JPH05213365A - Structure of emboss carrier taping - Google Patents

Structure of emboss carrier taping

Info

Publication number
JPH05213365A
JPH05213365A JP4001938A JP193892A JPH05213365A JP H05213365 A JPH05213365 A JP H05213365A JP 4001938 A JP4001938 A JP 4001938A JP 193892 A JP193892 A JP 193892A JP H05213365 A JPH05213365 A JP H05213365A
Authority
JP
Japan
Prior art keywords
recess
electric component
lead
emboss carrier
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4001938A
Other languages
Japanese (ja)
Inventor
Hidekazu Ariga
秀和 有賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP4001938A priority Critical patent/JPH05213365A/en
Publication of JPH05213365A publication Critical patent/JPH05213365A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To automatically mount an electric part stably by preventing turning over and jumping out of a packaged electric part when a cover tape is taken out from an emboss carrier tape. CONSTITUTION:A recess 3 for holding a lead is provided at the part where the tip of an outer lead 5 touches to an inner face of a recess 2 provided in an emboss carrier tape 1 for inserting an electric part 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は超小形の表面実装タイプ
の電気部品を包装封入するエンボスキャリアテーピング
の構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of embossed carrier taping for packaging and enclosing a super-small surface mount type electric component.

【0002】[0002]

【従来の技術】従来、この種の包装構造は、図2の断面
図(a)および正面図(b)に示すように直方体状のく
ぼみ2のついたプラスチック等のキャリアテープ1に電
気部品4を挿入し、カバーテープ7で封止されている。
2. Description of the Related Art Conventionally, as shown in the sectional view (a) and the front view (b) of FIG. 2, a packaging structure of this type has a carrier tape 1 made of plastic or the like having a rectangular parallelepiped recess 2 and an electric component 4. And is sealed with a cover tape 7.

【0003】[0003]

【発明が解決しようとする課題】上述した従来の包装構
造は、電気部品4が挿入されるくぼみ2が直方体状であ
るため、特に超小形で軽重量の電気部品(例えば2ピン
ミニモールドダイオードなど)の場合は、ユーザーで自
動実装する時、カバーテープ7をはがす際に電気部品が
反転または飛び出すなどの恐れがあり、実装面で真空チ
ャック等を用いて電気部品を取り出す際に支障をきたす
という問題があった。
In the conventional packaging structure described above, since the recess 2 into which the electric component 4 is inserted has a rectangular parallelepiped shape, the electric component is particularly small and light (for example, a 2-pin mini-mold diode). In the case of (1), there is a possibility that the electric component may be reversed or popped out when the cover tape 7 is peeled off when the user automatically mounts it, which causes a trouble when the electric component is taken out by using a vacuum chuck on the mounting surface. There was a problem.

【0004】[0004]

【課題を解決するための手段】本発明のエンボスキャリ
アテーピングの構造は、電気部品が挿入されるくぼみの
内側面において、この電気部品の一つの外部リードの先
端部が当たる部分にリード保持用のくぼみを有する構造
となっている。
The structure of the embossed carrier taping of the present invention is for holding a lead on the inner surface of a recess into which an electric component is inserted, where the tip of one outer lead of this electric component contacts. It has a hollow structure.

【0005】[0005]

【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の一実施例の包装構造を示し、同図
(a)は断面図,同図(b)は正面図である。キャリア
テープ1の電気部品挿入用のくぼみ2の内側面におい
て、電気部品4の外部リード5が当たる部分にリード保
持用の小さなくぼみ3を有している。
The present invention will be described below with reference to the drawings. 1A and 1B show a packaging structure of an embodiment of the present invention. FIG. 1A is a sectional view and FIG. 1B is a front view. On the inner surface of the recess 2 for inserting an electric component of the carrier tape 1, there is a small recess 3 for holding a lead in a portion of the electric component 4 where the external lead 5 abuts.

【0006】電気部品4がくぼみ2に挿入された後送り
穴6を上側に、くぼみ3を下側にすると電気部品4はく
ぼみ3の方へ移動し、外部リード5の先端がくぼみ3の
中へ入り込む。また、逆に送り穴6を下側にし、くぼみ
3を上側にすると電気部品4は送り穴6の方へ移動し、
取り出せる状態となる。
After the electric component 4 is inserted into the recess 2, the feed hole 6 is moved to the upper side and the recess 3 is moved to the lower side, so that the electric component 4 is moved toward the recess 3 and the tips of the outer leads 5 are in the recess 3. Go in. On the contrary, when the feed hole 6 is on the lower side and the recess 3 is on the upper side, the electric component 4 moves toward the feed hole 6,
It is ready to be taken out.

【0007】[0007]

【発明の効果】以上説明したように本発明は、電気部品
の外部リード保持用くぼみを有する包装構造により、ユ
ーザーでの自動実装時にカバーテープを取りはずす際
に、電気部品が反転または飛び出すことがなく、安定し
た実装作業が行なえるという効果を有する。
As described above, according to the present invention, the packaging structure having the recess for holding the external lead of the electric component does not cause the electric component to be inverted or popped out when the cover tape is removed during the automatic mounting by the user. The effect is that stable mounting work can be performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す図で、同図(a)は断
面図,同図(b)は正面図である。
1A and 1B are views showing an embodiment of the present invention, in which FIG. 1A is a sectional view and FIG. 1B is a front view.

【図2】従来のエンボスキャリアテーピングの構造を示
す図で、同図(a)は断面図,同図(b)は正面図であ
る。
2A and 2B are views showing a structure of a conventional embossed carrier taping, wherein FIG. 2A is a sectional view and FIG. 2B is a front view.

【符号の説明】[Explanation of symbols]

1 キャリアテープ 2 電気部品挿入用くぼみ 3 リード保持用くぼみ 4 電気部品 5 外部リード 6 送り穴 7 カバーテープ 1 carrier tape 2 recess for inserting electric parts 3 recess for holding lead 4 electric part 5 external lead 6 feed hole 7 cover tape

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 電気部品の自動実装が可能な包装形態で
あるエンボスキャリアテーピングの構造において、電気
部品が挿入されるくぼみの内側面の、前記電気部品の一
つの外部リード先端部が当たる部分に、リード保持用の
くぼみを有することを特徴とするエンボスキャリアテー
ピングの構造。
1. In a structure of embossed carrier taping, which is a packaging form capable of automatically mounting an electric component, a portion of an inner surface of a recess into which the electric component is inserted, which is in contact with one outer lead tip of the electric component. An embossed carrier taping structure having a recess for holding a lead.
JP4001938A 1992-01-09 1992-01-09 Structure of emboss carrier taping Withdrawn JPH05213365A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4001938A JPH05213365A (en) 1992-01-09 1992-01-09 Structure of emboss carrier taping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4001938A JPH05213365A (en) 1992-01-09 1992-01-09 Structure of emboss carrier taping

Publications (1)

Publication Number Publication Date
JPH05213365A true JPH05213365A (en) 1993-08-24

Family

ID=11515556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4001938A Withdrawn JPH05213365A (en) 1992-01-09 1992-01-09 Structure of emboss carrier taping

Country Status (1)

Country Link
JP (1) JPH05213365A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6142307A (en) * 1998-03-17 2000-11-07 Matsushita Electric Industrial Co., Ltd. Packing system of electronic components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6142307A (en) * 1998-03-17 2000-11-07 Matsushita Electric Industrial Co., Ltd. Packing system of electronic components

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990408