JPH0521215A - Manufacture of chip resistor - Google Patents

Abstract

PURPOSE:To provide a manufacturing method to obtain a plurality of chip resistors and simultaneously reduce the sizes of them by from split grooves vertically and horizontally on the upper surface of insulation substrate so as to divide the substrate into a plurality of small-piece substrates. CONSTITUTION:Split grooves 1 are discontinuously formed on the upper surface of insulation substrate 3 in the horizontal direction in a manner that they may not be laid across neighboring terminal electrodes 4 on the right and left sides.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip resistor in which a plurality of chip resistors are obtained by dividing an insulating substrate into a plurality of small piece substrates by dividing grooves.

[0002]

2. Description of the Related Art Conventionally, a chip resistor formed by forming one or a plurality of resistance films on the upper surface of a small piece substrate is shown in FIG.
They were manufactured in the order shown in (a) to (d).

First, as shown in FIG. 2 (a), a plurality of horizontal dividing grooves 11 and a plurality of vertical dividing grooves 1 are formed on the upper surface.
An insulating substrate 13 on which 2 and 2 are formed is prepared. Although each of the dividing grooves 11 and 12 is shown by a single line for the sake of convenience in the drawing, it is actually formed to have a V-shaped cross section.

Then, as shown in FIG. 2 (b), on the upper surface of the insulating substrate 13, a plurality of adjacent vertical dividing grooves 12 are provided, which extend above and below each horizontal dividing groove 11. The terminal electrode 14 of is formed.

Then, as shown in FIG. 2C, a plurality of resistance films 15 are formed on the upper surface of the insulating substrate 13 so as to be connected between the pair of upper and lower terminal electrodes 14. These resistance films 15 are trimmed with a laser beam or the like to have a predetermined resistance value.

Finally, the insulating substrate 13 is divided into the lateral dividing grooves 1.
1 and the vertical dividing groove 12 divides the chip substrate into a plurality of small piece substrates to form a chip resistor 17 having a terminal electrode 14 and a resistance film 15 formed on the upper surface of the small piece substrate 16 as shown in FIG. 2D. To get

The chip resistor 17 shown in FIG.
Is a pair of terminal electrodes 14 on the upper surface of the divided small piece substrate 16.
Although only one resistance film 15 is formed, a chip resistor having a plurality of pairs of terminal electrodes and a plurality of resistance films may be formed.

In this case, the interval between the vertical dividing grooves 12 adjacent to each other on the upper surface of the insulating substrate 13 may be widened, and a plurality of terminal electrodes and a plurality of resistance films may be formed between the adjacent dividing grooves 12. However, the manufacturing sequence is exactly the same as the above case.

[0009]

In the method of manufacturing a chip resistor as described above, the terminal electrode 14 is formed by printing a conductive paste.

Therefore, when an attempt is made to reduce the size of the chip resistor by narrowing the space between the adjacent dividing grooves 12 in the vertical direction or narrowing the space between the adjacent terminal electrodes 14, the printed conductive paste is divided in the horizontal direction. Bleed and spread in the groove 11,
There is a problem that adjacent terminal electrodes 14 are short-circuited.

When the terminal electrodes adjacent to each other are short-circuited in this way, the individual resistance values of the resistance film 15 cannot be measured and trimming becomes impossible.

Therefore, in the present invention, even if the distance between the adjacent dividing grooves in the vertical direction is narrowed or the distance between the adjacent terminal electrodes is narrowed, the terminal electrodes are not short-circuited with each other. It is an object of the present invention to provide a method of manufacturing a chip resistor that can be downsized.

[0013]

In order to achieve such an object, according to the present invention, an insulating substrate having a plurality of lateral dividing grooves and a plurality of vertical dividing grooves formed on its upper surface is provided. Prepared and connected to the upper surface of this insulating substrate between a plurality of terminal electrodes which are located between adjacent vertical dividing grooves and extend above and below both sides of the horizontal dividing groove, and to be paired with upper and lower terminal electrodes. A plurality of chip resistors are obtained by forming a plurality of resistance films and then dividing the insulating substrate into a plurality of small piece substrates by a dividing groove in the horizontal direction and a dividing groove in the vertical direction. The method of manufacturing a chip resistor as described above is characterized in that the lateral dividing grooves are formed discontinuously so as not to extend between the left and right adjacent terminal electrodes.

[0014]

Since the lateral dividing grooves on the upper surface of the insulating substrate are formed discontinuously so as not to extend between the left and right adjacent terminal electrodes, the conductive paste bleeds into the dividing grooves and the adjacent dividing grooves are adjacent to each other. As a result, a short circuit between adjacent terminal electrodes is prevented.

[0015]

Embodiments of the present invention will now be described in detail with reference to the drawings.

First, as shown in FIG. 1A, an insulating substrate 3 having an upper surface formed with a plurality of lateral dividing grooves 1 and a plurality of vertical dividing grooves 2 is prepared. The horizontal dividing groove 1 is formed discontinuously so as not to extend over the vertical dividing groove 2 and to extend over the adjacent region.

The insulating substrate 3 is made of a ceramic material such as alumina, and the dividing grooves 1 and 2 are formed at the same time when the insulating substrate 3 is molded, or formed by a laser beam or the like after firing. Further, although the dividing grooves 1 and 2 are each shown by a single line in the drawing for the sake of convenience, they are actually formed to have a V-shaped cross section.

Then, as shown in FIG. 1 (b), a plurality of vertical dividing grooves 2 are formed on the upper surface of the insulating substrate 3 between adjacent vertical dividing grooves 2 and above and below each horizontal dividing groove 1. The terminal electrode 4 is formed.

The terminal electrode 4 is formed by screen-printing a conductive paste such as an Ag-Pd alloy and firing it.

Then, as shown in FIG. 1C, a plurality of resistance films 5 are formed on the upper surface of the insulating substrate 3 so as to be connected between the terminal electrodes 4 forming a pair of upper and lower sides.

The resistance film 5 is set to a predetermined resistance value by trimming with a laser beam or the like after a resistance paste such as Ru is screen-printed and baked.

The terminal electrodes 4 and the resistance film 5 may be formed in reverse order.

Finally, the insulating substrate 3 is divided into a plurality of small piece substrates by the horizontal dividing groove 1 and the vertical dividing groove 2 so that the upper surface of the small piece substrate 6 as shown in FIG. A chip resistor 7 having the terminal electrode 4 and the resistance film 5 is obtained.

Since the lateral dividing groove 1 is formed discontinuously, it may be difficult to divide. In such a case, division can be facilitated by forming continuous or discontinuous division grooves on the lower surface of the insulating substrate 3 at positions corresponding to the transverse division grooves 1.

If the terminal electrode 4 is also extended and formed on the end surface of the small piece substrate 6 on the terminal electrode 4 side of the chip resistor 7, the solderability at the time of mounting on the printed circuit board surface is improved. You may make it provide separately the process of providing the terminal electrode of such an end surface.

Furthermore, the chip resistor 7 of the above-mentioned embodiment.
Is a pair of terminal electrodes 4 and 1 on the upper surface of the divided small piece substrate 6.
Although only the resistance film 5 is formed, it is possible to obtain a chip resistor in which a plurality of pairs of terminal electrodes and a plurality of resistance films are formed on the upper surface of the small piece substrate 6 as described in the description of the prior art. it can. When a chip resistor in which a plurality of pairs of terminal electrodes and a plurality of resistance films are formed on the upper surface of the small piece substrate 6 is obtained, the lateral dividing groove 1 formed on the upper surface of the insulating substrate 3 is used.
Need to be formed independently and discontinuously for each terminal electrode also in the region between the adjacent dividing grooves 2 in the vertical direction.

In short, whether the resistive film on the upper surface of the small piece substrate 6 is one or plural, the lateral dividing grooves 1 are formed discontinuously so as not to extend between the left and right adjacent terminal electrodes 4. You can go.

[0028]

As is clear from the above description,
According to the present invention, since the horizontal dividing grooves on the upper surface of the insulating substrate are formed discontinuously, even if the distance between the adjacent vertical dividing grooves is narrowed or the distance between the adjacent terminal electrodes is narrowed, the conductive paste is The terminal electrodes are not short-circuited due to bleeding, and as a result, the chip resistor can be downsized.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a method of manufacturing a chip resistor according to an embodiment of the present invention, in which (a) to (c) are partial plan views of an insulating substrate in each step, and (d) is a chip resistor. FIG.

2A and 2B are views for explaining a conventional method of manufacturing a chip resistor, in which FIGS. 2A to 2C are partial plan views of an insulating substrate in respective steps, and FIG. 2D is a perspective view of the chip resistor. ..

[Explanation of symbols]

 1 horizontal dividing groove 2 vertical dividing groove 3 insulating substrate 4 terminal electrode 5 resistive film 6 small piece substrate 7 chip resistor

Claims (1)

Claim: What is claimed is: 1. An insulating substrate (3) having a plurality of lateral dividing grooves (1) and a plurality of vertical dividing grooves (2) formed on an upper surface thereof. On the upper surface of the insulating substrate (3), a plurality of terminal electrodes (4) extending between upper and lower sides of the horizontal dividing groove (1) between adjacent vertical dividing grooves (2) and a pair of upper and lower terminals. A plurality of resistance films (5) connected to the terminal electrodes (4) to be formed are formed, and thereafter, the insulating substrate (3) is divided into a horizontal dividing groove (1) and a vertical dividing groove (2). ) Is used to obtain a plurality of chip resistors (7) by dividing the substrate into a plurality of small piece substrates (6), the method comprising the steps of dividing the lateral dividing groove (1) into A method of manufacturing a chip resistor, characterized in that the chip resistors are formed discontinuously so as not to extend between the left and right adjacent terminal electrodes (4).