JPH0521513A - Film carrier semiconductor device - Google Patents

Abstract

PURPOSE:To reduce the fluctuation of the length and bent position of leads by providing positioning holes through a film carrier tape as semiconductor chip positioning references. CONSTITUTION:After inner leads of semiconductor chips 2 are bonded to a film carrier tape 1, positioning holes 14 are formed through the tape 1. When the holes 14 are formed, a camera 15 for recognition finds the central positions of the chips 2 and an X-Y table 17 moves a metallic mold 16 to a prescribed position on the basis of the data about the central positions of the chips 2. The central positions of the chips 2 can be easily found by catching the silhouette images of the chips 2 formed by irradiating the chips 2 with light from the bottom of the tape 1 with the camera 15. Thereafter, outer leads of the chips 2 are cut or bent by using the holes 14 as positional references when the outer leads are bonded to a mounting substrate.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a film carrier semiconductor device.

[0002]

2. Description of the Related Art The structure of a conventional film carrier semiconductor device will be described in connection with its manufacturing method. Figure 4
FIG. 6 is a plan view showing the appearance of a conventional film carrier semiconductor device. Referring to FIG. 4, this film carrier semiconductor device is manufactured as follows.

First, the film carrier tape 1 and the semiconductor chip 2 are prepared. The film carrier tape 1 has two openings (sprocket hole 3 and device hole 4) and leads 5. Lead 5
One end protrudes into the device hole 4, and the other end is provided with an electric selection pad 6. This lead 5
Is obtained by laminating a metal foil such as copper on an insulating film serving as a base of the film carrier tape 1, and patterning the metal foil into a predetermined shape by etching or the like. The sprocket hole 3 is for carrying the film carrier tape 1, and is also used for positioning when the lead 5 is cut into a predetermined length and bent in a later step. The device hole 4 is an opening for housing the semiconductor chip 2.

Then, the portion of the lead 5 protruding into the device hole 4 and the bump (not shown) provided on the electrode (not shown) of the semiconductor chip 2 are aligned with each other,
Inner lead bonding is performed by a thermocompression bonding method or a eutectic method.

Then, in the state of the film carrier tape, a contactor (not shown) is applied to the electric selection pad 6 to perform electric selection and bias test to select non-defective products and complete the film carrier semiconductor device.

Next, a method for mounting the above film carrier semiconductor device on a mounting substrate will be described. When a film carrier semiconductor device is mounted, it is generally mounted in the following two steps. The lead 5 is cut, the semiconductor chip 2 is separated from the film carrier tape 1, and the lead 5 is bent.

FIG. 5 is a diagram for explaining a method of cutting / bending the lead 5. First, the positioning pin 7 is inserted into the sprocket hole 3 of the film carrier tape 1 and used as a position reference. Then, the lead cutting / bending upper blade 8 and the lead cutting lower blade 9 push the lead 5 to a predetermined length. At the same time, the lead 5 is bent downward by the lead bending lower blade 10. The individual semiconductor chip 2 with leads is fixed to a mounting substrate, and the leads 5 are outer lead bonded.

FIG. 6 is a sectional view showing the state at this time. First, the leaded semiconductor chip 2 is fixed to a mounting substrate 11 such as a printed wiring board with an adhesive 12 or the like.

Next, the bonding pad 13 on the mounting substrate 11 and the lead 5 are outer lead bonded.

Since the film carrier semiconductor device described above can be bonded at one time regardless of the number of leads 5, the mounting speed is fast, and since the film carrier tape is used, the work is automated. It has advantages such as being easy.

[0011]

The above-mentioned conventional film carrier semiconductor device is mounted on the mounting substrate 11 at the time of mounting.
The position of the bonding pad 13 and the position of the lead 5 of the leaded semiconductor chip 2 do not always match well, which may impair the reliability of the connection. The description will be given below.

When the film carrier semiconductor device is outer lead bonded to the mounting substrate, the leads 5 are cut and bent using the sprocket holes 3 of the film carrier tape 1 as a positioning reference. Here, considering the positional deviation between the position of the sprocket hole 3 and the position of the semiconductor chip 2, this positional deviation is a combination of the following two deviations.
Misalignment between sprocket hole 3 position and lead 5 pattern.

This deviation occurs in the process of manufacturing the film carrier tape and has a size of about 50 to 100 μm. Lead 5 pattern and semiconductor chip 2
Misalignment.

This deviation occurs when the semiconductor chip 2 is inner lead bonded to the film carrier tape 1 and has a size of about 50 μm.

That is, in the conventional film carrier semiconductor device, there is a maximum deviation of about 150 μm between the position of the sprocket hole 3 and the position of the semiconductor chip 2.

Therefore, in the stage after the cutting and bending of the leads, the lengths and bending positions of the leads are varied. For example, the leads are too long and stick out from the bonding pad of the mounting board, and are too long. In some cases, it may short-circuit with another bonding pad. Alternatively, the lead may be too short and the adhesive force with the bonding pad may not be sufficient.

The present invention has been made in view of the problems of the conventional film carrier semiconductor device as described above, and has less variation in lead length and bending position than in the conventional film carrier. It is an object to provide a semiconductor device.

[0018]

A film carrier semiconductor device according to the present invention is a film carrier tape having at least a carrier sprocket hole, a device hole into which a semiconductor chip is inserted, and a lead whose one end projects into the device hole. A film carrier semiconductor device having a structure in which a semiconductor chip is connected to a projecting portion of a lead, characterized in that the film carrier tape has a positioning hole provided with the position of the semiconductor chip as a reference. ..

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an optimum embodiment of the present invention will be described with reference to the drawings. 1 is a plan view of a film carrier semiconductor device according to a first embodiment of the present invention.

Referring to FIG. 1, the present embodiment is different from the conventional film carrier semiconductor device in that the film carrier tape 1 is provided with two positioning holes 14 different from the sprocket holes 3. Is.

The film carrier semiconductor device of this embodiment is manufactured as follows. First, the film carrier tape 1 and the semiconductor chip 2 are prepared. The film carrier tape 1 at this stage has not yet been provided with positioning holes. Similar to the conventional film carrier tape, only the sprocket hole 3, the device hole 4, and the lead 5 are provided.

Next, the film carrier tape 1 and the semiconductor chip 2 are subjected to inner lead bonding.

After that, the positioning hole 14 is opened in the film carrier tape 1. In this case, the film carrier tape 1 is placed on a hole punching device as shown in FIG. Come on. This drilling device includes a recognition camera 15 for detecting the position of the semiconductor chip 2, a mold 16 for opening a positioning hole, and an XY table 17 for moving the mold 16. It has and. And
When opening the positioning hole 14, the recognition camera 1
5 determines the center position of the semiconductor chip 2, and the XY table 17 moves the mold 16 to a predetermined position based on the data. The center position of the semiconductor chip 2 can be easily obtained by capturing a silhouette image formed by shining light from below the film carrier tape 1 with the recognition camera 15.

In this way, the positioning hole 14
Can be created at a position at a constant distance from the semiconductor chip 2. Then, after this, when the semiconductor chip 2 is outer lead bonded to a mounting substrate (not shown), the lead 5 is cut / bent by using the positioning hole 14 as a position reference, and thus the length of the lead 5 is increased. Also, the variation in the bending position can be suppressed to be small.

In fact, when the leads are cut and bent using the sprocket hole as a positioning reference as in the conventional film carrier semiconductor device, the positional deviation between the sprocket hole and the semiconductor chip is about 150 μm at maximum. However, in the case of this embodiment, 50 μ
It can be suppressed to m or less.

Next, a second embodiment of the present invention will be described. FIG. 3 is a plan view of the film carrier semiconductor device according to the second embodiment of the present invention.

Referring to FIG. 3, the present embodiment differs from the first embodiment in the positioning hole 18. In the film carrier semiconductor device of this embodiment, a total of four positioning holes 18 are provided between adjacent sprocket holes, two on each side. In this way, unlike the first embodiment, the positioning hole 18 is provided outside the area where the pattern of the leads 5 is formed, so that there is no restriction on the pattern layout of the leads 5 and mounting is performed. The density does not decrease. Further, since four positioning holes 18 are provided for one semiconductor chip 2, the variation in the positions of the positioning holes is averaged, and lead cutting / cutting at the time of outer lead bonding to the mounting board is performed. Since it can be positioned at four points during bending,
The accuracy of the bonding position is further improved as compared with the case of the first embodiment.

[0028]

As described above, according to the present invention, after the semiconductor chip is inner lead bonded to the film carrier tape, the center position of the semiconductor chip is detected and the positioning hole is formed based on this data. ing. Then, by cutting and bending the leads using the positioning holes, it is possible to reduce variations in the length and the bending position of the leads.
This means that with the progress of miniaturization and high-density mounting of electronic devices, the semiconductor device leads and the bonding pads of the mounting substrate are becoming finer than ever before, This is very effective in ensuring a reliable connection between the device and the mounting board.

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment of the present invention.

FIG. 2 is a perspective view for explaining a method of forming a positioning hole in the first embodiment of the present invention.

FIG. 3 is a plan view of the second embodiment of the present invention.

FIG. 4 is a plan view of a conventional film carrier semiconductor device.

FIG. 5 shows a conventional film carrier semiconductor device,
It is sectional drawing for demonstrating the process of cutting and bending a lead.

FIG. 6 shows a conventional film carrier semiconductor device,
It is sectional drawing which shows the state in which the semiconductor chip with a lead was outer-lead bonded to the mounting substrate.

[Explanation of symbols]

 1 film carrier tape 2 semiconductor chip 3 sprocket hole 4 device hole 5 lead 6 electric selection pad 7 positioning pin 8 lead cutting / bending upper blade 9 lead cutting lower blade 10 lead bending lower blade 11 mounting substrate 12 adhesive 13 bonding pad 14 , 18 Positioning hole 15 Recognition camera 16 Mold 17 XY table

Claims (1)

Claim: What is claimed is: 1. A film carrier tape having at least a carrier sprocket hole, a device hole into which a semiconductor chip is inserted, and a lead whose one end projects into the device hole. A film carrier semiconductor device in which semiconductor chips are connected, wherein the film carrier tape has a positioning hole provided with the position of the semiconductor chip as a reference.