPS and PC exhibit good dispersibility, but the mechanical properties of the resin composition are extremely insufficient. In addition, even if the viscosity of PPS (A) is relatively high, PPS
If the viscosity of (B) is less than 3 times that of PPS (A), the affinity of the interface is insufficient, and the effect of improving the mechanical properties is also small.
【0014】従って本発明組成物においては、3000
ポイズ以上の溶融粘度を有するPCとともに用いるPP
Sは、PPS(A)と該PPS(A)の3倍以上の溶融
粘度を持つPPS(B)とを組み合わせる。このような
組み合わせからなるPPSを用いることによって初めて
PPSとPCとの親和性が良好となり、かつPCを加え
た組成物における脆性を飛躍的に高めるのに十分とな
る。Therefore, in the composition of the present invention, 3000
PP used with PC having melt viscosity higher than poise
S combines PPS (A) with PPS (B) having a melt viscosity three times or more that of PPS (A). Only when PPS made of such a combination is used, the affinity between PPS and PC is improved, and it is sufficient to dramatically increase the brittleness of the composition containing PC.
【0015】用いるPPS(A)の溶融粘度範囲は上記
のようにPCとの親和性を維持しつつPPS自体の脆性
を悪化させない範囲として選ばれるが、100〜100
00ポイズ更に好ましくは300〜3000ポイズであ
る。一方、PPS(B)の溶融粘度範囲はPPS(A)
の脆性を補いかつ成形性を悪化させない範囲として選ば
れ、PPS(A)の粘度の3倍以上〜100000ポイ
ズ以下、更に好ましくは20000ポイズ以下が望まし
い。The melt viscosity range of the PPS (A) used is selected as a range in which the brittleness of PPS itself is not deteriorated while maintaining the affinity with PC as described above, but it is 100 to 100.
00 poise is more preferably 300 to 3000 poise. On the other hand, the melt viscosity range of PPS (B) is PPS (A)
Is selected as a range that compensates for brittleness and does not deteriorate moldability, and is preferably 3 times or more to 100,000 poises or less, more preferably 20,000 poises or less of the viscosity of PPS (A).
【0016】またPPS(A)とPPS(B)との混合
割合はこれらの粘度の絶対値と粘度の大小関係によって
異なり一概に規定できるものではないが、概ねPPS
(A)5〜50重量%に対しPPS(B)95〜50重
量%、更に好ましくはPPS(A)5〜30重量%に対
しPPS(B)95〜70重量%である。The mixing ratio of PPS (A) and PPS (B) varies depending on the absolute value of these viscosities and the magnitude relationship of the viscosities and cannot be specified unconditionally, but is generally PPS.
(A) 5 to 50% by weight, PPS (B) 95 to 50% by weight, and more preferably 5 to 30% by weight PPS (A) and PPS (B) 95 to 70% by weight.
【0017】本発明で用いられるPCは均質ポリカーボ
ネートまたは、例えば1種またはそれ以上の下記ビスフ
ェノールをベースにしたポリカーボネート共重合体が使
用できる。ヒドロキノン、レゾルシン、ジヒドロキシジ
フェニル、ビス−(ヒドロキシフェニル)−アルカン、
ビス−(ヒドロキシフェニル)−シクロアルカン、ビス
−(ヒドロキシフェニル)−サルファイド、ビス−(ヒ
ドロキシフェニル)−ケトン、ビス−(ヒドロキシフェ
ニル)−エーテル、ビス−(ヒドロキシフェニル)−ス
ルフォキシド、ビス−(ヒドロキシフェニル)−スルフ
ォンおよびα,α´−ビス−(ヒドロキシフェニル)−
ジイソプロピルベンゼン並びに核にアルキルまたはハロ
ゲンが置換したそれらの化合物。The PC used in the present invention can be a homogeneous polycarbonate or a polycarbonate copolymer based on, for example, one or more of the following bisphenols. Hydroquinone, resorcin, dihydroxydiphenyl, bis- (hydroxyphenyl) -alkane,
Bis- (hydroxyphenyl) -cycloalkane, bis- (hydroxyphenyl) -sulfide, bis- (hydroxyphenyl) -ketone, bis- (hydroxyphenyl) -ether, bis- (hydroxyphenyl) -sulfoxide, bis- (hydroxy) Phenyl) -sulfone and α, α'-bis- (hydroxyphenyl)-
Diisopropylbenzene and those compounds in which the nucleus is substituted with alkyl or halogen.
【0018】これらのうち好適なビスフェノールの具体
的なものとしては、4,4−ジヒドロキシジフェニル、
2,2−ビス−(4−ヒドロキシフェニル)−プロパ
ン、2,4−ビス−(4−ヒドロキシフェニル)−2−
メチルブタン、1,1−ビス−(4−ヒドロキシフェニ
ル)−シクロヘキサン、α,α´−ビス−(4−ヒドロ
キシフェニル)−p−ジイソプロピルベンゼン、2,2
−ビス−(3−メチル−4−ヒドロキシフェニル)−プ
ロパン、2,2−ビス−(3−クロル−4−ヒドロキシ
フェニル)−プロパン、ビス−(3,5−ジメチル−4
−ヒドロキシフェニル)−メタン、2,2−ビス−
(3,5−ジメチル−4−ヒドロキシフェニル)−プロ
パン、2,2−ビス−(3,5−ジメチル−4−ヒドロ
キシフェニル)−スルフォン、2,4−ビス−(3,5
−ジメチル−4−ヒドロキシフェニル)−2−メルカプ
タン、1,1−ビス−(3,5−ジメチル−4−ヒドロ
キシフェニル)−シクロヘキサン、α,α´−ビス−
(3,5−ジメチル−4−ヒドロキシフェニル)−p−
ジイソプロピルベンゼン、2,2−ビス−(3,5−ジ
クロロ−4−ヒドロキシフェニル)−プロパンおよび
2,2−ビス−(3,5−ジブロモ−4−ヒドロキシフ
ェニル)−プロパン等が挙げられ、好ましくは、2,2
−ビス−(4−ヒドロキシフェニル)プロパン、2,2
−ビス−(3,5−ジメチル−4−ヒドロキシフェニ
ル)−プロパン、2,2−ビス−(3,5−ジクロロ−
4−ヒドロキシフェニル)−プロパン、2,2−ビス−
(3,5−ジブロモ−4−ヒドロキシフェニル)プロパ
ンおよび1,1−ビス−(4−ヒドロキシフェニル)−
シクロヘキサンが挙げられる。Of these, specific examples of suitable bisphenols include 4,4-dihydroxydiphenyl,
2,2-bis- (4-hydroxyphenyl) -propane, 2,4-bis- (4-hydroxyphenyl) -2-
Methyl butane, 1,1-bis- (4-hydroxyphenyl) -cyclohexane, α, α′-bis- (4-hydroxyphenyl) -p-diisopropylbenzene, 2,2
-Bis- (3-methyl-4-hydroxyphenyl) -propane, 2,2-bis- (3-chloro-4-hydroxyphenyl) -propane, bis- (3,5-dimethyl-4)
-Hydroxyphenyl) -methane, 2,2-bis-
(3,5-Dimethyl-4-hydroxyphenyl) -propane, 2,2-bis- (3,5-dimethyl-4-hydroxyphenyl) -sulfone, 2,4-bis- (3,5
-Dimethyl-4-hydroxyphenyl) -2-mercaptan, 1,1-bis- (3,5-dimethyl-4-hydroxyphenyl) -cyclohexane, α, α'-bis-
(3,5-Dimethyl-4-hydroxyphenyl) -p-
Diisopropylbenzene, 2,2-bis- (3,5-dichloro-4-hydroxyphenyl) -propane, 2,2-bis- (3,5-dibromo-4-hydroxyphenyl) -propane and the like can be mentioned, preferably. Is 2, 2
-Bis- (4-hydroxyphenyl) propane, 2,2
-Bis- (3,5-dimethyl-4-hydroxyphenyl) -propane, 2,2-bis- (3,5-dichloro-
4-hydroxyphenyl) -propane, 2,2-bis-
(3,5-Dibromo-4-hydroxyphenyl) propane and 1,1-bis- (4-hydroxyphenyl)-
Cyclohexane is mentioned.
【0019】好適なPCは前述の好適ビスフェノールを
ベースにしたものである。特に好適なポリカーボネート
共重合体は、2,2−ビス−(4−ヒドロキシフェニ
ル)−プロパンと上記特に好適な他のビスフェノ−ルの
1種との共重合体である。Preferred PCs are based on the preferred bisphenols mentioned above. A particularly preferred polycarbonate copolymer is the copolymer of 2,2-bis- (4-hydroxyphenyl) -propane with one of the other particularly preferred other bisphenols mentioned above.
【0020】他の特に好適なPCは、2,2−ビス−
(4−ヒドロキシフェニル)−プロパンまたは2,2−
ビス−(3,5−ジメチル−4−ヒドロキシフェニル)
−プロパンだけをベースにしたものである。Another particularly suitable PC is 2,2-bis-
(4-hydroxyphenyl) -propane or 2,2-
Bis- (3,5-dimethyl-4-hydroxyphenyl)
-Based solely on propane.
【0021】なお、PCは公知の方法、例えばビスフェ
ノールとジフェニルカーボネートとの溶融エステル交換
反応、ビスフェノールとフォスゲンの二相界面重合法な
どの方法で製造することができる。The PC can be produced by a known method such as a melt transesterification reaction of bisphenol and diphenyl carbonate, a two-phase interfacial polymerization method of bisphenol and phosgene, and the like.
【0022】またPCは上記のようにPPSとの混合に
よって分解する傾向にあるため予め高分子量のものを用
いることが必要である。本発明においては溶融粘度が3
000ポイズ以上のもの、より好ましくは5000ポイ
ズ以上のものが本発明組成物の耐衝撃性の向上に著しく
優れている。Since PC tends to be decomposed by mixing with PPS as described above, it is necessary to use a high molecular weight PC in advance. In the present invention, the melt viscosity is 3
000 poises or more, more preferably 5000 poises or more are remarkably excellent in improving the impact resistance of the composition of the present invention.
【0023】PPSとPCとの混合割合は得られる樹脂
組成物の耐熱性と機械的性質のバランスを勘案して決め
られるものであり一概に決められるものではないがPP
S総量(A+B) 50〜90重量部に対し、PC 5
0〜10重量部が好ましい範囲である。但し、総合計量
を100重量部とする。The mixing ratio of PPS and PC is determined in consideration of the balance between heat resistance and mechanical properties of the resin composition to be obtained, and is not generally determined, but PP
PC 5 for S-total amount (A + B) 50-90 parts by weight
The preferred range is 0 to 10 parts by weight. However, the total weight is 100 parts by weight.
【0024】先に記載のとおりPCはPPSとの混合に
よって分解する傾向を示すため耐熱加工安定剤を樹脂組
成物に添加することは非常に大きな意味を持つ。耐熱加
工安定剤としてはフェノール系、硫黄系または燐系など
が使用される。該安定剤は、通常、0.1〜1.0重量
%の範囲で添加される。As described above, PC has a tendency to decompose when mixed with PPS, and therefore it is very important to add a heat-resistant processing stabilizer to the resin composition. Phenol-based, sulfur-based, phosphorus-based, or the like is used as the heat-resistant processing stabilizer. The stabilizer is usually added in the range of 0.1 to 1.0% by weight.
【0025】フェノール系耐熱加工安定剤としては、ブ
チル化ヒドロキシトルエン、ブチル化ヒドロキシアニソ
ール、n・オクタデシル−β−(4’・ヒドロキシ−
3’−5’・ジ・t・ブチルフェニル)プロピオネー
ト、1,1,3・トリス(2−メチル・4ヒドロキシ−
5−t・ブチルフェニル)’ブタン1,3,5トリメチ
ル・2,4,6・トリス(3,5・ジ・t・ブチル4ヒ
ドロキシベンジル)ベンゼン、テトラキス{メチレン・
3・(3’・5’−ジ・t・ブチル−4・ヒドロキシフ
ェニル)プロピオネート}メタンなどが好適に用いられ
る。As the phenolic heat-resistant processing stabilizer, butylated hydroxytoluene, butylated hydroxyanisole, n.octadecyl-β- (4'.hydroxy-
3'-5'.di.t.butylphenyl) propionate, 1,1,3.tris (2-methyl.4hydroxy-)
5-t.butylphenyl) 'butane 1,3,5 trimethyl.2,4,6.tris (3,5.di.t.butyl 4-hydroxybenzyl) benzene, tetrakis {methylene.
3 * (3 '* 5'-di.t.butyl-4.hydroxyphenyl) propionate} methane and the like are preferably used.
【0026】硫黄系の耐熱加工安定剤としては、ジラウ
リル3,3’チオジ・プロピオン酸エステル、ジ・ミリ
スチル3,3’チオジプロピオン酸エステル、ジ・ステ
アリル3,3’チオジプロピオン酸エステルなどが好適
に用いられる。As the sulfur-based heat-resistant processing stabilizer, dilauryl 3,3 'thiodipropionate, di-myristyl 3,3' thiodipropionate, di-stearyl 3,3 'thiodipropionate, etc. Is preferably used.
【0027】燐系の耐熱加工安定剤としては、トリスノ
ニルフェニルフォスファイト、トリス(ミックスド,モ
ノおよびジノニルフェニル)ホスファイト、トリス
(2,4ジ・t・ブチルフェニル)ホスファイト、4,
4’−ブチリデンビス(3・メチル6−t・ブチルフェ
ニル)ジ・トリデシルホスファイト、4,4’ビフェニ
レンジホスフィン酸テトラキス(2,4ジtブチルフェ
ニル)、トリス(シクロヘキシルフェニル)ホスファイ
ト、サイクリックネオペンタンテトライルビス(2,4
・ジ・t・ブチルフェニルホスファイト)、サイクリッ
クネオペンタンテトライルビス(2,6・ジ・t・ブチ
ル4メチルフェニルホスファイト)などが好適に用いら
れる。これらは数種類を混合して用いても差し支えな
い。Examples of phosphorus-based heat-resistant processing stabilizers include trisnonylphenyl phosphite, tris (mixed, mono- and dinonylphenyl) phosphite, tris (2,4di.t.butylphenyl) phosphite, 4,
4'-butylidene bis (3.methyl 6-t.butylphenyl) di tridecyl phosphite, 4,4'-biphenylenediphosphinic acid tetrakis (2,4 di-t-butylphenyl), tris (cyclohexylphenyl) phosphite, cyclic Neopentane tetraylbis (2,4
-Di.t.butylphenylphosphite), cyclic neopentanetetraylbis (2,6-di.t.butyl 4-methylphenylphosphite) and the like are preferably used. These may be used as a mixture of several kinds.
【0028】PCは系内の残存塩素によって加水分解が
加速されるので上記安定剤を使用する場合には注意を要
するが、PPSについても同様である。即ち、PPS中
には合成過程において生じたPPSのオリゴマ−成分、
もしくは未反応成分等の不純物が存在し、特に塩素成分
はNaClなどの不純物として含まれる場合や、分子末
端基に含まれる場合などが考えられ、これらがPCとの
混合時にPCの加水分解を促進し樹脂組成物の機械的性
質、耐熱性を低下させる。Since hydrolysis of PC is accelerated by residual chlorine in the system, caution should be exercised when the above stabilizer is used, but the same applies to PPS. That is, in PPS, an oligomer component of PPS generated in the synthesis process,
Or, there may be impurities such as unreacted components, and especially chlorine components may be contained as impurities such as NaCl, or may be contained in the molecular end groups. These accelerate the hydrolysis of PC when mixed with PC. However, it lowers the mechanical properties and heat resistance of the resin composition.
【0029】本発明者らは、PPSを熱水やアセトン、
各種アルコールを用いて十分に精製を行ない、不純物や
オリゴマー量が少ない各種PPSを用いた結果、塩素含
有量が4000ppm以下、特に好適には1500pp
m以下である特定のPPSを用いると機械的性質、並び
に耐熱性に優れた樹脂組成物を得ることが出来ることを
更に見い出した。The inventors of the present invention used PPS with hot water, acetone,
As a result of sufficiently purifying with various alcohols and using various PPS with a small amount of impurities and oligomers, chlorine content is 4000 ppm or less, particularly preferably 1500 pp.
It was further found that a resin composition excellent in mechanical properties and heat resistance can be obtained by using a specific PPS having a m or less.
【0030】PPS中に存在する塩素含有量の測定方法
は、公知の分析方法が可能であるが、PPS重合物を酸
もしくは酸素中で加熱分解させ、発生する塩素イオン濃
度を、イオンクロマトグラフィーや銀滴定により求める
方法が好ましい。The chlorine content present in PPS can be measured by a known analysis method, but the chlorine ion concentration generated by thermally decomposing the PPS polymer in acid or oxygen is analyzed by ion chromatography or The method of determining by argentometry is preferable.
【0031】本発明の樹脂組成物には、必要に応じて、
繊維状または粒状の強化剤を配合することが可能であ
り、樹脂組成物100重量部に対して、通常3〜300
重量部の範囲で配合することによって強度、剛性、耐熱
性、寸法安定性を更に向上させることができる。繊維状
強化剤としては、ガラス繊維、炭素繊維、シランガラス
繊維、ボロン繊維、ウィスカー、チタン酸カリウム、ア
スベスト、炭化ケイ素、アラミド繊維、セラミック繊
維、金属繊維などが挙げられる。また、粒状の強化材と
しては、マイカ、タルクなどの珪酸塩や炭酸塩、硫酸
塩、金属酸化物、ガラスビーズ、シリカなどが挙げられ
る。これらは2種類以上併用してもよく、これらの無機
充填剤は、通常充填剤の処理剤として用いられるシラン
系やチタン系のカップリング剤で処理することもでき
る。The resin composition of the present invention, if necessary,
It is possible to add a fibrous or granular reinforcing agent, and usually 3 to 300 parts by weight with respect to 100 parts by weight of the resin composition.
By blending in the range of parts by weight, strength, rigidity, heat resistance and dimensional stability can be further improved. Examples of the fibrous reinforcing agent include glass fiber, carbon fiber, silane glass fiber, boron fiber, whiskers, potassium titanate, asbestos, silicon carbide, aramid fiber, ceramic fiber and metal fiber. Examples of the granular reinforcing material include silicates such as mica and talc, carbonates, sulfates, metal oxides, glass beads, and silica. Two or more of these may be used in combination, and these inorganic fillers may be treated with a silane-based or titanium-based coupling agent which is usually used as a treating agent for the filler.
【0032】また、本発明組成物には、本発明の目的を
逸脱しない範囲で少量の離型剤、着色剤、紫外線安定
剤、発泡剤、難燃剤、難燃助剤、防錆剤、あるいはエポ
キシ樹脂、フェノール樹脂、ポリイミドなどの熱硬化性
樹脂を含有せしめることができる。In the composition of the present invention, a small amount of a releasing agent, a colorant, an ultraviolet stabilizer, a foaming agent, a flame retardant, a flame retardant aid, a rust preventive agent, or a small amount is used within the range not departing from the object of the present invention. A thermosetting resin such as an epoxy resin, a phenol resin, or a polyimide can be contained.
【0033】本発明の組成物の調整法は種々の公知の方
法で可能である。例えば、原料をダンブラーまたはヘン
シェルミキサーのような混合機で混合した後、1軸また
は2軸の押出機に供給し、280〜400℃で溶融混練
した後、ペレットとして調整する方法などがある。The composition of the present invention can be prepared by various known methods. For example, there is a method in which the raw materials are mixed with a mixer such as a tumbler or a Henschel mixer, then fed to a uniaxial or biaxial extruder, melt-kneaded at 280 to 400 ° C., and then adjusted as pellets.
【0034】[0034]
【実施例】以下に、本発明を実施例により具体的に説明
する。尚、本発明はこれら実施例にのみ限定されるもの
ではない。EXAMPLES The present invention will be specifically described below with reference to examples. The present invention is not limited to these examples.
【0035】〔合成例1〕溜出口、モノマー溶液仕込口
および窒素ガス導入口付きのオートクレーブに水硫化ナ
トリウム(NaSH・2H2O)9.55Kg、水酸化ナ
トリウム4.05Kgおよび50.0 Kgのn−メチル
ピロリドンを攪拌下窒素ガスを流通しながら、190
℃、1時間脱水操作を行なった。次いで、オートクレー
ブを密閉し、200℃に加熱された脱水操作で得られた
系に、p−ジクロルベンゼン14.7KgとN−メチル
ピロリドン10Kgとの溶液を約40分間かけて圧入
し、加圧下240℃に昇温して、4時間反応を行ない重
合物を分離しPPS−0を得た。[Synthesis Example 1] 9.55 kg of sodium hydrosulfide (NaSH.2H 2 O), 4.05 kg and 50.0 kg of sodium hydroxide were placed in an autoclave equipped with a distillation outlet, a monomer solution charging inlet and a nitrogen gas inlet. While stirring nitrogen gas while stirring n-methylpyrrolidone, 190
Dehydration operation was performed at ℃ for 1 hour. Then, the autoclave was closed, and a solution of 14.7 kg of p-dichlorobenzene and 10 kg of N-methylpyrrolidone was press-fitted into the system obtained by the dehydration operation heated to 200 ° C. over about 40 minutes, and under pressure. The temperature was raised to 240 ° C., the reaction was carried out for 4 hours, and the polymer was separated to obtain PPS-0.
【0036】〔後処理例〕合成例1のPPS−0を温水
で2回、アセトンで2回洗浄しPPS−1を得た。この
PPS−1を260℃で3時間、空気雰囲気下で熱処理
してPPS−2を得た。またこのPPS−1を260℃
で2時間、空気雰囲気下で熱処理しPPS−3を得た。
PPS−0を温水で3回、イソプロピルアルコールで2
回、アセトンで2回洗浄し、260℃で4時間、5時
間、6時間の各時間、空気雰囲気下で熱処理しそれぞれ
をPPS−4、PPS−5、PPS−6とした。PPS
−0を温水で1回洗浄した後、260℃で30分、空気
雰囲気下で熱処理しPPS−7を得た。[Post-treatment example] PPS-0 of Synthesis Example 1 was washed twice with warm water and twice with acetone to obtain PPS-1. This PPS-1 was heat-treated at 260 ° C. for 3 hours in an air atmosphere to obtain PPS-2. In addition, this PPS-1
And heat-treated in an air atmosphere for 2 hours to obtain PPS-3.
PPS-0 with warm water 3 times and isopropyl alcohol with 2 times.
Once, washed twice with acetone, and heat-treated at 260 ° C. for 4 hours, 5 hours, and 6 hours in an air atmosphere to obtain PPS-4, PPS-5, and PPS-6, respectively. PPS
-0 was washed once with warm water and then heat-treated at 260 ° C for 30 minutes in an air atmosphere to obtain PPS-7.
【0037】得られたPPSの溶融粘度、塩素含有量お
よび用いたPCの溶融粘度を表ー1に示した。溶融粘度
はフローテスター(CFT−500、島津製作所製)に
て、荷重を変えて測定し、せん断速度200secー1
に外挿し求めた。塩素含有量は塩素硫黄分析装置(TS
X−10型、三菱化成社製)で測定した。The melt viscosity of the obtained PPS, the chlorine content and the melt viscosity of the PC used are shown in Table 1. The melt viscosity was measured with a flow tester (CFT-500, manufactured by Shimadzu Corporation) under different loads, and the shear rate was 200 sec-1.
Extrapolated to. Chlorine content is measured by chlorine-sulfur analyzer (TS
X-10 model, manufactured by Mitsubishi Kasei).
【0038】〔実施例1〜5、比較例1〜2〕次の表ー
2に示す組み合わせで、予め粉体状態で混合し、押出機
を用いて300℃でペレット化した。これを300℃で
射出成形し、サンプル片を得た。これらはその物性値と
共に表ー2にまとめて表示した。[Examples 1 to 5 and Comparative Examples 1 and 2] The combinations shown in Table 2 below were preliminarily mixed in a powder state and pelletized at 300 ° C using an extruder. This was injection molded at 300 ° C. to obtain a sample piece. These are shown together in Table 2 together with their physical properties.
【0039】尚、アイゾット衝撃試験はASTMーD−
256(ノッチ付き、単位:Kg・cm/cm))、曲
げ試験による破断時の曲げ歪はJISーK7055(単
位:%)、熱変形温度はASTMーD648(18.6
Kgf/cm2、単位:℃)で各々測定した。The Izod impact test is ASTM-D-
256 (notched, unit: Kg · cm / cm), bending strain at break by bending test is JIS-K7055 (unit:%), heat distortion temperature is ASTM-D648 (18.6).
Kgf / cm 2 , unit: ° C).
【0040】[0040]
【表1】 註)S−1000、S−3000、H−3000は三菱
瓦斯化学(株)製ポリカーボネート。「ユーピロン」[Table 1] Note) S-1000, S-3000, and H-3000 are polycarbonates manufactured by Mitsubishi Gas Chemical Co., Inc. "Eupiron"
【0041】[0041]
【表2】 *1 三菱瓦斯化学(株)製ユーピロン *2 樹脂組成物全体に占める割合(重量%) *3 日本チバガイギー(株)製 IRGAFOS 168(リン系) IRGANOX
1010(フェノール系)を樹脂分に対し、各々0.0
5wt%、0.5wt%を添加[Table 2] * 1 Iupilon manufactured by Mitsubishi Gas Chemical Co., Ltd. * 2 Proportion (% by weight) in the entire resin composition * 3 IRGAFOS 168 (phosphorus-based) IRGANOX manufactured by Ciba-Geigy Co., Ltd.
1010 (phenolic) to the resin component, 0.0
Add 5wt%, 0.5wt%
【0042】〔実施例6〕耐熱加工安定剤であるアデカ
アーガス社製 MARK AO−23(硫黄系)を樹脂
分に対し、0.5wt%添加した以外は実施例1と同様
にしてサンプル片を得た。このもののアイゾット衝撃値
は17Kg・cm/cm、曲げ試験による破断時の曲げ
歪は6.0%、熱変形温度は195℃であった。[Example 6] A sample piece was prepared in the same manner as in Example 1 except that 0.5 wt% of MARK AO-23 (sulfur-based) manufactured by Adeka Argus Co., which was a heat-resistant processing stabilizer, was added to the resin component. Obtained. This product had an Izod impact value of 17 kg · cm / cm, a bending strain at break of 6.0% by a bending test, and a heat distortion temperature of 195 ° C.
【0043】[0043]
【発明の効果】本発明組成物は、耐衝撃性などの機械的
性質が著しく向上したものである。そのため、本発明の
樹脂組成物は、例えば、コネクタ・プリント基板・封止
成形品などの電気・電子部品、ランプリフレクター・各
種電装品部品などの自動車部品、各種建築物や航空機・
自動車などの内装用材料、テニスラケット・スキー・ゴ
ルフクラブ・釣竿などのレジャー・スポーツ用具、スピ
ーカー等のエンクロージャーや弦楽器等の裏甲板など音
響用材料、あるいはOA機器部品・カメラ部品・時計部
品などの精密部品等の射出成形・圧縮成形、あるいはコ
ンポジット・シート・パイプなどの押出成形・引抜成形
などの各種成形加工分野において耐熱性や耐衝撃性など
の機械的特性の優れた成形材料あるいは繊維、フィルム
として用いられる。The composition of the present invention has remarkably improved mechanical properties such as impact resistance. Therefore, the resin composition of the present invention includes, for example, electrical / electronic parts such as connectors / printed boards / encapsulation molded products, automobile parts such as lamp reflectors / various electrical component parts, various buildings and aircraft /
Interior materials such as automobiles, leisure and sports equipment such as tennis rackets, skis, golf clubs, fishing rods, acoustic materials such as enclosures such as speakers and back decks of stringed instruments, OA equipment parts, camera parts, clock parts, etc. Molding materials or fibers or films with excellent mechanical properties such as heat resistance and impact resistance in various molding processing fields such as injection molding and compression molding of precision parts, extrusion molding and pultrusion molding of composites, sheets, pipes, etc. Used as.
Claims (5)
と、該ポリフェニレンスルフィド樹脂(A)の3倍以上
の溶融粘度(300゜C、200sec−1での溶融粘
度、以下同様)を有するポリフェニレンスルフィド樹脂
(B)と、3000ポイズ以上の溶融粘度を有するポリ
カーボネート系樹脂(C)とを含有してなることを特徴
とする熱可塑性樹脂組成物。1. A polyphenylene sulfide resin (A)
And a polyphenylene sulfide resin (B) having a melt viscosity three times or more that of the polyphenylene sulfide resin (A) (melt viscosity at 300 ° C., 200 sec−1, and the same below), and a melt viscosity of 3000 poise or more. A thermoplastic resin composition comprising a polycarbonate resin (C).
溶融粘度が300〜3000ポイズである請求項1記載
の組成物。2. The composition according to claim 1, wherein the polyphenylene sulfide resin (A) has a melt viscosity of 300 to 3000 poise.
溶融粘度が20000ポイズ以下である請求項2記載の
組成物。3. The composition according to claim 2, wherein the polyphenylene sulfide resin (B) has a melt viscosity of 20000 poise or less.
ばれる少なくとも1種の耐熱加工安定剤を含有する請求
項1記載の組成物。4. The composition according to claim 1, further comprising at least one heat-resistant processing stabilizer selected from a phenol type, a phosphorus type and a sulfur type.
ポリフェニレンスルフィド樹脂を(A)及び/または
(B)として用いる請求項1記載の組成物。5. The composition according to claim 1, wherein a polyphenylene sulfide resin having a chlorine content of 4000 ppm or less is used as (A) and / or (B).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3196792A JPH05230369A (en) | 1992-02-19 | 1992-02-19 | Thermoplastic resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3196792A JPH05230369A (en) | 1992-02-19 | 1992-02-19 | Thermoplastic resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05230369A true JPH05230369A (en) | 1993-09-07 |
Family
ID=12345726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3196792A Pending JPH05230369A (en) | 1992-02-19 | 1992-02-19 | Thermoplastic resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05230369A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015030779A (en) * | 2013-08-01 | 2015-02-16 | 帝人株式会社 | Resin composition |
WO2021059841A1 (en) * | 2019-09-26 | 2021-04-01 | 帝人株式会社 | Polyarylene sulfide resin composition |
-
1992
- 1992-02-19 JP JP3196792A patent/JPH05230369A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015030779A (en) * | 2013-08-01 | 2015-02-16 | 帝人株式会社 | Resin composition |
WO2021059841A1 (en) * | 2019-09-26 | 2021-04-01 | 帝人株式会社 | Polyarylene sulfide resin composition |
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