JPH0521135A - Ceramic heater - Google Patents
Ceramic heaterInfo
- Publication number
- JPH0521135A JPH0521135A JP17155691A JP17155691A JPH0521135A JP H0521135 A JPH0521135 A JP H0521135A JP 17155691 A JP17155691 A JP 17155691A JP 17155691 A JP17155691 A JP 17155691A JP H0521135 A JPH0521135 A JP H0521135A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heat
- sensitive member
- substrate
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fixing For Electrophotography (AREA)
- Resistance Heating (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は両面パターンタイプのセ
ラミクスヒータにおいて基板裏面に設けた感熱部材の感
度を向上したものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is to improve the sensitivity of a heat sensitive member provided on the back surface of a substrate in a double-sided pattern type ceramics heater.
【0002】[0002]
【従来の技術】両面パターンタイプのセラミクスヒータ
はセラミクス製基板の表面に膜状発熱体を配設し、基板
裏面に発熱体の一端に接続した銀膜からなる回路パター
ンを配設して回路の両端子を基板の他端の表裏両面に集
中したもので、OA機器などに組込むとき配線が容易に
なり、またソケットが簡単になるなど大きな利点があ
る。この場合、発熱体の裏側に回路パターンをもって来
て両者ともに基板の中央において立体的に重ね合わすの
が一般的であった。2. Description of the Related Art In a double-sided pattern type ceramics heater, a film heating element is provided on the front surface of a ceramic substrate, and a circuit pattern made of a silver film connected to one end of the heating element is provided on the back surface of the substrate to form a circuit. Since both terminals are concentrated on both the front and back surfaces of the other end of the board, there are great advantages such as easy wiring when assembled in an OA device and a simple socket. In this case, it is general that the circuit pattern is brought to the back side of the heating element and both are three-dimensionally superposed at the center of the substrate.
【0003】[0003]
【発明が解決しようとする課題】このように、基板の中
央部の表裏両面に発熱体と回路パターンとが重なるよう
に配設すると、サーミスタなどの感熱部材を設けると
き、これら部材を回路パターンに直接接触させて配置し
なければならない。この場合、感熱部材が回路パターン
の温度を感知することになるが、回路パターンは電流を
通流するとともに、熱も良く伝導するので、始動に際
し、回路パターンの立上り温度が基板面の立上り温度よ
りも低い傾向がある。As described above, when the heating element and the circuit pattern are arranged so as to overlap with each other on the front and back surfaces of the central portion of the substrate, when the heat sensitive member such as the thermistor is provided, these members are formed into the circuit pattern. Must be placed in direct contact. In this case, the heat-sensitive member senses the temperature of the circuit pattern, but since the circuit pattern conducts current and conducts heat well, the starting temperature of the circuit pattern is higher than that of the board surface at the time of starting. Also tends to be low.
【0004】そこで、回路パターンに感熱部材を取付け
ると、始動時の感熱部材の検知温度が実際の温度よりも
低いため発熱体に過大な電流が流入し、オーバーシュー
トする結果になる。これではトナーの定着温度である2
00℃を大幅に超過し、ヒーター近傍に配置された部材
を加熱し劣化させ、またヒータそのものの寿命も短かく
なる。さらに、このヒータのしゅん間消費電力が大きく
なるため、大容量の電源が必要になるなどの欠点があ
る。Therefore, if a heat-sensitive member is attached to the circuit pattern, an excessive current flows into the heat-generating body because the temperature detected by the heat-sensitive member at startup is lower than the actual temperature, resulting in overshoot. This is the toner fixing temperature of 2
If the temperature exceeds 00 ° C, the members arranged in the vicinity of the heater will be heated and deteriorated, and the life of the heater itself will be shortened. Further, the heater consumes a large amount of power during operation, and thus has a drawback that a large capacity power source is required.
【0005】そこで本発明の課題は両面パターンタイプ
のセラミクスヒータにおいて、基板裏面に配設する感熱
部材の検知温度を実際の基板面温度に近ずけるように構
造を改善することである。Therefore, an object of the present invention is to improve the structure of a double-sided pattern type ceramics heater so that the temperature detected by the heat-sensitive member disposed on the back surface of the substrate can approach the actual temperature of the substrate surface.
【0006】[0006]
【課題を解決するための手段】本発明は表面に発熱体を
配設したセラミクス製基板の裏面において発熱体の真裏
に当る位置に感熱部材を設け、かつこの感熱部材を避け
た基板裏面に回路パターンを設けて感熱部材の検知温度
を実際の温度に近ずけたものである。According to the present invention, a heat sensitive member is provided on a back surface of a ceramics substrate having a heating element disposed on the front surface, at a position directly behind the heating element, and a circuit is provided on the back surface of the substrate avoiding the heat sensitive member. By providing a pattern, the detected temperature of the heat-sensitive member is made to approach the actual temperature.
【0007】[0007]
【作用】このような両面パターンタイプのセラミクスヒ
ータにおいては通電後の立上り時、基板裏面において最
も速く温度が立上るのは発熱体の真裏に当る位置であ
る。そこで、この位置に感熱部材を設けかつ回路パター
ンをこの位置から避ければ、感熱部材の温度は真実の温
度に近ずき、感熱精度を向上できる。In such a double-sided pattern type ceramics heater, the temperature rises fastest on the back surface of the substrate at the time of rising after energization is at the position directly behind the heating element. Therefore, if the heat-sensitive member is provided at this position and the circuit pattern is avoided from this position, the temperature of the heat-sensitive member approaches the true temperature, and the heat-sensitive accuracy can be improved.
【0008】[0008]
【実施例】以下、本発明の詳細を下記の各種実施例によ
って説明する。EXAMPLES The details of the present invention will be described below with reference to various examples.
【0009】実施例1 本実施例は回路パターンが感熱部材の周囲に閉環をなし
て迂回したもので、その詳細を図1ないし図3に示す。
図中、(1)はアルミナセラミクスからなる細長い基
板、(2)はこの基板(1)表面の中心線に沿って形成
され、基板(1)の長さの大部分に延在した細長い発熱
体、(31),(32)はこれら発熱体(2)の両端に
形成された電極、(4)は上記発熱体(2)表面を覆う
ガラス質保護膜、(5)は基板(1)の裏面において発
熱体(1)の中央部の真裏に配設された感熱部材の一例
であるサーミスタ、(6)は基板(1)の裏面において
上記感熱部材(5)を避けて基板(1)の両端部を連通
する回路パターン、(7),(7)は基板(1)の一端
部を貫通して一方の電極(31)と回路パターン(6)
とを電気的に接続するスルーホール、(8),(8)は
他方の電極(32)および回路パターン(6)の他端に
それぞれ設けられた端子である。Embodiment 1 In this embodiment, a circuit pattern is closed around a heat-sensitive member and circumvented, the details of which are shown in FIGS. 1 to 3.
In the figure, (1) is an elongated substrate made of alumina ceramics, (2) is an elongated heating element formed along the center line of the surface of the substrate (1) and extending over most of the length of the substrate (1). , (31) and (32) are electrodes formed at both ends of the heating element (2), (4) is a glassy protective film covering the surface of the heating element (2), and (5) is the substrate (1). A thermistor (6), which is an example of a heat-sensitive member disposed directly behind the center of the heating element (1) on the back surface, includes a thermistor (6) on the back surface of the substrate (1) while avoiding the heat-sensitive member (5). Circuit patterns for communicating both ends, (7) and (7) penetrate one end of the substrate (1) and one electrode (31) and the circuit pattern (6)
Through holes (8) and (8) for electrically connecting and are terminals provided on the other electrode (32) and the other end of the circuit pattern (6), respectively.
【0010】上記発熱体(2)はたとえば銀・パラジウ
ム合金ペーストをプリント配線して焼付けてなるもの
で、主体となる細長い発熱部(21)の両端部(22)
を広幅に形成してある。The heating element (2) is, for example, a printed wiring of silver-palladium alloy paste and baked, and both ends (22) of the elongated heating section (21) as the main body.
Is formed wide.
【0011】上記電極(31),(32)は銀ペースト
をプリントして焼付けてなるもので、図示のように一部
を発熱体端部(22),(22)表面に重層し主体を基
板(1)表面に直接形成してもよく、また図示しない
が、発熱体(2)の端部を大きく形成して電極全体を発
熱体端部表面に重層してもよく、いずれもそれぞれの利
点がある。The electrodes (31) and (32) are formed by printing a silver paste and baking it. As shown in the figure, a part of the electrodes is layered on the surfaces of the end portions (22) and (22) of the heating element and the main body is a substrate. (1) It may be directly formed on the surface, or, although not shown, the end portion of the heating element (2) may be formed to be large and the entire electrode may be layered on the end surface of the heating element. There is.
【0012】上記回路パターン(6)は銀ペーストをプ
リント配線して焼付けてなるもので、一方の電極(3
1)に対応する位置に設けた接続部(61)、閉環をな
して感熱部材(5)を包囲する迂回部(62)および基
板(1)の裏面において他方の電極(32)と異る位置
に対応させて設けた広幅の受電部(63)とを含むもの
である。The circuit pattern (6) is formed by printing wiring of silver paste and baking it. One electrode (3
1) A connection part (61) provided at a position corresponding to 1), a detour part (62) that forms a ring and surrounds the heat-sensitive member (5), and a position different from the other electrode (32) on the back surface of the substrate (1). And a wide power receiving portion (63) provided corresponding to the above.
【0013】上記端子(8),(8)はたとえば銅板や
黄銅板などの金属板をプレス成形してニッケルめっきま
たは銀めっきしたもので、細長い柄部(81)の中間部
に歪や伸縮を緩和するたとえばU字形の曲げ部(82)
を形成し、かつ先端は広幅で継線孔を有する継線部(8
3)に形成してある。そして、他方の電極(32)およ
び受電部(63)に柄部(81)基端をはんだ(84)
で固定して基板(1)の同一側方に並行して突出してあ
る。The terminals (8), (8) are, for example, a metal plate such as a copper plate or a brass plate which is press-formed and nickel-plated or silver-plated. For example, a U-shaped bent portion (82) for relaxing
And the tip is wide and has a wire connecting hole (8)
It is formed in 3). Then, the base end of the handle portion (81) is soldered (84) to the other electrode (32) and the power receiving portion (63).
It is fixed by and is projected in parallel to the same side of the substrate (1).
【0014】そして、両端子(8),(8)を図示して
ない電源の両端に接続するとともに感熱部材(5)すな
わちサーミスタを図示しない電流制御装置に接続する。
そして、電源を投入すれば、電流が両端子(8),
(8)から流入して発熱体(2)の発熱部(21)を通
流してこれを発熱させる。すると、発熱部(21)で生
じた熱が周囲を温めながら次第に蓄積されて昇温する。
このとき、発熱部(21)の中央部の温度が最も高く、
これから遠くなるほど温度が低く、かつ基板(1)裏面
では発熱部(21)の中央部の真裏が最も温度が高く、
これから遠くなるほど温度が低い。そして通電を継速す
るとこの部分温度関係のままで全体の温度が上昇し、や
がて、感熱部材(サーミスタ)(5)によって検知され
た温度が所定の温度に達すると通電が遮断され、各部の
温度が平均化され、この結果感熱部材(サーミスタ)
(5)の温度が下り、再度通電する。このようにして何
回か通電が断続する間にヒータ各部の温度が約200℃
でほぼ一定になり、定常状態になる。しかして、このよ
うなセラミクスヒータにおいては感熱部材(サーミス
タ)(5)の温度が発熱体(2)の最高温点の温度に近
いほど、感度がよく、温度調節精度が高い。本発明者ら
は発熱体(2)の中間部の真裏に当る位置の温度が発熱
体(2)の最高温点温度に近いことを発見し、感熱部材
(サーミスタ)(5)を発熱体の真裏に当る位置に配設
したものである。Then, both terminals (8), (8) are connected to both ends of a power source (not shown), and the heat sensitive member (5), that is, the thermistor is connected to a current control device (not shown).
Then, when the power is turned on, the current will flow to both terminals (8),
It flows in from (8) and flows through the heat generating part (21) of the heat generating element (2) to generate heat. Then, the heat generated in the heat generating portion (21) is gradually accumulated while warming the surroundings and the temperature rises.
At this time, the temperature of the central part of the heat generating part (21) is the highest,
The farther from this, the lower the temperature is, and the backside of the substrate (1) has the highest temperature just behind the center of the heat generating part (21).
The farther from this, the lower the temperature. When the energization is continued, the overall temperature rises in this partial temperature relationship, and when the temperature detected by the heat sensitive member (thermistor) (5) reaches a predetermined temperature, the energization is cut off and the temperature of each part is increased. Are averaged, and as a result, the heat-sensitive member (thermistor)
The temperature of (5) falls and the power is turned on again. In this way, the temperature of each part of the heater is about 200 ° C while the power is turned on and off several times.
Becomes almost constant at and becomes a steady state. In such a ceramic heater, however, the closer the temperature of the heat sensitive member (thermistor) (5) is to the temperature of the highest temperature point of the heating element (2), the better the sensitivity and the higher the temperature adjustment accuracy. The present inventors have found that the temperature of the position directly behind the middle part of the heating element (2) is close to the maximum temperature of the heating element (2), and the heat-sensitive member (thermistor) (5) is attached to the heating element. It is arranged at the position directly behind.
【0015】また、回路パターン(6)を構成する金属
膜の例である銀膜は熱を良く伝達する性質を有する。そ
こで、本実施例においては回路パターン(6)の一部を
サーミスタ(5)を包囲する閉環形迂回部(62)に形
成して感熱部材(サーミスタ)(5)との接触を避けた
のである。それで、感熱部材(サーミスタ)(5)に到
達した熱が回路パターン(6)に逃げることがなくな
り、感熱部材(サーミスタ)(5)の温度が発熱体
(2)の中央部の温度に近くなったのである。The silver film, which is an example of the metal film forming the circuit pattern (6), has a property of transferring heat well. Therefore, in this embodiment, a part of the circuit pattern (6) is formed in a ring-shaped bypass (62) surrounding the thermistor (5) to avoid contact with the heat sensitive member (thermistor) (5). .. Therefore, the heat reaching the heat sensitive member (thermistor) (5) does not escape to the circuit pattern (6), and the temperature of the heat sensitive member (thermistor) (5) becomes close to the temperature of the central portion of the heating element (2). It was.
【0016】このように、本実施例セラミクスヒータは
サーミスタを例とする感熱部材(5)の配設位置を限定
し、かつ回路パターン(6)を感熱部材(5)を避ける
ように配設したので、感熱部材(5)の温度は発熱体
(2)の温度に最も近くなり、温度検知感度が高く、し
たがって感熱部材(5)の作動遅れや検知温度のずれに
起因するオーバーシュートがほとんどなくなったのであ
る。As described above, in the ceramic heater of this embodiment, the position of the heat sensitive member (5) such as a thermistor is limited, and the circuit pattern (6) is arranged so as to avoid the heat sensitive member (5). Therefore, the temperature of the heat sensitive member (5) becomes the closest to the temperature of the heating element (2), and the temperature detection sensitivity is high, so that there is almost no overshoot due to the operation delay of the heat sensitive member (5) or the deviation of the detected temperature. It was.
【0017】また、端子(8)は配線時電線の剛性に起
因する押圧力や撚り圧力を受けており、また点滅すれば
発熱体(2)からの伝熱によって膨張収縮を繰り返す。
しかし、本実施例1のセラミクスヒータにおいては端子
(8)の柄部(81)の中間部に曲げ部(62)を形成
したので、上述の歪みや撚りあるいは膨張収縮がこの曲
げ部(62)に伝達されて曲げ部(62)の変形として
吸収され、端子(8)を剥離したり、電線を離脱させた
りすることがなくなったのである。Further, the terminal (8) receives a pressing force or a twisting pressure due to the rigidity of the electric wire during wiring, and when blinking, the expansion and contraction are repeated by the heat transfer from the heating element (2).
However, in the ceramic heater of the first embodiment, since the bent portion (62) is formed in the intermediate portion of the handle portion (81) of the terminal (8), the above-mentioned distortion, twist, expansion or contraction causes the bent portion (62). And is absorbed as a deformation of the bent portion (62) and the terminal (8) is not peeled off or the electric wire is not detached.
【0018】実施例2 本実施例2のセラミクスヒータは図4ないし図6に示す
ように、基板(1)の表面の中心線に沿って発熱体
(2)に形成し、基板(1)裏面の発熱体(2)の中央
部の真裏すなわち中心線上に感熱部材(5)の一例であ
るサーミスタを配設するとともに、この感熱部材(5)
を避けるよう、回路パターン(6)を基板(1)裏面の
一側に寄せて配設し、かつ両端子(8),(8)を基板
(1)の他端部において軸方向に並行して突設したもの
で、その他同一部分には同一符号を付して説明を略す。Embodiment 2 As shown in FIGS. 4 to 6, the ceramic heater of Embodiment 2 is formed on the heating element (2) along the center line of the surface of the substrate (1), and the back surface of the substrate (1) is formed. The thermistor, which is an example of the heat sensitive member (5), is arranged directly behind the central portion of the heating element (2), that is, on the center line, and the heat sensitive member (5) is provided.
In order to avoid the above, the circuit pattern (6) is arranged close to one side of the back surface of the substrate (1), and both terminals (8) and (8) are axially parallel to each other at the other end of the substrate (1). The same parts are designated by the same reference numerals and the description thereof will be omitted.
【0019】このセラミクスヒータも感熱部材(5)が
基板(1)の裏面において、発熱体(2)の真裏に当る
位置に配設され、かつ回路パターン(6)が感熱部材
(5)を避けて配設されているので、始動後の立上り時
において、感熱部材(5)の温度が発熱体(2)の温度
に極めて近似し、したがって感熱部材(5)の温度検知
感度が高く、したがって、感熱部材(5)の動作遅れや
検知温度のずれに起因するオーバーシュートがほとんど
なくなった。Also in this ceramic heater, the heat-sensitive member (5) is arranged on the back surface of the substrate (1) at a position directly behind the heating element (2), and the circuit pattern (6) avoids the heat-sensitive member (5). Since the temperature of the heat sensitive member (5) is extremely close to the temperature of the heating element (2) at the time of rising after starting, the temperature sensing sensitivity of the heat sensitive member (5) is high, and therefore, Almost no overshoot due to the operation delay of the heat sensitive member (5) or the deviation of the detected temperature.
【0020】また、端子(8),(8)も柄部(81)
の中間部に曲げ部(82),(82)を設けたので配線
の剛性に起因する押圧力や撚り圧力あるいはヒータ点滅
に起因する端子の膨張収縮を吸収して端子や電線の剥落
のおそれがなくなった。The terminals (8) and (8) are also provided with the handle (81).
Since the bent portions (82) and (82) are provided in the middle portion of the terminal, there is a possibility that the pressing force and the twisting force due to the rigidity of the wiring or the expansion and contraction of the terminal due to the blinking of the heater are absorbed and the terminal and the electric wire may come off. lost.
【0021】実施例3 本実施例3のセラミクスヒータは図7ないし図9に示す
ように、基板(1)の表面の中心線に沿って発熱体
(2)を形成し、基板(1)の裏面の発熱体(2)の中
央部の真裏すなわち中心線上に感熱部材(5)の一例で
あるサーミスタを配設するとともに、この感熱部材
(5)を避けるよう、回路パターン(6)の中央部(6
4)をU字形にわん曲させて配設し、かつ両端子
(8),(8)を基板(1)の他端部において両側方に
背向して突設したもので、その他同一部分には同一符号
を付して説明を略す。Example 3 As shown in FIGS. 7 to 9, the ceramic heater of Example 3 has a heating element (2) formed along the center line of the surface of the substrate (1) and the heating element (2) of the substrate (1) is formed. A thermistor, which is an example of the heat-sensitive member (5), is arranged directly behind the center of the heating element (2) on the back surface, that is, on the center line, and the center of the circuit pattern (6) is arranged so as to avoid the heat-sensitive member (5). (6
4) is bent in a U shape, and both terminals (8) and (8) are provided so as to project back to both sides at the other end of the substrate (1). Are denoted by the same reference numerals and description thereof is omitted.
【0022】この実施例3のセラミクスヒータも感熱部
材(5)が基板(1)の裏面において、発熱体(2)の
真裏に当る位置に配設され、かつ回路パターン(6)が
感熱部材(5)を避けて配設されているので、始動後の
立上り時において、感熱部材(5)の温度が発熱体
(2)の温度に極めて近似し、したがって感熱部材
(5)の温度検知感度が高く、したがって感熱部材
(5)の動作遅れや検知温度のずれに起因するオーバー
シュートがほとんどなくなった。Also in the ceramic heater of the third embodiment, the heat sensitive member (5) is arranged on the back surface of the substrate (1) at a position directly behind the heat generating element (2), and the circuit pattern (6) has the heat sensitive member (5). Since it is arranged avoiding 5), the temperature of the heat-sensitive member (5) is very close to the temperature of the heating element (2) at the time of rising after starting, and therefore the temperature detection sensitivity of the heat-sensitive member (5) is high. Therefore, the overshoot due to the operation delay of the heat sensitive member (5) and the deviation of the detected temperature was almost eliminated.
【0023】また、端子(8)も柄部(81)に曲げ部
(82)を設けたので、前述の両実施例と同様な効果が
ある。Further, since the terminal (8) is also provided with the bent portion (82) in the handle portion (81), the same effects as those of the above-described embodiments can be obtained.
【0024】実施例4 本実施例4のセラミクスヒータは図10および図11に
示すように、基板(1)の表面の一側に偏して発熱体
(2)を形成し、基板(1)の裏面の発熱体の中央部の
真裏すなわち一側に偏して感熱部材(5)の一例である
サーミスタを配設するとともにこの感熱部材(5)を避
けるよう、回路パターン(6)を基板(1)の他側に偏
して延在させ、かつ両端子(8),(8)を基板(1)
の他端部において両側方に背向して突設したもので、そ
の他同一部分には同一符号を付して説明を略す。Example 4 As shown in FIGS. 10 and 11, the ceramic heater of Example 4 has a heating element (2) which is biased to one side of the surface of the substrate (1) to form the substrate (1). A circuit pattern (6) is provided on the substrate (a) so that the thermistor, which is an example of the heat sensitive member (5), is disposed so as to be biased directly behind the central portion of the heating element on the back surface of the substrate, that is, to one side. 1) It is biased toward the other side and both terminals (8) and (8) are attached to the substrate (1).
At the other end thereof, the two parts are provided so as to project back to both sides, and the same parts are denoted by the same reference numerals and description thereof is omitted.
【0025】この実施例4のセラミクスヒータも感熱部
材(5)が基板(1)の裏面において、発熱体(2)の
真裏に当る位置に配設され、かつ回路パターン(6)が
感熱部材(5)を避けて配設されているので、始動後の
立上り時において、感熱部材(5)の温度が発熱体
(2)の温度に極めて近似し、したがって感熱部材
(5)の温度検知感度が高く、したがって感熱部材
(5)の動作遅れや検知温度のずれに起因するオーバー
シュートがほとんどなくなった。Also in the ceramic heater of the fourth embodiment, the heat sensitive member (5) is arranged on the back surface of the substrate (1) at a position directly behind the heating element (2), and the circuit pattern (6) is the heat sensitive member ( Since it is arranged avoiding 5), the temperature of the heat-sensitive member (5) is very close to the temperature of the heating element (2) at the time of rising after starting, and therefore the temperature detection sensitivity of the heat-sensitive member (5) is high. Therefore, the overshoot due to the operation delay of the heat sensitive member (5) and the deviation of the detected temperature was almost eliminated.
【0026】また、端子(8)も柄部(81)に曲げ部
(82)を設けたので、前述の3実施例と同様な効果が
ある。Further, since the terminal (8) is also provided with the bent portion (82) in the handle portion (81), the same effect as the above-mentioned three embodiments can be obtained.
【0027】なお、前述の各実施例において、発熱体を
銀・パラジウム合金膜で構成したが本発明はこれに限ら
ず、他の金属で構成してもよく、また膜状でなくともよ
い。また、回路パターンも銀以外の導電物質で構成して
もよく、また回路中に他の回路素子たとえば抵抗や蓄電
器、トランジスタなどを含ませてもよく、さらにパター
ンは膜でなくともよい。さらに、感熱部材は上述のサー
ミスタに限らずたとえばヒューズなど温度に感応して作
用する部材ならなんでもよい。さらに、基板の形状やセ
ラミクスの種類に限定はないが、厚さが厚すぎては伝熱
が悪くなって発熱体と感熱部材との温度差が大きくなっ
て本発明の目的に反する。In each of the above-mentioned embodiments, the heating element is made of a silver-palladium alloy film, but the present invention is not limited to this, and may be made of another metal, or may not be a film. The circuit pattern may also be made of a conductive material other than silver, other circuit elements such as resistors, capacitors, and transistors may be included in the circuit, and the pattern need not be a film. Further, the heat-sensitive member is not limited to the thermistor described above, but may be any member such as a fuse that acts in response to temperature. Further, the shape of the substrate and the type of ceramics are not limited, but if the thickness is too thick, heat transfer is deteriorated and the temperature difference between the heating element and the heat-sensitive member becomes large, which is against the object of the present invention.
【0028】[0028]
【発明の効果】このように、本発明のセラミクスヒータ
はセラミクス製基板の表面に発熱体を配設し、基板の裏
面において発熱体の真裏に当る位置に感熱部材を配設
し、かつこの感熱部材を避けて基板裏面に回路パターン
を形成したので、始動後の立上り時において、発熱体の
温度と感熱部材の温度とが極めて近似し、感熱部材の温
度検知感度が高く、感熱部材の動作遅れや感知温度のず
れに起因するオーバーシュートがほとんどなくなった。As described above, in the ceramic heater of the present invention, the heating element is provided on the front surface of the ceramic substrate, and the heat sensitive member is provided on the back surface of the substrate at a position directly behind the heating element. Since the circuit pattern is formed on the backside of the board avoiding the members, the temperature of the heating element and the temperature of the heat-sensitive member are very close to each other at the start-up after starting, the temperature detection sensitivity of the heat-sensitive member is high, and the operation of the heat-sensitive member is delayed. Almost no overshoot caused by the deviation of the sensed temperature.
【図1】この発明によるセラミクスヒータの第1の実施
例の平面図である。FIG. 1 is a plan view of a ceramic heater according to a first embodiment of the present invention.
【図2】上記第1の実施例の底面図である。FIG. 2 is a bottom view of the first embodiment.
【図3】図1のIII−III線に沿った断面図である。FIG. 3 is a sectional view taken along line III-III in FIG.
【図4】この発明によるセラミクスヒータの第2の実施
例の平面図である。FIG. 4 is a plan view of a ceramic heater according to a second embodiment of the present invention.
【図5】上記第2の実施例の底面図である。FIG. 5 is a bottom view of the second embodiment.
【図6】図4のVI−VI線に沿った断面図である。6 is a cross-sectional view taken along the line VI-VI of FIG.
【図7】この発明によるセラミクスヒータの第3の実施
例の平面図である。FIG. 7 is a plan view of a ceramic heater according to a third embodiment of the present invention.
【図8】上記第3の実施例の底面図である。FIG. 8 is a bottom view of the third embodiment.
【図9】図7のIX−IX線に沿った断面図である。9 is a sectional view taken along line IX-IX in FIG.
【図10】この発明によるセラミクスヒータの第4の実
施例の平面図である。FIG. 10 is a plan view of a ceramic heater according to a fourth embodiment of the present invention.
【図11】上記第4の実施例の底面図である。FIG. 11 is a bottom view of the fourth embodiment.
1…基板 2…発熱体 21…発熱部 22…端部 31,32…電極 4…保護膜 5…感熱部材 6…回路パターン 7…スルーホール 8…端子 81…柄部 82…曲げ部 DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Heating element 21 ... Heating part 22 ... End part 31, 32 ... Electrode 4 ... Protective film 5 ... Heat sensitive member 6 ... Circuit pattern 7 ... Through hole 8 ... Terminal 81 ... Handle part 82 ... Bent part
Claims (1)
配設された発熱体と、上記基板の裏面において上記発熱
体の真裏に当る位置に設けられた感熱部材と、この感熱
部材を避けて上記基板裏面に配設された回路パターンと
を具備したことを特徴とするセラミクスヒータ。Claim: What is claimed is: 1. A ceramic substrate, a heating element provided on the front surface of the substrate, and a heat-sensitive member provided on the back surface of the substrate directly behind the heating element. A ceramic heater comprising a circuit pattern provided on the back surface of the substrate while avoiding the heat sensitive member.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03171556A JP3102068B2 (en) | 1991-07-12 | 1991-07-12 | Ceramic heater |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP03171556A JP3102068B2 (en) | 1991-07-12 | 1991-07-12 | Ceramic heater |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0521135A true JPH0521135A (en) | 1993-01-29 |
JP3102068B2 JP3102068B2 (en) | 2000-10-23 |
Family
ID=15925323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP03171556A Expired - Fee Related JP3102068B2 (en) | 1991-07-12 | 1991-07-12 | Ceramic heater |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3102068B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007029981A1 (en) * | 2005-09-08 | 2007-03-15 | Smattech. Inc. | Ceramic heater |
KR100782063B1 (en) * | 2005-05-24 | 2007-12-04 | 주식회사 스마텍 | Ceramic Heater |
-
1991
- 1991-07-12 JP JP03171556A patent/JP3102068B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100782063B1 (en) * | 2005-05-24 | 2007-12-04 | 주식회사 스마텍 | Ceramic Heater |
WO2007029981A1 (en) * | 2005-09-08 | 2007-03-15 | Smattech. Inc. | Ceramic heater |
Also Published As
Publication number | Publication date |
---|---|
JP3102068B2 (en) | 2000-10-23 |
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